KR102340900B1 - transfer method of discrete devices using anchor - Google Patents

Abstract

The present invention comprises the steps of: forming a plurality of individual elements on a source substrate; forming an anchor including a protrusion protruding outward from the circumference of the individual elements on top of each of the individual elements; forming a sacrificial layer to expose the protrusion on top of transferring at least one of the individual elements into the deformable film by separating the source substrate from the deformable film; removing the sacrificial layer formed on the anchor of each of the individual elements to form an empty space in the deformable film; In addition, the step of supporting the protrusion of the anchor on a part of the deformable film, the step of attaching the interposer substrate through the adhesive layer formed as a whole on the lower surfaces of the individual elements, the anchor and the deformable film, and the part on the anchor without breaking the anchor separating the supported deformable film from the interposer substrate to leave at least one individual element on an adhesive layer on the interposer substrate, and transferring the at least one individual element remaining on the interposer substrate to the wiring board.

Description

Transfer method of discrete devices using anchor

The present invention relates to a method of transferring (or transferring) individual devices (individual components or individual chips), and more particularly, to a plurality of individual devices simultaneously or selectively to a plurality of individual devices or one individual device to a target substrate (or a target substrate), for example, a wiring substrate (or a display substrate), etc. relates to a transfer method for rapidly transferring a large amount.

The present invention is derived from research conducted and supervised by LC Square Co., Ltd. as part of the Ministry of Trade, Industry and Energy's industrial technology innovation project (electronic parts industry core technology development project). [Research period: 2019.01.01~2019.12.31, Host institution: Korea Institute of Machinery and Materials, Research project name: Development of core technology for active driving type MicroLED display with resolution of 200 PPI or more and transparency of 70 or more for free-curved automobile windows, task identification number: 20000619]

As electrical and electronic technologies are rapidly developed, it may be necessary to converge various individual devices with different technical characteristics to meet the needs of a new era and the needs of various consumers.

Accordingly, individual devices (or individual components) manufactured based on different technologies are manufactured on a source substrate, and then transferred (or transferred) in large quantities to a target substrate, such as a wiring substrate (or display substrate) without damage, and integrated. How you can do it is very important.

SUMMARY OF THE INVENTION An object of the present invention is to provide a transfer method for rapidly transferring individual elements to a target substrate in large quantities without damage by using an anchor.

In order to solve the above problems, a method for transferring individual devices according to an embodiment of the present invention includes forming a plurality of individual devices on a source substrate; forming an anchor on each of the individual elements, the anchor including a protrusion protruding outward from the circumference of the individual elements; forming a sacrificial layer to expose the protrusion on the anchor and each of the individual elements; embedding at least one of the individual elements into the deformable film by seating a deformable film on the entire surface of the source substrate having the individual elements on the anchor, the sacrificial layer formed thereon; transferring at least one of the individual elements into the deformable film by separating the source substrate from the deformable film; removing the sacrificial layer formed on the anchor of each of the individual elements to form an empty space in the deformable film, and the protrusion of the anchor being supported on a portion of the deformable film; attaching an interposer substrate to the individual elements, the anchor, and an adhesive layer formed entirely on lower surfaces of the deformable film; separating the deformable film partially supported by the anchor from the interposer substrate without breaking the anchor, leaving the at least one individual element on the adhesive layer on the interposer substrate; and transferring the at least one individual element remaining on the interposer substrate to a wiring substrate.

In one embodiment of the present invention, at least one protrusion of the anchor may be formed in a portion of the circumference of the individual element. A plurality of the protrusions of the anchor may be symmetrically formed on a portion of the circumference of the individual element.

In one embodiment of the present invention, the sacrificial layer may be formed on the anchor to completely cover the upper surface of the individual device. The deformable film may be composed of a thermoplastic resin or a photoplastic resin.
In one embodiment of the present invention, in the step of separating the deformable film partially supported on the anchor from the interposer substrate without breaking the anchor, the individual elements and the adhesive force between the anchor and the adhesive layer is determined by the anchor The deformable film can be easily separated from the interposer substrate by making it larger than the adhesive force between the and the deformable film.

In an embodiment of the present invention, embedding at least one of the individual elements into the deformable film includes: forming the deformable film on a support substrate; and seating the deformable film formed on the support substrate on the source substrate including the individual elements in which the sacrificial layer is formed on the anchor.

