KR101605317B1 - Optical selective transferring apparatus and its method for thin film devices - Google Patents

Abstract

The present invention relates to optical selective transferring apparatus and method. More specifically, the purpose of the present invention is to provide an optical selective transferring apparatus which ensures selective transference via partial optical beam irradiation during a process of transferring thin film devices attached to a stamp to other substrates, and an optical selective transferring method. To this end, the optical selective transferring apparatus comprises an optical device part (100) and a stage device part (200).

Description

Technical Field [0001] The present invention relates to an optical selective transferring apparatus and method,

The present invention relates to an optical selective transfer apparatus and method. More particularly, the present invention relates to a thin film device which is formed of various materials having a minimum pattern size of several nm, such as a semiconductor, a memory, and a sensor, and which is capable of high speed signal processing, high capacity, high sensitivity and high efficiency. The present invention relates to an optical selective transfer apparatus and method which enable selective transfer using an optical method in the manufacture of a product.

Typical thin film device based products are manufactured by performing a number of processes on a substrate. These products can be separated into individual devices by a dicing process and then manufactured into finished products through packaging (semiconductor chips, sensor chips, etc.), or a plurality of devices mounted on a substrate can be integrated into one product (Solar cells, displays, etc.). In the case of the former, the substrate is cut according to the size of the device during the dicing process and used as a means for fixing the device to the final product. In the latter case, the entire device is fixed and used up to the final product. Therefore, the arrangement of the devices to be formed on the substrate is determined according to the use of the product. In the case of a display device, for example, in the case where a unit for forming each pixel is a single device, the arrangement of the devices is determined according to the pitch of the pixels.

The material of the substrate is various depending on the material properties of the device to be manufactured and the process environment (temperature, pressure, chemical resistance, etc.) such as silicon (Si), glass, quartz, sapphire, . Therefore, even if a low-priced polymer substrate is used, it can not be used because it does not meet the conditions of temperature, chemical resistance and the like as well as the planarity management. Particularly, even if the substrate is expensive, It can not be reused because it is mounted.

In recent years, technologies for exfoliating such devices from other substrates and transferring them to other substrates have been developed. That is, a device is manufactured on a substrate, a sacrificial layer is interposed therebetween, In the process, the sacrificial layer is chemically or physically removed and a process for separating the device and the substrate is being developed.

When a device is actually fabricated using a device, a space having wiring and other uses is required. That is, a space is required between the device and the device. If all the devices are transferred all at once on the wafer, space can not be formed between the device and the device. On the other hand, when the device is composed not of a single type of device but of various types of devices, one device must be transferred and then transferred to another device. As can be seen from these examples, it is often necessary to selectively transfer devices in a device transfer process for device fabrication.

As a technique for performing such selective transfer, U.S. Patent Publication No. 2012-0313241 (" METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS ", December 13, 2012, hereinafter referred to as Prior Art 1) (Protrusions) of the stamp using a stamp having protrusions arranged in the same form as that of the array of the elements, so that protrusions are formed only on a part where the elements are desired to be arranged on the receiving substrate, Thereby transferring the element to only a portion of the surface of the substrate, thereby ultimately making selective transfer possible.

However, in such a method, there is a disadvantage that it is necessary to change the stamp itself in which the protrusion is formed in order to change the position of the protrusion, and there is also a problem that a large amount of stamps having various protrusion patterns must be prepared. In addition, the prior art 1 uses only the mechanical principle that the transfer is performed in the contact area and the transfer is not performed in the non-contact area, but the following problems may also occur. Generally, it is not a simple matter to control the contact pressure uniformly distributed over the entire area of the substrate in the transfer process even in the case of the general transfer, not the selective transfer, and even when the transfer is not properly performed due to the uneven contact pressure exist. However, when the stamp having the protruding pattern is used as described above, there arises a problem that it becomes much harder to control the horizontal alignment between the stamp and the substrate or the uniformly distributed pressure to be applied as compared with the flat stamp.

On the other hand, the prior art 1 has a limitation that it can be applied only to a planar substrate transfer process, and Korean Patent Laid-Open Publication No. 2014-0079183 ("Selective Peeling and Transfer Apparatus and Method ", 2014.06.26, This is solved using optical methods. In the prior art 2, some of the high-performance devices existing on the wafer substrate are selectively removed and transferred to the flexible substrate, or the entire high-performance device existing on the wafer substrate is peeled off, Or a part of a high-performance device existing on a wafer substrate, and selectively transferring a part of the high-performance device selectively onto a flexible substrate. At this time, in the prior art 2, a method is employed in which only a part of at least one selected from the wafer substrate, the flexible substrate, and the dummy substrate is irradiated with light so that only a part of the element layer is selectively peeled or transferred.

The method of Prior Art 2 has advantages such as that the uniformity of the pressure distribution is much easier to achieve when compared with the prior art 1 in that the adhesive force is controlled using the optical method. However, the wafer substrate (transfer source) There are some weaknesses in that there are a lot of process steps and complexity in that three substrates such as a substrate (transfer intermediate medium) and a dummy substrate (transfer target) must be used.

These prior arts have some drawbacks, and there has been a steady demand for selective transfer devices and methods that overcome these drawbacks and simplify the process steps while using optical methods.

