CN112701077A - Device transfer method - Google Patents
Device transfer method Download PDFInfo
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- CN112701077A CN112701077A CN202011576856.5A CN202011576856A CN112701077A CN 112701077 A CN112701077 A CN 112701077A CN 202011576856 A CN202011576856 A CN 202011576856A CN 112701077 A CN112701077 A CN 112701077A
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- 238000000034 method Methods 0.000 title claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 165
- 239000003292 glue Substances 0.000 claims abstract description 56
- 230000003301 hydrolyzing effect Effects 0.000 claims abstract description 41
- 238000006460 hydrolysis reaction Methods 0.000 claims abstract description 29
- 230000007062 hydrolysis Effects 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000000853 adhesive Substances 0.000 claims abstract description 18
- 230000001070 adhesive effect Effects 0.000 claims abstract description 18
- 239000010410 layer Substances 0.000 claims description 55
- 239000012790 adhesive layer Substances 0.000 claims description 27
- 239000011521 glass Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 230000003313 weakening effect Effects 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 239000005020 polyethylene terephthalate Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 13
- 239000000416 hydrocolloid Substances 0.000 description 5
- 229920001225 polyester resin Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
Abstract
The application discloses a device transfer method, and relates to the technical field of semiconductors. According to the device transfer method, the device on the first substrate is adhered by the hydrolysis glue layer, and then the adhered device is attached to the adhesion layer of the second substrate, so that the device adhered to the hydrolysis glue layer is adhered to the adhesion layer, and the adhesion layer has the property of being not dissolved in water and being not adhered. And finally, putting the temporary substrate, the second substrate and the device which are bonded into a whole into water, dissolving the hydrolytic glue layer in water, and peeling off the temporary substrate to obtain the second substrate with the device adhered thereon, thereby completing the transfer of the device. The device transfer method provided by the application utilizes the hydrolytic adhesive as the transfer adhesive, can be completely removed after transfer, solves the problem that part of devices are remained on the temporary substrate, and improves the transfer yield. And the hydrolytic adhesive can be coated on the temporary substrate in a large area, and large-area and large-volume transfer can be realized, so that the transfer efficiency of the device is improved.
Description
Technical Field
The application relates to the technical field of semiconductors, in particular to a device transfer method.
Background
There is no mature and commercialized mass transfer technology route, and the existing organic stamp technology, roll-to-roll technology, fluid assembly technology, etc. all have the disadvantages of their own technologies, either the yield problem or the efficiency problem.
In view of this, the present application is specifically made.
Disclosure of Invention
The application aims to provide a device transfer method which can improve the device transfer yield and transfer efficiency.
The application is realized as follows:
in a first aspect, the present application provides a device transfer method comprising:
providing a temporary substrate paved with a hydrolysis glue layer;
adhering the device on the first substrate by using the hydrolysis glue layer on the temporary substrate;
attaching the temporary substrate adhered with the device to an adhesive layer of a second substrate so as to enable the device adhered to the hydrolytic glue layer to be adhered to the adhesive layer, wherein the adhesive layer has the property of being insoluble in water and being non-adhesive;
and putting the temporary substrate, the second substrate and the device which are bonded into a whole into water so as to peel off the temporary substrate.
In an alternative embodiment, before the step of adhering the device on the first substrate with the hydrolytic glue layer on the temporary substrate, the device transfer method further comprises:
weakening the device on the first substrate to reduce the bonding force between the device and the first substrate.
In an alternative embodiment, the step of providing a temporary substrate provided with a hydrolytic glue layer comprises:
and coating a hydrolytic glue on the surface of the temporary substrate by a spin coating method to form the hydrolytic glue layer.
In an alternative embodiment, the step of adhering the device on the first substrate by using the hydrolytic glue layer on the temporary substrate includes:
attaching the side of the temporary substrate with the hydrolysis glue layer to the upper surface of a device on the first substrate so as to enable the device to be adhered to the hydrolysis glue layer;
and applying an external force to the temporary substrate to enable the temporary substrate to be far away from the first substrate so as to enable the device to be stripped from the first substrate.
In an optional embodiment, a boss is disposed on a surface of the temporary substrate, the hydrolysis glue layer is laid on the boss, and the step of adhering the device on the first substrate by using the hydrolysis glue layer on the temporary substrate includes:
and selectively adhering part of the devices on the first substrate by using the hydrolysis glue layer on the boss.
In an alternative embodiment, the device transfer method further comprises:
and after the temporary substrate is peeled off, drying the second substrate adhered with the device.
In an alternative embodiment, the first substrate is a wafer substrate.
In an alternative embodiment, the material of the temporary substrate comprises glass, sapphire, PET or PI.
