KR101110420B1 - Alignment module for substrate and lithograph apparatus having the alignment module - Google Patents

Abstract

PURPOSE: A substrate aligning module and a lithography device including the same are provided to maintain the alignment of a substrate by minimizing the misalignment of the substrate and a stamp. CONSTITUTION: A substrate chuck is mounted on a substrate holder. A stamp chuck(21) is formed on the upper side of a substrate and is mounted in a stamp holder. A stage unit(40) is connected to the stamp holder and firstly aligns the substrate and the stamp. A piezoelectric device is connected to the substrate holder and secondly aligns the substrate and the stamp. A spring unit(25) is located at the same height as the contact surface between the substrate and the stamp.

Description

Substrate alignment module and a lithographic apparatus having the same {ALIGNMENT MODULE FOR SUBSTRATE AND LITHOGRAPH APPARATUS HAVING The ALIGNMENT MODULE

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lithographic apparatus for the manufacture of semiconductor devices, and to a substrate alignment module for performing an imprint process in which a substrate and a stamp are aligned and in alignment, and a lithographic apparatus having the same.

Generally, a semiconductor device is manufactured by repeating unit processes such as deposition, lithography, etching, chemical mechanical polishing, cleaning and drying, ion implantation, and inspection on a semiconductor substrate. .

BACKGROUND OF THE INVENTION In recent years, manufacturing techniques have been developed to improve the degree of integration, reliability, response speed, and the like, and design rules for fine processing technologies have been strict.

In general, in order to manufacture a semiconductor device, a micrometer or nanometer level microstructure must be fabricated. A method of transferring a shape of a structure in large quantities by using a mask or a stamp and a mask or stamp There is a way to fabricate any shape without. Here, in the former case, there are photo lithography for irradiating light to a mask and imprint lithography for physically compressing and transferring the image using a stamp.

On the other hand, in the case of photolithography, the mask is aligned and positioned on a substrate on which a resist is applied, and then the light is irradiated to cure the resist. In the case of imprint lithography, the resist is cured using a method of arranging the stamp on the substrate to which the resist is applied, pressing the stamp to closely adhere the substrate, and heating or irradiating light.

However, in the case of the photolithography process, the fineness of the processable structure depends on the wavelength of the light source, and thus it is difficult to process the microstructure below the wavelength of the light source even when using a mask of a fine pattern, and due to the influence of the interference effect of light, As the degree of integration increases, there is a problem in that the CD (critical dimension) of the pattern is formed nonuniformly.

In order to overcome the problems and limitations of this photolithography process, an imprint lithography process has been developed. Imprint lithography is a method of transferring a pattern by physically bringing a patterned stamp into contact with a substrate and then applying energy (ultraviolet or heat) to harden the pattern. It is possible to produce a sub-nano fine pattern.

Meanwhile, a two-dimensional or three-dimensional structure is formed on a substrate through a lithography process. In order to form the three-dimensional structure, a multi-layer patterning process is performed by performing two or more photolithography or imprint lithography processes. Here, in the case of the multi-layer patterning process, since a plurality of patterning processes are sequentially performed to form a structure, the shape formed at every patterning process is different from the shape formed on the substrate manufactured in the initial process and the pattern formed in the previous patterning step. very important. Therefore, alignment of the position between the mask or stamp and the substrate is very important, and such alignment is one of the important factors that determine the accuracy and performance of the fabricated structure. Particularly, as the necessity of nanotechnology arises, it is required to manufacture not only the micrometer-level shape but also the nanometer-level precise shape, and thus the development of manufacturing equipment of this level is required.

Embodiments of the present invention to solve the above-described problem is a substrate alignment module capable of precisely aligning the substrate and the stamp in the imprint lithography or photolithography apparatus, and maintain the position of the aligned substrate and stamp and a lithographic apparatus having the same It is to provide.