In one embodiment of the present invention, after transferring the first individual element on which the sacrificial layer is formed on the anchor into the deformable film, embedding the individual element on which the sacrificial layer is formed on the anchor; By repeating the step of transferring the individual elements having the sacrificial layer formed on the anchor into the deformable film, second to n-th individual elements (n>2, n is a positive integer) are further embedded into the deformable film. can do it

In one embodiment of the present invention, the source substrate is a deformable film in which the individual device having the sacrificial layer formed on the anchor is embedded, and laser lift-off or chemical lift-off method can be separated.

A method of transferring individual elements according to an embodiment of the present invention includes transferring first to third individual elements separated from each other and having an anchor and a sacrificial layer formed thereon into a deformable film; forming an empty space in the deformable film by removing the sacrificial layer formed on the first to third individual elements; forming an adhesive layer as a whole on the lower surface of the deformable film including the first to third individual elements on which the anchor is formed, wherein the anchor is partially adhered to the adhesive layer and the deformable film; attaching an interposer substrate to a lower surface of the adhesive layer; separating the deformable film partially supported by the anchor from the interposer substrate without breaking the anchor, leaving the first to third individual elements on the adhesive layer on the interposer substrate; and transferring at least one of the first to third individual elements formed on the adhesive layer on the interposer to a wiring board.
The anchor includes protrusions protruding outward of the first to third individual elements, and the first to third individual elements formed on the adhesive layer on the interposer substrate are respectively a red light emitting element, a green light emitting element and It is a blue light emitting device.

In one embodiment of the present invention, in the step of separating the deformable film partially supported by the anchor from the interposer substrate without breaking the anchor, the first to third individual elements and the protrusion of the anchor The adhesive force between the adhesive layers may be greater than the adhesive force between the protruding portion of the anchor and the deformable film, so that the deformable film may be easily separated from the interposer substrate.
In one embodiment of the present invention, at least one protrusion may be formed in a portion of the circumference of the first to third individual elements.

The present invention uses an anchor partially glued in a deformable film to transfer individual components (individual components or individual chips) to an interposer substrate, and then transfers a plurality of individual components simultaneously, or a plurality of individual components or one individual component. may be selectively transferred to the wiring board. Accordingly, according to the present invention, it is possible to rapidly transfer individual devices in large quantities to a target substrate (or a target substrate), for example, a wiring substrate (or a display substrate).

1 to 5 are diagrams schematically illustrating a method of transferring individual devices according to an embodiment of the present invention.
6 and 7 are views summarizing a transfer method of individual devices according to an embodiment of the present invention.
8A and 8B and FIGS. 9 to 14 are cross-sectional views illustrating a method of transferring individual devices according to an exemplary embodiment of the present invention.
15 to 20 are cross-sectional views for explaining a method of transferring individual devices according to an embodiment of the present invention.
21 to 24 are plan views for explaining an anchor arrangement method of individual elements according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments of the present invention may be implemented by only one, and also, the following embodiments may be implemented by combining one or more. Accordingly, the technical spirit of the present invention is not construed as being limited to one embodiment.

1 to 5 are diagrams schematically illustrating a method of transferring individual devices according to an embodiment of the present invention.

1 and 2 , a plurality of individual devices 200 are formed on a source substrate 100 . The source substrate 100 is a sapphire substrate, a silicon (Si) substrate, a gallium arsenide (GaAs) substrate, a gallium phosphate (GaP) substrate, a gallium arsenide (GaAsP) substrate, a silicon carbide (SiC) substrate, a potassium nitrogen (GaN) substrate. , an aluminum nitrogen (AlN) substrate, a zinc oxide (ZnO) substrate, and a magnesium oxide (MgO) substrate may be used.

The source substrate 100 may be a semiconductor substrate. The source substrate 100 may be a wafer. The individual devices 200 may be any one of an electronic device, an optical device, a sensor device, a diode device, a transistor device, a laser device, a PN junction device, and a MEMS device. The individual components 200 may be referred to as individual components or individual chips.

In this embodiment, a light emitting device, for example, a micro LED (light emitting diode) device will be used as an example of the individual devices 200 . The micro LED device may refer to an LED device having a size of 100 μm X 100 μm or less. In order to implement a full-color display using the micro LED elements 210, 220, and 230, as shown in FIG. 1, the red micro LED elements 210 having different emission wavelengths on three different source substrates 100, respectively. , a green micro LED device 220 , and a blue micro LED device 230 may be manufactured. The emission wavelength may vary depending on the semiconductor bandgap.

The blue micro LED device 230 may be manufactured based on GaN. The green micro LED device 220 is GaN-based, but may be manufactured by adjusting the band gap by different from the blue micro LED device 230 in the composition ratio of the quantum well structure material (InGaN) that is the light emitting region. The red micro LED device 210 may be manufactured based on GaAs.