In an alternative embodiment, the device is a microdevice.
In alternative embodiments, the device comprises a micro LED, diode, transistor, or integrated circuit chip.
The application has the following beneficial effects:
according to the device transfer method provided by the embodiment of the application, the device on the first substrate is adhered by utilizing the characteristic that the hydrolysis glue layer has stronger adhesive force. And then attaching the adhered device to the adhesive layer of the second substrate so as to adhere the device adhered to the hydrolytic glue layer to the adhesive layer, wherein the adhesive layer has the property of not being dissolved and debonded by water. And finally, putting the temporary substrate, the second substrate and the device which are bonded into a whole into water, dissolving the hydrolytic glue layer in water to ensure that the bonding force between the temporary substrate and the device is lost, peeling off the temporary substrate to obtain the second substrate bonded with the device, and completing the transfer of the device from the first substrate to the second substrate. According to the device transfer method, the hydrolytic adhesive is used as the transfer adhesive, the hydrolytic adhesive can be completely removed after transfer, the problem that part of devices are remained on the temporary substrate is solved, and the transfer yield is improved. And the hydrolytic adhesive can be coated on a temporary substrate in a large area, and large-area and large-volume transfer can be realized, so that the transfer efficiency of the device is improved, and the cost is reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
FIG. 1 is a flow chart of a device transfer method in one embodiment of the present application;
FIGS. 2-7 are schematic diagrams of a process for transferring a device according to an embodiment of the present application;
fig. 8 to 10 are schematic views illustrating a process of using a temporary substrate with a dummy block to pick up a device according to another embodiment of the present application.
Reference numerals: 100-a temporary substrate; 110-hydrolysis glue layer; 120-boss; 200-a first substrate; 300-a device; 400-a second substrate; 410-an adhesive layer.
Detailed Description
The mass transfer technology is an important technology in the production and manufacturing of the equipment containing the Micro devices, and is one of the major bottlenecks facing the Mini/Micro-LED display. Achieving high yield, low cost, and efficient mass transfer is the goal of the industry in pursuit of this technology. Today, there is no mature and commercialized mass transfer technology route, such as organic stamping technology, roll-to-roll technology, fluid assembly technology, etc. all have the disadvantages of their own technologies, either the yield problem or the efficiency problem.
In order to solve the problems of low transfer efficiency and yield in the prior art, embodiments of the present application provide a device transfer method based on hydrolyzed glue, which uses hydrolyzed glue as a transfer adhesive to stick a device on a first target substrate and then transfer the device onto a second target substrate. The hydrolytic adhesive can be completely removed through soaking after transfer, so that the problem that part of devices are remained on the temporary substrate is solved, and the transfer yield is improved. Meanwhile, the hydrolytic glue can be coated on a large-area substrate, large-area mass transfer is realized, the transfer efficiency is improved, and the cost is reduced.
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be clearly and completely described below. The examples, in which specific conditions are not specified, were conducted under conventional conditions or conditions recommended by the manufacturer. The reagents or instruments used are not indicated by the manufacturer, and are all conventional products available commercially.
It is to be understood that the embodiments described are only a subset of the embodiments of the present application and not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. are used for indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings or the orientation or positional relationship which the present invention product is usually put into use, it is only for convenience of describing the present application and simplifying the description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation and be operated, and thus, should not be construed as limiting the present application.
Furthermore, the appearances of the terms "first," "second," and the like, if any, are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
It should be noted that the features of the embodiments of the present application may be combined with each other without conflict.
The features and properties of the present application are described in further detail below with reference to examples.
Example (b):
FIG. 1 is a flow chart of a method for transferring a device 300 according to one embodiment of the present application; fig. 2-7 are schematic diagrams illustrating a process of transferring the device 300 according to an embodiment of the present application. Referring to fig. 1 and fig. 7, a method for transferring a device 300 according to an embodiment of the present application includes:
and step S100, providing a temporary substrate paved with a hydrolysis glue layer.
In alternative embodiments of the present application, the temporary substrate 100 may be a rigid or flexible substrate, and the material thereof includes, but is not limited to, glass, sapphire, polyester resin (PET) or polyimide resin (PI). In this embodiment, the temporary substrate 100 may be a flat plate, and the hydrolytic adhesive layer 110 is used as a transfer adhesive and uniformly laid on one surface of the temporary substrate 100.
Specifically, in the present embodiment, the hydrolytic glue layer 110 may be formed by applying hydrolytic glue to the surface of the temporary substrate 100 by spin coating. Of course, in other alternative embodiments, the glue hydrolysis layer 110 may be formed by knife coating, but it should be ensured that the glue hydrolysis layer 110 is even and uniform as much as possible to improve the adhesion effect on the device 300.
