CN112968084A - Display panel and manufacturing method thereof - Google Patents
Display panel and manufacturing method thereof Download PDFInfo
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- CN112968084A CN112968084A CN202110155382.5A CN202110155382A CN112968084A CN 112968084 A CN112968084 A CN 112968084A CN 202110155382 A CN202110155382 A CN 202110155382A CN 112968084 A CN112968084 A CN 112968084A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 169
- 239000012790 adhesive layer Substances 0.000 claims abstract description 144
- 239000010410 layer Substances 0.000 claims abstract description 71
- 230000001070 adhesive effect Effects 0.000 claims abstract description 26
- 239000000853 adhesive Substances 0.000 claims abstract description 25
- 239000000463 material Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000003779 heat-resistant material Substances 0.000 claims description 2
- 230000005484 gravity Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 238000000926 separation method Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 4
- 230000000181 anti-adherent effect Effects 0.000 description 3
- 238000005411 Van der Waals force Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- -1 polydimethylsiloxane Polymers 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
- H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
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- Microelectronics & Electronic Packaging (AREA)
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Abstract
The embodiment of the invention discloses a display panel and a manufacturing method thereof. The manufacturing method of the display panel comprises the following steps: providing a first substrate, wherein the first substrate comprises a first bonding layer; providing a second substrate, wherein a plurality of light-emitting units are arranged on the second substrate; providing a third substrate; and picking up the plurality of light emitting cells using the first substrate under a first condition such that the plurality of light emitting cells are located on the first adhesive layer of the first substrate; transferring the plurality of light emitting cells onto a third substrate under a second condition; wherein an adhesive force between the plurality of light emitting cells and the first adhesive layer under the first condition is greater than an adhesive force between the plurality of light emitting cells and the first adhesive layer under the second condition. According to the embodiment of the invention, the first bonding layers with different viscosity are arranged under different conditions, and the first substrate comprising the first bonding layers is used for realizing single transfer of a large number of luminous units, so that the transfer times can be obviously reduced, the production cost is reduced, and the production efficiency is improved.
Description
Technical Field
The invention relates to the field of display, in particular to a display panel and a manufacturing method thereof.
Background
As a new display technology in the future, a Light Emitting Diode (LED) is one of the bottlenecks and cores of technology development.
At present, the transfer scheme mainly adopts a printing head controlled with high precision to carry out an elastic stamp, an LED is transferred onto the transfer head by utilizing Van der Waals force, the adhesion force between the LED and the elastic stamp is changed by adjusting the moving speed of the elastic stamp, the LED is placed and transferred onto a specified substrate, and the customized elastic stamp material is mainly a PDMS (polydimethylsiloxane) material, has small size, needs multiple transfer actions during mass transfer, has low production efficiency and has high production cost.
Therefore, a display panel and a method for fabricating the same are needed to solve the above-mentioned problems.
Disclosure of Invention
The embodiment of the invention provides a display panel and a manufacturing method thereof, which can solve the technical problems that multiple transfer actions are required when a large amount of luminous energy is transferred, the production efficiency is low and the production cost is high at present.
The embodiment of the invention provides a manufacturing method of a display panel, which comprises the following steps:
providing a first substrate, wherein the first substrate comprises a first substrate and a first bonding layer positioned on the first substrate;
providing a second substrate, wherein a plurality of light-emitting units are arranged on the second substrate;
providing a third substrate; and
picking up a plurality of the light emitting units on the second substrate using the first substrate under a first condition such that the plurality of the light emitting units are located on the first adhesive layer of the first substrate;
transferring the plurality of light emitting cells on the first adhesive layer of the first substrate onto the third substrate under a second condition;
wherein an adhesive force between the plurality of light emitting cells and the first adhesive layer in the first condition is greater than an adhesive force between the plurality of light emitting cells and the first adhesive layer in the second condition.
In an embodiment, the first condition is heating the first adhesive layer at a first temperature, the second condition is heating the first adhesive layer at a second temperature, the second temperature being greater than the first temperature, the material of the first adhesive layer comprising a thermal de-bonding material.