According to embodiments of the present invention for achieving the above object of the present invention, a substrate alignment module capable of precisely aligning the position between the substrate and the stamp and maintaining the aligned substrate and the position of the stamp, the substrate is mounted A substrate chuck, a substrate holder on which the substrate chuck is mounted, a stamp chuck provided on an upper portion of the substrate, and a stamp chuck mounted on the substrate, a stamp holder on which the stamp chuck is mounted, and connected to the stamp holder to align the substrate and the stamp with a first alignment. And a piezoelectric element connected to the stage part and the substrate holder for aligning the substrate and the stamp.

According to one side, it comprises a spring portion of the leaf spring form connecting the stamp holder and the stage portion, wherein the spring portion is provided to be located at the same height as the surface the substrate and the stamp abuts when the substrate and the stamp is in contact To align the height change and angle change between the substrate and the stamp. Here, the spring unit includes a spring block having a predetermined opening formed in the stage and provided inside the opening, one end of which is connected to the stamp holder and the other end of which is connected to the spring block, and one end of which is the stage. It may be formed in a double structure including a second spring connected to the portion and the other end connected to the spring block. In addition, a plurality of springs may be provided along the circumference of the stamp holder.

According to one side, the stage portion first alignment of the position of the substrate and the stamp at the micrometer level, the piezoelectric element second alignment of the position of the substrate and the stamp at the nanometer level. Here, the stage part may be formed by stacking a plurality of stage blocks, and each stage block may have a hole having a size larger than that of the substrate and the stamp so that the substrate and the stamp may be positioned at the center thereof. In addition, the stage unit may include a linear guide for linearly moving the stage block in left and right directions, and a rotation guide for rotating the stage block. The linear guide may be provided between each of the stage blocks to connect the stage blocks, and a linear adjuster for adjusting the linear movement of the stage block may face each other on both sides of the stage block. Can be. The rotation guide may be provided to connect the stage block, and a rotation controller for adjusting the rotational movement of the stage block may be provided at one side of the stage block.

According to one side, the substrate holder may use a means for fixing the substrate chuck in the form of any one of magnetic force, electrostatic force, air pressure.

On the other hand, according to the embodiments of the present invention for achieving the above object of the present invention, a substrate is mounted on the stamp and the substrate alignment module for aligning the position of the substrate and the stamp, the transfer unit for moving the substrate alignment module, It comprises a position measuring unit for measuring the position of the substrate and the stamp mounted on the substrate alignment module, an ultraviolet irradiation unit for irradiating the ultraviolet rays to the substrate and a pressing unit for pressing the substrate against the stamp. Here, the substrate alignment module, a substrate chuck on which the substrate is mounted, a substrate holder on which the substrate chuck is mounted, a stamp chuck provided on the substrate and mounted on the stamp, a stamp holder on which the stamp chuck is mounted, and connected to the stamp holder And a stage portion for firstly aligning the substrate and the stamp, and a piezoelectric element connected to the substrate holder for secondly aligning the substrate and the stamp.

According to one side, the ultraviolet irradiation unit is provided on the upper portion, the lower portion corresponding to the ultraviolet irradiation unit is provided with the pressing portion, the pressing portion is moved vertically to operate to contact the substrate alignment module to the ultraviolet irradiation unit, When the pressing unit moves, the substrate alignment module may move upward from the transfer unit.

According to one side, the upper side of the pressing portion may be provided with a heating unit for applying heat to the substrate.

As described above, according to embodiments of the present invention, it is possible to align and fix the position of the substrate for multi-layer patterning, and more easily to adjust the position between the substrate and the stamp.

In addition, the position of the substrate may be precisely adjusted during the alignment of the substrate, and the alignment between the substrate and the stamp may be minimized during the contacting and pressing of the stamp.

In addition, since various structures can be manufactured precisely, a more integrated semiconductor device can be manufactured.

