TWI764239B - Component transfer device and manufacturing method of component module - Google Patents

Abstract

The subject of this invention is to provide the element transfer apparatus which can transfer a component to a circuit board at the space|interval which differs from the space|interval between elements of an element board. Furthermore, there is provided a method of manufacturing an element module capable of arranging elements on a circuit board at an interval different from the interval between elements arranged on the element substrate. The component transfer device of the present invention includes: an elastic sheet including a first through hole and a second through hole; a first holding pin whose first shaft portion is inserted into the first through hole; and a second holding pin whose second through hole The shaft portion is inserted through the second through hole; the first adhesive portion is provided on the first holding pin and adheres to the first element; and the second adhesive portion is provided on the second holding pin and adheres to the second element.

Description

Component transfer device and manufacturing method of component module

The present invention relates to a component transfer device which picks up components from a component substrate on which components are formed, and discharges the components to a circuit substrate on which a circuit for driving components is formed. Moreover, it is about a manufacturing method of the component module using a component transfer device.

In small and medium-sized displays such as smartphones, displays using liquid crystal or OLED (Organic Light Emitting Diode) have been commercialized. Among them, compared with liquid crystal displays, OLED displays using self-luminous elements, ie OLEDs, have the advantages of high contrast ratio and no need for a backlight. However, since the OLED is composed of an organic compound, it is difficult to ensure high reliability of the OLED display due to the deterioration of the organic compound.

On the other hand, as a next-generation display, development of a so-called micro LED display in which tiny micro LEDs are arranged in pixels arranged in a matrix is being advanced. Micro LEDs are self-luminous elements similar to OLEDs, but unlike OLEDs, they are composed of stable inorganic compounds including gallium (Ga) or indium (In). Therefore, compared with the OLED display, the micro LED display can easily ensure high reliability. Furthermore, micro LEDs have higher luminous efficiency and can achieve high brightness. Therefore, the micro LED display is expected as a next-generation display with high reliability, high brightness, and high contrast ratio.

In a micro LED display, micro LEDs need to be arranged in each pixel of a circuit substrate (also called a backplane or a TFT (Thin Film Transistor) substrate). As one of the methods of arranging micro LEDs on a circuit board, it is known to pick up a plurality of micro LEDs from an element substrate using a transfer substrate, attach the transfer substrate to the circuit substrate, and transfer the picked up plurality of micro LEDs. A method on a circuit board (for example, refer to Patent Document 1 or Patent Document 2). [Prior Art Literature] [Patent Literature]

[Patent Document 1] US Patent Application Publication No. 2016/0240516 [Patent Document 2] US Patent Application Publication No. 2017/0047306

[Problems to be Solved by Invention]

However, the conventional transfer substrate cannot be used directly when the interval between elements formed on the element substrate and the interval between elements arranged on the circuit substrate are different. In this case, it is necessary to repeat the transfer step to adjust the interval between the components, and the manufacturing operation is greatly increased. That is, repetition of the transfer step is one of the main reasons for the increase in the manufacturing cost of the micro LED display.

The present invention has been made in view of the above-mentioned problems, and one of its subjects is to provide a component transfer device that can arrange components on a circuit board at a different interval from the distance between components formed on the component substrate. Moreover, one of the subjects is to provide the manufacturing method of the element module which arrange|positions elements on the circuit board at the interval different from the interval between the elements formed on the element substrate. [Technical means to solve problems]

A component transfer device according to an embodiment of the present invention includes: an elastic sheet including a first through hole and a second through hole; a first holding pin whose first shaft portion is inserted through the first through hole; and a second holding pin , the second shaft portion of which is inserted into the second through hole; the first adhesive portion is provided on the first holding pin and adheres to the first element; and the second adhesive portion is provided on the second holding pin and adheres to the second element .

In the method of manufacturing a component module according to an embodiment of the present invention, the elastic sheet is stretched and contracted, and the interval between the first holding pin inserted into the first through hole of the elastic sheet and the second holding pin inserted through the second through hole is made change, and the first component and the second component on the first support substrate are adhered and picked up to each of the first adhesive portion provided on the first holding pin and the second adhesive portion provided on the second holding pin.

A method of manufacturing a component module according to an embodiment of the present invention includes a first holding pin inserted into the first through hole and the second through hole of the elastic sheet and provided with a first adhesive portion and a second adhesive The second holding pin of the part is attached to pick up the first element and the second element on the first support substrate, the elastic sheet is stretched and contracted, and the interval between the first holding pin and the second holding pin is changed. 2. On the support substrate, the first element and the second element are placed and released.

Hereinafter, each embodiment of the present invention will be described with reference to the drawings. In addition, the embodiment is merely an example, and those skilled in the art can easily conceive of changes as appropriate while maintaining the gist of the invention, and are of course also included in the scope of the present invention. In addition, in order to make a description clearer, the drawing may show the width, thickness, shape, etc. of each part typically compared with the actual state. However, the shape shown in the figure is only an example, and is not intended to limit the interpreter of the present invention.

In each embodiment of the present invention, for convenience of description, the words "upper" or "lower" are used for description, but there may be cases where the relationship between upper and lower is reversed. For example, the representation of the components on the substrate is only to illustrate the top-down relationship between the substrate and the components, and other components may also be arranged between the substrate and the components.

In this specification, the expressions "α includes A, B or C", "α includes any one of A, B and C", and "α includes one selected from the group consisting of A, B and C" are as long as Unless otherwise specified, the case where α includes a plurality of combinations of A to C is not excluded. Furthermore, these performances do not preclude the inclusion of other requirements in α.

In this specification, the so-called "element" refers to, for example, a Micro Electro Mechanical System (MEMS), a Light Emitting Diode (LED), or a Laser Diode (LD), but an element Not limited to these. Also, LEDs include mini-LEDs or micro-LEDs.

In this specification, the so-called "component module" means a circuit board on which components are arranged. The element module is, for example, a MEMS module equipped with MEMS, an LED module equipped with LED, or an LD module equipped with LD, etc., but the element module is not limited to these.

<First Embodiment> 1A to 1D, the component transfer device 10 according to one embodiment of the present invention will be described.

[structure] FIG. 1A is a schematic plan view of a component transfer device 10 according to an embodiment of the present invention. As shown in FIG. 1A , the component transfer device 10 includes an elastic sheet 100 and a plurality of holding pins 110 .

1B is a schematic plan view of the elastic sheet 100 of the component transfer device 10 according to one embodiment of the present invention. Specifically, FIG. 1B shows the elastic sheet 100 from which the retaining pin 110 is removed from the component transfer device 10 . As shown in FIG. 1B , the elastic sheet 100 is provided with a through hole 101 . The holding pin 110 shown in FIG. 1A is inserted into the through hole 101 of the elastic sheet 100 . Therefore, the through hole 101 is provided at the position where the holding pin 110 is attached.

FIG. 1C is a schematic cross-sectional view of the component transfer device 10 according to one embodiment of the present invention. Specifically, Fig. 1C is a schematic cross-sectional view taken along the line A-A' of Fig. 1A. As shown in FIG. 1C , in the component transfer device 10 , a holding pin 110 is fitted into the through hole 101 of the elastic sheet 100 . An adhesive portion 120 is provided at one end of the holding pin 110 . In addition, in the constant state of the component transfer device 10, the interval between two adjacent holding pins 110 is L1.

