JP2001331121A - Enlarged arrangement method for microchip - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device for integrating and manufacturing transistor(TR) segments to be highly effected by defect to a small processing area and spatially mounting the respective TRs onto a substrate. SOLUTION: This device consists of >=1 means for holding microchips formed with the TRs and >=1 connecting means having functions to interconnect the microchip holding means and stretching the same and allows the enlarged arrangement of the microchips by impressing energy to the connecting means from outside and parting the microchip holding means from each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a device in which a large number of elements such as minute electric and optical elements are regularly arranged.

[0002]

2. Description of the Related Art Liquid crystal panel manufacturing processes include cleaning, film formation,
It consists of resist coating, exposure, development, etching, resist stripping, and repetition of these. Especially in the film forming process and the etching process that require a vacuum accompanying the enlargement of the liquid crystal display device, a larger device is used, the whole substrate is housed in the chamber, and the batch processing is performed over the entire surface. are doing.

[0003]

According to the above-mentioned conventional manufacturing method, the following problems are raised, particularly as the size of the liquid crystal substrate increases.

(1) Defects in the manufacture of semiconductor devices are as follows:
It is known that it occurs with a certain probability per unit area. Therefore, in the production of large liquid crystal substrates,
Since the processing area is large, the rate of occurrence of picture element defects is high. On the other hand, the amount of redundant wiring that can be arranged in advance to relieve picture element defects is limited. Therefore, in the case of a large-sized substrate, the quantity of in-process products to be discarded without being able to rescue picture element defects increases despite the high price.

(2) According to the conventional manufacturing method, large-sized substrates are collectively stored and processed in all the devices, so that the size of the devices cannot be avoided. Clean rooms, on the other hand, are always expensive and maintain a high degree of cleanliness. Therefore, the increase in the footprint of the apparatus is not limited to preventing the introduction of other apparatuses in a small clean room, but directly increases the clean room maintenance cost.

(3) As the size of the processing chamber increases with the size of the liquid crystal substrate, the inside of the chamber is evacuated to a high degree of vacuum required for the process. A fast, large-capacity vacuum pump must be introduced. As a result, the production tact time is increased, which is a factor of reducing the cost of the product.

[0007]

In order to solve the above problems, a switching transistor for turning on and off each of the picture elements and a liquid crystal substrate are manufactured by different processes, and the switching transistor is manufactured. A manufacturing method for transferring each picture element has been proposed. In this method, a transistor portion which is strongly affected by a defect is integrated and manufactured on a small processing area, so that the transistor portion is hardly affected by contamination and the like, and a high yield rate can be manufactured. In the present application, the above-described problems (1) to (3) of the large-sized liquid crystal manufacturing apparatus effectively carry out the transfer of the transistor.
Is provided.

The first invention of the present invention comprises at least one means for holding a microchip, and at least one connection means having a function of connecting and extending the microchip holding means with each other. By applying energy from outside to the microchip, the microchip holding means are separated from each other, and the microchip can be enlarged and arranged.

According to a second aspect of the present invention, the connecting means of the first aspect comprises an airtight elastic film and a liquid layer containing bubbles, and the bubbles are expanded by external energy to separate the microchip holding means from each other. At the very least, the microchip can be expanded.

According to a third aspect of the present invention, the connecting means of the first aspect comprises a gas-tight elastic film and a low-boiling substance, and the low-boiling substance is vaporized by external energy to expand the microchip holding means. The microchips are spaced apart from each other, allowing for an expanded arrangement of the microchips.

[0011] A fourth invention of the present invention is characterized in that the low-boiling substance of the third invention includes a micro-member that absorbs light energy, and heats the micro-member that absorbs light energy by external energy to reduce the low-boiling substance. The microchip is expanded by being vaporized to separate the microchip holding means from each other, thereby enabling the microchip to be expanded.

According to a fifth aspect of the present invention, the connecting means of the first aspect comprises an elastic member, and the microchip holding means is separated from each other by stretching the outer peripheral portion in a direction away from the center, thereby enlarging the microchip. Enable placement.

According to a sixth aspect of the present invention, the microchip holding means of the first aspect is formed of a hollow member, and allows the microchip to be adsorbed by suction, thereby enabling an enlarged arrangement of the microchip.

According to a seventh aspect of the present invention, the microchip holding means of the first aspect comprises a light transmissive member and an adhesive layer disposed on a surface in contact with the microchip. Is applied, the adhesive force is lost, the microchip is detached, and the microchip can be expanded and arranged.

According to an eighth invention of the present invention, the microchip holding means of the first invention comprises a heat conductive member, holds the microchip by surface tension due to liquid immersion, and loses the surface tension by heating to hold the microchip. Detachable, allowing for expanded placement of the microchip.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.

(First Embodiment) FIG. 1 shows a first embodiment of the present invention. The connecting means for connecting the microchip holding means 1 to each other comprises an airtight elastic film 3, a liquid layer 4, and bubbles 5 contained in the liquid layer. The hermetic elastic film 3 has a structure sandwiching the liquid layer 4 containing air bubbles from above and below, and mutually restrains the adjacent microchip holding means 1.