1 and 2 are cross-sectional views illustrating a multi-layer patterning process in an imprint lithography process according to an embodiment of the present invention.
3 is a schematic diagram illustrating a substrate alignment module according to an embodiment of the present invention.
4 through 7 are schematic diagrams for explaining the configuration and operation of a lithographic apparatus according to an embodiment of the present invention.
8 and 9 are schematic views for explaining the mounting of the substrate and the stamp in the substrate alignment module of FIG.
FIG. 10 is a schematic diagram for describing linear direction adjustment during first position alignment in the substrate alignment module of FIG. 3.
FIG. 11 is a schematic diagram illustrating a rotation direction adjustment during first position alignment in the substrate alignment module of FIG. 3.
12 is a schematic diagram illustrating a second position alignment in the substrate alignment module of FIG. 3.
FIG. 13 is a schematic view showing the influence of the inclination of the stamp in the substrate alignment module of FIG. 3.
FIG. 14 is a plan view illustrating a structure of a stamp holder and a spring part in FIG. 13.
15 and 16 are perspective views and side cross-sectional views of main parts for showing a deformed state of the spring part when the stamp holder moves up and down in FIG. 14.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to or limited by the embodiments. In describing the present invention, a detailed description of well-known functions or constructions may be omitted for clarity of the present invention.

Hereinafter, a substrate alignment module 10 and a lithographic apparatus 100 according to embodiments of the present invention will be described in detail with reference to the drawings. According to this embodiment the lithographic apparatus comprises a substrate alignment module 10 for aligning and fixing the substrate 1, wherein the substrate 1 and the stamp 3 are seated and aligned on the substrate alignment module 10. Then, the process is performed by being transferred to the lithographic apparatus 100 while being fixed to the substrate alignment module 10.

Meanwhile, hereinafter, an imprint lithography apparatus will be described as an example, but the present invention is not limited to imprint lithography, and the same can be applied to a photo lithography apparatus.

1 and 2 are cross-sectional views illustrating a multi-layer patterning process in an imprint lithography process according to an embodiment of the present invention.

First, as shown in FIG. 1, the resist 51 is applied onto the substrate 1 and the first stamp 31 is pressed against the resist 51 to form a pattern formed on the first stamp 31. ) Is transferred to. In FIG. 1, reference numeral 51a denotes a resist 51a to which the pattern of the first stamp 31 is transferred.

Next, in order to form a three-dimensional structure on the substrate 1, as shown in FIG. 2, as shown in FIG. 1, the second resist (i.e., on the resist 51a to which the pattern of the first stamp 31 is transferred). 52), the second stamp (3) is pressed to transfer the pattern of the second stamp (32). Here, reference numeral 52a in FIG. 1 denotes a resist 52a to which the pattern of the second stamp 32 is transferred. In FIG. 2, 'P' indicates a pattern shape P to be transferred from the second stamp 32, and 'M' indicates the position of the substrate 1 when the second stamp 32 is aligned with the substrate 1. The alignment shape M for confirming is shown.

In the present embodiment, patterning using the first and second stamps 31 and 32 has been described as an example. However, the present invention is not limited thereto, and three or more stamps may be used.

In the multilayer patterning process, as shown in FIGS. 1 and 2, two or more stamps 31 and 32 are sequentially transferred to form a three-dimensional structure, thereby forming a three-dimensional structure. Position alignment of (1) is important. According to this embodiment a substrate alignment module 10 for aligning the stamp 3 with the substrate 1 and maintaining the position of the aligned substrate 1 is disclosed.

3 is a schematic diagram illustrating a substrate alignment module 10 according to an embodiment of the present invention. For convenience of explanation, hereinafter, the reference numeral of the stamp is used as '3' and the resist is described using the reference numeral '5'. Here, the stamp 3 includes the first and second stamps 31 and 32 described above, and includes stamps for transferring a pattern to the substrate 1. Similarly, the resist 5 collectively refers to resists applied to the substrate 1 including the first and second resists 51 and 52 before the pattern is transferred.

The substrate alignment module 10 aligns the substrate 1 with the stamp 3 and keeps the aligned substrate 1 and stamp 3 fixed, and the substrate is placed on the substrate alignment module 10 for the lithography process. 1 and 3 are transported and mounted to the lithographic apparatus 100 (see FIGS. 4 to 7) in a fixed state.