1D is a schematic cross-sectional view of the holding pin 110 and the adhesive portion 120 of the component transfer device 10 according to one embodiment of the present invention. As shown in FIG. 1D , the holding pin 110 includes a shaft portion 111 , a first head portion 112 , and a second head portion 113 . The first head portion 112 is disposed at the first end of the shaft portion 111 , and the second head portion 113 is disposed at the second end opposite to the first end of the shaft portion 111 . The outer diameter of each of the first head portion 112 and the second head portion 113 is larger than the outer diameter of the shaft portion 111 . The shaft portion 111 of the holding pin 110 is inserted through the through hole 101 , and the elastic sheet 100 is sandwiched between the first head portion 112 and the second head portion 113 . Moreover, the adhesive part 120 is provided in the surface on the opposite side of the surface in which the shaft part 111 of the 1st head part 112 is provided.

The outer diameter of the shaft portion 111 is smaller than the opening diameter of the through hole 101 . In addition, the length of the shaft portion 111 is larger than the depth of the through hole 101 (corresponding to the film thickness of the elastic sheet 100). Therefore, the shaft portion 111 can float in the through hole 101 not only in the in-plane direction of the elastic sheet 100 but also in the film thickness direction.

In addition, the outer diameter of the shaft portion 111 may be substantially the same as the opening diameter of the through hole 101 so that the shaft portion 111 hardly floats in the in-plane direction of the elastic sheet 100 . Furthermore, the length of the shaft portion 111 and the depth of the through hole 101 may be approximately equal, so that the shaft portion 111 hardly floats in the thickness direction of the elastic sheet 100 .

On the other hand, each of the first head portion 112 and the second head portion 113 is located outside the through hole 101 and protrudes from the opening surface of the through hole 101 . The outer diameter of each of the first head portion 112 and the second head portion 113 is larger than the opening diameter of the through hole 101 . Therefore, the first head portion 112 and the second head portion 113 do not enter the through hole 101 . Therefore, the first head portion 112 and the second head portion 113 can function as a fastener for preventing the holding pin 110 from falling out of the through hole 101 of the elastic sheet 100 .

The component transfer device 10 uses the adhesive portion 120 to pick up components from the component substrate and release the components to the circuit substrate. Therefore, the adhesive force of the adhesive portion 120 is large enough to pick up the components from the component substrate, and small enough to release the components to the circuit substrate.

The outer diameter of the shaft portion 111 , the first head portion 112 , the second head portion 113 , and the adhesive portion 120 can be appropriately determined in consideration of the size and shape of the element. For example, the outer diameter of the first head portion 112 or the second head portion 113 may be 1.25 times or more and 5 times or less with respect to the outer diameter of the shaft portion 111 . The outer diameter of the first head 112 and the outer diameter of the second head 113 may be the same or different. The same applies to the outer diameter of the adhesive portion 120 . That is, the outer diameter of the adhesive portion 120 may be the same as the outer diameter of the first head portion 112 , or may be different from the outer diameter of the first head portion 112 .

The length of the shaft portion 111 may be equal to or greater than the film thickness of the elastic sheet 100 . When the length of the shaft portion 111 is larger than the film thickness of the elastic sheet 100, the movement range of the shaft portion 111 in the film thickness direction of the elastic sheet 100 becomes larger. However, if the length of the shaft portion 111 is too large compared to the film thickness of the elastic sheet 100, the first head 112 or the second head 113 is too far from the elastic sheet 100, so the positional alignment between the holding pin 110 and the element is unstable. Therefore, the length of the shaft portion 111 is preferably 1 time or more and 2 times or less with respect to the film thickness of the elastic sheet 100 .

The adhesive portion 120 preferably includes a flat surface of the adhesive element. The surface roughness of the flat surface of the adhesive portion 120 is, for example, 1 μm or less, preferably 0.5 μm or less. If the surface roughness of the flat surface is smaller, the area in contact with the element increases, so the adhesive force between the adhesive portion 120 and the element can be increased. In addition, it is preferable that the surface on the opposite side of the surface on which the shaft portion 111 of the second head portion 113 is provided is also a flat surface. When the second head portion 113 has a flat surface, since the pressure can be applied to the flat surface of the second head portion 113 uniformly, the parallelism of the adhesive portion 120 can be easily adjusted.

The film thickness of the adhesive portion 120 can be appropriately determined in consideration of the size and shape of the element. The adhesive portion 120 can be embedded into the element by having flexibility. Therefore, the film thickness of the adhesive portion 120 is preferably larger than the height of the device. In addition, the adhesive portion 120 can also be made to have fluidity to adhere the components by embedding the components.

The cross-sectional shape of each of the through hole 101 , the shaft portion 111 , the first head portion 112 , the second head portion 113 , and the adhesive portion 120 shown in FIGS. 1A to 1D is circular, but not limited thereto. The cross-sectional shape of each of the through hole 101 , the shaft portion 111 , the first head portion 112 , the second head portion 113 , and the adhesive portion 120 may be polygonal, elliptical, or the like. That is, the shape of each of the through hole 101 , the shaft portion 111 , the first head portion 112 , the second head portion 113 , and the adhesive portion 120 may be various shapes such as a polygonal column, a column, or an elliptical column.

The size of the elastic sheet 100 can be appropriately determined in consideration of the size of the element substrate or the circuit substrate. The size of the elastic sheet 100 is, for example, 50 mm square, but not limited thereto. In addition, although the shape of the elastic sheet 100 is, for example, a rectangle, it is not limited to this. The shape of the elastic sheet 100 can also be set as a polygon, a circle, or an ellipse.

The thickness of the elastic sheet 100 can be appropriately determined in consideration of the rigidity of the component transfer device 10 . The film thickness of the elastic sheet 100 is, for example, 1 mm or more and 10 mm or less, but is not limited thereto. When the film thickness of the elastic sheet 100 is thin, the rigidity of the component transfer device 10 becomes weak. Moreover, when the film thickness of the elastic sheet 100 is thick, the stretchability of the elastic sheet 100 decreases. Therefore, the thickness of the elastic sheet 100 is preferably the thickness of the through hole 101, which is within the above-mentioned range.

The number and interval of the holding pins 110 can be appropriately determined in consideration of the arrangement of elements in each of the first substrate and the second substrate, the size of the elements, and the like. For example, the holding pins 110 may be arranged in the elastic sheet 100 in a matrix or a zigzag staggered lattice.

1E is a schematic cross-sectional view showing a state in which the elastic sheet 100 is stretched in the component transfer device 10 according to one embodiment of the present invention. As shown in FIG. 1E , the component transfer device 10 stretches the elastic sheet 100 by applying a force to the in-plane direction of the elastic sheet 100 . At the same time, the interval between the holding pins 110 is also stretched from L1 in the constant state shown in FIG. 1C to L2 in the stretched state shown in FIG. 1E . In FIG. 1E , the stretched state of the elastic sheet 100 is shown, but the elastic sheet 100 can also be shrunk. Therefore, by adjusting the force applied to the elastic sheet 100, the interval between the holding pins 110 can be adjusted.