3 to 5 , in order to apply the red micro LED device 210 , the green micro LED device 220 , and the blue micro LED device 230 manufactured on different source substrates 100 as display pixels , the red micro LED device 210 , the green micro LED device 220 , and the blue micro LED device 230 are transferred to the interposer substrate 400 or the target substrate on which the adhesive layer 410 is formed. The interposer substrate 400 may be referred to as an intermediate substrate, a temporary substrate, or an interposer.

In FIG. 3 , the red micro LED device 210 , the green micro LED device 220 , and the blue micro LED device 230 are all transferred onto one interposer substrate 400 . However, if necessary, the red micro LED device 210 , the green micro LED device 220 , and the blue micro LED device 230 may be transferred to the three interposer substrates, respectively.

When transferring (or transferring) the red micro LED device 210 , the green micro LED device 220 , and the blue micro LED device 230 to the interposer substrate 400 , The micro LED elements 210 , 220 , and 230 are not transferred to the interposer substrate 400 . In addition, when the micro LED elements 210 , 220 , 230 manufactured on the source substrate 100 are transferred to the interposer substrate 400 , the number of the micro LED elements 210 , 220 , 230 is the micro LED element. (210, 220, 230) to adjust the interval (or pitch), etc.

Subsequently, the red micro LED element 210 , the green micro LED element 220 , and the blue micro LED element 230 transferred to the interposer substrate 400 are connected to the wiring board 500 or target substrate, that is, the display substrate. to realize a full-color display.

As described above, when the red micro LED device 210 , the green micro LED device 220 , and the blue micro LED device 230 are transferred to the three interposer substrates, respectively, the red micro LED on each interposer substrate The device 210 , the green micro LED device 220 , and the blue micro LED device 230 may be transferred to a wiring board 500 or a target board, that is, a display board to implement a full color display.

However, the number of red micro LED devices 210 , green micro LED devices 220 , and blue micro LED devices 230 manufactured on different source substrates 100 may be hundreds of thousands to millions. In some embodiments, the number of red micro LED devices 210 , green micro LED devices 220 , and blue micro LED devices 230 manufactured on different source substrates 100 may be millions or more.

The present invention uses hundreds of thousands or millions of red micro LED devices 210, green micro LED devices 220, and blue micro LED devices 230 as a target substrate, that is, interposer substrate 400, or It is possible to transfer a large amount and high speed to the wiring board 500 .

6 and 7 are views summarizing a transfer method of individual devices according to an embodiment of the present invention.

Specifically, a method for transferring a large amount of individual devices 200 to the interposer substrate 400 or the wiring substrate 500 may be classified into FIGS. 6 and 7 .

Referring to FIG. 6 , individual devices 200 , that is, a red micro LED device 210 , a green micro LED device 220 , and a blue micro LED device 230 are formed on each of the three source substrates 100 . . Then, the individual devices 200 , that is, the red micro LED device 210 , the green micro LED device 220 , and the blue micro LED device 230 are individually mass-transferred to the three interposer substrates 400 .

Subsequently, the individual devices 200 transferred to the three interposer boards 400, that is, the red micro LED device 210, the green micro LED device 220, and the blue micro LED device 230, are connected to the wiring board 500. ) can be individually mass-transcribed.

Referring to FIG. 7 , individual devices 200 , that is, a red micro LED device 210 , a green micro LED device 220 , and a blue micro LED device 230 are formed on each of the three source substrates 100 . . Then, the individual devices 200 , that is, the red micro LED device 210 , the green micro LED device 220 , and the blue micro LED device 230 are mass-transferred onto one interposer substrate 400 .

Subsequently, the individual devices 200 , that is, the red micro LED device 210 , the green micro LED device 220 , and the blue micro LED device 230 transferred to one interposer board 400 are connected to the wiring board 500 . ) can be integrated and mass-transferred. The transfer method of individual elements shown in FIGS. 1 to 7 may be applied to the present invention described below.

8A and 8B and FIGS. 9 to 14 are cross-sectional views illustrating a method of transferring individual devices according to an exemplary embodiment of the present invention.

Referring to FIGS. 8A and 8B , FIG. 8B is an enlarged view of the individual devices 200 in which the sacrificial layer 203 is formed on the anchor 201 of FIG. 8A . Individual devices 200 spaced apart from each other are formed on the source substrate 100 . The individual elements 200 may include an electrode 202 . In this embodiment, the source substrate 100 may be a sapphire substrate. The source substrate 100 may be a growth substrate on which material layers constituting the individual devices 200 are grown. The individual devices 200 may be micro LED devices as described above.

