TW201814310A - Handler for testing electronic parts and method for adjusting teaching point thereof whereby start-up rate of the handler is improved to increase processing capacity of the handler - Google Patents

Abstract

The present invention relates to a handler for testing electronic parts and a method for adjusting teaching point thereof. This invention comprising the following technical steps: capturing an image of a pick-up unit of a pick-up module or the grasping condition of a semiconductor element being grasped by the pick-up unit during a handler start-up process; and comparing the captured image with stored images so as to determine whether the teaching point through the pick-up module fails or not, or whether the grasping of the semiconductor element is poor or of. According to this invention, since the teaching point is being continuously adjusted during the handler start-up process, the reliability of the moving operation of semiconductor element can be improved, and since termination of the start-up process due to a failure of the teaching point does not occur, the start-up rate of the handler can be improved to increase the processing capacity, and the determination of whether apick-up of semiconductor element is poor or not can be promptly confirmed and rapidly responded.

Description

Sorting machine for testing electronic components and method for adjusting teaching point thereof

The present invention relates to a sorting machine that electrically connects a semiconductor element to a testing machine and classifies the semiconductor element based on a test result.

A sorting machine for testing electronic components (hereinafter referred to as a "handler") is a method for electrically connecting electronic components manufactured through a predetermined manufacturing process to a tester based on the test results. Classified equipment.

Generally, a sorter performs the following tasks in order to test multiple electronic components together: moving the electronic components stacked on the customer tray to the test tray, and after completing the test, the The electronics move to the customer tray.

Therefore, the sorting machine is provided with a plurality of mobile devices for moving electronic components between different on-load elements and on-load elements. Here, in addition to the above-mentioned customer trays or test trays, the stacking elements also include all elements capable of stacking electronic components in the sorter, such as a buffer section for temporarily stacking electronic components.

In most cases, the mobile device has a plurality of pickers capable of grasping or releasing the electronic components. In addition, a plurality of pickup portions can adjust a distance between each other so that the electronic components can be moved between different stacked elements.

In addition, in order for the pick-up section to appropriately hold or release the electronic component, it is necessary to hold or release the electronic component in a state of being located at an accurate teaching point. Therefore, the teaching point of the pickup unit needs to be set accurately. Here, the teaching point can be understood as an operation position when the pick-up unit performs an operation of grasping the electronic component or an operation of releasing the grasp of the electronic component.

In the case where the teaching point is not set normally, a problem occurs when the electronic component is held and released.

First of all, when the teaching of the grip points of electronic components is poor, accidental grip release may occur midway due to poor grips and incomplete grips. In this case, electronic components obviously occur. May be lost, and misoperation may occur due to the gripped electronic components or damaged electronic components being sandwiched between other constituent components.

In addition, if the teaching of the grip release point of the electronic component is not good, the electronic component will not be properly placed in the correct position and will detach, the phenomenon of repeated stacking at the same location, or the electronic component will be defective. Causes of test failure, misoperation, and failure caused by contact with the test electromechanical in the installed state.

The present invention relates to a technology for accurately setting a teaching point of a pickup section for moving an electronic component having a thin plate shape such as a semiconductor element and having a small size. In particular, due to the development of integrated technology, accurate setting of teaching points is required for electronic components such as semiconductor devices that are further miniaturized, and this is true.

In the prior art, the adjustment of the teaching point of the pick-up section is performed manually. As an example of manual adjustment, there is a method of separately providing a teaching jig having a teaching hole formed therein, and inserting a teaching pin coupled to a reference pickup section (hereinafter referred to as a "reference pickup section"). Go to the teaching hole and capture the moment when it is smoothly inserted, so that teaching is completed at the captured moment and captured place. Of course, it also includes a method in which a reference stick is installed at the position of the reference pick-up section instead of the reference pick-up section and performed. However, when the teaching points are adjusted manually as described above, it takes too much time in a program that manually sets a large number of teaching points corresponding to a large number of mobile devices one by one. In addition, focusing on the trend toward miniaturization of electronic components, the accuracy of setting teaching points will decrease due to lack of operator proficiency or visual reasons. Therefore, it is difficult to set accurate teaching through operations based on visual recognition. point. That is, whether the reference picking section (or the reference rod) can be smoothly inserted into the teaching hole depends on the operator's field of vision and feel. Therefore, the operator's standards are different from each other, and the time required varies depending on the skill of the operator. For these reasons, the teaching point adjustment operation takes about 5 hours. In addition, when adjusting the teaching point, due to the difference in rigidity between the various components, the degree of damage between the contacted structural members is large, and therefore cost is also wasted. Furthermore, it is necessary to remove the teaching jig after adjusting the teaching point, and then install the stacking elements according to the type of the semiconductor element to drive the device. There are also some difficulties in this procedure, that is, it is necessary to consider setting tolerances.

Therefore, for example, Korean Published Patent No. 10-2006-0003110 (hereinafter, referred to as "the prior art") has studied a technique for automatically setting a teaching point.