1. U.S. Patent Publication No. 2012-0313241 ("METHODS FOR SURFACE ATTACHMENT OF FLIPPED ACTIVE COMPONENTS ", December 13, 2012) 2. Korean Patent Publication No. 2014-0079183 ("Selective Peeling and Transfer Apparatus and Method ", Apr. 26, 2014)

SUMMARY OF THE INVENTION The present invention has been made in order to solve the problems of the prior art as described above, and it is an object of the present invention to provide a method of transferring thin film devices attached to a stamp, The present invention provides an optical selective transfer apparatus and method capable of transferring an image onto a recording medium. In the device manufacturing process, devices are arranged in a high-density integrated form for productivity. Then, in the process of transferring to a new substrate, the intervals and positions are rearranged to increase the efficiency of production, And to make it possible to produce devices. According to the present invention, the related process can be performed by efficiently aligning and contacting the stamp and the substrate while selectively irradiating the condensed beam.

According to an aspect of the present invention, there is provided an optical selective transfer apparatus comprising: an optical device unit (100) for irradiating light; A first substrate 510 made of a transparent material through which a first adhesive layer whose adhesive force is changed by light irradiation is applied to a lower surface of the first substrate 510 to which a plurality of transfer target devices 550 are adhered and disposed and light can pass therethrough, A stage device unit 200 for aligning, contacting and pressing the second substrate 520 coated with the second adhesive layer of the different material from the first adhesive layer applied to the second substrate 510; The first substrate 510 and the second substrate 510 are bonded to each other by the adhesive force of the first adhesive layer, which is generated as light is irradiated onto a selected area of the first substrate 510 by the optical device unit 100, Some of the devices 550 on the first substrate 520 may be transferred to the second substrate 520.

Here, when the adhesive force of the second adhesive layer is A, the adhesive force of the first adhesive layer before light irradiation is B, and the adhesive force of the first adhesive layer after light irradiation is C, the first adhesive layer and the second adhesive layer are B > A> C, respectively.

When the adhesive force of the second adhesive layer is A, the adhesive force of the first adhesive layer before light irradiation is B, and the adhesive force of the first adhesive layer after light irradiation is C, the first adhesive layer and the second adhesive layer satisfy the relation C> A > B, respectively.

The optical device unit 100 includes at least one light source 111 and a camera for observing and measuring the transfer state of the substrate when X, Y, Z, and θ are the respective movement axes and rotational axis directions of the fixed coordinate system And a focusing stage 122 for moving the focusing lens 121 in the Z-axis direction, the beam generating and measuring unit 110 including the focusing lens 121 and the focusing lens 121, .

In addition, the stage device unit 200 may be configured such that X, Y, Z, and θ represent angularly moving axes and rotational axis directions of the fixed coordinate system, x, y, and z , a substrate scanning stage 250 which is fixed on the surface of the substrate and performs movement in the X-axis direction and Y-axis direction of an object placed on the substrate, a first substrate supporting and fixing the first substrate 510, A substrate pressing stage 212 connected to the first fixing unit 211 to perform a z-axis movement of the first fixing unit 211; A first substrate moving stage 210 including a first substrate aligning stage 213 for performing movement in the x-axis direction, y-axis direction, and? -Axis direction of the substrate pressing stage 212, A second fixing part 221 for fixing and supporting the second substrate 520 at a position facing the second substrate 520, The first substrate alignment stage 213 is disposed on one side of the substrate scanning stage 250 and connected to the second fixing unit 221 to rotate the second fixing unit 221 in the [ And a second substrate moving unit 220 including a second substrate rotating stage 222 for performing a second substrate moving operation such that the first substrate moving unit 210 and the second substrate moving unit 220 are moved by the substrate scanning stage 250, The entire moving part 220 is moved in the X axis direction and the Y axis direction is performed and the second substrate rotating part 222 rotates the second substrate moving part 220 in the? Axis direction, the y-axis direction, and the? -Axis direction alignment of the first substrate 510 with respect to the second substrate 520 is performed by the first substrate alignment stage 213, and the substrate pressing stage 212 ) Between the first substrate (510) and the second substrate (520) Pressure can be performed.

In this case, the first fixing part 211 is formed in a plate shape of a transparent material through which light can pass, and a first fixing chuck (not shown) having the first substrate 510 fixedly mounted on the lower surface thereof by a vacuum method or a mechanical method A holder 2112 formed in a frame shape to surround the periphery of the first fixing chuck 2111, a hollow space through which light can pass, and a frame shape surrounding the hollow space, A holder fixing block 2113 which is stacked on the upper side of the holder 2112 and connected to the substrate pressing stage 212 and a holder fixing block 2113 which is disposed on the upper side of the holder 2112 so as to allow only movement in the z axis direction of the holder 2112 and the holder fixing block 2113, And a plate surface is disposed in parallel to the plate surface of the holder 2112 or the plate surface of the holder fixing block 2113 and is provided at the edge of the holder 2112 or at the edge of the holder fixing block 2113 A leaf spring 2114, A plate spring 2114 which is formed in a column shape extending in the stacking direction of the holder 2112 and the holder fixing block 2113 and whose plate surface is arranged in parallel with the plate surface of the holder 2112, A plurality of plate spring supports 2115 for connecting and fixing another plate spring 2114 arranged in parallel to the plate surface of the holder fixing block 2113, A plurality of preloading springs 2116 provided on the holder fixing block 2113, a screw head and a screw column, and a threaded column portion is mounted on the holder 2112 and the holder fixing block 2112 from the holder fixing block 2113 side. A plurality of angle compensating screws 2117 arranged to penetrate and connect the first substrate 510 and the second substrate 520 to each other to compensate for the angle of the first substrate 510 in order to align the first substrate 510 and the second substrate 520, To this end, And a plurality of angle compensating springs 2118 which are supported on the head of the screw of the angle compensating screw 2117 and whose other end is supported on the plate surface of the holder fixing block 2113.