An anchor 201 including a protrusion EP protruding outward from the circumference of the individual elements 200 is formed on each of the individual elements 200 . The anchor 201 may be formed of an insulating layer. The anchor 201 may be formed to entirely cover the upper surfaces of the individual elements 200 except for the electrode 202 . The anchor 201 may be formed to cover only a portion of the upper surface of the individual elements 200 .

A sacrificial layer 203 is formed to expose the protrusion EP on the anchor 201 and each of the individual elements 200 . The sacrificial layer 203 may be formed as an insulating layer that has an etching selectivity compared to that of the deformable film 300 or the anchor 201 and can be easily removed. The sacrificial layer 203 covers the top surfaces of the anchor 201 and the individual elements 200 as a whole except for the protrusion EP of the anchor 201 . The support substrate 310 to which the deformable film 300 is attached may be positioned on the source substrate 100 including the individual elements 200 in which the sacrificial layer 203 is formed on the anchor 201 .

In other words, after attaching the deformable film 300 on the support substrate 310 , the support substrate 310 is attached to the anchor 201 with the deformable film 300 as the lower portion and the sacrificial layer 203 is formed on the individual device. It may be positioned (settled) on the source substrate 100 including the elements 200 . The deformable film 300 may be a material deformed by light or heat, as will be described later. The deformable film 300 may be a material that is deformed corresponding to the shape of the individual elements 200 during each embedding process to be described later.

Referring to FIG. 9 , the deformable film 300 attached to the support substrate 310 is incorporated on the source substrate 100 including the individual elements 200 in which the sacrificial layer 203 is formed on the anchor 201 . do. In this case, the individual elements 200 in which the sacrificial layer 203 is formed on the anchor 201 on the source substrate 100 is embedded into the deformable film 300 .

The deformable film 300 is a flowable material that can be integrated by embedding the individual elements 200 and fixing them to some extent. The deformable film 300 may be a material that is deformed by light or heat and can control the degree of deformation or the number of deformations. The deformable film 300 may be a material that can be freely deformed by light or heat even by a basic (primary) embedding process and an additional (secondary) embedding process. In some embodiments, the deformable film 300 may be formed of, for example, a thermoplastic or photoplastic resin. In some embodiments, the deformable film 300 may use a thermosetting or photocurable resin capable of a partial curing process.

The deformable film 300 is formed in the form of a film or provided in a fluid state to be seated on the source substrate 100 including the individual elements 200 in which the sacrificial layer 203 is formed on the anchor 201 or laminated. Or it may be formed by coating. The deformable film 300 is seated in an accurate position on the source substrate 100, and the source substrate ( 100) may be seated on the top.

Since it is preferable to stably embed the individual elements 200 in which the sacrificial layer 203 is formed on the anchor 201 in the deformable film 300 , the individual elements in which the sacrificial layer 203 is formed on the anchor 201 . It may be preferable to be formed thicker than the thickness of (200). In some embodiments, the deformable film 300 may have a thickness of at least 100 μm or more. In some embodiments, the deformable film 300 may have a thickness of at least 10 μm or more. In some embodiments, the deformable film 300 may have a thickness of 10 μm to 100 μm.

However, in some cases, the thickness of the deformable film 300 may be appropriately adjusted under the embedding process environment because embedding and integration may be made on or near the surface of the deformable film 300 .

In some embodiments, the deformable film 300 may include polyethylene, polypropylene, acrylic resin, polyamide resin, polyimide, dry film photoresist (DFR), epoxy acrylate, urethane acrylate, polyester acrylate, or the like. have.

10 and 11 , the deformable film 300 in which the individual devices 200 in which the sacrificial layer 203 is formed on the anchor 201 from the source substrate 100 are embedded may be separated from each other. 11 illustrates a state in which the source substrate 100 is separated.

Separation of the deformable film 300 including the individual elements 200 in which the sacrificial layer 203 is formed on the source substrate 100 and the anchor 201 is laser-lift-off or chemical lift-off. (Chemical-lift-off) method can be performed. Here, a process of separating the deformable film 300 including the embedded individual elements 200 from the source substrate 100 by the laser gift-off method will be described.