In the prior art, two cameras, a test plate, and a position determination plate are used to set the teaching point of the pickup section. However, the prior art has the following problems.

First, since two cameras, a test board, and a position determination board are required, production costs increase.

Second, because all the information obtained through the two cameras is used, the data processing speed will also be reduced.

The present invention provides a technology capable of accurately setting a reference position and a teaching point of a reference pickup unit using a camera.

The sorting machine for testing electronic components according to the present invention for solving the aforementioned object includes a plurality of mobile devices that move electronic components located in a teaching area at a front end to a teaching at a rear end on a moving path of a semiconductor element. An area; a connecting device for electrically connecting an electronic component to a testing machine at a test position located on the moving path; at least one camera for determining the display of the electronic component by means of at least one of the plurality of mobile devices Poor teaching or not; a control device that controls the plurality of mobile devices, the connection device, and the at least one camera, and at least one of the plurality of mobile devices includes a pickup module having at least one pickup unit The at least one pick-up section includes a reference pick-up section capable of gripping or releasing the grip of the electronic component; and a mobile machine for placing the pick-up module in a teaching area at a front end and a teaching area at a rear end. The camera captures the bottom surface of the specific electronic component held by the reference pickup section at a specific position, and the control The device uses a bottom image of a specific electronic component captured by the camera at the specific position and held by the reference picking section to determine whether the teaching of the reference picking section is poor, and if the reference If the teaching of the pickup section is not good, adjust the teaching point of the reference pickup section.

After the control device captures an image of the bottom surface of the reference pickup section at the specific position by using the camera, analyzes and adjusts a teaching point of the reference pickup section for the first time, and then uses the first time The bottom surface image of the specific electronic component held by the reference pickup section of the teaching point is adjusted to determine whether the teaching of the reference pickup section is poor.

The control device uses the bottom surface image of the reference pickup section to align the center of the bottom surface of the reference pickup section with the center of the camera, and align the reference center of the bottom surface with the center of the camera. The center of the bottom image of the specific electronic component held by the unit is compared with the center of the camera to determine whether the teaching of the reference pickup unit is poor.

The specific electronic component is a model device made to determine whether the teaching of the reference pickup unit is defective.

The X-axis length and Y-axis length of the bottom surface of the model equipment are respectively longer than the X-axis length and Y-axis length of the actual electronic component bottom surface.

On the bottom surface of the model device, a marking portion having a color different from a background color is provided at a predetermined place.

The mobile device further includes an identification member coupled to the reference picking section for setting a reference position of the reference picking section.

The identification tool has a structure that is inserted into the reference pick-up section in the form of a pipe.

The mobile device further includes a setting camera whose relative coordinates to the reference pickup section have been determined, and the control device determines whether the center of an image captured by the setting camera is captured after the camera is captured by the setting camera. Align with the center of the camera to set the reference position of the reference pickup section.

The teaching point adjustment method in the sorting machine for testing electronic components according to the present invention for solving the aforementioned objects includes the following steps: a holding step of holding a model device located at a predetermined position using a reference picking section; a moving step , Moving the reference picking portion holding the model device to a specific position; an image acquisition step, using a camera to acquire a bottom image of the model device held by the reference picking portion located at the specific position; returning to the step, After moving the reference picking section to a predetermined position, returning the model device to the original position; an analysis step of comparing and analyzing the image acquired in the image acquisition step and the image during normal gripping; The adjusting step adjusts a teaching point of the reference pickup unit by using the value analyzed in the analyzing step.

It also includes the following steps: a confirmation step, re-holding the model device returned in the returning step by using the reference pickup section adjusted the teaching point in the adjusting step, and then re-executing the moving step and image acquisition step And analysis steps to confirm whether the teaching point is defective.

The present invention has the following effects.

First, since it is not necessary to use jigs or the like separately, production costs can be reduced.

Second, since the position of the pick-up portion can be accurately grasped at a specific position by an identifier, the accuracy of adjusting the teaching point can be improved.

Third, because the sharpness of the image captured by the camera can be improved by using the model equipment, it can not only improve the adjustment accuracy of the teaching point, but also further reduce the production cost by eliminating additional components for improving accuracy .

Fourth, since the test points are adjusted by using model equipment having almost the same specifications as the placement grooves, the adjustment precision of the teaching points can be further improved.

Fifth, since it is sufficient to process information based on only one camera, the teaching point can be adjusted in a shorter time.

Hereinafter, preferred embodiments according to the present invention will be described. For reference, for the sake of brevity, the known content or repeated description will be omitted or compressed as much as possible. < Explanation of the basic structure of a sorting machine >

FIG. 1 is a schematic plan configuration view of a sorter 100 (hereinafter, referred to as a “sorter”) for an electronic component test according to an embodiment of the present invention.

