TW201824442A - 包含旋轉軸的晶圓載台 - Google Patents

包含旋轉軸的晶圓載台 Download PDF

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TW201824442A
TW201824442A TW106145380A TW106145380A TW201824442A TW 201824442 A TW201824442 A TW 201824442A TW 106145380 A TW106145380 A TW 106145380A TW 106145380 A TW106145380 A TW 106145380A TW 201824442 A TW201824442 A TW 201824442A
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wafer
rotating shaft
wafer stage
cylindrical guide
guide
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琴淵旭
金喆洙
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南韓商愛思開矽得榮股份有限公司
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

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Abstract

本發明涉及一種晶圓載台的旋轉軸。根據本發明的一個實施例,晶圓載台包含:其上放置晶圓的晶圓盤;用於旋轉晶圓盤的旋轉軸;設置在所述旋轉軸的側面的外圍的圓柱形導引;以及用於支撐圓柱形導引和旋轉軸之間的旋轉軸的球軸承。

Description

包含旋轉軸的晶圓載台
本發明涉及一種晶圓載台,特別是涉及一種具有旋轉軸的晶圓載台。
半導體最基本的原材料是晶圓。不斷地開發用於檢測晶圓上可能發生的細小缺陷的設備,以檢測如較細小金屬或非金屬污染源的雜質。在這種檢測設備的開發中,更精確的檢測過程的重要性隨著半導體晶片的小型化趨勢而增加。
為了消除晶圓上可能出現的缺陷,首要的需求是先檢測缺陷為何和是什麼導致缺陷的發生。
針對上述需求,晶圓分析設備也在日益完善。各種類型的晶圓檢測設備還包含自動視覺檢測系統(Auto Visual Inspection System,AVIS)。但是,在AVIS的檢測過程中也可能會產生顆粒。在半導體生產環境中產生的顆粒可被稱為可能干擾半導體生產過程正常操作的污染物或缺陷。
舉例來說,在AVIS檢測晶圓的過程中,也可以在晶圓所在的移動設備上產生顆粒。在晶圓檢測過程中,可通過設備之間的接觸或設備內部件之間的接觸而產生顆粒。
因此,需要一種可以防止設備之間接觸或設備內部件之間接觸而在晶圓移動或檢測過程中產生顆粒的特定方法。
發明內容本發明就是為了解決上述習知技術的問題而提出的,其目的在於提供一種晶圓載台的旋轉軸。
本發明的目的在於提供一種晶圓載台,用於阻擋在晶圓移動或檢測設備中的旋轉軸中可能產生的顆粒。詳細而言,本發明旨在提供一種能夠減少在旋轉部件與非旋轉部件之間接觸或摩擦時可能產生的顆粒的量的方法。
本發明的目的不限於上述,並且根據以下描述,本領域通常知識者將清楚地理解其它目的。
根據本發明的一個實施例,為了解決上述技術問題,一種晶圓載台包含:其上放置晶圓的晶圓盤;用於旋轉晶圓盤的旋轉軸;設置在所述旋轉軸的側面的外圍的圓柱形導引;以及用於支撐圓柱形導引和旋轉軸之間的旋轉軸的球軸承。
根據一個實施例,該圓柱形導引可以從該旋轉軸的一下端延伸到旋轉軸的一上端。
根據一個實施例,該圓柱形導引的一上端可以與該晶圓盤的一下端表面間隔開。