As shown in FIG. 10 , a laser 205 is applied to the source substrate 100 . In this case, the adhesive force between the source substrate 100 and the deformable film 300 is lowered, so that the sacrificial layer 203 is formed on the anchor 201 from the source substrate 100 and includes the embedded individual elements 200 . The deformable film 300 may be separated.

In other words, the laser irradiated from the rear surface of the source substrate 100 supplies energy between the source substrate 100 and the individual devices 200 in which the sacrificial layer 203 is formed on the anchor 201 to form the anchor 201 . The individual device 200 on which the sacrificial layer 203 is formed is separated from the source substrate 100 .

If the source substrate 100 is a transparent sapphire substrate, the source substrate 100 is transparent to light (it has a band gap in which light is not absorbed), and individual devices 200 made of a nitrogen compound, etc. are opaque to light. The individual device 200 is separated from the source substrate 100 by using a phenomenon in which energy is concentrated on the surface of the individual device 200 (between the source substrate 100 and the individual device 200 ).

When the deformable film 300 is formed on the support substrate 310 , hold the support substrate 310 and separate the deformable film 300 from the source substrate 100 , or the deformable film 300 without the support substrate 310 . When formed alone, the deformable film 300 is peeled and separated from the source substrate 100 . For convenience of peeling, an adhesive member such as an adhesive roller may be used.

Through this process, as shown in FIG. 11 , the individual elements 200 having the sacrificial layer 203 formed on the anchor 201 may be transferred into the deformable film 200 .

12 and 13 , as shown in FIG. 12 , the sacrificial layer 203 formed on the anchor 201 of each of the individual elements 200 is removed to remove the empty space 206 in the deformable film 300 . to form The empty space 206 may be an internal public space. By the formation of the empty space 206 , the protrusion EP of the anchor 201 may be supported on a portion of the deformable film 300 .

As shown in FIG. 13 , an interposer substrate partially adhered to the anchor 201 while interposing an adhesive layer 410 on the lower surface of the individual elements 200 , the anchor 201 and the deformable film 300 ( 400) is attached. More specifically, an adhesive layer 410 is formed on the lower surface of the deformable film 300 including the individual elements 200 embedded and provided with the anchor 201 . The adhesive layer 410 may be formed by coating an adhesion promoter resin, such as polyimide, photo resist (PR), or SU-8.

Next, the interposer substrate 400 is attached to the lower surface of the adhesive layer 410 . When using the interposer substrate 400 on which the adhesive layer 410 is formed, the interposer substrate 400 on which the adhesive layer 410 is formed is embedded and the deformable film 300 including the individual elements 200 having an anchor. It can be attached directly to the bottom.

The interposer substrate 400 may be any one of a semiconductor substrate, a polymer substrate, glass, metal, paper, and an insulator according to the purpose or purpose of the individual device 200 . The interposer substrate 400 may use an organic or inorganic substrate, a rigid or flexible substrate, or the like. Also, the interposer substrate 400 may be a thin film deposited on a rigid substrate.

The interposer substrate 400 may be intermediately cured with light or heat and fully cured after transfer is completed. In an embodiment, the interposer substrate 400 may be formed of a flexible substrate material such as polyethylene terephthalate (PET), polydimethylsiloxane (PDMS), or polyimide (PI) through spin coating and heat treatment.

The adhesive force between the adhesive layer 410 and the interposer substrate 400 may be greater than the adhesive force between the deformable film 300 and the anchor 201 on the individual element 200 integrated in the deformable film. In addition, the adhesive force between the adhesive layer 410 and the individual element 200 integrated in the deformable film 300 may be greater than the adhesion between the deformable film 300 and the anchor 201 on the individual element 200 .

Referring to FIG. 14 , the deformable film 300 and the support substrate 310 partially supported by the anchor 202 are separated from the individual elements 200 adhered to the adhesive layer 410 on one surface of the interposer substrate 400 . make it Since the adhesive force between the adhesive layer 410 and the individual elements 200 integrated inside the deformable film 300 is greater than the adhesive force between the deformable film 300 and the anchors 201 on the individual elements 200, the deformable film 300 ) and the support substrate 310 can be easily separated from the interposer substrate 400 . In this case, as shown in FIG. 14 , the individual elements 200 including the anchor 201 may be left apart from each other on the adhesive layer 410 formed on one surface of the interposer substrate 400 .

8 to 14 described above have described a transfer method of the same plurality of individual devices 200, for example, three green micro LED devices (220 in FIGS. 1 and 3) for convenience. In addition, only one of the individual elements 200 included in the deformable film 300 in FIG. 10 may be lifted off. For example, when laser irradiation is performed on only one or two of the individual elements 200 in FIG. 10 , only one or two of the individual elements 200 included in the deformable film 300 can be separated from the source substrate 100 . have.