The substrate alignment module 10 includes a substrate chuck 11 on which the substrate 1 is mounted, a substrate holder 13 on which the substrate chuck 11 is fixed, and a stamp chuck 21 on which the stamp 3 is mounted and supported. It comprises a stamp holder 23 to which the stamp chuck 21 is fixed. A spring portion 25 and a piezoelectric element 15 are provided for the alignment of the substrate 1, and a stage portion 40 is provided for the alignment of the position between the substrate 1 and the stamp 3.

For example, each of the substrate chuck 11 and the stamp chuck 21 has grooves formed on the surface where the substrate 1 and the stamp 3 come into contact with each other, and provides a vacuum in the grooves so that the substrate 1 and the stamp chuck ( 3) may be a vacuum chuck to hold and fix each. However, the present invention is not limited thereto, and the substrate chuck 11 and the stamp chuck 21 may substantially fix the substrate 1 and the stamp 3, including an electrostatic chuck held and fixed in an electrostatic manner. It can have various forms.

In addition, the substrate chuck 11 and the stamp chuck 21 may be made of metal or glass. Here, in the case of the stamp chuck 21, ultraviolet irradiation may be performed during the lithography process, and a material such as transparent glass through which the ultraviolet ray may pass through the stamp chuck 21 may be irradiated with the stamp 3. This can be used.

The stamp holder 23 is connected to and supported by the stage portion 40 by a spring portion 25. The substrate holder 13 is connected to and supported by the stage unit 40 by the piezoelectric element 15.

The stage portion 40 is composed of a plurality of stage blocks 41, 42, 43, 44, and is positioned between the substrate 1 and the stamp 3 by using the spring portion 25 and the piezoelectric element 15. Adjust to align and fix the substrate 1 and the stamp 3 in an aligned state. In addition, the stage 40 is formed by stacking a plurality of stage blocks 41, 42, 43, and 44, and a substrate 1 and a stamp 3 in the center of the stage blocks 41, 42, 43, and 44. Since holes must be located, holes 42a, 43a (see FIGS. 10 and 11) larger in size than the substrate 1 and the stamp 3 are formed in the center of the stage blocks 41, 42, 43, and 44.

Detailed configurations and operations of the substrate alignment module 10 and the stage unit 40 will be described with reference to FIGS. 8 to 16.

Next, the operation of the substrate alignment module 10 and the configuration and operation of the lithographic apparatus 100 in the lithographic apparatus 100 according to an embodiment of the present invention will be briefly described with reference to FIGS. 4 to 7. For reference, FIGS. 4 to 7 are schematic diagrams for explaining the configuration and operation of the lithographic apparatus 100 according to an embodiment of the present invention.

As shown in FIG. 4, with the substrate 1 and the stamp 3 mounted on the substrate alignment module 10, the substrate alignment module 10 is supported by the transfer unit 120 and mounted on the lithographic apparatus 100. do.

The relative position of the substrate 1 and the stamp 3 mounted on the substrate alignment module 10 is measured by the position measuring unit 110. Here, when there is a deviation in the position of the substrate 1 and the stamp 3 measured by the position measuring unit 110, the position of the substrate 1 and the stamp 3 is fine in the substrate alignment module 10 To adjust the alignment.

Next, when the position alignment of the substrate 1 and the stamp 3 is completed, as shown in FIG. 5, the substrate alignment module 10 is pressed by the transfer unit 120 and the heating unit 150 as shown in FIG. 5. 140 is conveyed.

Next, as shown in FIGS. 6 and 7, the pressing unit 150 moves upward to pressurize and move the substrate alignment module 10 to the upper portion, and the ultraviolet irradiation unit having the substrate alignment module 10 positioned thereon. Move upward until it comes in contact with 130.

In a state where the substrate alignment module 10 is in pressure contact with the ultraviolet irradiation unit 130, the ultraviolet irradiation unit 130 irradiates the substrate alignment module 10 with ultraviolet rays and hardens the resist applied on the substrate 1. .