The second fixing part 221 includes a second fixing chuck 2211 on the upper surface of which the second substrate 520 is fixed by a vacuum method or a mechanical method, And a plurality of load cells 2213 interposed between the second fixed chuck 2211 and the load cell holder 2212. The load cell holder 2212 includes a plurality of load cells 2213,

At this time, the second fixing part 221 has a V-shaped section on the bottom surface of the second fixing chuck 2211 so as to prevent horizontal slippage between the second fixing chuck 2211 and the load cell 2213 A plurality of V-shaped slots 2211a are radially arranged and the upper portion of the load cell 2213 is formed in a hemispherical shape so that an upper portion of the load cell 2213 is inserted into the V-shaped slot 2211a .

In the optical selective transfer method using the optical selective transfer apparatus as described above, the first substrate 510 and the second substrate 520 are spaced apart from each other in the z-axis direction (200) on the stage device part (200); The first substrate 510 and the second substrate 520 are moved and rotated by the stage device unit 200 to align the positions of the first substrate 510 and the second substrate 520; The first substrate 510 is moved and contacted with the second substrate 520 by the stage unit 200; By the change in the adhesive force of the first adhesive layer generated as the light is irradiated onto a selected area of the first substrate 510 by the optical device unit 100, the elements 550 on the first substrate 510 A portion of the first substrate is transferred to the second substrate 520; The first substrate 510 is moved and separated from the second substrate 520 by the stage device unit 200; . ≪ / RTI >

According to the present invention, there is a great effect that a semiconductor capable of realizing more various functions and performance can be effectively manufactured by rearranging thin film devices fabricated by using a conventional wafer substrate-based semiconductor manufacturing process through a selective transfer process . In other words, a device that becomes a transcription source can be manufactured in a conventional manner to enable mass production and rapid production, and selective transfer is performed from devices as transfer sources, thereby easily manufacturing semiconductors that realize various functions and performance, The efficiency of the device manufacturing process is maximized.

In addition, since the selective transfer is performed using the optical method in the present invention, there is no mechanical structure in which the balance is broken at the time of pressure application in terms of shape, so that the pressure generated when the protrusion pattern is formed on the stamp and the selective transfer is performed There is an advantage that the distribution irregularity problem can be solved at its source. That is, according to the present invention, the uniform pressure is distributed over the entire area when the stamp-substrate is contacted in the transfer process, thereby reducing the possibility of the transfer failure problem due to the contact failure.

1 is an outline view of an optical selective transfer process using a condensing beam.
FIGS. 2 and 3 are a perspective view, a front view, a top view, and a side view of the optical selective transfer device. FIG.
4 is a conceptual view of the structure of an optical selective transfer apparatus;
FIGS. 5 and 6 are a perspective view, a front view, a top view, and a side view of the stage apparatus of the optical selective transfer apparatus. FIG.
Figs. 7 and 8 are a structural view (a schematic cross-sectional view and a sectional perspective view) of the first fixing part in the stage apparatus. Fig.
9 to 11 are a structural view (a cross-sectional view, a perspective view, an assembly view) of the second fixing portion in the stage device.
FIG. 12 is a process chart of a first embodiment of a transfer process using an optical selective transfer device. FIG.
13 is a process chart for a second embodiment of a transfer process using an optical selective transfer device.

Hereinafter, an optical selective transfer apparatus and method according to the present invention having the above-described structure will be described in detail with reference to the accompanying drawings.

FIG. 1 is a schematic diagram of an optical selective transfer process using a condensing beam, and the basic operation principle of the optical selective transfer apparatus of the present invention will be described with reference to FIG.

As shown in FIG. 1, in order to transfer, a first substrate 510, to which transferring devices 550 are adhered, and a second substrate 520 to which the device 550 is to be transferred, . 1 (a), the transfer target devices 550 are disposed on the lower surface of the first substrate 510, and as shown in FIG. 1 (b) The lower surface of the second substrate 520 is aligned and brought into contact with the upper surface of the second substrate 520, and then the pressing is performed.

At this time, the first adhesive layer, in which the first substrate 510 and the elements 550 are adhered to each other, is made of a material whose adhesive force is changed by light irradiation. The first substrate 510 is made of a transparent material capable of transmitting light. As shown in FIG. 1 (c), the first substrate 510 is irradiated with a condensing beam from above the first substrate 510, Can be changed.

In this process, if the light beam is selectively irradiated only to a desired position instead of irradiating the entire area of the first substrate 510, the adhesive force of the first adhesive layer changes only in a part of the region irradiated with light. At this time, a second adhesive layer of a material different from that of the first adhesive layer applied to the first substrate 510 is previously applied to the second substrate 520. As the adhesive force of the first adhesive layer changes, By appropriately predetermining the relationship between the adhesive force of the first adhesive layer before light irradiation / the adhesive force of the first adhesive layer after the light irradiation, only a part of the elements 550, as shown in Fig. 1 (d) And transferred from the first substrate 510 to the second substrate 520.