根據一個實施例,該圓柱形導引可以包含一圓柱形框架,該圓柱形框架包含對應於該球軸承位置的一凹槽。
根據一個實施例,球軸承可以以與旋轉軸的長度成比例的規則,間隔設置在不同的位置上。
根據一個實施例,晶圓載台可以更包含一馬達用於向該旋轉軸提供一旋轉驅動力。
根據一個實施例,晶圓載台可以更包含一上導引設置在該旋轉軸的一上端,以防止該晶圓盤偏離其位置,其中該上導引可以具有與該晶圓盤重心相同的一光盤形狀。
根據一個實施例,上導引可以與晶圓盤分開設置。
根據一個實施例,圓柱形導引可以固定在旋轉接頭上。
根據一個實施例,晶圓載台可以更包含一下導引,設置在該旋轉軸的一下端,以防止該旋轉軸偏離其位置,其中該下導引設置在該圓柱形導引的一側面的一外圍。
根據一個實施例,晶圓載台可以更包含一固定部,用於固定該旋轉接頭和該旋轉軸。
根據一個實施例,圓柱形導引可以連接並固定在旋轉接頭上。
根據一個實施例,晶圓檢測設備可以包含晶圓載台。
本發明的各方面僅僅是本發明的優選實施例中的一些,和由本領域通常知識者在下面描述的本發明的詳細描述,可以導出和理解反映本發明的技術特徵的各種實施例。
現在將描述根據本發明的晶圓載台的旋轉軸的功效。
首先,本發明在檢測或移動晶圓的狀態下,通過減少顆粒的產生可以提高晶圓的質量。
第二,本發明防止將旋轉驅動力傳遞到放置有晶圓的板上的旋轉軸偏離,從而防止晶圓的搖晃。
在本發明中可獲得的效果不限於上述效果,並且本領域通常知識者根據下面的描述將明顯地理解未提及的其他效果。
在下文中,將參考圖式詳細描述應用本發明的實施例的設備和各種方法。考慮到製定規格的容易性,以下描述中使用的組件的後綴「模塊」和「部分」僅是給出或混合,並且區分為彼此沒有意義或作用。
在實施例的描述中,在描述為形成在「上(頂)或下(底)」和每個組件「之前(前)」或「之後(後)」、「上(頂)或下(底)」和「之前(前)」或「之後(後)」的情況,意在表示這兩個組件是直接相互接觸或一個或多個其他部件設置在兩個部件之間。
而且,除非特別說明,否則本文所述的如「包含」、「構造」或「具有」的術語是指存在元件,因此不應理解為排除其他元件,而是進一步包含其它元件。除非另外定義,包含技術或科學術語的所有術語,具有與本發明所屬領域的通常知識者通常理解的相同的含義。除非在本發明中明確限定,否則通常使用的術語(例如預定義術語)應該被解釋為與相關技術的上下文含義一致,並且不被理解為理想的或過於正式的含義。
在描述本發明的元件時,可以使用如第一、第二、A、B、(a)和(b)的術語。這些術語僅用於區分元件與其他元件,並且這些術語不限制元件的性質、順序或依序。當元件被描述為「連接」、「連結」或「結合」到另一個元件時,該元件可以直接連接到或結合到另一個元件。然而,應該理解,另一元件可以在相應的元件之間「連接」、「耦合」或「結合」。
在本發明的描述中,當確定對於本領域通常知識者顯而易見的相關已知技術可能不必要地模糊本發明的主旨時,將省略其詳細描述。
在圖1中,描述了晶圓載台的構型,且在圖2A至圖3B中,描述了晶圓載台中可能產生的顆粒。隨後,在圖4至圖7B中,將描述避免產生顆粒的原因的具體方法,顆粒可能是由於晶圓載台的部件之間的接觸而產生的。
圖1是用於描述根據本發明一實施例的晶圓載台的視圖。
參照圖1,晶圓載台可以包含晶圓盤110、上導引120、旋轉軸130、旋轉接頭140和固定部150。圖1所示的元件不是必需的,因此可以實現具有比圖1更多或更少元件的晶圓載台。
自動視覺檢測系統(AVIS)通過肉眼或低速率放大鏡在晶圓上執行檢測顆粒的程序,且晶圓載台可以包含在AVIS中。可以在晶圓載台上放置晶圓。晶圓載台可放置晶圓,並提供進行AVIS檢測顆粒的區域。
然而,晶圓載台可不一定包含在AVIS中,而在通過粒子計數器等檢測顆粒的過程中使用晶圓載台。換句話說,晶圓載台可以包含用來支撐晶圓可能位於的區域的載台。檢測晶圓上的顆粒的程序可以在晶圓的全部區域進行,但是檢測顆粒的程序也可以只在晶圓的某個區域進行,以便檢測出更細的顆粒。