Here, although the present embodiment has been described with an example of irradiating ultraviolet rays, the present invention is not limited by the drawings, and the heating unit 140 in contact with the lower portion of the substrate alignment module 10 applies a predetermined heat. It is also possible to cure the resist accordingly.

When the curing of the resist is completed, the pressing unit 150 returns to the initial position, the substrate alignment module 10 is mounted on the transfer unit 120, and then returns to the initial position to complete the lithography process.

Meanwhile, in the above-described embodiment, an example in which the stamp 3 is seated on the upper part and the substrate 1 is seated on the lower part of the substrate alignment module 10 is described. However, on the contrary, the substrate 1 is seated on the upper part and the lower part is seated. It is also possible for the stamp 3 to be seated. In this case, it will be obvious that the position of the ultraviolet irradiation part 130 is changed according to the position of the stamp 3.

Next, with reference to FIGS. 8-15, the position alignment of the board | substrate 1 and the stamp 3 in the board | substrate alignment module 10 is demonstrated in detail.

8 and 9 are diagrams for describing a method of mounting the substrate 1 and the stamp 3 in the substrate alignment module 10.

The stamp chuck 21 and the stamp holder 23 can be separated from the substrate alignment module 10. As shown in FIG. 8, the stamp chuck 21 is separated from the substrate chuck ( 11) and the stamp (3) is mounted and fixed to the stamp chuck (21). When the stamp chuck 21 with the stamp 3 is mounted on the stamp holder 23, the mounting of the substrate 1 and the stamp 3 is completed.

Here, the stamp 3 adheres to the substrate 1 by the weight of the stamp 3, the stamp chuck 21, and the stamp holder 23. However, when the stamp chuck 21 is mounted, deformation occurs in the spring portion 25 mounted on the stamp holder 23, thereby closely adhering between the substrate 1 and the stamp 3 by the elastic force of the spring portion 25. Can be increased or decreased.

10 and 11 are views for explaining first position alignment of the substrate 1 and the stamp 3 by the stage portion 40 in the substrate alignment module 10, and FIG. 10 illustrates straight line adjustment. 11 is a diagram for explaining a rotation direction adjustment.

The stage portion 40 aligns the position between the substrate 1 and the stamp 3, aligning the position at the micrometer level. In this embodiment, the position alignment between the substrate 1 and the stamp 3 by the stage portion 40 is called a first position alignment, and the substrate 1 and the stamp 3 by the piezoelectric element 15 described later. The positional alignment between is called a second positional alignment.

Referring to FIG. 10, the linear direction adjustment of the first position alignment is performed between the third stage block 43 and the fourth stage block 44 as illustrated in FIG. 10. A linear guide 45 for adjusting the substrate 1 and the stamp 3 is provided between the third and fourth stage blocks 43 and 44, and the third and fourth stage blocks ( The right and left edge portions 43 and 44 are provided with linear adjustment units 46 for micro adjustment for fine adjustment, respectively.

For example, the linear adjuster 46 may be a screw capable of adjusting the positions of the third and fourth stage blocks 43 and 44 at a micro level.

The relative position of the third stage block 43 and the fourth stage block 44 is changed by the linear adjuster 46. In addition, the linear adjuster 46 is positioned to face each other with the third and fourth stage blocks 43 and 44 interposed therebetween, and by appropriately combining through the linear adjuster 46 provided on both sides, the external frictional force is provided. Even in this relatively large situation, fine and precise adjustments are possible.

Here, in FIG. 10, the left and right position movements of the third and fourth stage blocks 43 and 44 have been described as an example. However, the first stage block is provided through the linear adjusting unit 46 in the same manner as the above-described embodiment. A forward and backward positional movement between the 41 and the second stage block 42 can be realized.

Next, referring to FIG. 11, the second stage block 42 and the third stage block 43 are constrained by a rotation guide 47 for rotational movement. One edge portion of the stage blocks 42 and 43 is provided with a rotation controller 48 for fine adjustment.