And step S200, adhering the device on the first substrate by using the hydrolysis glue layer on the temporary substrate.
In the embodiment of the present application, the device 300 to be transferred is provided on the first substrate 200. Optionally, the first substrate 200 is a wafer substrate. Further optionally, the devices 300 on the first substrate 200 are micro devices 300, such as devices 300 having dimensions in the range of 1-5000 microns.
In the present embodiment, the device 300 may be a micro LED, a diode, a transistor, or an integrated circuit chip (IC). It should be understood that the type and size of the device 300 are not limited to the above examples, but may be selected according to the actual situation.
In adhering the device 300 on the first substrate 200 by using the glue hydrolyzing layer 110 on the temporary substrate 100, the following steps can be specifically performed:
1) the side of the temporary substrate 100 having the hydrolytic adhesive layer 110 is attached to the upper surface of the device 300 on the first substrate 200, so that the device 300 is adhered to the hydrolytic adhesive layer 110. As shown in fig. 2 and 3, when the glue hydrolysis layer 110 of the temporary substrate 100 is close to the first substrate 200 without a large difference in height between the plurality of devices 300 on the first substrate 200, the upper surface of each device 300 covered by the temporary substrate 100 is stuck by the glue hydrolysis layer 110. The planar temporary substrate 100 and the glue-hydrolyzing layer 110 can easily stick all the large-area devices 300 on the first substrate 200 without distinction.
2) An external force is applied to the temporary substrate 100 away from the first substrate 200 to peel the device 300 from the first substrate 200. As shown in fig. 4, the temporary substrate 100 is moved away from the first substrate 200 by an external force, and all the devices 300 covered by the temporary substrate 100 are adhered from the first substrate 200 by the glue hydrolyzing layer 110 and transferred to the temporary substrate 100.
It can be seen that in this manner, the devices 300 can be transferred in large areas and in large quantities with greater efficiency and cost savings.
It should be understood that the bonding force between the hydrolytic glue layer 110 and the device 300 should be greater than the bonding force between the first substrate 200 and the device 300. In order to avoid the failure of the glue hydrolysis layer 110 to adhere the device 300 from the first substrate 200, in this embodiment, before the step S200, a weakening process may be performed on the device 300 on the first substrate 200 to reduce the bonding force between the device 300 and the first substrate 200, so as to improve the success rate of the adhesion, that is, the transfer yield of the device 300.
And step S300, attaching the temporary substrate adhered with the device to the adhesive layer of the second substrate so as to enable the device adhered to the hydrolytic glue layer to be adhered to the adhesive layer, wherein the adhesive layer has the property of being not dissolved and debonded by water.
As shown in fig. 5, after the device 300 is transferred onto the temporary substrate 100, the temporary substrate 100 to which the device 300 is attached to the adhesive layer 410 of the second substrate 400, so that the device 300 attached to the glue hydrolyzing layer 110 is adhered to the adhesive layer 410. Here the second substrate 400 is the target substrate to which the device 300 needs to be transferred. In the present embodiment, the adhesion layer 410 has a property of being insoluble and non-adhesive to water, so that the adhesion capability of the adhesion layer 410 is not affected when the adhesion of the hydrolysis glue layer 110 to the device 300 is released in a subsequent process.
Step S400, putting the temporary substrate, the second substrate and the device which are bonded into a whole into water so as to peel off the temporary substrate.
In this embodiment, after the temporary substrate 100, the second substrate 400 and the device 300 bonded together are put in water, the hydrolytic adhesive layer 110 is dissolved in water, so that the bonding force between the temporary substrate 100 and the device 300 is lost, the temporary substrate 100 is peeled off from the device 300, and the adhesive layer 410 is not dissolved in water and is not decomposed by water, so that the adhesion with the device 300 is maintained, as shown in fig. 6. After the temporary substrate 100 is peeled off, the second substrate 400 to which the device 300 is attached is taken out of water and dried, thereby completing the transfer, resulting in the structure shown in fig. 7.
In order to make the hydrolytic glue layer 110 dissolve more quickly, the temperature of the water can be increased appropriately to improve the transfer efficiency.
The device 300 transfer method described in the above embodiment is based on using a planar temporary substrate 100, and the temporary substrate 100 can stick all the devices 300 covered thereby without distinction, and the efficiency is high.