The microchip holding means are arranged in a one-dimensional array, and the pitch between the holding means is made equal to the pitch of the switching transistors formed on the wafer. The microchip holding means is a microchip holding means 11 having a hollow structure as shown in FIG. 5, and a suction pad 12 is provided at the tip, and the transistor 13 is connected to the microchip holding means by a suction means (not shown). Let each adsorb.

The present embodiment has the above-described structure, and the enlarged arrangement according to the structure is performed in the following procedure. (1) The switching transistor 2 formed on the wafer is divided. (2) Positioning is performed with the connecting means contracted. (3) Each of the microchip holding means is brought into contact with each transistor in one-to-one correspondence. (4) The plurality of transistors 2 are respectively sucked to the suction pads 12 of the plurality of microchip holding units 11 by a suction unit (not shown). (5) The adhesive strength of the sheet is reduced by, for example, heating the expanded sheet to which the wafer on which the transistor is formed is attached, and the sheet is separated from the transistor. (6) The entire system including the microchip holding means holding the transistor and the connecting member is arranged on the air ejection table 20. (FIG. 1 b) (7) Irradiate the connecting means with a laser beam, infrared ray, or the like as the external energy 6. (8) The bubbles 5 existing in the connecting means expand due to the external energy, and the surrounding liquid evaporates and vaporizes to increase the volume. As a result, the adjacent microchip holding means 1 are separated from each other. (9) The movement between the microchip holding means is stopped at a distance where the internal pressure of the bubble and the tension of the airtight elastic film 3 are balanced. (10) The enlarged arrangement means and the liquid crystal substrate are aligned with each other, and the switching transistor is brought into contact with the liquid crystal substrate. (11) Release the suction means (not shown) and transfer the held switching transistor to the liquid crystal substrate.

(Second Embodiment) FIG. 2 shows a second embodiment of the present invention. In FIG. 2A, the connecting means for connecting the microchip holding means 1 to each other comprises an airtight elastic film 3 and a liquid layer 7. The airtight elastic film 3 has a structure sandwiching the liquid layer 7 from above and below, and the adjacent microchip holding means 1
To each other. The liquid layer 7 is composed of a liquid having a low boiling point,
It is easily vaporized by infrared rays or laser beam 6 to separate the microchip holding means. (FIG. 2B) In this embodiment, an alcohol-based solvent is used as the low boiling point liquid. Further, in the liquid layer, a black dye is melted in order to increase the efficiency of absorbing heat energy.

The chip transfer method using the present connecting means is the same as that in the first embodiment, and therefore, the description is omitted.

(Third Embodiment) FIG. 3 shows a third embodiment of the present invention. In FIG. 3A, the connecting means for connecting the microchip holding means 1 to each other comprises an airtight elastic film 3 and a liquid layer 7. The airtight elastic film 3 has a structure sandwiching the liquid layer 8 from above and below, and the adjacent microchip holding means 1
To each other. The liquid layer 8 is formed by diffusing a black heat absorbing member (particle) 9 in the liquid in order to increase the efficiency of absorbing heat energy. Infrared and laser beam 6
Irradiates the air bubbles stably on the heat absorbing member as a nucleus, and separates the microchip holding means.
(FIG. 3 (b)) The chip transfer method using the connecting means is the same as that of the first embodiment, and therefore the description is omitted.

(Fourth Embodiment) FIG. 4 shows a fourth embodiment of the present invention. In FIG. 4A, the connecting means for connecting the microchip holding means 1 to each other comprises a uniform elastic elastic member 10.

The microchip holding means are arranged in a one-dimensional array, and the pitch between the holding means is made equal to the pitch of the switching transistors formed on the wafer. The microchip holding means has a hollow structure as shown in FIG. 5, and a suction pad is provided at the tip.

The present embodiment has the above-described structure, and the enlarged arrangement according to this embodiment is performed in the following procedure. (1) The switching transistor 2 formed on the wafer is divided. (2) Positioning is performed with the connecting means contracted. (3) Each of the microchip holding means is brought into contact with each transistor in one-to-one correspondence. (4) The transistor 2 is turned on by a suction means (not shown).
On the suction pad 12 of the microchip holding means 11. (5) The adhesive strength of the sheet is reduced by a method such as heating the expanded sheet to which the wafer on which the transistor is formed is attached, and the sheet is separated from the transistor. (6) The entire system including the microchip holding means holding the transistor and the connecting member is arranged on the air ejection table 20. (FIG. 4B) (7) As the external energy 21, a force is applied to extend the outer peripheral portion of the connecting means in a direction away from the center. (8) Due to the external energy, the connecting means composed of the homogeneous elastic expansion and contraction member is similarly stretched in various places,
The microchip holding means can be separated from each other. (9) The mutual movement of the microchip holding means stops in a state where the tension of the elastic elastic member and the tensile force as external energy are balanced. (10) The enlarged arrangement means and the liquid crystal substrate are aligned with each other, and the switching transistor is brought into contact with the liquid crystal substrate. (11) Release the suction means (not shown) and transfer the held switching transistor to the liquid crystal substrate.