當檢測顆粒的程序僅在晶圓的特定區域進行時,晶圓載台可以通過旋轉或移動晶圓來改變晶圓的檢測區域。
晶圓盤110可提供放置晶圓的區域。在放置在晶圓盤110上的晶圓上可以進行檢測顆粒的程序。晶圓盤110可以在特定位置旋轉,以改變用於檢測顆粒的晶圓的區域。晶圓盤110可以晶圓盤的重心為旋轉軸進行旋轉運動,且藉由晶圓盤110的旋轉可以改變晶圓的檢測區域。
當放置晶圓時,可以連續旋轉晶圓盤110,且當晶圓被放置在特定檢測區域時,晶圓盤110的旋轉停止,且晶圓盤110在完成檢測之後可以再次旋轉。
上導引120可以設置在旋轉軸130的上端,即晶圓盤110下方的區域。上導引120可以防止晶圓盤110偏移,使得晶圓盤110不會偏離旋轉區域。
上導引120可以具有與晶圓盤110相同重心的盤狀。
旋轉軸130的上端可與晶圓盤110的下端表面一體地連接。晶圓盤110可固定到旋轉軸130的上部,使得晶圓盤110可以通過旋轉軸130的旋轉而旋轉。
旋轉軸130可由馬達(未繪示出)提供旋轉驅動力,且可將所提供的旋轉驅動力傳輸到晶圓盤110。旋轉軸130可在與旋轉接頭140連接的位置繞著旋轉軸(為一個固定的轉軸)的重心旋轉。
旋轉接頭140可支撐旋轉軸130和晶圓盤110。
固定部150可連接旋轉軸130的下端和旋轉接頭140。在一實施例中,固定部150可包含連接旋轉軸130和旋轉接頭140的螺栓和螺母。
圖2A至圖2D是用於描述根據本發明的實施例的顆粒的生成狀態的視圖,而圖3A和圖3B是用於描述根據本發明一實施例的旋轉軸的旋轉區域的視圖。
與晶圓盤相較,旋轉軸的重量可能相對較小。用於將由馬達(未示出)產生的旋轉驅動力傳送到晶圓盤的旋轉軸的重量應該要小,以便減小旋轉驅動力的損失。
參照圖2A,旋轉軸可以在沿預定方向旋轉的同時將旋轉力傳遞到晶圓盤。但是,由於連接在旋轉軸的上端的晶圓盤的重量比旋轉軸重,其中連接旋轉軸和晶圓盤的耦合體的重心可以形成在上側。另一方面,在旋轉軸的下部,可以由馬達提供旋轉驅動力。
參考圖2B,在重心形成在上側的耦合體沿著預定方向旋轉的同時,可在旋轉運動的切線方向上產生力。可以在很大程度上在具有相對較重的晶圓盤中產生與由旋轉動力學產生的旋轉運動相切的力。
在晶圓盤的旋轉運動中產生的切線力,可能影響連接到重量相對較重的晶圓盤的旋轉軸的上端,因此可將足以偏離旋轉區域的力施加到旋轉軸。
當晶圓盤的重量比旋轉軸的重量大時,在晶圓盤的旋轉運動中產生的切線力可能變大。
參考圖2C,當旋轉軸偏離「旋轉區域」時,旋轉軸的上部可接觸上板。旋轉軸的旋轉區域是指以旋轉軸的重心為旋轉軸的區域,且旋轉軸在旋轉軸所在的位置旋轉。
旋轉軸偏離為重心並在旋轉軸的上端和下端分別進行旋進運動、並與上導引或旋轉接頭發生接觸或摩擦的旋轉軸線,該上導引或旋轉接頭在這種情況下被固定和設置。接觸或摩擦可能在上導引、旋轉接頭或旋轉軸上產生顆粒。
上導引可由聚四氟乙烯等輕質防水材料製成,聚四氟乙烯可由與旋轉軸摩擦或碰撞而產生顆粒。
參考圖2D,即使是連接旋轉軸和旋轉接頭的固定部也可能偏離之前固定的位置。當這種情況持續時,連接旋轉軸和旋轉接頭的固定部會鬆動,晶圓載台可能無法正常支撐晶圓。固定部用於將旋轉軸連接到旋轉接頭,但是可能不足以承受旋轉軸偏離旋轉軸線時產生的力。換句話說,僅用固定部來支撐旋轉軸和晶圓盤的整個耦合體可能是不夠的。
參照圖3A,相對於作為旋轉軸130的重心的旋轉軸,旋轉軸130正常地旋轉,並且可以對應於圖2A中的情況。
參考圖3B,旋轉軸130常態地相對旋轉軸線旋轉,這可對應於圖2D。通過旋轉軸130的偏離正常旋轉區域的旋進運動,旋轉區域可以更大。區域310表示旋轉軸130偏離正常旋轉區域的區域,且偏離旋轉軸線,從而發生掉落現象。
圖4是用於描述根據本發明一實施例的上導引和下導引的視圖。
參照圖4,位於旋轉軸430的上部和下部的上導引420和下導引450可防止旋轉軸430的掉落現象。