On the other hand, in the case of a substrate providing elements in a general semiconductor process, it is referred to as a 'stamp', and a substrate to which an element is transferred is often referred to as a 'substrate' in many cases. In this regard, in the present invention, the source substrate on which elements to be transferred are originally disposed is the first substrate 510, and the substrate on which the devices are transferred is the second substrate 520. In the present invention, the first substrate 510 ) Becomes a 'stamp' in the general semiconductor process concept, and the second substrate 520 becomes a 'substrate' in the general semiconductor process concept.

As described above, the basic concept of the present invention is to change the adhesive force between the first substrate 510 and the element 550 by irradiating light, and to transfer the element 550 to the second substrate 520 using the changed adhesive force difference will be. That is, only a desired one of the elements 550 on the first substrate 510 can be selectively transferred to the second substrate 520 by appropriately selecting an area to be irradiated with light.

As described above, since a separate protrusion is formed in the stamp (corresponding to the first substrate in the present invention), contact / non-contact areas with the substrate (corresponding to the second substrate in the present invention) are formed In the case of selective transfer of devices, there is a great risk that the contact pressure between the stamp and substrate due to the protruding portion structure is formed to be considerably non-uniform over the entire area, and thus the transfer may not be properly performed. In addition, in order to perform the selective transfer as desired, a large number of stamps with different protrusion patterns must be prepared. In the case of performing selective transfer of a certain pattern and performing selective transfer of another pattern, it is necessary to stop the process and replace the stamp There were various operational inconveniences.

However, in the present invention, since the selective transfer is performed using light irradiation, there is no need to form a protrusion on the stamp, so that the flatness of the stamp is naturally achieved, which makes it much easier to uniform the pressure distribution between the stamp and the substrate The possibility of occurrence of defective transfer can be remarkably reduced. In addition, it is possible to change the selective transfer pattern as desired by simply issuing a control instruction to change the light irradiation area even during the process so that there is no need to interrupt the process, and the convenience of operation is maximized. It will be.

An embodiment of the optical selective transfer apparatus and method of the present invention that actually realizes such a principle will be described in more detail below with reference to FIGS. 2 to 13. FIG.

FIG. 2 is a perspective view of an optical selective transfer apparatus of the present invention, and FIG. 3 is a front view, a top view, and a side view of the optical selective transfer apparatus of the present invention. 4 is a conceptual diagram showing a simplified structure of the optical selective transfer apparatus. 2 to 4, the optical selective transfer device of the present invention comprises an optical device unit 100 and a stage device unit 200. [

The optical device unit 100 irradiates light and the stage device unit 200 aligns, contacts, and presses the first substrate 510 and the second substrate 420 with each other . More specifically, the first substrate 510 is made of a transparent material to which a first adhesive layer whose adhesive force is changed by light irradiation is applied to a lower surface thereof, a plurality of transfer target devices are adhered and arranged, and light can pass therethrough . The second substrate 520 is coated with a second adhesive layer of a material different from that of the first adhesive layer applied to the first substrate 510 on the upper surface thereof. In the optical selective transfer apparatus according to the present invention, when the first substrate 510 and the second substrate 520 are aligned, contacted, and pressed by the stage apparatus unit 200, A part of the elements on the first substrate 510 are electrically connected to the second substrate 510 by a change in the adhesive force of the first adhesive layer which is generated as light is irradiated onto a selected part of the first substrate 510 by the light- (520).

Hereinafter, the specific configuration of each part will be described in more detail.

4, the optical device unit 100 includes a beam generating and measuring unit 110 including at least one light source 111 and a camera 112 for observing and measuring a transfer state of the substrate, A condenser lens 121 and a focusing stage 122 for moving the condenser lens 121 in the Z axis direction. First, each of the moving axes and the rotational axis directions of the fixed coordinate system are referred to as X, Y, Z, and Θ.

The shape of the light source 111, which is a component of the beam generating and measuring unit 110, may be varied depending on the material of the first adhesive layer applied to the first substrate 510. The first adhesive layer may be made of any material, and the light source 111 may be formed of a material that changes the adhesive force of the ultraviolet rays, Generating infrared rays, and the like. Of course, the wavelength may be adjusted so that light of a specific wavelength is generated. In addition, for observation and measurement using the camera 112 to be described below, a light source that generates natural light in a general visible light wavelength band may be used. Since the light source device itself generating light in this manner has various commercially available technologies, it can be appropriately selected and adopted.

The camera 112, which is a component of the beam generating and measuring unit 110, detects light reflected by the light irradiated onto the first substrate 510 to reflect an image of the first substrate 510 So that it can be photographed. In this way, it is possible to check in real time whether the selective light irradiation is correctly performed on the first substrate 510 by the camera 112, and also to check whether or not the first substrate 510 and the second substrate 520 It is also possible to measure and check whether the alignment is correct.

The condensing lens 121, which is a component of the beam irradiation unit 120, collects the light generated from the light source 111 and irradiates the condensed light onto the first substrate 510. The beam generating and measuring device 110 may further include a mirror or the like capable of appropriately adjusting an optical path so that the light can proceed toward the condenser lens 121. Since the structure of such an optical system is widely disclosed in a general light irradiation apparatus, it can be appropriately and selectively adopted.