(Fifth Embodiment) FIG. 6 is a view showing another embodiment relating to a contact portion for holding a microchip by the microchip holding means of the present invention. In this embodiment, the microchip holding means 14 is made of a transparent polycarbonate resin, and the front end is coated with an adhesive 15 similar to the adhesive used for the expanded sheet. The pressure-sensitive adhesive has a property that the pressure-sensitive adhesive strength is reduced by heating.

This embodiment is an alternative to the suction type micro component holding means of the above-mentioned embodiments (1) to (4). After the switching transistor 2 is enlarged on the liquid crystal substrate, the laser beam 16 is passed through the transparent member 14. Is applied to the adhesive member to reduce the adhesive force and detach the transistor chip.

(Sixth Embodiment) FIG. 7 is a view showing another embodiment relating to a contact portion for holding a microchip by the microchip holding means of the present invention. In this embodiment, the microchip holding means 17 is a columnar member made of electrolytic copper having good thermal conductivity. The tip of the cylindrical member is immersed in liquid when holding the transistor chip (1).
8), contact the transistor chip in a wet state,
In this method, a transistor chip is held using surface tension.

After the switching transistor is disposed on the liquid crystal substrate in an enlarged manner, the other end of the transistor holding portion is heated to lose the surface tension, and the transistor chip is detached.

[0030]

According to the present invention, the switching transistor portion of the liquid crystal panel is manufactured by a small wafer process with a high yield rate, and this can be expanded and arranged.

(1) The occurrence of defects due to the processing of large substrates can be avoided, and expensive substrates are not discarded.

(2) Since a large liquid crystal substrate can be manufactured by a small process, a clean room can be effectively utilized.

(3) Since the capacity of the chamber required for the process is small, the disposal time can be shortened, and the tact time can be shortened. Furthermore, the consumption of the reactive gas required for the process can be reduced.

As described above, the present invention has a remarkable effect in manufacturing a large liquid crystal panel.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a cross section in a stretching direction of a first embodiment.

FIG. 2 is a diagram illustrating a cross section in a stretching direction of a second embodiment.

FIG. 3 is a diagram illustrating a cross section in a stretching direction of a third embodiment.

FIG. 4 is a diagram illustrating a cross section in a stretching direction of a fourth embodiment.

FIG. 5 is a diagram showing a structure of a suction type microchip holding means.

FIG. 6 is a diagram illustrating a structure of an adhesive type microchip holding means.

FIG. 7 is a diagram showing a structure of a surface tension type microchip holding means.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Microchip holding means 2 Microchip 3 Airtight elastic film 4 Liquid layer 5 Bubbles 6 External energy 7 Liquid layer 8 Liquid layer 9 Particle 10 Elastic expansion / contraction member 11 Microchip holding means 12 Suction pad 14 Microchip holding means 15 Adhesive 17 Micro Tip holding means 18 Liquid immersion part 20 Air ejection table 21 External energy

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Motoyuki Suzuki Inventor F-term in Sharp Co., Ltd. 22-22 Nagaikecho, Abeno-ku, Osaka-shi, Osaka 2H092 JA24 MA31 NA13 5G435 AA17 BB12 GG00 KK05

Claims (8)

[Claims] The present invention comprises at least one means for holding a microchip, and at least one connecting means for interconnecting the microchip holding means and having a function of extending, wherein the connecting means has an external connection. Characterized in that the microchip holding means are separated from each other by applying energy from the microchip. 2. The connecting means according to claim 1, comprising a gas-tight elastic film and a liquid layer containing air bubbles, wherein the air bubbles are expanded by external energy or a liquid is injected into the water-tight elastic film. And enlarging and disposing the microchip holding means from each other. 3. The connecting means according to claim 1, comprising an airtight elastic film and a low-boiling substance, the low-boiling substance is vaporized by external energy to expand the microchip holding means and separate the microchip holding means from each other. A method for enlarging and arranging a microchip, characterized in that: 4. A method for enlarging and arranging a small member, wherein the low-boiling substance according to claim 3 includes a small member that absorbs light energy. 5. The connecting means according to claim 1, wherein the connecting means comprises a uniform elastic elastic member, and the microchip holding means is separated from each other by stretching an outer peripheral portion in a direction away from the center. How to enlarge and arrange chips. 6. A method for enlarging and arranging microchips according to claim 1, wherein said microchip holding means is made of a hollow member and attracts said microchips by suction, static electricity or surface tension. 7. The microchip holding means according to claim 1, comprising a light-transmitting member and an adhesive layer provided on a surface in contact with the microchip, wherein the adhesive layer applies light energy. A microchip is detached by losing an adhesive force due to the method. 8. The microchip holding means according to claim 1, wherein the microchip is held by surface tension due to liquid immersion, and the surface tension is lost by heating to detach the microchip. Expansion arrangement method.