TW201815865A - 環氧樹脂組成物、b階段薄片、硬化環氧樹脂組成物、樹脂薄片、附有樹脂之金屬箔、及金屬基板 - Google Patents

環氧樹脂組成物、b階段薄片、硬化環氧樹脂組成物、樹脂薄片、附有樹脂之金屬箔、及金屬基板 Download PDF

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Publication number
TW201815865A
TW201815865A TW106118203A TW106118203A TW201815865A TW 201815865 A TW201815865 A TW 201815865A TW 106118203 A TW106118203 A TW 106118203A TW 106118203 A TW106118203 A TW 106118203A TW 201815865 A TW201815865 A TW 201815865A
Authority
TW
Taiwan
Prior art keywords
resin composition
epoxy resin
epoxy
mass
group
Prior art date
Application number
TW106118203A
Other languages
English (en)
Chinese (zh)
Inventor
木口一也
田中慎吾
西山智雄
竹澤由高
Original Assignee
日立化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成股份有限公司 filed Critical 日立化成股份有限公司
Publication of TW201815865A publication Critical patent/TW201815865A/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW106118203A 2016-06-02 2017-06-02 環氧樹脂組成物、b階段薄片、硬化環氧樹脂組成物、樹脂薄片、附有樹脂之金屬箔、及金屬基板 TW201815865A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-111371 2016-06-02
JP2016111371 2016-06-02

Publications (1)

Publication Number Publication Date
TW201815865A true TW201815865A (zh) 2018-05-01

Family

ID=60478811

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106118203A TW201815865A (zh) 2016-06-02 2017-06-02 環氧樹脂組成物、b階段薄片、硬化環氧樹脂組成物、樹脂薄片、附有樹脂之金屬箔、及金屬基板

Country Status (2)

Country Link
TW (1) TW201815865A (fr)
WO (1) WO2017209210A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018168556A1 (fr) * 2017-03-15 2018-09-20 日立化成株式会社 Résine époxyde, composition de résine époxyde, produit durci de résine époxyde et matériau composite
WO2020045560A1 (fr) * 2018-08-31 2020-03-05 Jnc株式会社 Composition, produit durci, corps stratifié et dispositif électronique
WO2020256005A1 (fr) * 2019-06-21 2020-12-24 住友ベークライト株式会社 Composition de résine thermodurcissable, feuille de résine et substrat de base métallique

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008239679A (ja) * 2007-03-26 2008-10-09 Sumitomo Chemical Co Ltd エポキシ樹脂組成物
JP2008266594A (ja) * 2007-03-26 2008-11-06 Sumitomo Chemical Co Ltd エポキシ樹脂組成物
JP5020125B2 (ja) * 2008-03-10 2012-09-05 新神戸電機株式会社 積層板の製造法
JP5614301B2 (ja) * 2011-01-20 2014-10-29 日立化成株式会社 熱硬化性樹脂組成物、並びにその半硬化物及び硬化物
JP6102082B2 (ja) * 2012-04-26 2017-03-29 日立化成株式会社 エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、樹脂シート、プリプレグ、積層板、金属基板、及びプリント配線板
CN106103531A (zh) * 2014-03-20 2016-11-09 日立化成株式会社 树脂组合物、树脂片、树脂片固化物、树脂片层叠体、树脂片层叠体固化物及其制造方法、半导体装置以及led装置
TWI710595B (zh) * 2014-12-08 2020-11-21 日商昭和電工材料股份有限公司 環氧樹脂組成物、樹脂薄片、預浸體、附有樹脂的金屬箔、金屬基板、及電力半導體裝置
TWI748935B (zh) * 2014-12-26 2021-12-11 日商昭和電工材料股份有限公司 環氧樹脂、環氧樹脂組成物、含無機塡料的環氧樹脂組成物、樹脂薄片、硬化物、及環氧化合物

Also Published As

Publication number Publication date
WO2017209210A1 (fr) 2017-12-07

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