[Material] The elastic sheet 100 is preferably an elastic material that deforms when a force is applied and recovers when the force is removed. As the elastic material of the elastic sheet 100, for example, natural rubber (NR: Natural Rubber), silicone rubber (SI), polyurethane rubber (PUR: Polyurethane Rubber), fluorine rubber (FPM), nitrile rubber (NBR: Nitrile-Butadiene Rubber) ), Styrene Butadiene Rubber (SBR: Styrene Butadiene Rubber), Butadiene Rubber (BR: Butadiene Rubber), Isoprene Rubber (IR: Isoprene Rubber), EPDM: Ethylene- Propylene-Diene Monomer), polyacrylate rubber (ACM), or butyl rubber (IIR: Isobutylene Isoprene Rubber), etc., these rubbers can be used alone or in combination. In particular, when high heat resistance is required, the elastic material of the elastic sheet 100 is preferably silicone rubber or fluororubber. In addition, regarding the silicone rubber of this specification, it is assumed that it contains polydimethylsiloxane (Polydimethylsiloxane: PDMS).

In addition, the elastic sheet 100 may contain additives such as a vulcanization material, a filler, a softener, a colorant, or an anti-deterioration agent. As the vulcanizing material, sulfur, a sulfur compound, a peroxide, or the like can be used. As the filler, barium sulfate, calcium carbonate, silicic acid, magnesium silicate, calcium silicate, or the like can be used. As the softener, paraffin-based processing oil, naphthenic processing oil, or the like can be used. As the colorant, carbon black, titanium white, ultramarine blue, phthalocyanine, or iron red, lead chromate, and the like can be used. As the anti-deterioration agent, phenol, wax, or the like can be used.

Furthermore, the elastic sheet 100 may contain a vulcanization aid or a vulcanization accelerator. As the vulcanization aid, zinc stearate, stearic acid, zinc white, zinc oxide, magnesium oxide, or the like can be used. As the vulcanization accelerator, thiazoles, thiurams, sulfenamides, or dithiocarbamates, etc. can be used.

The retaining pin 110 can be made of the same elastic material as the elastic sheet 100 . In addition, a material with high rigidity (rigid material) can also be used for the holding pin 110 . As the rigid material of the holding pin 110, for example, quartz, glass, or silicon can be used. Furthermore, metal materials such as aluminum, brass, or stainless steel can also be used for the holding pin 110 .

The holding pin 110 can be produced by integrating the shaft portion 111 , the first head portion 112 , and the second head portion 113 , but is not limited to this. Each of the shaft portion 111 , the first head portion 112 , and the second head portion 113 may be separately fabricated, and the holding pins 110 may be fabricated by crimping, welding, or following them. Therefore, the shaft portion 111 , the first head portion 112 , and the second head portion 113 may be made of different materials.

The adhesive portion 120 can use the same elastic material as the elastic sheet 100 . In particular, the elastic material of the adhesive portion 120 is preferably an elastic material with low repellency. In addition, the adhesive portion 120 can be made of a material (planarization material) that is easy to form a flat surface. As the planarizing material of the adhesive portion 120, for example, polyimide resin, acrylic resin, epoxy resin, or siloxane resin can be used. Other. The material of the adhesive portion 120 may also be photosensitive resin.

The adhesive portion 120 may further use a gel material obtained by mixing borax or the like with starch, carboxymethyl cellulose, polyvinyl acetate, or polyvinyl alcohol and the like.

The material of the adhesive portion 120 may be different from the material of the retaining pin 110 . For example, a rigid material may be used for the retaining pin 110 to increase the rigidity of the retaining pin 110 , and an elastic material for retaining deformation may be used for the adhesive portion 120 .

The materials of the adhesive portions 120 need not all be the same. The material of the adhesive portion 120 can be changed according to the position where the holding pin 110 is provided. For example, the first material may be used for the adhesive portion 120 of the holding pin 110 provided on the inner side of the elastic sheet 100 , and the second material may be used for the adhesive portion 120 of the holding pin 110 provided on the outer side of the elastic sheet 100 . By changing the material of the adhesive portion 120 , the adhesive force can be changed according to the position of the holding pin 110 .

As described above, according to the component transfer device 10 of the present embodiment, components can be transferred on the circuit board at intervals different from the distance between components on the component substrate by utilizing the elasticity of the elastic sheet 100 . In addition, in the component transfer device 10, since the holding pin 110 is provided with the adhesive portion 120, the holding pin 110 can be rigid, and the material of the adhesive portion 120 can be selected according to the picked-up or released component. Therefore, since the number of repetitions of the transfer step can be reduced by using the component transfer device 10, the manufacturing operation or manufacturing cost of the device including the component 610 can be reduced.

<Variation example> 2A-2C, the component transfer apparatus 10A which is a modification of the component transfer apparatus 10 is demonstrated. Hereinafter, the description of the same structure as that of the component transfer device 10 will be omitted, and the structure different from the component transfer device 10 will be mainly described.

2A is a schematic cross-sectional view of a component transfer device 10A according to an embodiment of the present invention. Specifically, Fig. 2A is a schematic cross-sectional view of the component transfer device 10A cut at the same position as the line A-A' in Fig. 1A. As shown in FIG. 2A , the component transfer device 10A includes an elastic sheet 100 , a plurality of holding pins 110 , a first adhesive portion 120R, a second adhesive portion 120G, and a third adhesive portion 120B. The film thicknesses are different in the first adhesive portion 120R, the second adhesive portion 120G, and the third adhesive portion 120B. That is, in the component transfer device 10A, any one of the first adhesive portion 120R, the second adhesive portion 120G, and the third adhesive portion 120B having different film thicknesses is provided at one end of each of the plurality of holding pins 110 . In addition, in the constant state of the component transfer device 10A, the interval between the two adjacent holding pins 110 is L1.

In FIG. 2A, the 1st element 610R, the 2nd element 610G, and the 3rd element 610B which are provided on the 1st support board|substrate 600 of the element board|substrate 60 and differ in height are also shown. The film thicknesses of the first adhesive portion 120R, the second adhesive portion 120G, and the third adhesive portion 120B of the component transfer device 10A are adjusted according to the heights of the first element 610R, the second element 610G, and the third element 610B, respectively. That is, the first element 610R having a smaller height is provided with a first adhesive portion 120R having a larger film thickness, and the third element 610B having a larger height is provided with a third adhesive portion 120B having a smaller film thickness.

In the following description, unless the case of the 1st adhesive part 120R, the 2nd adhesive part 120G, and the 3rd adhesive part 120B is distinguished in particular, it will be described as the adhesive part 120A. In addition, in the case where the 1st element 610R, the 2nd element 610G, and the 3rd element 610B are not distinguished in particular, it is expressed as the element 610.

2B is a schematic cross-sectional view showing a state in which the component 610 is picked up by the adhesive portion 120A in the component transfer device 10A according to one embodiment of the present invention. As shown in FIG. 2B , the first element 610R, the second element 610G, and the third element 610B are respectively attached to the first adhesive portion 120R, the second adhesive portion 120G, and the third adhesive portion 120B. Since the film thickness of the adhesive portion 120A varies according to the height of the element 610, in the state where the element 610 is adhered to the adhesive portion 120A, the holding pin 110 can be held to the bottom surface of the element 610 (on the opposite side to the surface to which the adhesive portion 120A is adhered). surface) are approximately the same distance.