In addition, when defective elements exist among the plurality of individual elements 200 formed on the source substrate 100 in FIG. 10 , laser irradiation is not irradiated to the defective element, so that only one or two of the individual elements 200 are selectively used. It may be separated from the source substrate 100 .

In addition, in the deformable film 300, the red micro LED element (210 in FIGS. 1 and 3) and the blue micro LED element ( FIGS. 1 and 3 ) among the individual elements 200 by repeating FIGS. 8 to 14 . 230) can also be transcribed.

Subsequently, as described above with reference to FIGS. 1 to 7 , the individual elements 200 remaining on the interposer substrate 400 are transferred to the wiring board ( 500 in FIGS. 3 and 5 to 7 ) to implement a full-color display. can

15 to 20 are cross-sectional views for explaining a method of transferring individual devices according to an embodiment of the present invention.

Referring to FIG. 15 , an individual device 200 , such as a red micro LED device 210 or a first individual device, is formed on a source substrate ( FIGS. 1 and 8A , and 100 in FIGS. 9 to 11 ). Next, an anchor 201 and a sacrificial layer 203 are formed on the upper surface of the red macro LED element 210 . Since the formation of the anchor 201 and the sacrificial layer 203 has been previously described with reference to FIGS. 8A and 8B , they are omitted.

After seating the deformable film 300 formed on the support substrate 310 on the source substrate 100 including the red micro LED element 210 on which the anchor 201 and the sacrificial layer 203 are formed, the deformable film 300 ) Embedding an individual device 200 , for example, a red micro LED device 210 or a first individual device, in a first region inside, and separating the source substrate 100 . An individual device 200 on which the anchor 201 and the sacrificial layer 203 are formed inside the deformable film 300, for example, a red micro LED device 210 or a first individual device, is embedded, and the source substrate 100 is separated. The process to be performed is the same as described with reference to FIGS. 8A and 8B and FIGS. 9 to 11 .

Referring to FIG. 16 , an individual device 200 , eg, a green micro LED device 220 or a second individual device, is formed on a source substrate 100 in FIGS. 1 , 8A, and 9 to 11 . Next, an anchor 201 and a sacrificial layer 203 are formed on the upper surface of the green macro LED element 220 . Since the formation of the anchor 201 and the sacrificial layer 203 has been previously described with reference to FIGS. 8A and 8B , they are omitted.

A red micro LED element 210 (first individual element) is embedded in the source substrate 100 having the anchor 201 and the sacrificial layer 203 formed thereon including the green micro LED element 220 (or the second individual element). After the deformed film 300 is seated, an individual element 200, for example, a green micro LED element 220, or a second individual element, is embedded in a second region inside the deformable film 300, and the source substrate 100 is separate An individual device 200 on which the anchor 201 and the sacrificial layer 203 are formed inside the deformable film 300, for example, a green micro LED device 220 or a second individual device, is embedded, and the source substrate 100 is separated. The process to be performed is the same as described with reference to FIGS. 8A and 8B and FIGS. 9 to 11 .

Referring to FIG. 17 , an individual device 200 , such as a blue micro LED device 230 or a third individual device, is formed on a source substrate 100 in FIGS. 1 , 8A, and 9 to 11 . Next, an anchor 201 and a sacrificial layer 203 are formed on the upper surface of the blue macro LED element 230 . Since the formation of the anchor 201 and the sacrificial layer 203 has been previously described with reference to FIGS. 8A and 8B , they are omitted.

The anchor 201 and the sacrificial layer 203 are formed on the source substrate 100 including the blue micro LED device 230 (or the third individual device), the red and green micro LED devices 210, 220. or the first and a second individual element), after seating the embedded deformable film 300 , the individual element 200 , such as a blue micro LED element 230 (or a third individual element), in a third region inside the deformable film 300 . is embedded and the source substrate 100 is separated. An individual device 200 on which the anchor 201 and the sacrificial layer 203 are formed in the deformable film 300 is embedded, for example, a blue micro LED device 320 or a third individual device, and the source substrate 100 is separated. The process to be performed is the same as described with reference to FIGS. 8A and 8B and FIGS. 9 to 11 .

15 to 17 show a red micro LED element (210. or a first discrete element), a green micro LED element (220, or a second discrete element), and a blue micro LED element 230, or The steps of embedding and transferring three individual elements 200 composed of a third individual element) have been described. However, when the steps of embedding the individual element 200 and transferring the individual element 200 into the deformable film 300 are repeatedly performed, the second to n-th individual elements (n> 2, n is a positive integer) can be further embedded.