Here, the rotation controller 48 may be a screw that can adjust the rotational movement of the second and third stage blocks 42 and 43 at a micro level.

In addition, the rotation controller 48 is fixedly mounted to the third stage block 43, and the second stage block 42 rotates as the rotation controller 48 is operated. In addition, the rotation controller 48 is positioned on one side of the third stage block 43 so that the two rotation controllers 48 face each other, and are provided to operate in a direction pushing each other. The rotation of the second and third stage blocks 42 and 43 can be adjusted by appropriately combining the two rotation adjusting units 48.

According to the present embodiment, the stage part 40 is formed between the substrate 1 and the stamp 3 by moving the first to fourth stage blocks 41, 42, 43, 44 in left, right, front, and rotation directions. 1 Perform position alignment. In addition, the linear adjustment unit 46 and the rotation control unit 48 provided to face each other can be finely and precisely adjusted, and after the adjustment is completed, the adjusted position is firmly fixed. Therefore, even if there is no separate fixing device, the aligned positions of the substrate 1 and the stamp 3 can be fixed. However, unlike the embodiment described above, it is also possible to provide a separate fixing device for fixing the alignment position of the substrate 1 and the stamp (3).

12 is a schematic view for explaining the second position alignment using the piezoelectric element 15 in the substrate alignment module 10.

Referring to FIG. 12, the second position alignment is performed through the piezoelectric element 15 provided between the substrate holder 13 and the stage portion 40. The piezoelectric element 15 is stretched or shrunk relatively precisely in the range of several tens of micrometers to several nanometers depending on the applied voltage. In the present embodiment, the piezoelectric element 15 is inserted between the substrate holder 13 and the fourth stage block 44, and is applied to the fourth stage block 44 by applying a predetermined voltage to the piezoelectric element 15. The relative position of the substrate 1 relative to the substrate 1 is finely adjusted.

In addition, the piezoelectric elements 15 are provided with first and second piezoelectric elements 151 and 152 on both sides of the substrate holder 13, respectively, and have different voltages on the first and second piezoelectric elements 151 and 152. Can be applied. For example, as the first piezoelectric element 151 is contracted and the second piezoelectric element 152 is expanded, as shown in the center of FIG. 12, the substrate 1 is slightly moved to the left direction. do. Similarly, as shown in the lower portion of FIG. 12, as the first piezoelectric element 151 is expanded and the second piezoelectric element 152 is contracted, the position of the substrate 1 is slightly moved to the right direction.

As described above, when the position between the substrate 1 and the stamp 3 in the substrate alignment module 10 is aligned, it is pressurized by the lithographic apparatus 100, and in this process, the substrate 1 and the stamp 3. Strong pressure is applied. The degree of pressure applied varies depending on the area of the substrate 1, the thickness of the applied resist and the properties of the material, the shape of the pattern of the stamp 3, and the like. The relatively high pressure is applied to the substrate 1 and the stamp ( 3) Do not shift the position between.

In this embodiment, a spring portion 25 is provided for preventing the positional shift between the substrate 1 and the stamp 3. Hereinafter, with reference to FIGS. 13-16, the operation | movement of the spring part 25 is demonstrated in detail. For reference, FIG. 13 is a schematic view showing the influence of the inclination of the stamp on the spring portion 25 in the substrate alignment module 10 according to an embodiment of the present invention. FIG. 14 is a plan view illustrating the structure of the stamp holder 23 and the spring part 25 in FIG. 13, and FIGS. 15 and 16 show the spring part 25 when the stamp holder 23 moves up and down in FIG. 14. The main portion perspective and side cross-sectional views for showing the deformation state of the).

In the substrate alignment module 10, the spring portion 25 prevents misalignment of the aligned substrate 1 and the stamp 3. For example, the spring portion 25 may be a leaf spring.