雖然上導引420可防止旋轉軸430偏離其旋轉軸,但可能不夠。因此,下導引450可以設置在圓柱形的旋轉軸430的外部,從而防止旋轉軸430偏離旋轉軸線的下落現象。
同時,不同於圖4,下導引450可以設置在圓柱形導引的側面的外圍。
圖5是用於描述根據本發明一實施例的圓柱形導引的視圖。
參照圖5,覆蓋旋轉軸530的整個側面的圓柱形導引550可以防止旋轉軸530偏離其旋轉軸的掉落現象。圓柱形導引550可固定並設置在旋轉接頭540上。
圓柱形導引550可以設置在旋轉軸530的側面的外圍,以防止旋轉軸530偏離旋轉軸。
固定設置在旋轉接頭540上的圓柱形導引550的上端,可以與處於旋轉運動的晶圓盤510的下端表面間隔設置,從而避免與晶圓盤510接觸。
圓柱形導引550可以設置為具有不影響旋轉軸530的旋轉的距離。
但是,當旋轉軸530偏離旋轉軸的情況發生時,圓柱形導引550和旋轉軸530之間可能發生面對面接觸或內部摩擦。圓柱形導引550可以防止旋轉軸530偏離旋轉軸線,但是顆粒可能會通過面對面接觸產生。
在一個實施例中,圓柱形導引550可從旋轉軸530的下端延伸到其上端並覆蓋整個側面。
圖6是用於描述根據本發明一實施例的圓柱形導引和球軸承的視圖。
參照圖6,球軸承640可位在圓柱形導引650與旋轉軸630之間並支撐旋轉軸630。換句話說,球軸承640可位於圓柱形導引650與旋轉軸630之間,並防止旋轉軸630偏離為重心的旋轉軸線。
在旋轉軸630偏離旋轉軸線的情況下,圓柱形導引650與旋轉軸630之間可能發生面對面接觸或內部摩擦。球軸承640可以設置在圓柱形導引650與旋轉軸630之間以防止這種接觸。
球軸承640可以減小圓柱形導引650與旋轉軸630之間的面對面接觸,並防止其中旋轉軸630偏離旋轉軸線的掉落現象,從而減少旋轉軸630的旋轉能量的損失。
球軸承640可位於圓柱形導引650和旋轉軸630之間,但也可以包含在圓柱形導引650中。圓柱形導引650可以包含具有凹槽的圓柱形框架,球軸承640可以位於該凹槽中。
包含在圓柱形導引650中的圓柱形框架可包含用於定位球軸承640的內環或外環。
圖7A和圖7B是用於描述根據本發明一實施例的球軸承的配置的視圖。
參考圖7A,球軸承720可位於圓柱形導引730和旋轉軸710之間。球軸承720可以設置為使得圓柱形導引730和旋轉軸710在任何一個區域中都不是面對面接觸。
在一個實施例中,球軸承720可設置成與旋轉軸710的中心具有預定的間隔角度。
球軸承720可以與旋轉軸的長度成比例的規則間隔設置在不同的位置。
參照圖7B,在圓柱形導引730的俯視圖中,球軸承可設置在與旋轉軸710的長度對應的直線上。
對於本領域通常知識者而言顯而易見的是,在不脫離本發明的精神或基本特徵的情況下,本發明可以以其他具體形式來實施。
因此,不應在所有方面限制性解釋上面的詳細描述,並應被視為說明性的。本發明的範圍應該通過對所附申請專利範圍的合理解釋來確定,並且在本發明的等同範圍內的所有改變都包含在本發明的範圍內。
110‧‧‧晶圓盤
120‧‧‧上導引
130‧‧‧旋轉軸
140‧‧‧旋轉接頭
150‧‧‧固定部
310‧‧‧區域
420‧‧‧上導引
430‧‧‧旋轉軸
450‧‧‧下導引
510‧‧‧晶圓盤
530‧‧‧旋轉軸
540‧‧‧旋轉接頭
550‧‧‧圓柱形導引
630‧‧‧旋轉軸
640‧‧‧球軸承
650‧‧‧圓柱形導引
710‧‧‧旋轉軸
720‧‧‧球軸承
730‧‧‧圓柱形導引
圖1是用於描述根據本發明一實施例的晶圓載台的視圖。 圖2A至圖2D是用於描述根據本發明一實施例的顆粒的生成狀態的視圖。 圖3A和3B是用於描述根據本發明一實施例的旋轉軸的旋轉區域的視圖。 圖4是用於描述根據本發明一實施例的上導引和下導引的視圖。 圖5是用於描述根據本發明一實施例的圓柱形導引的視圖。 圖6是用於描述根據本發明一實施例的圓柱形導引和球軸承的視圖。 圖7A和圖7B是用於描述根據本發明一實施例的球軸承的配置的視圖。