Referring to FIG. 18 , as shown in FIG. 12 , the sacrificial layer 203 formed on the anchor 201 of each of the individual elements 200 is removed to form an empty space 206 in the deformable film 300 . do. The empty space 206 may be an internal public space. By the formation of the empty space 206 , the protrusion EP of the anchor 201 may be supported on a portion of the deformable film 300 .

Referring to FIG. 19 , as previously described in FIG. 13 , the adhesive layer 410 is interposed on the lower surface of the individual elements 200 , the anchor 201 , and the deformable film 300 , and the anchor 201 and the partial adhesion The interposer substrate 400 is attached. More specifically, the embedded individual elements 200, namely the red micro LED element 210. or the first discrete element, the green micro LED element 220, or the second discrete element), and the blue micro LED element 230, Alternatively, the adhesive layer 410 is formed on the lower surface of the deformable film 300 including the third individual element). Next, the interposer substrate 400 is attached to the lower surface of the adhesive layer 410 . In FIG. 19 , the same content as in FIG. 13 is omitted.

Referring to FIG. 20 , as shown in FIG. 14 , the deformable film 300 and the support substrate 310 are separated from the individual elements 200 adhered to the adhesive layer 410 on one surface of the interposer substrate 400 . . Since the adhesive force of the adhesive layer 410 and the individual element 200 integrated inside the deformable film 300 is greater than the adhesive force between the deformable film 300 and the anchor on the individual element 200 , the deformable film 300 and the support The substrate 310 may be easily separated from the interposer substrate 400 .

In this case, as shown in FIG. 20 , the individual elements 200 including the anchor 201 apart from each other on the adhesive layer 410 formed on one surface of the interposer substrate 400, that is, the red micro LED element 210, or A first discrete element), a green micro LED element 220 (or a second discrete element), and a blue micro LED element 230 (or a third discrete element) may be located.

Subsequently, as described above with reference to FIGS. 1 to 7 , the individual elements 200 left on the interposer substrate 400 , that is, the red micro LED element 210 or the first individual element, and the green micro LED element 220 . , or the second individual device), and the blue micro LED device 230 (or the third individual device) are transferred to the wiring board ( 500 in FIGS. 3 and 5 to 7 ) to implement a full-color display.

21 to 24 are plan views for explaining an anchor arrangement method of individual elements according to an embodiment of the present invention.

Specifically, as shown in FIGS. 21 to 24 , anchors 201a , 201b , 201c , and 201d may be positioned on a portion of the circumference of the individual element 200 . The anchors 201a, 201b, 201c, 201d formed on a portion of the circumference of the individual element 200 have at least one protrusion 201a-1, 201a-2, 201b-1, 201b-2, 201c-1, 201c- 2, 201d-1, 201d-2) may be provided.

In more detail, as shown in FIG. 21 , four protrusions 201a - 1 of the anchor 201a may be located at the center of four sides constituting the circumference of the individual element 200 . The protrusions 201a - 1 of the anchor 201a may be positioned symmetrically to each other in the horizontal and vertical directions of the individual elements 200 . As shown in FIG. 21 , four protrusions 201a - 2 of the anchor 201a may be located at four corners constituting the circumference of the individual element 200 . The protrusions 201a - 2 of the anchor 201a may be positioned symmetrically to each other in the diagonal direction of the individual elements 200 .

As shown in FIG. 22 , three protrusions 201b - 1 of the anchor 201b may be located at the center of three sides constituting the circumference of the individual element 200 . As shown in FIG. 22 , two protrusions 201b - 2 of the anchor 201b may be positioned at the corners of two sides constituting the circumference of the individual element 200 . The protrusions 201b - 2 of the anchor 201b may be positioned symmetrically to each other in the diagonal direction of the individual elements 200 .

As shown in FIG. 23 , two protrusions 201c - 1 of the anchor 201c may be located at the center of two sides constituting the circumference of the individual element 200 . As shown in FIG. 23 , two protrusions 201c - 2 of the anchor 201c may be located at the corners of two sides constituting the circumference of the individual element 200 .

As shown in FIG. 24 , one protrusion 201d - 1 of the anchor 201d may be located in the central portion of one side constituting the circumference of the individual element 200 . As shown in FIG. 24 , two protrusions 201d - 2 of the anchor 201d may be located at the corners of one side constituting the circumference of the individual element 200 .