In an embodiment, the step of providing a second substrate on which a plurality of light emitting units are disposed includes:
providing the second substrate, wherein the second substrate comprises a second substrate and a second bonding layer positioned on the second substrate, and a plurality of light emitting units are arranged on the second bonding layer;
wherein the viscosity of the second tie layer is less than the viscosity of the first tie layer under the first condition.
In an embodiment, the step of providing the third substrate includes:
providing the third substrate, wherein the third substrate comprises a third substrate and a third bonding layer positioned on the third substrate;
the step of transferring the plurality of light emitting cells on the first adhesive layer of the first substrate onto the third substrate under the second condition includes:
transferring the plurality of light emitting cells on the first adhesive layer of the first substrate to the third adhesive layer of the third substrate under the second condition;
wherein the viscosity of the third bonding layer is greater than the viscosity of the first bonding layer under the second condition.
In an embodiment, the first substrate further includes a plurality of stages located on the first substrate, and a plurality of the first adhesive layers, the plurality of stages are arranged at intervals, and each of the first adhesive layers is located on the corresponding stage.
In an embodiment, an area of a side of the carrier away from the first substrate is smaller than an area of a side of the carrier close to the first substrate.
In an embodiment, the first substrate further includes a heat reflective layer between the carrier and the first bonding layer;
wherein the heat reflective layer is to reflect heat directed by the first adhesive layer toward the carrier back toward the first adhesive layer in the second condition.
In an embodiment, the first substrate further includes a fourth adhesive layer between the stage and the first substrate;
wherein a material of the fourth bonding layer has a bonding force between the fourth bonding layer and the stage that is greater than a bonding force between the first bonding layer and the stage under the second condition.
In an embodiment, the second condition is that the first adhesive layer is irradiated with ultraviolet light, and a material of the first adhesive layer includes an ultraviolet light visbreaking material.
The embodiment of the invention also provides a display panel, which is manufactured by any one of the manufacturing methods of the display panel.
According to the embodiment of the invention, the first bonding layers with different viscosity are arranged under different conditions, and the first substrate comprising the first bonding layers is used for realizing single transfer of a large number of luminous units, so that the transfer times can be obviously reduced, the production cost is reduced, and the production efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a flowchart illustrating a method for fabricating a display panel according to an embodiment of the present invention;
fig. 2 to fig. 15 are schematic flow charts of a method for manufacturing a display panel according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention. Furthermore, it should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, and are not intended to limit the present invention. In the present invention, unless otherwise specified, the use of directional terms such as "upper" and "lower" generally means upper and lower in the actual use or operation of the device, particularly in the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
At present, the transfer scheme mainly adopts a printing head controlled with high precision to carry out an elastic stamp, an LED is transferred onto the transfer head by utilizing Van der Waals force, the adhesion force between the LED and the elastic stamp is changed by adjusting the moving speed of the elastic stamp, the LED is placed and transferred onto a specified substrate, and the customized elastic stamp material is mainly a PDMS (polydimethylsiloxane) material, has small size, needs multiple transfer actions during mass transfer, has low production efficiency and has high production cost.
Referring to fig. 1 to 15, an embodiment of the invention provides a method for manufacturing a display panel 100, including:
s100, providing a first base plate 210, wherein the first base plate 210 comprises a first substrate 211 and a first bonding layer 300 positioned on the first substrate 211;
s200, providing a second substrate 220, wherein a plurality of light-emitting units 500 are arranged on the second substrate 220;
s300, providing a third substrate 230; and
s400, under a first condition, picking up the plurality of light emitting cells 500 on the second substrate 220 using the first substrate 210 such that the plurality of light emitting cells 500 are located on the first adhesive layer 300 of the first substrate 210;
s500, transferring the plurality of light emitting cells 500 on the first adhesive layer 300 of the first substrate 210 onto the third substrate 230 under a second condition;
wherein an adhesive force between the plurality of light emitting cells 500 and the first adhesive layer 300 in the first condition is greater than an adhesive force between the plurality of light emitting cells 500 and the first adhesive layer 300 in the second condition.
According to the embodiment of the invention, the first bonding layers with different viscosity are arranged under different conditions, and the first substrate comprising the first bonding layers is used for realizing single transfer of a large number of luminous units, so that the transfer times can be obviously reduced, the production cost is reduced, and the production efficiency is improved.