The focusing stage 122, which is a component of the beam irradiating unit 120, serves to move the condenser lens 121 in the Z-axis direction. The focus of the condensing beam can be adjusted as the focusing stage 122 moves the condenser lens 121 in the Z-axis direction, that is, the up-and-down direction.

The optical device unit 100 having the above-described configuration is controlled by a suitable control unit, which is connected to the outside or is built in and adjustable, so that the selection of the light source or the wavelength and the vertical movement of the condenser lens are controlled, It is possible to irradiate the desired light with the desired light.

Next, the stage device unit 200 will be described. 5 and 6 show a perspective view, a front view, a top view, and a side view of the stage apparatus of the optical selective transfer apparatus, in addition to the conceptual view of FIG. Also, the moving axis and the rotating axis direction of the fixed coordinate system are X, Y, Z, and Θ.

4, the stage device unit 200 includes a substrate scanning stage 250 fixed on a sheet surface, a first substrate moving unit 210 for performing movement and rotation of the first substrate, And a second substrate moving unit 220 for moving and rotating the second substrate. The second substrate moving unit 220 is disposed on the substrate scanning stage 250 and the first substrate moving unit 210 is disposed on the second substrate moving unit 220. That is, it is convenient to indicate the movement and rotation of the substrate scanning stage 250 and the second substrate moving unit 220 as a fixed coordinate system, and movement and rotation of the first substrate moving unit 210 use a fixed coordinate system It is convenient to represent the second substrate moving part 220 in a relative coordinate system. Accordingly, the respective moving axes and the rotational axis directions of the relative coordinate system with respect to the fixed coordinate system are denoted by x, y, z, and θ.

The substrate scanning stage 250 is fixed on the ground to perform movement in the X-axis direction and Y-axis movement of the object placed on the upper side. 4 and described above, a second substrate moving part 220 and a first substrate moving part 210 are mounted on the substrate scanning stage 250, that is, the substrate scanning stage 250 The second substrate moving unit 220 and the first substrate moving unit 210 are moved in the X-axis direction and the Y-axis direction.

The first substrate moving part 210 includes a first fixing part 211 for fixing and supporting the first substrate 510 and a second fixing part 211 connected to the first fixing part 211, A y-axis direction movement, and a? -Axis direction rotation of the substrate pressing stage 212 in conjunction with the substrate pressing stage 212 to perform a z-axis direction movement of the substrate pressing stage 212 And a first substrate alignment stage 213. That is, the movement of the first substrate 510 in the x-axis direction, the y-axis direction, and the rotation in the θ-axis direction is performed by the first substrate alignment stage 213, The movement of the first substrate 510 in the z-axis direction is performed (contact with the second substrate) and the pressing is performed.

The second substrate moving part 220 includes a second fixing part 221 for fixing and supporting the second substrate 520 at a position facing the first substrate 510, The first substrate alignment stage 213 is disposed on one side and is connected to the second fixing unit 221 to rotate in the? -Axial direction of the second fixing unit 221, Stage 222 as shown in FIG. Since the movement of the second substrate 220 in the X-axis direction and the movement in the Y-axis direction is performed by the substrate scanning stage 250, in order to arrange the second substrate 520 in the correct position, A stage for moving the second substrate 520 is sufficient for the second substrate rotating stage 222 to perform the 慮 -axial rotation.

In summary, in the stage device 200 according to the present invention, the substrate scanning stage 250 moves the entire first substrate moving part 210 and the second substrate moving part 220 in the X-axis direction Axis movement of the second substrate moving part 220 is performed by the second substrate rotating stage 222, and the first substrate aligning stage 213 is moved in the Y- Axis direction, the y-axis direction, and the? -Axis direction of the first substrate 510 with respect to the second substrate 520, and the first substrate 510 is aligned by the substrate pressing stage 212, And the second substrate 520 are performed.

Figs. 7 and 8 show a structural view (a sectional schematic view, a sectional perspective view) of the first fixing part in the stage apparatus. The first fixing part 211 includes a first fixing chuck 2111, a holder 2112, a holder fixing block 2113, a leaf spring 2114, a leaf spring support 2115, 2116, an angle compensating screw 2117, and an angle compensating spring 2118.

The first fixing chuck 2111 is in the form of a plate and fixes the first substrate 510 by fixing the first substrate 510 on the lower surface thereof by a vacuum method or a mechanical method. The vacuum method generally refers to a method using a vacuum pad or the like used for fixing an object with a vacuum, and the mechanical method refers to a method using a mechanical structure such as bolt-nut fastening and groove-fastening fastening. Any method can be used as long as it can stably fix the first substrate 510 to the first fixing chuck 2111. That is, any suitable fixing structure among various commonly known plate-to-plate structures can be employed . At this time, according to the light irradiation direction, since the light can reach the first substrate 510 only when the light passes through the first fixing chuck 2111, the first fixing chuck 2111 is made of a transparent material .

The holder 2112 is formed in a frame shape surrounding the first fixing chuck 2111. Although the first fixing chuck 2111 has a rectangular shape in the drawing, the holder 2112 is also illustrated as having an empty rectangular shape. Of course, the first fixing chuck 2111 is not necessarily a square, It is a matter of course that the shape of the holder 2112 can also be appropriately changed in accordance with the shape of the first fixing chuck 2111.

