WO2019106835A1 - Composition de résine, et procédé de fabrication de stratifié - Google Patents

Composition de résine, et procédé de fabrication de stratifié Download PDF

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Publication number
WO2019106835A1
WO2019106835A1 PCT/JP2017/043322 JP2017043322W WO2019106835A1 WO 2019106835 A1 WO2019106835 A1 WO 2019106835A1 JP 2017043322 W JP2017043322 W JP 2017043322W WO 2019106835 A1 WO2019106835 A1 WO 2019106835A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
resin layer
epoxy
epoxy resin
curing agent
Prior art date
Application number
PCT/JP2017/043322
Other languages
English (en)
Japanese (ja)
Inventor
一也 木口
智雄 西山
竹澤　由高
Original Assignee
日立化成株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日立化成株式会社 filed Critical 日立化成株式会社
Priority to PCT/JP2017/043322 priority Critical patent/WO2019106835A1/fr
Priority to TW107142365A priority patent/TW201925260A/zh
Publication of WO2019106835A1 publication Critical patent/WO2019106835A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers

Definitions

  • ⁇ 4> The resin composition according to ⁇ 2> or ⁇ 3>, wherein the curing agent comprises a curing agent that is liquid at room temperature.
  • the curing agent comprises a phenol novolac resin.
  • ⁇ 6> The resin composition according to any one of ⁇ 1> to ⁇ 5>, wherein the inorganic filler contains at least one selected from the group consisting of boron nitride, alumina, aluminum nitride, silica, and graphite.
  • the resin composition of the present embodiment has a thixotropic index at 25 ° C. of 1.2 to 10, and a viscosity of 3.5 Pa ⁇ s to 50 Pa ⁇ s measured at 25 ° C. and 5 min ⁇ 1 (rpm).
  • a thixotropic index at 25 ° C. of 1.2 to 10 By being s, it is excellent in the applicability
  • the heat conductivity after hardening is excellent by containing the epoxy resin which has a mesogen frame, and a hardening
  • the epoxy resin having a mesogen skeleton and the curing agent will be described later
  • the resin layer After disposing the second member on the resin layer formed on the first member, the resin layer is cured to obtain a laminate.
  • the method for curing the resin layer is not particularly limited.
  • the heat treatment may be performed by sandwiching with a pair of heat plates and heating while pressing.
  • the resin layer is formed in accordance with the shape of the member.
  • the resin composition of the above embodiment is excellent in the coating property to the members constituting the laminate and is excellent in the shape retentivity after coating, so even in such a case, the resin layer is formed at the predetermined position. can do.
  • meogenic skeleton refers to a molecular structure that may exhibit liquid crystallinity. Specific examples thereof include a biphenyl skeleton, a phenyl benzoate skeleton, a cyclohexyl benzoate skeleton, an azobenzene skeleton, a stilbene skeleton, and derivatives thereof.
  • An epoxy resin composition containing an epoxy monomer having a mesogen skeleton tends to form a high-order structure upon curing, and tends to be able to achieve higher thermal conductivity when producing a cured product.
  • the highly ordered higher order structure derived from the mesogen skeleton includes a nematic structure, a smectic structure and the like.
  • the nematic structure is a liquid crystal structure in which the molecular long axis is oriented in a uniform direction and has only an orientational order.
  • the smectic structure is a liquid crystal structure which has a one-dimensional position order in addition to the alignment order and has a layer structure of a constant period.
  • the direction of the period of the layer structure is uniform. That is, the molecular order is higher in the smectic structure than in the nematic structure.
  • the epoxy monomer mixture contains three or more specific epoxy monomers, it is sufficient if the epoxy monomer mixture consisting of all the specific epoxy monomers constituting the epoxy monomer mixture is compatible as a whole, and from three or more specific epoxy monomers Any two selected specific epoxy monomers may not be compatible with one another.
  • a phenol curing agent it is preferable to use at least one selected from the group consisting of an amine curing agent and a phenol curing agent as the curing agent, and further, from the viewpoint of storage stability, a phenol curing agent It is more preferable to use at least one of Further, from the viewpoint of solventlessness, it is preferable to select a liquid curing agent.
  • the phenol novolac resin having a partial structure represented by at least one selected from the group consisting of the general formulas (III-1) to (III-4) is particularly preferably substituted or unsubstituted Ar 31 to Ar 34
  • a curing agent having a low melting point is obtained.
  • the inclusion of such a phenol resin as a curing agent has the advantage of facilitating the production and handling of the epoxy resin composition.
  • the molecular weight of the phenol novolac resin having a partial structure represented by at least one selected from the group consisting of general formula (III-1) to general formula (III-4) is not particularly limited.
  • the number average molecular weight (Mn) is preferably 2000 or less, more preferably 1500 or less, and still more preferably 350 to 1500.
  • the weight average molecular weight (Mw) is preferably 2000 or less, more preferably 1500 or less, and still more preferably 400 to 1500.
  • Mn and Mw are measured by the usual method using GPC (gel permeation chromatography).
  • the copper foil of the produced cured epoxy resin composition with copper foil was removed by etching to obtain a sheet-like cured epoxy resin composition (cured resin sheet).
  • the resulting cured resin sheet was cut into 10 mm long and 10 mm wide to obtain a sample.
  • the sample was subjected to X-ray diffraction measurement (using an X-ray diffractometer manufactured by Rigaku Corporation) using a CuK ⁇ 1 ray, a tube voltage of 40 kV, a tube current of 20 mA, and 2 ⁇ of 2 ° to 30 °. From the presence or absence of the diffraction peak in the range of ⁇ 10 °, it was confirmed that a smectic structure was formed.
  • Comparative Example 3 (Preparation of epoxy resin composition) An epoxy resin composition was prepared in the same manner as in Example 3 except that the amount of solvent was changed, to prepare a copper foil-cured epoxy resin composition.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne (1) une composition de résine qui contient un matériau de remplissage inorganique dont la teneur en volume est comprise entre 40 et 65% en volume, qui présente un indice de thixotropie à 25°C compris entre 1,2 et 10, et une viscosité mesurée sous des conditions de 25°C et de ５ｍｉｎ－１（ｒｐｍ） comprise entre ３,５Ｐａ・ｓ et ５０Ｐａ・ｓ, et qui est destinée à former par application une couche de résine d'un stratifié possédant une paire d'éléments et ladite couche de résine disposée entre ladite paire d'éléments, ou (2) une composition de résine qui présente un indice de thixotropie à 25°C compris entre 1,2 et 10, et une viscosité mesurée sous des conditions de 25°C et de ５ｍｉｎ－１（ｒｐｍ） comprise entre ３,５Ｐａ・ｓ et ５０Ｐａ・ｓ, qui contient une résine époxy ayant un squelette mésogène et un agent de durcissement, et qui est destinée à former par application une couche de résine d'un stratifié possédant une paire d'éléments et ladite couche de résine disposée entre ladite paire d'éléments.
PCT/JP2017/043322 2017-12-01 2017-12-01 Composition de résine, et procédé de fabrication de stratifié WO2019106835A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2017/043322 WO2019106835A1 (fr) 2017-12-01 2017-12-01 Composition de résine, et procédé de fabrication de stratifié
TW107142365A TW201925260A (zh) 2017-12-01 2018-11-28 樹脂組成物及積層體的製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2017/043322 WO2019106835A1 (fr) 2017-12-01 2017-12-01 Composition de résine, et procédé de fabrication de stratifié