In the case of a light-emitting element such as a mini-LED or a micro-LED, the height of the light-emitting element may be different depending on the light-emitting color. For example, when the first element 610R, the second element 610G, and the third element 610B are red light-emitting elements, green light-emitting elements, and blue light-emitting elements, respectively, in the element transfer device 10A, according to the red light-emitting element, green light-emitting element, green light-emitting element For the heights of the light-emitting element and the blue light-emitting element, the film thicknesses of the first adhesive portion 120R, the second adhesive portion 120G, and the third adhesive portion 120B were adjusted, respectively. Therefore, even if the light-emitting elements with different heights are used, the light-emitting elements can be picked up together by using the element transfer device 10A. In addition, since the distances from the holding pins 110 to the bottom surfaces of the light-emitting elements are aligned, the light-emitting elements can be released together with the circuit board.

2C is a schematic cross-sectional view showing a state in which the elastic sheet 100 is stretched in the component transfer device 10A according to one embodiment of the present invention. As shown in FIG. 2C , the component transfer device 10A stretches the elastic sheet 100 by applying a force to the in-plane direction of the elastic sheet 100 . At the same time, the interval between the holding pins 110 is also stretched from L1 in the constant state shown in FIG. 2A to L2 in the stretched state shown in FIG. 2C . In FIG. 2C , the stretched state of the elastic sheet 100 is shown, but the elastic sheet 100 can also be shrunk. Therefore, by adjusting the force applied to the elastic sheet 100, the interval between the holding pins 110 can be adjusted.

As described above, according to the component transfer device 10A of the modified example of the present embodiment, since the film thickness of the adhesive portion 120 is adjusted according to the height of the components 610 , components 610 with different heights can be picked up or released at the same time. Therefore, since the number of repetitions of the transfer steps can be reduced by using the component transfer device 10, the manufacturing operation or manufacturing cost of the device including the components can be reduced.

The above-mentioned structure also includes a modified example and is only one embodiment, and the present invention is not limited to the above-mentioned structure.

<Second Embodiment> 3A to 3C, the component transfer device 20 according to one embodiment of the present invention will be described. Hereinafter, the description of the same configuration as that of the first embodiment will be omitted, and the configuration that is different from the first embodiment will be mainly described.

3A is a schematic cross-sectional view of a component transfer device 20 according to an embodiment of the present invention. Specifically, Fig. 3A is a schematic cross-sectional view of the component transfer device 20 cut at the same position as the line A-A' shown in Fig. 1A. As shown in FIG. 3A , the component transfer device 20 includes an elastic sheet 200 , a plurality of holding pins 210 , and an adhesive portion 220 . The elastic sheet 200 is provided with a through hole 201, and a holding pin 210 is inserted therein. In addition, an adhesive portion 220 is provided at one end of the holding pin 210 . In addition, in the constant state of the component transfer device 20, the interval between two adjacent holding pins 210 is L1.

3B is a schematic cross-sectional view of the holding pin 210 and the adhesive portion 220 of the component transfer device 20 according to one embodiment of the present invention. As shown in FIG. 3B , the holding pin 210 includes a shaft portion 211 , a first head portion 212 , and a second head portion 213 . A first head portion 212 is provided at one end of the shaft portion 211 , and a second head portion 213 is provided at the other end of the shaft portion 211 . Moreover, the adhesive part 220 is provided in the surface on the opposite side of the surface in which the shaft part 211 of the 1st head part 212 is provided.

The shaft portion 211 has a tapered shape, and the outer diameter varies depending on the position. That is, the outer diameter of the shaft portion 211 is largest on the side of the first head portion 212 and smallest on the side of the second head portion 213 . The outer diameter of the first head portion 212 is larger than the maximum outer diameter of the shaft portion 211 . In addition, the outer diameter of the second head portion 213 is larger than the minimum outer diameter of the shaft portion 211 .

The through hole 201 also has the same taper shape as the shaft portion 211, and the opening diameter varies depending on the position. That is, the opening diameter of the through hole 201 is the largest on the first opening surface on the side of the first head 212 , and the smallest on the side of the second head 213 . The outer diameter of the first head portion 212 is larger than the opening diameter of the first opening surface. In addition, the outer diameter of the second head portion 213 is larger than the opening diameter of the second opening surface.

The opening diameter of the first opening surface or the opening diameter of the second opening surface of the through hole 201 is preferably smaller than the maximum outer diameter of the shaft portion 211, but is not limited thereto. When the opening diameter or the second opening diameter of the first opening surface of the through hole 201 is smaller than the maximum outer diameter of the shaft portion 211 , the elastic sheet 200 can be fixed at the middle position of the shaft portion 211 .

The taper angles of the shaft portion 211 and the through hole 201 can be appropriately determined in consideration of the length of the shaft portion 211, the film thickness of the elastic sheet 200, and the like. In addition, the taper angle of the shaft portion 211 and the taper angle of the through hole 201 are preferably the same, but not limited to this.

3C is a schematic cross-sectional view showing a state in which the elastic sheet 200 is stretched in the component transfer device 20 according to one embodiment of the present invention. As shown in FIG. 3C , the component transfer device 20 stretches the elastic sheet 200 by applying a force to the in-plane direction of the elastic sheet 200 . At the same time, the interval between the holding pins 210 is also stretched from L1 in the constant state shown in FIG. 3A to L2 in the stretched state shown in FIG. 3C . Therefore, by adjusting the force applied to the elastic sheet 200, the interval between the holding pins 110 can be adjusted. In FIG. 3C , the stretched state of the elastic sheet 200 is shown, but the elastic sheet 200 can also be shrunk. Therefore, by adjusting the force applied to the elastic sheet 200, the interval between the holding pins 210 can be adjusted.

In addition, when the opening diameter of the first opening surface or the opening diameter of the second opening surface of the through hole 201 is smaller than the maximum outer diameter of the shaft portion 211, as shown in FIG. 3C, the shaft portion 211 can be fixed at a specific position. Therefore, since the component transfer device 20 can fix the holding pin 210 to the elastic sheet 200 in the stretched state, the picking or releasing of the component 610 is stable.

As described above, according to the device transfer device 20 of the present embodiment, the elastic sheet 200 can be used to transfer the components on the circuit board at intervals different from the gap between the components on the component substrate. In addition, in the component transfer device 20, the holding pin 210 can be fixed to the elastic sheet 200 in the stretched state, and the component 610 can be stably picked up or released. Therefore, by using the component transfer device 20, the manufacturing operation and manufacturing cost of the device including the component 610 can be reduced, and the yield can be improved.

<Variation example> 4A - FIG. 4C, the component transfer apparatus 20A which is a modification of the component transfer apparatus 20 is demonstrated. Hereinafter, the description of the same structure as that of the component transfer device 20 will be omitted, and the structure different from the component transfer device 10 will be mainly described.

4A is a schematic cross-sectional view of a component transfer device 20A according to an embodiment of the present invention. Specifically, Fig. 4A is a schematic cross-sectional view of the component transfer device 20A cut at the same position as the line A-A' in Fig. 1A. As shown in FIG. 4A , the component transfer device 20A includes an elastic sheet 200A, a plurality of holding pins 210A, and an adhesive portion 220 . The elastic sheet 200A is provided with a through hole 201A, and a holding pin 210A is fitted therein. In addition, an adhesive portion 220 is provided at one end of the holding pin 210A. In addition, in the constant state of the component transfer device 20A, the interval between the two adjacent holding pins 210A is L1.

4B is a schematic cross-sectional view of the holding pin 210A and the adhesive portion 220 of the component transfer device 20A according to one embodiment of the present invention. As shown in FIG. 4B , the holding pin 210A includes a shaft portion 211A, a first head portion 212A, and a second head portion 213A. A first head portion 212A is provided at one end of the shaft portion 211A, and a second head portion 213A is provided at the other end of the shaft portion 211A. Moreover, the adhesive part 220A is provided in the surface on the opposite side of the surface in which the shaft part 211A of the 1st head part 212A is provided.