The holder fixing block 2113 is stacked on the holder 2112 and connected to the holder 2112 and is fixedly connected to the substrate pressing stage 212. That is, the moving and rotating operations applied by the substrate pressing stage 212 and the first substrate alignment stage 213 (connected to the substrate pressing stage 212) are performed based on the holder fixing block 2113 . The holder fixing block 2113 must be able to pass light therethrough. Therefore, the holder fixing block 2113 is formed with an empty space through which light can pass, and the frame surrounding the empty space .

The leaf spring 2114 is provided to allow movement of the holder 2112 and the holder fixing block 2113 only in the z-axis direction. That is, the holder 2112 and the holder fixing block 2113 are guided by the leaf spring 2114 in the z-axis direction, that is, the up-and-down direction. Each of the leaf springs 2114 is formed in a plate shape and the plate surface is arranged parallel to the plate surface of the holder 2112 or the plate surface of the holder fixing block 2113, Or at the rim of the holder fixing block 2113. [ Referring to FIG. 8, when the holder 2112 and the holder fixing block 2113 are formed in a rectangular shape, the leaf springs 2114 are arranged in each corner of a rectangular shape having apexes, and 16 are provided. Of course, as the shapes of the holder 2112 and the like are changed, the arrangement and number of the leaf springs 2114 can be variously changed.

The plate spring support base 2115 is formed in a columnar shape extending in the stacking direction of the holder 2112 and the holder fixing block 2113. The plate spring support base 2115 has a plate surface which is arranged in parallel with the plate surface of the holder 2112 The plate spring 2114 of the holder fixing block 2113 and the other plate spring 2114 arranged in parallel to the plate surface of the holder fixing block 2113 are connected and fixedly supported. The number of the leaf springs 2114 is large, and accordingly, the number of the leaf spring supports 2115 is also increased. 7, the plate spring 2114 is connected to the holder 2112 or the holder fixing block 2113, and the plate spring support 2115 is connected to the plate spring 2113. [ The holder 2112 and the holder fixing block 2113 are connected to each other by the plate spring support 2115. In this case,

A plurality of the preloading springs 2116 are interposed between the holder 2112 and the holder fixing block 2113. The holder 2112 and the holder fixing block 2113 are urged in a direction to push each other by the elastic force of the preload spring 2116. [ The angle compensating spring 2118 to be described below forces the holder 2112 and the holder fixing block 2113 in a direction in which they approach each other and the force in the pushing direction applied by the preload spring 2116 and The holder 2112 and the holder fixing block 2113 form an appropriate spacing by balancing the force in the approaching direction applied by the angle compensating spring 2118. [

The angle compensating screw 2117 is formed in the shape of a screw including a screw head and a screw column, and a threaded column portion is fixed to the holder 2112 and the holder fixing block 2113 from the holder fixing block 2113 side. As shown in FIG.

The angle compensating spring 2118 has one end supported by the screw head of the angle compensating screw 2117 and the other end supported by the plate surface of the holder fixing block 2113 so that the holder 2112, And the holder fixing block 2113 approach each other. The elastic force of the angle compensating spring 2118 can be adjusted according to how much the angle compensating screw 2117 is tightened. As shown in the lower view of FIG. 7, when the angle compensating screw is tightened or loosened, The holder 2112 moves on the basis of the reference position 2113.

The ultimate purpose of the angle compensating screw 2117 and the angle compensating spring 2118 is to prevent the first substrate 510 and the second substrate 520 from moving horizontally to align the first substrate 510 and the second substrate 520, To compensate for the angle of the light. If the first substrate 510 and the second substrate 520 are not aligned horizontally, the distribution of the pressure applied across the entire area of the substrate during contact and pressing of the first and second substrates becomes uneven, There is a possibility of occurrence. Therefore, it is necessary to adjust this level. When the first substrate and the second substrate are not horizontally aligned, the pre-alignment spring 2116 and the angle compensating spring 2118 can be adjusted by appropriately adjusting the angle compensating screw 2117 as shown in the lower view of FIG. To balance the forces exerted by the first and second substrates to ultimately achieve conformal contact at all locations when contact and pressure between the first and second substrates are achieved do. In the conceptual diagram of FIG. 7, two of the angle compensating screw 2117 and the angle compensating spring 2118 are shown as being simplified in order to easily explain the concept, but this is shown two-dimensionally. The angle compensating screw 2117 and the angle compensating spring 2118 are installed at three positions as shown in FIG.

Figs. 9 to 11 show the structural diagrams (schematic cross-sectional view, perspective view and assembly view) of the second fixing part in the stage apparatus. The second fixing part 221 includes a second fixing chuck 2211, a load cell holder 2212, and a load cell 2213 as shown in FIG.

The second fixing chuck 2211 serves to fix the second substrate 520 on the upper surface by a vacuum method or a mechanical method. The vacuum chucking or mechanical chucking of the substrate is the same as the description of the first chuck chuck 2111, and thus a detailed description thereof will be omitted here.

The load cell holder 2212 is stacked on the lower side of the second fixing chuck 2211 and functions to fix the load cell 2213 as shown in FIG.

A plurality of the load cells 2213 are interposed between the second fixed chuck 2211 and the load cell holder 2212. The load cell 2213 can measure the force that is pressurized when the first substrate 510 and the second substrate 520 are contacted and pressurized, individually or in combination. Particularly, it is possible to observe the process of compensating the horizontal alignment between the first substrate 510 and the second substrate 520 by the angle adjusting means as described above, through the value measured by the load cell 2213.