In addition, the spring portion 25 is provided to maintain the same position as the contact surface of the substrate 1 and the stamp 3 in a state in which the substrate 1 and the stamp 3 are in contact with each other. That is, as shown in FIG. 13, the spring part 25 has a rotation center located at the dotted line position, ie, the surface position of the stamp 3. In this state, when the inclination occurs due to the vertical movement of the stamp 3, only the vertical movement is performed while the horizontal movement of the stamp 3 is minimized by the action of the spring portion 25. Here, since the vertical movement of the stamp 3 has little effect on the positional displacement of the substrate 1 and the stamp 3, the horizontal movement between the substrate 1 and the stamp 3 is suppressed in the pressing process. Therefore, the positional shift between the board | substrate 1 and the stamp 3 can be suppressed, and the aligned state can be effectively maintained.

Here, FIG. 13 schematically shows the stamp holder 23 and the spring portion 25 for the purpose of explanation. In the case where the actual stamp holder 23 moves up and down, the spring may be caused by tension or compression of the spring portion 25. It is difficult for the unit 25 to operate smoothly. In the present embodiment, as shown in Figs. 14 to 16, the spring portion 25 can be configured.

The spring portion 25 is provided with a plate spring in a double structure, the spring portion 25 is connected between the stamp holder 23 and the spring block 27, the spring block 27 and the first stage block 41 The spring portion 25 is also configured to be connected between. 14 to 16, a predetermined opening is formed in the first stage block 41, and a spring block 27 is provided inside the opening. The spring 25 has one end connected to the stamp holder 23, the other end connected to the spring block 27, and one end connected to the first stage block 41, and the other end connected to the spring block 27. It is formed in a double structure of the connected second spring. In addition, a plurality of springs 25 may be provided along the circumference of the stamp holder 23. For example, the springs 25 may be provided at four positions at equal intervals of 90 °.

As shown in FIG. 15 and FIG. 16, when one side of the stamp holder 23 moves in the up and down direction, the spring block 27 moves in a constant amount along the moving direction of the stamp holder 23. The spring portion 25 is connected in a double structure, as shown in Figure 16, the spring portion 25 is deformed. Here, since the spring portion 25 is deformed in the vertical direction without tension or shrinkage in the longitudinal direction, one side of the stamp holder 23 moves only in the vertical direction. And since the stamp holder 23 moves only to an up-down direction, the horizontal movement of the stamp 3 can be suppressed, and the position shift between the board | substrate 1 and the stamp 3 can be suppressed.

According to the present embodiment, in manufacturing a fine shape using an imprint lithography apparatus, the position of the substrate 1 and the stamp 3 can be precisely aligned and maintained in an aligned state. Position shift can be prevented. In addition, by making it possible to manufacture a variety of shapes precisely, it is possible to perform the production of fine parts in a semiconductor device more smoothly. That is, the substrate 1 and the stamp 3 may be finely aligned in the substrate alignment module 10, and the aligned state may be maintained. In addition, the stage 40 allows the substrate 1 and the stamp 3 to be precisely aligned at the micrometer level and held in an aligned state. In addition, the piezoelectric element 15 allows the substrate 1 and the stamp 3 to be aligned precisely at the nanometer level. In addition, by preventing the position of the substrate 1 and the stamp 3 aligned in the pressing process through the spring portion 25, it is possible to improve the accuracy of the patterning and reduce the occurrence of defects

As described above, the present invention has been described by specific embodiments such as specific components and the like, but the embodiments and the drawings are provided only to help a more general understanding of the present invention, and the present invention is limited to the above-described embodiments. In other words, various modifications and variations are possible to those skilled in the art to which the present invention pertains. Therefore, the spirit of the present invention should not be limited to the above-described embodiments, and all the things that are equivalent to or equivalent to the scope of the claims as well as the claims to be described later belong to the scope of the present invention.