The shaft portion 211A has a tapered shape, and the outer diameter varies depending on the position. That is, the outer diameter of the shaft portion 211A is the smallest on the side of the first head portion 212A and the largest on the side of the second head portion 213A. The outer diameter of the first head portion 212A is larger than the minimum outer diameter of the shaft portion 211A. In addition, the outer diameter of the second head portion 213A is larger than the maximum outer diameter of the shaft portion 211A.

The through-hole 201A also has the same taper as the shaft portion 211A, and the opening diameter varies depending on the position. That is, the opening diameter of the through hole 201A is the smallest on the first opening surface on the side of the first head 212A, and is the largest on the side of the second head 213A. The outer diameter of the first head portion 212A is larger than the opening diameter of the first opening surface. In addition, the outer diameter of the second head portion 213A is larger than the opening diameter of the second opening surface.

The opening diameter of the first opening surface or the opening diameter of the second opening surface of the through hole 201A is preferably smaller than the maximum outer diameter of the shaft portion 211A, but is not limited thereto. When the opening diameter or the second opening diameter of the first opening surface of the through hole 201A is smaller than the maximum outer diameter of the shaft portion 211A, the elastic sheet 200 can be fixed at the middle position of the shaft portion 211A.

The taper angles of the shaft portion 211A and the through hole 201A can be appropriately determined in consideration of the length of the shaft portion 211A, the film thickness of the elastic sheet 200A, and the like. In addition, the taper angle of the shaft portion 211A and the taper angle of the through hole 201A are preferably the same, but not limited to this.

4C is a schematic cross-sectional view showing a state in which the elastic sheet 200A is stretched in the component transfer device 20 according to one embodiment of the present invention. As shown in FIG. 4C , the component transfer device 20A stretches the elastic sheet 200A by applying a force to the in-plane direction of the elastic sheet 200A. At the same time, the interval between the holding pins 210A is also stretched from L1 in the constant state shown in FIG. 4A to L2 in the stretched state shown in FIG. 4C . Therefore, by adjusting the force applied to the elastic sheet 200A, the interval between the holding pins 110A can be adjusted. In FIG. 4C , the stretched state of the elastic sheet 200A is shown, but the elastic sheet 200A can also be shrunk. Therefore, by adjusting the force applied to the elastic sheet 200A, the interval between the holding pins 210A can be adjusted.

Furthermore, when the opening diameter of the first opening surface or the opening diameter of the second opening surface of the through hole 201A is smaller than the maximum outer diameter of the shaft portion 211A, as shown in FIG. 4C , the shaft portion 211A can be fixed at a specific position. Therefore, since the component transfer device 20 can fix the holding pin 210A to the elastic sheet 200A in the stretched state, the component 610 is stably picked up or released.

As described above, the component transfer device 20A according to the modification of the present embodiment can utilize the elasticity of the elastic sheet 200A to transfer components on the circuit board at intervals different from the distance between components on the component substrates. In addition, in the component transfer device 20A, the holding pin 210A can be fixed to the elastic sheet 200A in the stretched state, and the component 610 can be picked up or released stably. Therefore, by using the component transfer device 20, the manufacturing operation and manufacturing cost of the device including the component 610 can be reduced, and the yield can be improved.

<Third Embodiment> Referring to FIGS. 5 to 8H , a method for manufacturing a component module according to an embodiment of the present invention will be described. In this embodiment, a method of transferring the components 610 from the component substrate 60 on which the components 610 are formed to the circuit board 70 on which the circuits of the driving components 610 are formed using the component transferring apparatus 10 will be described.

[Element substrate] FIG. 5 is a schematic perspective view of an element substrate 60 used in a method for manufacturing an element module according to an embodiment of the present invention.

As shown in FIG. 5 , the element substrate 60 includes a first support substrate 600 and a plurality of elements 610 . In FIG. 5 , a plurality of elements 610 are arranged on the first support substrate 600 in a matrix, but the present invention is not limited thereto. The plurality of elements 610 may also be arranged on the first support substrate 600 in a zigzag staggered lattice shape. The component substrate 60 may be separated and arranged on the first support substrate 600 so that the component transfer device 10 can pick up the component 610 .

The first support substrate 600 may be a rigid substrate such as quartz, glass, silicon, or sapphire, or a flexible substrate such as polyimide, acrylic, polyethylene naphthalate (PEN), and polyethylene terephthalate (PET). Sexual substrate. In addition, the first support substrate 600 is not limited to a substrate, and may be a thin film or a sheet.

In addition, the first support substrate 600 may be a base material or a wafer used for forming the element 610, or may be a dicing film or a dicing sheet.

[circuit board] The circuit board 70 has the circuit of the driving element 610 formed on the second support board 700 . As the second support substrate 700, a translucent substrate such as a glass substrate, a quartz substrate, a sapphire substrate, a polyimide substrate, an acrylic substrate, a siloxane substrate, or a fluororesin substrate can be used. In addition, when translucency is not required, as the second support substrate 700, a semiconductor substrate such as a silicon substrate, a silicon carbide substrate, or a semiconductor substrate such as a compound semiconductor substrate, or a conductive substrate such as a stainless steel substrate may be used. In addition, the second support substrate 700 may be a rigid substrate having rigidity or a flexible substrate having flexibility.

As an example of the circuit board 70, the circuit board 70 which can be used for a display device is demonstrated. FIG. 6 is a block diagram showing the layout of the circuit board 70 used in the method for manufacturing the device module according to one embodiment of the present invention.

As shown in FIG. 6 , on the second support substrate 700 , a pixel region 710 , a driver circuit region 720 , and a terminal region 730 are provided. The driver circuit area 720 and the terminal area 730 are disposed around the pixel area 710 .

The pixel region 710 includes a plurality of pixels arranged in a matrix, and each pixel includes any one of a red light-emitting pixel 710R, a green light-emitting pixel 710G, and a blue light-emitting pixel 710B. In addition, a pixel circuit 711 is provided in each pixel. In addition, although not shown, an electrode electrically connected to the element 610 is provided in each pixel. Furthermore, in order to bond the element 610 to the electrode, a conductive adhesive 790 may also be provided on the electrode. The conductive adhesive 790 is, for example, an adhesive containing a conductive filler, but is not limited thereto. The conductive adhesive 790 may also be cured over time, such as silver paste. In addition, the conductive adhesive 790 may be a thermosetting adhesive or a photocurable adhesive. The conductive adhesive 790 fixes the picked-up element 610 on the second support substrate 700 of the circuit board 70 , and electrically connects the element 610 and the wiring provided on the second support substrate 700 .

The driver circuit region 720 includes a gate driver circuit 720G and a source driver circuit 720S. The pixel circuit 711 and the gate driver circuit 720G are electrically connected via the gate wiring 721 . In addition, the pixel circuit 711 and the source driver circuit 720S are connected via the source wiring 722 . The red light-emitting pixel 710R, the green light-emitting pixel 710G, and the blue light-emitting pixel 710B are disposed at positions where the gate wiring 721 and the source wiring 722 intersect.