At this time, when the horizontal slip occurs between the load cell 2213 and the second fixing chuck 2211, the pressure measurement is not correctly performed. A plurality of V-shaped slots 2211a having a V-shaped cross section are radially formed on the lower surface of the second fixing chuck 2211 so as to prevent horizontal slippage between the second fixing chuck 2211 and the load cell 2213, And an upper portion of the load cell 2213 is formed in a hemispherical shape so that an upper portion of the load cell 2213 is inserted into the V-shaped slot 2211a.

By using the optical selective transfer apparatus of the present invention as described above, the first substrate and the second substrate are brought into contact and pressurization in a state in which relative alignment, angle compensation, and the like are performed. In this state, And the combination of blinking of the optical focusing beam, beam irradiation is performed only in the selective region, and thus selective transfer can be performed.

As described briefly above, the adhesive force of the first adhesive layer applied to the first substrate 510 is changed by light irradiation, and the adhesive strength of the second adhesive layer applied to the second substrate 520 does not change even before and after the light irradiation, .

When the adhesive force of the second adhesive layer is A, the adhesive force of the first adhesive layer before the light irradiation is B, and the adhesive force of the first adhesive layer after the light irradiation is C, the first adhesive layer and the second adhesive layer, B > A > C. According to the first embodiment, in the first embodiment, since the adhesive force C of the first adhesive layer is weaker than the adhesive force A of the second adhesive layer at the portion irradiated with the light, To the second substrate is performed. Of course, in a portion where no light is irradiated, the adhesive force B of the first adhesive layer is stronger than the adhesive force A of the second adhesive layer, so that the device is not transferred, and selective transfer of the device can be achieved in this way. FIG. 12 conceptually shows a process diagram for a first embodiment of a transfer process using an optical selective transfer apparatus.

Conversely, the first adhesive layer and the second adhesive layer may be made of a material satisfying the relationship of C > A > B. According to the second embodiment, in contrast to the first embodiment, the element is not transferred at the portion irradiated with the light but is transferred at the portion where the light is not irradiated. 13 conceptually shows a process chart for a second embodiment of a transfer process using an optical selective transfer apparatus.

The optical selective transfer method of the present invention will be summarized as follows in the first and second embodiments. First, the first substrate 510 and the second substrate 520 are disposed on the stage device 200 so as to be spaced apart from each other in the z-axis direction (Figs. 12 (a) and 13 (a)). Next, the first substrate 510 and the second substrate 520 are moved and rotated by the stage device unit 200 so that the positions of the first substrate 510 and the second substrate 520 are aligned (FIG. 12 (b), FIG. 13 (b) ). Next, the first substrate 510 is moved by the stage device 200 to contact and press the second substrate 520 (FIGS. 12 (c) and 13 (c)).

In this state, a change in the adhesive force of the first adhesive layer, which is generated as light is irradiated onto a selected area of the first substrate 510 by the optical device unit 100, Are transferred to the second substrate 520 (Fig. 12 (d), Fig. 13 (d)). Finally, when the first substrate 510 is moved and separated from the second substrate 520 by the stage device 200 (Figs. 12 (e) and 13 (e)), in the case of the first embodiment As shown in FIG. 12, the device is transferred at a portion irradiated with light. In the second embodiment, the device is transferred at a portion where light is not irradiated, as shown in FIG. 13, Selective transfer from one substrate to the second substrate can be realized.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It goes without saying that various modifications can be made.

100:
110: beam generating and measuring unit
111: light source 112: camera
120:
121: condenser lens 122: focusing stage
200: stage device unit
210: a first substrate moving part
211: first fixing portion
2111: first fixing chuck 2112: holder
2113: holder fixing block 2114: leaf spring
2115: Plate spring support 2116: Preload spring
2117: angle compensating screw 2118: angle compensating spring
212: substrate pressing stage 213: first substrate alignment stage
220: second substrate moving part
221: second fixing portion
2211: second fixing chuck 2211a: V-shaped slot
2212: Load cell holder 2213: Load cell
222: second substrate rotating stage
250: substrate scanning stage
510: first substrate 520: second substrate

Claims (9)