Fig. 8 to 10 are schematic views illustrating a process of picking up a device 300 using a temporary substrate 100 having a stage 120 according to another embodiment of the present application. As shown in fig. 8 to 10, in an alternative embodiment, the surface of the temporary substrate 100 may also be provided with a boss 120, and the hydrolytic glue layer 110 is laid on the boss 120. Therefore, in the step S200, the step of adhering the device 300 on the first substrate 200 by using the glue hydrolyzing layer 110 on the temporary substrate 100 may specifically include selectively adhering a part of the device 300 on the first substrate 200 by using the glue hydrolyzing layer 110 on the boss 120.
As shown in fig. 8 to 10, the side of the temporary substrate 100 having the mesa 120 (coated with the hydrolytic adhesive layer 110) is first attached to the upper surface of the partial device 300 on the first substrate 200, so that the device 300 is bonded to the hydrolytic adhesive layer 110. It can be seen that only the device 300 abutting the lands 120 is able to bond to the hydrocolloid layer 110, whereas the device 300 between two lands 120 is not able to contact the hydrocolloid layer 110. An external force is then applied to move the temporary substrate 100 away from the first substrate 200 such that the devices 300 in contact with the layer of hydrocolloid 110 on the lands 120 are glued up, while the devices 300 not abutting the lands 120 remain on the first substrate 200. By using a temporary substrate 100 with a mesa 120, selective bonding of the device 300 can be achieved, simply by designing the pattern of the mesa 120 of the temporary substrate 100 in advance. The design of the mesa 120 needs to take into account the pitch, height, etc. of the devices 300 to be transferred.
Of course, in fig. 8 to 10, the glue hydrolyzing layer 110 is coated on not only the projection 120 but also the recess; in alternative embodiments, the hydrocolloid layer 110 may be applied only to the lands 120.
After the device 300 is attached by using the temporary substrate 100 with the bumps 120, the method for subsequently transferring the device 300 can refer to fig. 5 to 7, which are not described herein again.
In summary, the device 300 transferring method provided in the embodiment of the present application utilizes the characteristic that the glue hydrolysis layer 110 has a strong adhesive force to adhere the device 300 on the first substrate 200. The adhered device 300 is then attached to the adhesive layer 410 of the second substrate 400 such that the device 300 adhered to the hydrocolloid layer 110 adheres to the adhesive layer 410, the adhesive layer 410 having the property of being insoluble in water and being debondable. Finally, the temporary substrate 100, the second substrate 400 and the device 300 which are bonded into a whole are put into water, the glue hydrolysis layer 110 is dissolved in the water, so that the bonding force between the temporary substrate 100 and the device 300 is lost, the temporary substrate 100 is peeled off, the second substrate 400 with the device 300 is obtained, and the transfer of the device 300 from the first substrate 200 to the second substrate 400 is completed. The device 300 transferring method provided by the embodiment of the application utilizes the hydrolytic adhesive as the transferring adhesive, can be completely removed after transferring, solves the problem that part of the device 300 remains on the temporary substrate 100, and improves the transferring yield. And the hydrolytic adhesive can be coated on the temporary substrate 100 in a large area, and large-area and large-volume transfer can be realized, so that the transfer efficiency of the device 300 is improved, and the cost is reduced.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A device transfer method, comprising:
providing a temporary substrate paved with a hydrolysis glue layer;
adhering the device on the first substrate by using the hydrolysis glue layer on the temporary substrate;
attaching the temporary substrate adhered with the device to an adhesive layer of a second substrate so as to enable the device adhered to the hydrolytic glue layer to be adhered to the adhesive layer, wherein the adhesive layer has the property of being insoluble in water and being non-adhesive;
and putting the temporary substrate, the second substrate and the device which are bonded into a whole into water so as to peel off the temporary substrate.
2. The device transfer method according to claim 1, wherein before the step of adhering the device on the first substrate with the hydrolytic adhesive layer on the temporary substrate, the device transfer method further comprises:
weakening the device on the first substrate to reduce the bonding force between the device and the first substrate.
3. The device transfer method of claim 1, wherein the step of providing a temporary substrate with a layer of glue for hydrolysis applied thereto comprises:
and coating a hydrolytic glue on the surface of the temporary substrate by a spin coating method to form the hydrolytic glue layer.
4. The device transfer method according to claim 1, wherein the step of adhering the device on the first substrate with the hydrolytic adhesive layer on the temporary substrate comprises:
attaching the side of the temporary substrate with the hydrolysis glue layer to the upper surface of a device on the first substrate so as to enable the device to be adhered to the hydrolysis glue layer;
and applying an external force to the temporary substrate to enable the temporary substrate to be far away from the first substrate so as to enable the device to be stripped from the first substrate.