The terminal area 730 includes a terminal portion 730T for connection with an external device. The terminal portion 730T and the gate driver circuit 720G are electrically connected via the connection wiring 731 . In addition, the terminal portion 730T and the source driver circuit 720S are electrically connected via the connection wiring 732 . The external device and the circuit board 70 are electrically connected by connecting to the terminal portion 730T by a flexible printed circuit board (FPC: Flexible Printed Circuit) or the like connected to the external device. A signal from an external device can be supplied to drive each pixel circuit 711 provided on the circuit board 70 .

[Manufacturing method of component module] FIG. 7 is a flow chart of a manufacturing method of an element module according to an embodiment of the present invention. As shown in FIG. 7 , the manufacturing method of the component module of this embodiment includes a step of aligning the component transfer device 10 and the component substrate 60 ( S100 ), a step of picking up the component 610 from the component substrate 60 ( S200 ), and component transfer The positioning step of the device 10 and the circuit substrate 70 ( S300 ), and the step of releasing the element 610 to the circuit substrate 70 ( S400 ).

Hereinafter, referring to FIGS. 8A to 8H , the manufacturing method of the element module will be described in detail. In addition, each of FIG. 8A to FIG. 8H is a schematic diagram showing a manufacturing method of an element module according to an embodiment of the present invention.

FIG. 8A shows a state in which the component transfer device 10 is installed on the component substrate 60 in step S100. The interval between the holding pins 110 of the component transfer device 10 is L1. Moreover, the adhesive part 120 is provided in the 1st head part 112 of the holding pin. On the other hand, in the element substrate 60 , the first element 610R, the second element 610G, and the third element 610B are arranged on the first support substrate 600 . The spacing between elements 610 is L2.

FIG. 8B shows the state of the elastic sheet 100 of the tensile element transfer device 10 in step S100. In order to match the interval between the holding pins 110 of the component transfer device 10 to the interval L2 between the components 610 , a force is applied to stretch and fix the elastic sheet 100 . Moreover, the alignment mark provided in the element transfer device 10 and the alignment mark provided in the element substrate 60 are matched. The alignment mark may be arranged in the center of the component transfer device 10 or the component substrate 60 , or may be arranged on the periphery or four corners of the component transfer device 10 or the component substrate 60 . In addition, the component transfer device 10 and the component substrate 60 may be aligned using a plurality of alignment marks. The space between the holding pins 110 and the space L2 between the elements 610 are matched to complete the alignment of the element transfer device 10 and the element substrate 60 .

8C shows a state in which the adhesive portion 120 of the component transfer device 10 is pressed against the first component 610R, the second component 610G, and the third component 610B of the component substrate 60 in step S200. Since the adhesive portion 120 has elasticity, the higher the height of the element 610 is, the more the element 610 is embedded in the adhesive portion 120 . In this state, in order to increase the adhesive force between the adhesive portion 120 and the element 610 , force can also be applied to the elastic sheet 100 or the holding pin 110 .

FIG. 8D shows a state in which the component transfer device 10 picks up the first component 610R, the second component 610G, and the third component 610B in step S200. When the adhesive force between the adhesive portion 120 and the element 610 is greater than the adhesive force (adhesion force) between the first support substrate 600 and the element 610 , the element 610 is peeled off from the first support substrate 600 . Although the heights of the first element 610R, the second element 610G, and the third element 610B are different, since the heights of the first element 610R, the second element 610G, and the third element 610B are adjusted by the adhesive portion 120, the pins 110 are held. The distances to the bottom surfaces of the first element 610R, the second element 610G, and the third element 610B are substantially the same. That is, when the elements 610 with different heights are adhered to the adhesive portion 120, the bottom surfaces of the elements 610 are located in substantially the same plane. In other words, the adhesive portion 120 is deformed and held so that the bottom surface of the first element 610R, the bottom surface of the second element 610G, and the bottom surface of the third element 610B are substantially aligned.

FIG. 8E shows a state in which the component transfer device 10 is installed on the circuit board 70 in step S300 . The interval between the holding pins 110 of the component transfer device 10 is L2. On the other hand, the circuit board 70 is provided with a conductive adhesive 790 for connecting to electrodes on the second support board 700 . The interval between the conductive adhesives 790 (between electrodes) is L3.

FIG. 8F shows the state of the elastic sheet 100 of the reduced component transfer device 10 in step S300. In order to make the interval between the holding pins 110 of the component transfer device 10 match the interval L3 between the conductive adhesives 790 , a force is applied to shrink and fix the elastic sheet 100 . Alignment marks can be used for alignment. That is, the alignment mark provided in the component transfer device 10 and the alignment mark provided in the circuit board 70 are matched. The alignment marks may be arranged in the center of the component transfer device 10 or the circuit board 70 , or may be arranged on the periphery or the four corners of the component transfer device 10 or the circuit board 70 . In addition, the component transfer device 10 and the circuit board 70 may be aligned using a plurality of alignment marks. The space between the holding pins 110 and the space L3 between the conductive adhesives 790 are matched to complete the alignment of the component transfer device 10 and the circuit board 70 .

8G shows a state in which the first element 610R, the second element 610G, and the third element 610B adhered to the adhesive portion 120 of the element transfer device 10 are pressed against the conductive adhesive 790 of the circuit board 70 in step S400 . In this state, in order to increase the adhesive force between the conductive adhesive 790 and the element 610 , force may also be applied to the elastic sheet 100 or the holding pin 110 .

8H shows a state in which the component transfer device 10 releases the first component 610R, the second component 610G, and the third component 610B in step S400. When the adhesive force between the conductive adhesive 790 and the element 610 is greater than the adhesive force between the adhesive portion 120 and the element 610 , the element 610 is peeled off from the pick-up surface. If the force is removed from the elastic sheet 100 of the component transfer device 10, the interval between the holding pins 110 returns to the constant state L1.

When the circuit substrate 70 needs a plurality of components 610 , steps S100 to S400 are repeated. For example, when the component 610 is a micro LED, the component transfer device 10 can be used to repeat the picking and releasing of the red micro LED, the green micro LED, and the blue micro LED to produce a micro LED module capable of full-color display .

In addition, when the element 610 is a micro-UV LED, a red phosphor, a green phosphor, and a blue phosphor can be arranged on the side of the outgoing light, so as to convert the phosphor into the micro-UV LED to emit light. Ultraviolet light is used to produce micro LED modules that can display full color.

As described above, according to the manufacturing method of the component module according to an embodiment of the present invention, the elastic sheet 100 of the component transfer device 10 can be stretched and retracted, and the component 610 can be picked up or released. In addition, even if the components 610 have different heights, since the adhesive portion 120 adjusts the height difference of the components 610, the alignment of the components 610 is relatively easy. Therefore, when the component 610 is mounted on the circuit board 70 using the component transfer device 10, the manufacturing operation and manufacturing cost of the component module can be reduced, and the yield can be improved.

<Variation 1> 9, the manufacturing method of the element module which is a modification of the above-mentioned third embodiment will be described. The manufacturing method of the component module of the present modification can be performed in the same steps as above. Therefore, hereinafter, the description of the same configuration as the above will be omitted, and the configuration different from the above will be mainly described.