Claims (13)

  1. 一種晶圓載台,包含: 一晶圓盤,一晶圓放置在該晶圓盤上; 一旋轉軸,用於旋轉該晶圓盤; 一圓柱形導引,設置於該旋轉軸的一側面的一外圍;以及 一球軸承,用於支撐該圓柱形導引和該旋轉軸之間的該旋轉軸。
  2. 如請求項1所述之晶圓載台,其中該圓柱形導引從該旋轉軸的一下端延伸到該旋轉軸的一上端。
  3. 如請求項1所述之晶圓載台,其中該圓柱形導引的一上端與該晶圓盤的一下端表面間隔開。
  4. 如請求項1所述之晶圓載台,其中該圓柱形導引包含一圓柱形框架,該圓柱形框架包含對應於該球軸承的一位置的一凹槽。
  5. 如請求項1所述之晶圓載台,更包含一馬達用於向該旋轉軸提供一旋轉驅動力。
  6. 如請求項1所述之晶圓載台,更包含一上導引,設置在該旋轉軸的一上端,以防止該晶圓盤偏離其位置。
  7. 如請求項6所述之晶圓載台,其中該上導引具有與該晶圓盤重心相同的一盤狀。
  8. 如請求項6所述之晶圓載台,其中該上導引與該晶圓盤分開設置。
  9. 如請求項1所述之晶圓載台,更包含一旋轉接頭,用於固定該圓柱形導引,其中該圓柱形導引設置在該旋轉接頭上。
  10. 如請求項1所述之晶圓載台,更包含一下導引,設置在該旋轉軸的一下端,以防止該旋轉軸偏離其位置。
  11. 如請求項10所述之晶圓載台,其中該下導引設置在該圓柱形導引的一側面的一外圍。
  12. 如請求項9所述之晶圓載台,更包含一固定部,用於固定該旋轉接頭和該旋轉軸。
  13. 一種晶圓檢測設備,包含請求項1至12項中任一項所述的晶圓載台。
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CN117637591A (zh) * 2024-01-25 2024-03-01 合肥晶合集成电路股份有限公司 晶圆金属元素分析方法及分析系统

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CN114654394A (zh) * 2022-03-20 2022-06-24 上海图双精密装备有限公司 一种晶圆检测移动载台机构
CN117637591A (zh) * 2024-01-25 2024-03-01 合肥晶合集成电路股份有限公司 晶圆金属元素分析方法及分析系统
CN117637591B (zh) * 2024-01-25 2024-04-19 合肥晶合集成电路股份有限公司 晶圆金属元素分析方法及分析系统

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