1: substrate
3, 31, 32: stamp
5, 51, 52: resist
51a, 52a: resist to which pattern was transferred
10: substrate alignment module
11: substrate chuck
13: substrate holder
15, 151, 152: piezoelectric element (PZT)
21: stamp chuck
23: stamp holder
25: spring part
27: spring block
40: stage part
41, 42, 43, 44: stage block
42a, 43a: hole
45: linear guide
46: linear micrometer
47: rotation guide
48: micrometer
100: lithographic apparatus
110: position measuring unit
120: transfer unit
130: ultraviolet irradiation unit
140: heating unit
150: pressurization
M: alignment area
P: pattern area

Claims (13)

A substrate chuck on which the substrate is mounted;
A substrate holder on which the substrate chuck is mounted;
A stamp chuck provided on the substrate and mounted with a stamp;
A stamp holder on which the stamp chuck is mounted;
A stage unit connected to the stamp holder to first align the substrate with the stamp;
A piezoelectric element connected to the substrate holder for second alignment of the substrate with the stamp; And
It has a plate spring form that connects the stamp holder and the stage portion, and is provided so as to be located at the same height as the surface the substrate and the stamp abuts when the substrate and the stamp is in contact, changing the height between the substrate and the stamp And a spring unit for aligning the angle change;
Substrate alignment module comprising a.
delete The method of claim 1,
The spring unit may include a spring block having a predetermined opening formed in the stage and provided inside the opening,
A first spring having one end connected to the stamp holder and the other end connected to the spring block; And
A second spring having one end connected to the stage part and the other end connected to the spring block;
Substrate alignment module formed in a double structure comprising a.
The method of claim 1,
And a plurality of springs provided along a circumference of the stamp holder.
delete The method of claim 1,
The stage unit is formed by stacking a plurality of stage blocks,
And each stage block has a hole larger in size than the substrate and the stamp so that the substrate and the stamp are positioned at the center thereof.
The method of claim 6,
And the stage unit includes a linear guide for linearly moving the stage block in left, right, and front and rear directions, and a rotation guide for rotating the stage block.
The method of claim 7, wherein
The linear guide is provided between each of the stage blocks to connect each stage block,
And a linear adjuster for adjusting the linear movement of the stage block to face each other on both sides of the stage block.
The method of claim 7, wherein
The rotation guide is provided to connect the stage block,
The substrate alignment module is provided with a rotation controller for adjusting the rotational movement of the stage block on one side of the stage block.
The method of claim 1,
The substrate holder is a substrate alignment module for fixing the substrate chuck in the form of any one of magnetic force, electrostatic force, air pressure.
A substrate alignment module having a substrate and a stamp mounted thereon to align a position of the substrate and the stamp;
A transfer unit to move the substrate alignment module;
A position measuring unit measuring a position of the substrate and the stamp mounted on the substrate alignment module;
An ultraviolet irradiator for irradiating ultraviolet rays to the substrate; And
A pressing unit for pressing the substrate against the stamp;
Including,
Board alignment module,
A substrate chuck on which the substrate is mounted;
A substrate holder on which the substrate chuck is mounted;
A stamp chuck provided on the substrate and mounted with a stamp;
A stamp holder on which the stamp chuck is mounted;
A stage unit connected to the stamp holder to first align the substrate with the stamp;
A piezoelectric element connected to the substrate holder for second alignment of the substrate with the stamp; And
It has a plate spring form that connects the stamp holder and the stage portion, and is provided so as to be located at the same height as the surface the substrate and the stamp abuts when the substrate and the stamp is in contact, changing the height between the substrate and the stamp And a spring unit for aligning the angle change;
Lithographic apparatus comprising a.
The method of claim 11,
The ultraviolet irradiation unit is provided at the upper portion, the lower portion corresponding to the ultraviolet irradiation unit is provided with the pressing unit,
And the pressing unit moves vertically to contact the substrate alignment module with the ultraviolet irradiation unit, and when the pressing unit moves, the substrate alignment module leaves the transfer unit and moves upward.
The method of claim 11,
An upper side of the pressing unit is a lithographic apparatus provided with a heating unit for applying heat to the substrate.

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