The technical solution of the present invention will now be described with reference to specific embodiments.
The manufacturing method of the display panel 100 includes:
s100, providing a first substrate 210, where the first substrate 210 includes a first substrate 211 and a first adhesive layer 300 on the first substrate 211, and refer to fig. 2 specifically.
In this embodiment, step S100 includes:
s110, a fourth adhesive layer 700 is formed on the first substrate 211, specifically referring to fig. 13.
In this embodiment, when the first condition is that the first adhesive layer 300 is heated at a first temperature, the second condition is that the first adhesive layer 300 is heated at a second temperature, the second temperature is higher than the first temperature, and the material of the first adhesive layer 300 includes a thermal de-bonding material, the material of the fourth adhesive layer 700 includes a high-temperature heat-resistant material, and the adhesive force between the fourth adhesive layer 700 and the stage 400 is higher than the adhesive force between the first adhesive layer 300 and the stage 400 in the second condition. In step S500, the carrier 400 is advantageously separated from the third substrate 230, so that the light-emitting unit 500 is smoothly placed at a specific position, and the carrier 400 is prevented from being separated from the first substrate 211.
In this embodiment, the fourth adhesive layer 700 may be made of a pressure sensitive adhesive, and the fourth adhesive layer 700 may increase the viscosity of the pressure sensitive adhesive by heating, so that the adhesive effect between the first substrate 210 and the stage 400 is good, and the stage 400 and the third substrate 230 can be conveniently peeled off.
In this embodiment, step S110 may be omitted.
In this embodiment, the first substrate 210 may be a glass substrate.
S120, forming a plurality of carrier stages 400 on the fourth adhesive layer 700, please refer to fig. 13.
In this embodiment, when the step S110 is omitted, the step S120 is to form a plurality of stages 400 on the first substrate 210, specifically refer to fig. 9.
In this embodiment, the arrangement of the carrier 400 corresponds to the tape attaching position of the light emitting unit 500, and may be an array arrangement or a special arrangement, which is not limited herein as the case may be.
In this embodiment, the material of the carrier 400 may be a photoresist material, and the photoresist material has a good adhesion with the first substrate 210 and/or the fourth bonding layer 700, so that the carrier 400 can be conveniently disposed, and the stability of the carrier 400 is ensured.
In this embodiment, an area of a side of the carrier 400 away from the first substrate 211 is smaller than an area of a side of the carrier 400 close to the first substrate 211, specifically referring to fig. 9, by providing a trapezoidal carrier 400, a surface of the stage 400 on the side closer to the first substrate 211 may be circular, truncated pyramid, or a surface on the side closer to the first substrate 210 may be circular, and a surface on the side farther from the first substrate 211 may have a shape corresponding to the shape of the light emitting unit 500, on the one hand, an area of the stage 400 on the side closer to the first substrate 211 is large, the adhesion between the first substrate 211 and the carrier 400 can be strengthened, the transfer reliability can be enhanced, on the other hand, the area of the carrier 400 on the side away from the first substrate 211 is smaller, in the subsequent step of removing the first adhesive layer 300, the separation between the first adhesive layer 300 and the light emitting unit 500 is facilitated.
In this embodiment, after the step of forming the plurality of stages 400 arranged at intervals on the first substrate 210, the method for manufacturing the display panel 100 further includes: a heat reflective layer 600 is formed on the carrier 400. The first adhesive layer 300 is formed on the heat reflective layer 600, as shown in fig. 12.
In this embodiment, the heat reflective layer 600 is configured to reflect heat emitted from the first adhesive layer 300 toward the carrier 400 back to the first adhesive layer 300 under the second condition. After the heat is transferred from the first adhesive layer 300 to the carrier 400, the heat is reflected back to the first adhesive layer 300 through the heat reflective layer 600, so that the heating intensity of the heat to the first adhesive layer 300 can be enhanced, the temperature rise of the first adhesive layer 300 is accelerated, the decrease of the viscosity of the first adhesive layer 300 is accelerated, the adhesion between the first adhesive layer 300 and the light emitting unit 500 is accelerated, and the separation of the first adhesive layer 300 and the light emitting unit 500 is facilitated.