9 is a schematic view showing a state before the component transfer device 10 having picked up the component 610 is pressed against the circuit board 70A in the manufacturing method of the component module according to one embodiment of the present invention. A first element 610R, a second element 610G, and a third element 610B are adhered to the adhesive portion 120 of the element transfer device 10 . In addition, although not shown, an electrode is arrange|positioned in 700 A of 2nd support substrates of the circuit board 70A, and the conductive adhesive 790 is provided on this electrode. Therefore, the first element 610R, the second element 610G, and the third element 610B can be electrically connected to the electrodes of the circuit board 70A via the conductive adhesive 790 . In addition, the electrical connection of the 1st element 610R, the 2nd element 610G, and the 3rd element 610B, and the electrode of the circuit board 70A is not limited to the conductive adhesive 790. For example, the 1st element 610R, the 2nd element 610G, and the 3rd element 610B, and the electrode of the circuit board 70A may be electrically connected via an anisotropic conductive film (ACF: Anisotropic Conductive Film).

The circuit board 70A includes a curved surface at least in part. Specifically, the second support substrate 700B includes a curved surface that protrudes toward the component transfer device 10 side.

The elastic sheet 100 of the component transfer device 10 can not only be stretched in the in-plane direction, but also can be bent in the vertical direction of the elastic sheet 100 . Therefore, even if the circuit board 70A includes a curved surface, when the component transfer device 10 is pressed against the circuit board 70A, the component transfer device 10 is bent along the circuit board 70A, and the first element 610R, the second element 610G, and the first element 610R, the second element 610G, and the The three elements 610B are next to the circuit board 70A.

Although the heights of the first component 610R, the second component 610G, and the third component 610B are different, the difference in height is adjusted by the adhesive portion 120 of the component transfer device 10 so that the picked first component 610R, the second component The positions of the bottom surfaces of the element 610G and the third element 610B are substantially aligned. Therefore, even when the elastic sheet 100 is bent and bent along it, the positions of the bottom surfaces of the first element 610R, the second element 610G, and the third element 610B are aligned and bent. Therefore, the alignment of the first element 610R, the second element 610G, and the third element 610B is easy with respect to the circuit board 70A including the curved surface.

The component transfer device 10 can apply force to the elastic sheet 100 to fix it, and press against the circuit substrate 70A. In addition, the component transfer device 10 may be pressed against the circuit board 70A while changing the force applied to the elastic sheet 100 .

The component transfer device 10 can bend the elastic sheet 100 along the curved surface of the circuit board 70A after placing the component 610 at the center of the circuit board 70A, and place the component 610 on the end of the circuit board 70A. In addition, the component transfer device 10 may also bend the elastic sheet along the curved surface of the circuit board 70A after placing the component 610 on one end of the circuit board 70A and place the component 610 on the other end. In this case, a plurality of alignment marks can also be used for proper alignment.

As mentioned above, according to the manufacturing method of the component module which is a modification of the third embodiment, the component 610 can also be released from the circuit board 70A including the curved surface protruding toward the component transfer device 10 side. In the component transfer device 10 , the bottom surfaces of the components 610 are aligned because the adhesive portion 120 adjusts the height difference of the components 610 . Therefore, with respect to the circuit substrate 70A including the curved surface, the alignment of the components 610 is also easier. Therefore, if the device 610 is transferred to the circuit board 70A including the curved surface using the device transfer device 10 , the manufacturing operation and manufacturing cost of the device module can be reduced, and the yield can be improved.

<Variation 2> 10 , another modification of the third embodiment, that is, a method for producing an element module will be described. The manufacturing method of the component module of the present modification can be performed in the same steps as above. Therefore, hereinafter, the description of the same configuration as the above will be omitted, and the configuration different from the above will be mainly described.

10 is a schematic view showing a state before the component transfer device 10 having picked up the component 610 is pressed against the circuit board 70B in the manufacturing method of the component module according to one embodiment of the present invention.

The circuit board 70B includes a curved surface in at least a part. Specifically, the second support substrate 700B includes a curved surface concave toward the component transfer device 10 side.

The elastic sheet 100 of the component transfer device 10 can be bent along the curved surface of the circuit board 70B. At this time, the curvature of the component transfer device 10 can be adjusted by using the curved plate 30 . Specifically, the curved surface plate 30 matching the curved surface of the circuit board 70B is pressed against the second head portion 113 side of the holding pin 110 of the component transfer device 10 . The elastic sheet 100 is bent with the same curvature as the curved surfaces of the curved plate 30 and the circuit board 70B. Since the positions of the bottom surfaces of the first element 610R, the second element 610G, and the third element 610B are also aligned and curved, the first element 610R, the second element 610G, and the third element are relative to the circuit board 70B including the curved surface. The alignment of 610B is easier. Moreover, since the curvature of the component transfer apparatus 10 is fixed by the curved surface plate 30, the 1st component 610R, the 2nd component 610G, and the 3rd component 610B can be attached to the circuit board 70 stably.

The curved plate 30 can be made of the same material as the second support substrate 700B, but is not limited to this. The curved plate 30 only needs to be able to fix the bending of the component transfer device 10 .

As described above, according to another modification of the third embodiment, that is, the method for manufacturing a component module, the component 610 can also be released from the circuit board 70B including the curved surface concave toward the component transfer device 10 side. In the component transfer device 10 , the bottom surfaces of the components 610 are aligned because the adhesive portion 120 adjusts the height difference of the components 610 . In addition, by bending the component transfer device 10 using the curved plate 30, the curvature of the component transfer device 10 can be adjusted. Therefore, the alignment of the element 610 with respect to the circuit board 70B including the curved surface is facilitated. Moreover, since the curved surface plate 30 fixes the bending of the component transfer device 10, the component 610 can be stably mounted on the circuit board 70B. Therefore, if the device 610 is transferred to the circuit board 70B including the curved surface using the device transfer device 10 , the manufacturing operation and manufacturing cost of the device module can be reduced, and the yield can be improved.

As an embodiment of the present invention, each of the above-described embodiments can be implemented in an appropriate combination as long as they do not contradict each other. In addition, based on the display device of each embodiment, those skilled in the art can appropriately add, delete, or change the design, or add or omit steps or change the conditions, as long as the gist of the present invention is satisfied. scope of the present invention.

It should be understood that other effects that are different from the effects obtained by the above-described aspects of the embodiments, or those that can be easily predicted by those skilled in the art, can be obtained by the present invention as a matter of course.

10: Component transfer device 10A: Component transfer device 20: Component transfer device 20A: Component transfer device 30: Curved panel 60: Component substrate 70: circuit substrate 70A: circuit board 70B: circuit substrate 100: elastic sheet 100A: elastic sheet 101: Through hole 110: Hold Pin 110A: Hold pin 111: Shaft 112: 1st head 113: Head 2 120: Adhesive part 120A: Adhesive part 120B: 3rd adhesive part 120G: 2nd adhesive part 120R: 1st adhesive part 200: elastic sheet 200A: elastic sheet 201: Through hole 201A: Through hole 210: Hold Pin 210A: Hold Pin 211: Shaft 211A: Shaft 212: 1st Head 212A: Head 1 213: Head 2 213A: Head 2 220: Adhesion Department 220A: Adhesive part 600: 1st support substrate 610: Components 610B: 3rd element 610G: 2nd element 610R: 1st element 700: Second support substrate 700A: 2nd support board 700B: 2nd support board 710: Pixel area 710B: blue light-emitting pixel 710G: Green light-emitting pixels 710R: red light-emitting pixel 711: Pixel circuit 720: Driver circuit area 720G: Gate Driver Circuit 720S: Source Driver Circuit 721: Gate wiring 722: Source wiring 730: Terminal area 730T: Terminal part 731: Connection wiring 732: Connection wiring 790: Conductive Adhesive L1: Interval L2: Interval L3: Interval S100~400: Steps