As such, the anchors 201a, 201b, 201c, and 201d formed on a portion of the circumference of the individual element 200 partially contact the deformable film 300 to reduce the contact area, so the adhesive layer formed on the interposer substrate 400 ( 410) can be used to easily transfer individual devices from the deformable film to the interposer substrate.

The present invention has been described above with reference to the embodiment shown in the drawings, but this is only exemplary, and it will be understood by those skilled in the art that various modifications, substitutions and equivalent other embodiments are possible therefrom. will be. The true technical protection scope of the present invention should be defined by the technical spirit of the appended claims.

100: source substrate, 200: individual element, 300: deformable film, 310: support substrate, 400: interposer substrate, 205: laser, 410: adhesive layer

Claims (10)

forming a plurality of individual devices on a source substrate;
forming an anchor on each of the individual elements, the anchor including a protrusion protruding outward from the circumference of the individual elements;
forming a sacrificial layer to expose the protrusion on the anchor and each of the individual elements;
embedding at least one of the individual elements into the deformable film by seating a deformable film on the entire surface of the source substrate including the individual elements on the anchor, the sacrificial layer being formed;
transferring at least one of the individual elements into the deformable film by separating the source substrate from the deformable film;
removing the sacrificial layer formed on the anchor of each of the individual elements to form an empty space in the deformable film, and the protrusion of the anchor being supported on a portion of the deformable film;
attaching an interposer substrate to the individual elements, the anchor, and an adhesive layer formed entirely on lower surfaces of the deformable film;
separating the deformable film partially supported by the anchor from the interposer substrate without breaking the anchor, leaving the at least one individual element on the adhesive layer on the interposer substrate; and
and transferring the at least one individual element remaining on the interposer substrate to a wiring board. The method according to claim 1, wherein at least one protrusion of the anchor is formed in a portion of a circumference of the individual element. The method according to claim 1, wherein a plurality of protrusions of the anchor are formed symmetrically to each other on a portion of a circumference of the individual device. The method of claim 1 , wherein the sacrificial layer is formed on the anchor to completely cover an upper surface of the individual device. The method of claim 1, wherein in the step of separating the deformable film partially supported by the anchor from the interposer substrate without breaking the anchor,
The method for transferring individual elements, characterized in that the individual elements and the adhesive force between the anchor and the adhesive layer are greater than the adhesive force between the anchor and the deformable film to easily separate the deformable film from the interposer substrate. 2. The method of claim 1, wherein embedding at least one of the individual elements into the deformable film comprises:
forming the deformable film on a support substrate; and
and placing the deformable film formed on the support substrate on the source substrate including the individual elements with the sacrificial layer formed on the anchor. The method according to claim 1, wherein after transferring the first individual element on which the sacrificial layer is formed on the anchor into the deformable film,
The steps of embedding the individual element having the sacrificial layer formed on the anchor and transferring the individual element having the sacrificial layer formed on the anchor into the deformable film are repeatedly performed to enter the second to the deformable film inside the deformable film. A method of transferring individual elements, characterized in that further embedding of an nth individual element (n>2, n is a positive integer). transferring first to third individual elements separated from each other and having an anchor and a sacrificial layer formed thereon into a deformable film;
forming an empty space in the deformable film by removing the sacrificial layer formed on the first to third individual elements;
forming an adhesive layer as a whole on the lower surface of the deformable film including the first to third individual elements on which the anchor is formed, wherein the anchor is partially adhered to the adhesive layer and the deformable film;
attaching an interposer substrate to a lower surface of the adhesive layer;
separating the deformable film partially supported by the anchor from the interposer substrate without breaking the anchor, leaving the first to third individual elements on the adhesive layer on the interposer; and
and transferring at least one of the first to third individual elements formed on the adhesive layer on the interposer substrate to a wiring substrate,
The anchor includes an outwardly projecting projection of the first to third individual elements, and
The first to third individual devices formed on the adhesive layer on the interposer substrate are a red light emitting device, a green light emitting device, and a blue light emitting device, respectively. The method of claim 8, wherein in the step of separating the deformable film partially supported by the anchor from the interposer substrate without breaking the anchor,
The first to third individual elements and the adhesive force between the protrusion of the anchor and the adhesive layer is greater than the adhesive force between the protrusion of the anchor and the deformable film to easily separate the deformable film from the interposer substrate Transfer method of individual elements, characterized in that. 9. The method according to claim 8, wherein at least one protrusion is formed in a portion of a circumference of the first to third individual elements.

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