S130, a plurality of first adhesive layers 300 are formed on the stage 400.
In this embodiment, the first substrate 210 further includes a plurality of stages 400 located on the first substrate 211, and a plurality of first adhesive layers 300, the plurality of stages 400 are arranged at intervals, and each first adhesive layer 300 is located on the corresponding stage 400, as shown in fig. 10.
S200, providing a second substrate 220, wherein a plurality of light emitting units 500 are disposed on the second substrate 220, specifically referring to fig. 3.
In this embodiment, step S200 includes:
s210, providing the second substrate 220, including a second substrate 221 and a second adhesive layer 222 disposed on the second substrate 221, wherein a plurality of light emitting units 500 are disposed on the second adhesive layer 222, as shown in fig. 3.
In this embodiment, the viscosity of the second adhesive layer 222 is lower than the viscosity of the first adhesive layer 300 under the first condition, and under the first condition, the first substrate 210 including the first adhesive layer 300 is used to pick up a plurality of light emitting units 500, the first substrate 210 with the first adhesive layer 300 is close to the light emitting units 500, so as to pick up the light emitting units 500, and the light emitting units 500 are adhered to the first adhesive layer 300, so as to complete the picking-up operation, specifically refer to fig. 5 and 6.
In this embodiment, the arrangement of the light emitting units 500 on the second substrate 220 temporarily fixed may correspond to the arrangement of the stage 400, and the stage 400 on the first substrate 210 may finish the bonding and pickup corresponding to the light emitting units 500 at a time.
In this embodiment, the light emitting unit 500 may include a Mini-LED or a Micro-LED, and the like, which is not limited herein.
S300, providing a third substrate 230, specifically referring to fig. 4.
In this embodiment, step S300 includes:
s310, providing the third substrate 230 including a third substrate 231 and a third bonding layer 232 on the third substrate 231, please refer to fig. 4 specifically.
In this embodiment, before step S310, the method further includes:
s301, forming an array substrate on the third substrate 231.
In this embodiment, the forming step of the array substrate includes:
and S3011, forming an active layer on the substrate layer.
And S3012, forming a first insulating layer on the active layer.
And S3013, forming a gate layer on the first insulating layer.
And S3014, forming a second insulating layer on the grid layer.
And S3015, forming a source drain layer on the second insulating layer.
And S3016, forming a third insulating layer on the source drain layer.
And S3017, forming an anode layer and a cathode layer on the third insulating layer.
In this embodiment, the material of the third adhesive layer 232 may include an anisotropic conductive adhesive layer. The anisotropic conductive adhesive layer includes conductive particles, which has a conductive effect, so that the light emitting unit 500 can be electrically connected to the array substrate, and meanwhile, the anisotropic conductive adhesive layer can also enhance the adhesive force between the array substrate and the light emitting unit 500, thereby preventing the light emitting unit 500 from being separated.
In this embodiment, the light emitting unit 500 is electrically connected to the anode layer through the conductive particles in the anisotropic conductive adhesive layer.
S400, under a first condition, the first substrate 210 is used to pick up the plurality of light emitting units 500 on the second substrate 220, so that the plurality of light emitting units 500 are located on the first adhesive layer 300 of the first substrate 210, specifically refer to fig. 5 and 6.
S500, under a second condition, transferring the plurality of light emitting cells 500 on the first adhesive layer 300 of the first substrate 210 onto the third substrate 230, specifically referring to fig. 7.
In this embodiment, the step of transferring the plurality of light emitting cells 500 on the first adhesive layer 300 of the first substrate 210 to the third substrate 230 under the second condition includes: under the second condition, the plurality of light emitting cells 500 on the first adhesive layer 300 of the first substrate 210 are transferred onto the third adhesive layer 232 of the third substrate 230, with reference to fig. 14.
In this embodiment, the viscosity of the third adhesive layer 232 is greater than the viscosity of the first adhesive layer 300 under the second condition.
In this embodiment, the adhesion between the plurality of light emitting cells 500 and the first adhesive layer 300 under the first condition is greater than the adhesion between the plurality of light emitting cells 500 and the first adhesive layer 300 under the second condition, and the first substrate 210 may be manufactured in a larger area, so that a large number of light emitting cells 500 may be transferred at a time, thereby significantly reducing the number of transfers, reducing the production cost, and improving the production efficiency.