1A is a schematic plan view of a component transfer device according to an embodiment of the present invention. 1B is a schematic plan view of the elastic sheet of the component transfer device according to one embodiment of the present invention. 1C is a schematic cross-sectional view of a component transfer device according to an embodiment of the present invention. 1D is a schematic cross-sectional view of a holding pin and an adhesive portion of the component transfer device according to one embodiment of the present invention. 1E is a schematic cross-sectional view showing a state in which the elastic sheet is stretched in the component transfer device according to one embodiment of the present invention. 2A is a schematic cross-sectional view of a component transfer device according to an embodiment of the present invention. 2B is a schematic cross-sectional view showing a state in which a component is picked up at an adhesive portion in the component transfer device according to one embodiment of the present invention. 2C is a schematic cross-sectional view showing a state in which the elastic sheet is stretched in the component transfer device according to one embodiment of the present invention. 3A is a schematic cross-sectional view of a component transfer device according to an embodiment of the present invention. 3B is a schematic cross-sectional view of the holding pin and the adhesive portion of the component transfer device according to one embodiment of the present invention. 3C is a schematic cross-sectional view showing a state in which the elastic sheet is stretched in the component transfer device according to one embodiment of the present invention. 4A is a schematic cross-sectional view of a component transfer device according to an embodiment of the present invention. 4B is a schematic cross-sectional view of the holding pin and the adhesive portion of the component transfer device according to one embodiment of the present invention. 4C is a schematic cross-sectional view showing a state in which the elastic sheet is stretched in the component transfer device according to one embodiment of the present invention. FIG. 5 is a schematic perspective view of an element substrate used in a method for manufacturing an element module according to an embodiment of the present invention. FIG. 6 is a block diagram showing the layout of the circuit board used in the method for manufacturing the device module according to one embodiment of the present invention. FIG. 7 is a flow chart of a manufacturing method of an element module according to an embodiment of the present invention. FIG. 8A is a schematic diagram showing a manufacturing method of an element module according to an embodiment of the present invention. FIG. 8B is a schematic diagram showing a manufacturing method of an element module according to an embodiment of the present invention. FIG. 8C is a schematic diagram showing a method of manufacturing a component module according to an embodiment of the present invention. FIG. 8D is a schematic diagram showing a manufacturing method of an element module according to an embodiment of the present invention. FIG. 8E is a schematic diagram showing a manufacturing method of an element module according to an embodiment of the present invention. FIG. 8F is a schematic diagram showing a manufacturing method of an element module according to an embodiment of the present invention. FIG. 8G is a schematic diagram showing a manufacturing method of an element module according to an embodiment of the present invention. FIG. 8H is a schematic diagram showing a manufacturing method of an element module according to an embodiment of the present invention. 9 is a schematic view showing a state before pressing a component transfer device having picked up components against a circuit board in the manufacturing method of the component module according to one embodiment of the present invention. 10 is a schematic view showing a state before pressing the component transfer device having picked up components against the circuit board in the manufacturing method of the component module according to one embodiment of the present invention.

10: Component transfer device

100: elastic sheet

101: Through hole

110: Hold Pin

120: Adhesive part

L1: Interval

Claims (19)

A component transfer device comprising: an elastic sheet including a first through hole and a second through hole; a first holding pin whose first shaft portion is inserted through the first through hole; and a second holding pin whose first through hole 2. The shaft portion is inserted through the above-mentioned second through hole; the first adhesive portion is provided on the above-mentioned first holding pin and adheres to the first element; and a second adhesive portion is provided on the above-mentioned second holding pin and adheres to the second element ; Through the expansion and contraction of the elastic sheet, the interval between the first holding pin and the second holding pin can be adjusted. The component transfer device of claim 1, wherein the material of each of the first adhesive portion and the second adhesive portion is an elastic material having low repulsion. The component transfer device according to claim 1, wherein the first adhesive portion and the second adhesive portion are deformed so that the bottom surface of the first component and the bottom surface of the second component substantially coincide, and the deformations are maintained. The component transfer device of claim 1, wherein the film thickness of the first adhesive portion and the film thickness of the second adhesive portion are different. The component transfer device according to claim 1, wherein the first shaft portion and the second shaft portion can float in the first through hole and in the second through hole, respectively. The component transfer device of claim 1, wherein each of the first through hole, the second through hole, the first shaft portion, and the second shaft portion includes a taper. The component transfer device of claim 1, wherein the material of the first holding pin and the second holding pin is different from the material of the first adhesive portion and the second adhesive portion. The component transfer device according to claim 1, further comprising a curved plate, and the elastic sheet is bent along the curved surface of the curved plate. The component transfer device according to any one of claims 1 to 8, wherein each of the first component and the second component is an LED. A manufacturing method of a component module, which makes an elastic sheet expand and contract to change the interval between a first holding pin inserted through a first through hole of the elastic sheet and a second holding pin inserted through the second through hole, and The first component and the second component on the first support substrate are adhered and picked up to each of the first adhesive portion provided on the first holding pin and the second adhesive portion provided on the second holding pin. According to the manufacturing method of the component module of claim 10, the elastic sheet is further expanded and contracted, the interval between the first holding pin and the second holding pin is changed, and the second support substrate is placed and released The above-mentioned first element adhered to the above-mentioned first adhesive portion and the second component adhered to the second adhesive portion. The method for manufacturing a component module according to claim 10, wherein the first adhesive portion and the second adhesive portion are deformed and held in such a way that the bottom surface of the first component and the bottom surface of the second component are substantially consistent, and are adhered and picked up. The said 1st element and the said 2nd element on the said 1st support substrate. The manufacturing method of the component module of claim 10, wherein the elastic sheet is bent along the curved surface of the second support substrate, and the first component and the second component are released on the second support substrate. The manufacturing method of the component module according to claim 10, wherein the elastic sheet is bent along the curved surface of the curved surface board which is substantially the same as the curvature of the curved surface of the second supporting substrate, and is placed on the second supporting substrate and the first supporting substrate is released. 1 element and the above-mentioned second element. A method for manufacturing a component module, comprising a first holding pin inserted through a first through hole of an elastic sheet and provided with a first adhesive portion, and a second through hole inserted through the elastic sheet and provided with a second The second holding pin of the adhesive portion adheres and picks up the first element and the second element on the first support substrate, and the elastic sheet is stretched and contracted, so that the interval between the first holding pin and the second holding pin is changed, And on the 2nd support substrate, the said 1st element and the said 2nd element are mounted and released. The manufacturing method of a component module according to claim 15, wherein the first adhesive portion and the second adhesive portion are deformed and held in such a way that the bottom surface of the first component and the bottom surface of the second component are substantially consistent, and are adhered and picked up. The said 1st element and the said 2nd element on the said 1st support substrate. The manufacturing method of the component module of claim 15, wherein the elastic sheet is bent along the curved surface of the second support substrate, and the first component and the second component are released on the second support substrate. The manufacturing method of the component module according to claim 15, wherein the elastic sheet is bent along the curved surface of the curved surface board whose curvature is substantially the same as the curvature of the curved surface of the second supporting substrate, placed on the second supporting substrate, and the first supporting substrate is released. 1 element and the above-mentioned second element. The method for manufacturing an element module according to any one of claims 10 to 18, wherein each of the first element and the second element is an LED.

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