5. The device transfer method according to claim 1, wherein the temporary substrate is provided with a boss on the surface thereof, the hydrolysis glue layer is laid on the boss, and the step of adhering the device on the first substrate by using the hydrolysis glue layer on the temporary substrate comprises:
and selectively adhering part of the devices on the first substrate by using the hydrolysis glue layer on the boss.
6. The device transfer method according to claim 1, further comprising:
and after the temporary substrate is peeled off, drying the second substrate adhered with the device.
7. The device transfer method according to any of claims 1-6, wherein the first substrate is a wafer substrate.
8. The device transfer method according to any one of claims 1 to 6, wherein the material of the temporary substrate comprises glass, sapphire, PET or PI.
9. The device transfer method according to any one of claims 1 to 6, wherein the device is a micro device.
10. The device transfer method according to any of claims 1-6, wherein the device comprises a micro LED, a diode, a transistor, or an integrated circuit chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011576856.5A CN112701077A (en) | 2020-12-28 | 2020-12-28 | Device transfer method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011576856.5A CN112701077A (en) | 2020-12-28 | 2020-12-28 | Device transfer method |
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| Publication Number | Publication Date |
|---|---|
| CN112701077A true CN112701077A (en) | 2021-04-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011576856.5A Pending CN112701077A (en) | 2020-12-28 | 2020-12-28 | Device transfer method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114400279A (en) * | 2022-01-10 | 2022-04-26 | 东莞市中麒光电技术有限公司 | LED chip mass transfer method |
| WO2023015356A1 (en) * | 2021-08-12 | 2023-02-16 | Newsouth Innovations Pty Limited | An electronic device and method of forming an electronic device |
| WO2023016376A1 (en) * | 2021-08-10 | 2023-02-16 | 重庆康佳光电技术研究院有限公司 | Mass transfer method, temporary substrate, transfer substrate, and led display device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030087476A1 (en) * | 2001-09-06 | 2003-05-08 | Toyoharu Oohata | Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system |
| CN1667839A (en) * | 2004-03-10 | 2005-09-14 | 精工爱普生株式会社 | Thin film device supply body and method of fabricating the same and its use in a transfer method |
| CN102403333A (en) * | 2010-09-13 | 2012-04-04 | 株式会社半导体能源研究所 | Light-emitting display device and method for manufacturing same |
| CN106601657A (en) * | 2016-12-12 | 2017-04-26 | 厦门市三安光电科技有限公司 | Transfer system and transfer method of microelements, manufacturing method, device and electronic device |
| JP2018032740A (en) * | 2016-08-24 | 2018-03-01 | 東レエンジニアリング株式会社 | Mounting method and mounting apparatus |
| CN108513684A (en) * | 2016-12-26 | 2018-09-07 | 株式会社Lg化学 | Method for shifting microelectronic component |
| CN111199907A (en) * | 2018-11-20 | 2020-05-26 | 昆山工研院新型平板显示技术中心有限公司 | Transfer method and transfer apparatus for micro-light emitting device |
-
2020
- 2020-12-28 CN CN202011576856.5A patent/CN112701077A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030087476A1 (en) * | 2001-09-06 | 2003-05-08 | Toyoharu Oohata | Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system |
| CN1667839A (en) * | 2004-03-10 | 2005-09-14 | 精工爱普生株式会社 | Thin film device supply body and method of fabricating the same and its use in a transfer method |
| CN102403333A (en) * | 2010-09-13 | 2012-04-04 | 株式会社半导体能源研究所 | Light-emitting display device and method for manufacturing same |
| JP2018032740A (en) * | 2016-08-24 | 2018-03-01 | 東レエンジニアリング株式会社 | Mounting method and mounting apparatus |
| CN106601657A (en) * | 2016-12-12 | 2017-04-26 | 厦门市三安光电科技有限公司 | Transfer system and transfer method of microelements, manufacturing method, device and electronic device |
| CN108513684A (en) * | 2016-12-26 | 2018-09-07 | 株式会社Lg化学 | Method for shifting microelectronic component |
| CN111199907A (en) * | 2018-11-20 | 2020-05-26 | 昆山工研院新型平板显示技术中心有限公司 | Transfer method and transfer apparatus for micro-light emitting device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023016376A1 (en) * | 2021-08-10 | 2023-02-16 | 重庆康佳光电技术研究院有限公司 | Mass transfer method, temporary substrate, transfer substrate, and led display device |
| WO2023015356A1 (en) * | 2021-08-12 | 2023-02-16 | Newsouth Innovations Pty Limited | An electronic device and method of forming an electronic device |
| CN114400279A (en) * | 2022-01-10 | 2022-04-26 | 东莞市中麒光电技术有限公司 | LED chip mass transfer method |
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