In this embodiment, the manufacturing method of the display panel 100 further includes:
s600, under the second condition, the first adhesive layer 300 and the first substrate 210 are removed, specifically referring to fig. 7 and 8.
In this embodiment, after the light emitting unit 500 and the third substrate 230 are aligned, bonded and bound, changing the condition to the second condition, separating the first adhesive layer 300 from the light emitting cell 500, the gravity of the light emitting unit 500 in the first condition is smaller than the adhesive force between the first adhesive layer 300 and the light emitting unit 500, in the second condition, the sum of the adhesive force between the third substrate 230 and the light emitting unit 500 and the gravity of the light emitting unit 500 is greater than the adhesive force between the first adhesive layer 300 and the light emitting unit 500, specifically referring to fig. 5 to 7 and 11, that is, the light emitting unit 500 can be picked up by the first adhesive layer 300, transferred, in the second condition, the separation between the first adhesive layer 300 and the light emitting unit 500 may be facilitated.
In this embodiment, the first condition is that the first adhesive layer 300 is heated at a first temperature, the second condition is that the first adhesive layer 300 is heated at a second temperature, the second temperature is higher than the first temperature, and the material of the first adhesive layer 300 includes a thermal viscosity reducing material. The first condition may be normal temperature and pressure, that is, the light emitting unit 500 may be picked up by the first adhesive layer 300 and transferred, after the light emitting unit 500 and the third substrate 230 are aligned, attached and bound, the temperature is raised to the second condition, and the viscosity of the adhesive layer is weakened by heating the adhesive layer including a thermal de-bonding material until the sum of the adhesive force between the third substrate 230 and the light emitting unit 500 and the gravity of the light emitting unit 500 is greater than the adhesive force between the first adhesive layer 300 and the light emitting unit 500, that is, the first adhesive layer 300 and the light emitting unit 500 are conveniently separated.
In this embodiment, the thermal viscosity-reducing material includes a resin, a curing agent, a solvent, and a foaming agent. The resin may comprise a mixture of one or more of acrylic resins, alkyd resins, synthetic fatty acid resins, phenolic resins, polyvinyl chloride resins.
In this embodiment, the second temperature is higher than the first temperature, and the second temperature is 100 ℃ to 200 ℃. The adhesion of the first adhesive layer 300 may be sufficiently weakened to facilitate the separation of the first adhesive layer 300 from the light emitting unit 500, and the electrical components in the third substrate 230 may be protected.
In this embodiment, the step of removing the first substrate 210 and the first adhesive layer 300 under the second condition includes: the second condition is that the first adhesive layer 300 is irradiated with ultraviolet light, and the material of the first adhesive layer 300 includes an ultraviolet light viscosity reducing material. The first condition may be that under normal temperature and pressure natural light, that is, through the first adhesive layer 300, the light emitting unit 500 may be picked up and transferred, and after the light emitting unit 500 is aligned, attached and bound to the third substrate 230, the first adhesive layer 300 is irradiated by ultraviolet light, that is, the second condition, so that the viscosity of the adhesive layer is weakened to the sum of the adhesive force between the third substrate 230 and the light emitting unit 500 and the gravity of the light emitting unit 500 is greater than the adhesive force between the first adhesive layer 300 and the light emitting unit 500, that is, the separation between the first adhesive layer 300 and the light emitting unit 500 is facilitated.
In this embodiment, the ultraviolet light viscosity-reducing material may include a photosensitive group and a binder, and the binder may be acrylate.
In this embodiment, an ultraviolet reflecting layer is further included between the carrier 400 and the first substrate 210, and under the second condition, the ultraviolet reflecting layer is configured to reflect ultraviolet light emitted from the first adhesive layer 300 toward the carrier 400 back to the first adhesive layer 300. After the ultraviolet light is transmitted from the first adhesive layer 300 to the carrier 400, the ultraviolet light is reflected back to the first adhesive layer 300 by the ultraviolet light reflecting layer, so that the reaction between the ultraviolet light and the first adhesive layer 300 can be enhanced, the weakening of the viscosity of the first adhesive layer 300 is accelerated, the adhesion between the first adhesive layer 300 and the light emitting unit 500 is accelerated, and the first adhesive layer 300 and the light emitting unit 500 can be conveniently separated.