Publications (1)

Publication Number Publication Date
WO2019106835A1 true WO2019106835A1 (fr) 2019-06-06

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TW (1) TW201925260A (fr)
WO (1) WO2019106835A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009102603A (ja) * 2007-10-05 2009-05-14 Hitachi Chem Co Ltd 接着剤組成物及び半導体装置
WO2012108320A1 (fr) * 2011-02-10 2012-08-16 住友ベークライト株式会社 Composition de résine d'encapsulation à des fins de pré-application, puce à semi-conducteur et dispositif à semi-conducteur
JP2013030637A (ja) * 2011-07-29 2013-02-07 Sumitomo Bakelite Co Ltd 液状樹脂組成物および半導体装置
JP2016004818A (ja) * 2014-06-13 2016-01-12 日立化成株式会社 印刷用樹脂組成物及びプリント配線板
JP2016155985A (ja) * 2015-02-26 2016-09-01 日立化成株式会社 エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、及びそれらを用いた樹脂シート、プリプレグ、積層板、金属基板、配線板、パワー半導体装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009102603A (ja) * 2007-10-05 2009-05-14 Hitachi Chem Co Ltd 接着剤組成物及び半導体装置
WO2012108320A1 (fr) * 2011-02-10 2012-08-16 住友ベークライト株式会社 Composition de résine d'encapsulation à des fins de pré-application, puce à semi-conducteur et dispositif à semi-conducteur
JP2013030637A (ja) * 2011-07-29 2013-02-07 Sumitomo Bakelite Co Ltd 液状樹脂組成物および半導体装置
JP2016004818A (ja) * 2014-06-13 2016-01-12 日立化成株式会社 印刷用樹脂組成物及びプリント配線板
JP2016155985A (ja) * 2015-02-26 2016-09-01 日立化成株式会社 エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、及びそれらを用いた樹脂シート、プリプレグ、積層板、金属基板、配線板、パワー半導体装置

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TW201925260A (zh) 2019-07-01

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