And a camera (112) for observing and measuring the transfer state of the substrate and at least one light source (111) when each of the movement axes and the rotation axis direction of the fixed coordinate system is X, Y, Z, And a focusing stage 122 for moving the focusing lens 121 in the Z-axis direction and irradiating light to the focusing lens 121, (100);
A first substrate 510 made of a transparent material through which a first adhesive layer whose adhesive force is changed by light irradiation is applied to a lower surface of the first substrate 510 to which a plurality of transfer target devices 550 are adhered and disposed and light can pass therethrough, A stage device unit 200 for aligning, contacting and pressing the second substrate 520 coated with the second adhesive layer of the different material from the first adhesive layer applied to the second substrate 510;
And,
By the change in the adhesive force of the first adhesive layer generated as the light is irradiated onto a selected area of the first substrate 510 by the optical device unit 100, the elements 550 on the first substrate 510 Is transferred to the second substrate (520). ≪ IMAGE >
The optical information recording medium according to claim 1, wherein the first adhesive layer and the second adhesive layer comprise
The adhesive strength of the second adhesive layer is A,
The adhesive force of the first adhesive layer before light irradiation is B,
When the adhesive force of the first adhesive layer after light irradiation is C,
B > A > C. ≪ / RTI >
The optical information recording medium according to claim 1, wherein the first adhesive layer and the second adhesive layer comprise
The adhesive strength of the second adhesive layer is A,
The adhesive force of the first adhesive layer before light irradiation is B,
When the adhesive force of the first adhesive layer after light irradiation is C,
And a material satisfying a relationship of C > A > B.
delete The apparatus according to claim 1, wherein the stage device unit (200)
X, Y, Z, and &thetas; respectively represent the movement axes and the rotation axis directions of the fixed coordinate system,
And x, y, z, and &thetas; respectively, the moving axis and the rotating axis direction of the relative coordinate system with respect to the fixed coordinate system,
A substrate scanning stage 250 which is fixed on the paper and performs an X-axis direction movement and a Y-axis direction movement of an object placed on the upper side,
A first fixing part 211 which fixes and supports the first substrate 510 and a second substrate fixing part 211 which is connected to the first fixing part 211 to perform a z-axis movement of the first fixing part 211, And a first substrate alignment stage 213 connected to the substrate pressing stage 212 to perform the x-axis movement, the y-axis movement, and the? -Axis rotation of the substrate pressing stage 212 A first substrate moving part 210,
A second fixing part 221 for fixing and supporting the second substrate 520 at a position facing the first substrate 510 and a second fixing part 221 disposed on the substrate scanning stage 250, And a second substrate rotating stage (222) having an alignment stage (213) and connected to the second fixing part (221) to perform the rotation in the Θ axis direction of the second fixing part (221) The moving unit 220,
, ≪ / RTI >
The entirety of the first substrate moving part 210 and the second substrate moving part 220 is moved in the X-axis direction and the Y-axis direction by the substrate scanning stage 250,
The second substrate rotating stage 222 rotates the second substrate moving part 220 in the? -Axis direction,
The x-axis direction, the y-axis direction, and the? -Axis alignment of the first substrate 510 with respect to the second substrate 520 are performed by the first substrate alignment stage 213,
Wherein contact and pressing between the first substrate (510) and the second substrate (520) are performed by the substrate pressing stage (212).
6. The apparatus of claim 5, wherein the first fixing portion (211)
A first fixing chuck 2111 having a lower surface on which a first substrate 510 is fixed by a vacuum method or a mechanical method,
A holder 2112 formed in a frame shape to surround the periphery of the first fixing chuck 2111,
And a holder fixing block 2113 which is stacked on the upper side of the holder 2112 and is connected to the substrate pressing stage 212, ),
The holder 2112 and the holder fixing block 2113 are formed in a plate shape so as to allow only the z-axis movement of the holder 2112 and the holder fixing block 2113. The plate surface is arranged parallel to the plate surface of the holder 2112 or the plate surface of the holder fixing block 2113 A plurality of leaf springs 2114 disposed at a rim of the holder 2112 or a rim of the holder fixing block 2113,
A plate spring 2114 which is formed in a column shape extending in the stacking direction of the holder 2112 and the holder fixing block 2113 and whose plate surface is arranged in parallel to the plate surface of the holder 2112, A plurality of plate spring supports 2115 for connecting and fixing another plate spring 2114 arranged in parallel to the plate surface of the holder fixing block 2113,
A plurality of preload springs 2116 interposed between the holder 2112 and the holder fixing block 2113,
A screw head and a screw thread, and the threaded column portion is connected to the holder fixing block 2113 through the holder 2112 and the holder fixing block 2113, The angle compensating screws 2117,
One end is supported on the screw head of the angle compensating screw 2117 so as to compensate for the angle of the first substrate 510 to align the first substrate 510 and the second substrate 520, A plurality of angle compensating springs 2118 arranged to be supported on the plate surface of the holder fixing block 2113,
And an optical transfer unit.
6. The apparatus of claim 5, wherein the second fixing portion (221)
A second fixing chuck 2211 fixed on the upper surface of the second substrate 520 by a vacuum method or a mechanical method,
A load cell holder 2212 stacked on the lower side of the second fixing chuck 2211,
A plurality of load cells 2213 interposed between the second fixed chuck 2211 and the load cell holder 2212,
And an optical transfer unit.
[8] The apparatus of claim 7, wherein the second fixing part (221)
In order to prevent horizontal slippage between the second fixing chuck 2211 and the load cell 2213,
A plurality of V-shaped slots 2211a having a V-shaped cross section are radially arranged on the lower surface of the second fixing chuck 2211,
The upper portion of the load cell 2213 is formed in a hemispherical shape,
And an upper portion of the load cell (2213) is inserted into the V-shaped slot (2211a).
An optical selective transfer method using any one of the optical selective transfer apparatuses selected from the first, second, third, fifth, sixth, seventh and eighth embodiments,
Disposing the first substrate (510) and the second substrate (520) on the stage device part (200) so that they are spaced apart from each other in the z axis direction;
The first substrate 510 and the second substrate 520 are moved and rotated by the stage device unit 200 to align the positions of the first substrate 510 and the second substrate 520;
The first substrate 510 is moved and contacted with the second substrate 520 by the stage unit 200;
By the change in the adhesive force of the first adhesive layer generated as the light is irradiated onto a selected area of the first substrate 510 by the optical device unit 100, the elements 550 on the first substrate 510 A portion of the first substrate is transferred to the second substrate 520;
The first substrate 510 is moved and separated from the second substrate 520 by the stage device unit 200;
And a second transferring step of transferring the image onto the recording medium.

Images