In this embodiment, the first condition is that the first adhesive layer 300 is heated at a first temperature, the second condition is that the first adhesive layer 300 is heated at a second temperature, the second temperature is lower than the first temperature, and the material of the first adhesive layer 300 includes a low-temperature anti-adhesive material. The first condition may be normal temperature and pressure, that is, the light emitting unit 500 may be picked up by the first adhesive layer 300 and transferred, after the light emitting unit 500 and the third substrate 230 are aligned, attached and bound, the temperature is reduced to the second condition, and the adhesive layer including a low-temperature anti-adhesive material is processed at a low temperature, so that the viscosity of the adhesive layer is reduced to a point that the sum of the adhesive force between the third substrate 230 and the light emitting unit 500 and the gravity of the light emitting unit 500 is greater than the adhesive force between the first adhesive layer 300 and the light emitting unit 500, that is, the first adhesive layer 300 and the light emitting unit 500 are conveniently separated.
In this embodiment, the low-temperature anti-adhesive material may be a pressure-sensitive adhesive or a resin glue, after the temperature is reduced, the viscosity of the pressure-sensitive adhesive or the resin glue is reduced, the adhesive force between the first adhesive layer 300 and the light emitting unit 500 is reduced, and the first adhesive layer 300 and the first substrate 210 are conveniently removed.
In this embodiment, the step of forming the stage 400 includes:
an electrical wiring layer including a plurality of metal wires is formed on the first substrate 210. A plurality of stages 400 are formed on the wire layer, the stages 400 corresponding to the metal wires in the wire layer. A via hole is formed on the carrier 400, which exposes the metal line. And filling metal connecting wires in the air. A first adhesive layer 300 is formed on the stage 400.
In this embodiment, the second condition is that the first adhesive layer 300 is energized, and the material of the first adhesive layer 300 includes an electro-thinning material. The first condition may be that the light emitting unit 500 is picked up by the first adhesive layer 300 under natural light at normal temperature and normal pressure, and then transferred, after the light emitting unit 500 is aligned, attached and bound to the third substrate 230, the first adhesive layer 300 is powered on, that is, the second condition, so that the viscosity of the adhesive layer is weakened to the sum of the adhesive force between the third substrate 230 and the light emitting unit 500 and the gravity of the light emitting unit 500 is greater than the adhesive force between the first adhesive layer 300 and the light emitting unit 500, that is, the separation between the first adhesive layer 300 and the light emitting unit 500 is facilitated. The metal wires corresponding to different carrier 400 can be controlled independently, so that the lowering and attaching of different light emitting units 500 can be realized.
In this embodiment, the electro-adhesion reducing material may include catechol, and when the material including catechol is powered on, the adhesion force between the first adhesive layer 300 and the light emitting unit 500 may be reduced, so that the first adhesive layer 300 and the first substrate 210 may be easily removed.
In this embodiment, after step S600, the method for manufacturing the display panel 100 further includes:
s700, forming a package layer 800 on the light emitting unit 500, please refer to fig. 15.
In this embodiment, the encapsulation layer may be made of an inorganic-organic-inorganic three-layer material, so as to enhance the encapsulation effect.
According to the embodiment of the invention, the first bonding layers with different viscosity are arranged under different conditions, and the first substrate comprising the first bonding layers is used for realizing single transfer of a large number of luminous units, so that the transfer times can be obviously reduced, the production cost is reduced, and the production efficiency is improved.
The embodiment of the invention also discloses a display panel 100, and the display panel 100 is manufactured by any one of the manufacturing methods of the display panel 100.
For a specific structure of the display panel 100, please refer to any one of the above embodiments of the manufacturing method of the display panel 100 and fig. 2 to 15, which are not described herein again.
The embodiment of the invention discloses a display panel and a manufacturing method thereof. The manufacturing method of the display panel comprises the following steps: providing a first substrate, wherein the first substrate comprises a first bonding layer; providing a second substrate, wherein a plurality of light-emitting units are arranged on the second substrate; providing a third substrate; and picking up the plurality of light emitting cells using the first substrate under a first condition such that the plurality of light emitting cells are located on the first adhesive layer of the first substrate; transferring the plurality of light emitting cells onto a third substrate under a second condition; wherein an adhesive force between the plurality of light emitting cells and the first adhesive layer under the first condition is greater than an adhesive force between the plurality of light emitting cells and the first adhesive layer under the second condition. According to the embodiment of the invention, the first bonding layers with different viscosity are arranged under different conditions, and the first substrate comprising the first bonding layers is used for realizing single transfer of a large number of luminous units, so that the transfer times can be obviously reduced, the production cost is reduced, and the production efficiency is improved.
The display panel and the manufacturing method thereof provided by the embodiment of the invention are described in detail above, and the principle and the embodiment of the invention are explained by applying a specific example, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for those skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (10)
1. A method for manufacturing a display panel is characterized by comprising the following steps:
providing a first substrate, wherein the first substrate comprises a first substrate and a first bonding layer positioned on the first substrate;
providing a second substrate, wherein a plurality of light-emitting units are arranged on the second substrate;
providing a third substrate; and
picking up a plurality of the light emitting units on the second substrate using the first substrate under a first condition such that the plurality of the light emitting units are located on the first adhesive layer of the first substrate;
transferring the plurality of light emitting cells on the first adhesive layer of the first substrate onto the third substrate under a second condition;
wherein an adhesive force between the plurality of light emitting cells and the first adhesive layer in the first condition is greater than an adhesive force between the plurality of light emitting cells and the first adhesive layer in the second condition.
2. The method according to claim 1, wherein the first condition is heating the first adhesive layer at a first temperature, wherein the second condition is heating the first adhesive layer at a second temperature, wherein the second temperature is higher than the first temperature, and wherein a material of the first adhesive layer comprises a thermal de-bonding material.
3. The method for manufacturing a display panel according to claim 1, wherein the step of providing a second substrate on which a plurality of light emitting units are disposed comprises:
providing the second substrate, wherein the second substrate comprises a second substrate and a second bonding layer positioned on the second substrate, and a plurality of light emitting units are arranged on the second bonding layer;
wherein the viscosity of the second tie layer is less than the viscosity of the first tie layer under the first condition.
4. The method for manufacturing a display panel according to claim 1, wherein the step of providing the third substrate includes:
providing the third substrate, wherein the third substrate comprises a third substrate and a third bonding layer positioned on the third substrate;
the step of transferring the plurality of light emitting cells on the first adhesive layer of the first substrate onto the third substrate under the second condition includes:
transferring the plurality of light emitting cells on the first adhesive layer of the first substrate to the third adhesive layer of the third substrate under the second condition;
wherein the viscosity of the third bonding layer is greater than the viscosity of the first bonding layer under the second condition.
5. The method for manufacturing a display panel according to claim 1, wherein the first substrate further includes a plurality of stages on the first substrate, and a plurality of first adhesive layers, the plurality of stages being arranged at intervals, each first adhesive layer being located on a corresponding stage.
6. The method for manufacturing a display panel according to claim 5, wherein an area of a side of the stage away from the first substrate is smaller than an area of a side of the stage close to the first substrate.
7. The method for manufacturing a display panel according to claim 5, wherein the first substrate further comprises a heat reflective layer located between the carrier and the first adhesive layer;
wherein the heat reflective layer is to reflect heat directed by the first adhesive layer toward the carrier back toward the first adhesive layer in the second condition.
8. The method for manufacturing a display panel according to claim 5, wherein the first substrate further includes a fourth adhesive layer between the stage and the first substrate;
the fourth bonding layer is made of a high-temperature heat-resistant material, and the bonding force between the fourth bonding layer and the carrier under the second condition is larger than the bonding force between the first bonding layer and the carrier.
9. The method according to claim 1, wherein the second condition is that the first adhesive layer is irradiated with ultraviolet light, and a material of the first adhesive layer includes an ultraviolet light viscosity reducing material.
10. A display panel manufactured by the method for manufacturing a display panel according to any one of claims 1 to 9.
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