As shown in FIG. 1, a sorting machine 100 according to an embodiment of the present invention includes the following elements: a test tray 110, a first mobile device 121, a first camera 122, a soak chamber, and a test chamber. 140 (test chamber), connection device 150, desoak chamber 160, second mobile device 171, second camera 172, sorting table 180, third mobile device 191, third camera 192 And control unit CA.

In the test tray 110, a plurality of inserts capable of accommodating semiconductor elements may be more or less roamed, and may be cycled along the closed path C according to a plurality of transfer devices (not shown).

The first mobile device 121 moves the semiconductor device to be tested stacked on the customer tray CT ₁ to the test tray 110 located at a loading position LP (Loading Position).

The first camera 122 is provided in order to detect a teaching failure of a semiconductor element by the first mobile device 121.

The soaking chamber 130 is provided to realize a function of preheating or precooling the semiconductor elements stacked on the test tray 110 transferred from the loading position LP according to the test environmental conditions before testing. That is, the semiconductor device stacked on the test tray 110 is assimilated to the temperature required for the test while being transferred into the soaking chamber 130.

The test chamber 140 is equipped to realize the following functions: the test tray 110 transferred to the test position TP (Test Position) after the preheating / precooling of the soaking chamber 130 is stored, and the test tray 110 stacked on the test tray is stored 110 semiconductor components were tested.

The connecting device 150 pushes the semiconductor element toward the tester side coupled to the test chamber 140, so that the semiconductor element is electrically connected to the tester, wherein the semiconductor element is stacked in the test chamber 140 The test tray 110 of the test position TP.

The heat-dissipation chamber 160 is provided to realize the function of assimilating the heated or cooled semiconductor elements stacked on the test tray 110 transferred from the test chamber 140 into the second mobile device 171 or the third mobile device 191. The temperature required when moving (preferably close to normal temperature).

The second mobile device 171 moves the semiconductor elements stacked on the test tray 110 that has been moved from the unheating chamber 160 to an unloading position UP (Unloading Position) to a sorting table 180.

The second camera 172 is provided for detecting whether or not the teaching of the semiconductor element by the second mobile device 171 is poor.

The sorting table 180 is stacked with semiconductor components moved from the test tray 110 by the second mobile device 171.

The third mobile device 191 sorts the semiconductor components stacked on the sorting table 180 according to the test level, and moves them to the empty customer tray CT ₂ .

The third camera 192 is provided in order to detect the failure of teaching of the semiconductor element by the first mobile device 191.

The control device CA controls the operations of the first mobile device 121, the first camera 122, the connection device 140, the second mobile device 171, the second camera 172, the third mobile device 191, and the third camera 192 described above. In particular, the control device CA uses images acquired by the first camera 122, the second camera 172, and the third camera 192 to adjust for holding the semiconductor by the first mobile device 121, the second mobile device 171, and the third mobile device 191. Teaching point of the device or the release of the grip of the semiconductor device.

Next, a characteristic portion of the present invention in the sorter 100 having the basic configuration as described above will be described. ＜ Description for mobile devices ＞

Mobile MA: moving the electronic component is performed between the CT _1, CT ₂ and the test tray 110 and sorting station 180 is responsible for customer tray 121,171,191. At this time, the mobile device MA moves the electronic component from the teaching area at the front end (for example, the area where the customer tray on which the electronic components to be tested are stacked) to the teaching area at the rear end (for example, receiving The area where the test tray from which the test component of the electronic component to be tested comes from the stacking position is moved).

As shown in the exemplary embodiment illustrated in FIG. 2, the mobile device MA has a pickup module PM, a first horizontal moving machine HM ₁ , a second horizontal moving machine HM _2, and an elevator UD.

The pick-up module PM includes pickers P ₀ and P that can hold or release the gripping of the semiconductor element. Here, the pick-up portions P ₀ and P grip the semiconductor element by vacuum, or release the grip of the semiconductor element by releasing the vacuum. In addition, the distance between the pick-up portions P ₀ and P can also be adjusted. Of course, it suffices that one or more pickup sections P ₀ and P are provided, and the pickup sections P ₀ and P may be provided in any desired number according to the specifications of the sorter 100.

The first horizontal moving machine HM ₁ moves the pickup module PM in a first direction on a horizontal plane.

The second horizontal moving machine HM ₂ moves the pickup module PM in a second direction (substantially perpendicular to the first direction) on a horizontal plane.

Therefore, the pick-up module PM moves the semiconductor element in accordance with a movement pattern determined by the first horizontal moving machine HM ₁ and the second horizontal moving machine HM ₂ .

For reference, according to the embodiment, any one of the first horizontal moving machine HM ₁ and the second horizontal moving machine HM ₂ may be omitted. That is, the mobile device may include a case where it is necessary to move along the X axis and a Y axis, and a case where it is sufficient to move only along a certain axis (X axis or Y axis). This is because the stacking element corresponding to the mobile device may be configured to move along the X-axis or the Y-axis, or may be configured to move along all of the two axes. Therefore, it can be structured as follows: The moving direction of the mobile device can be moved along the direction of any one of the axes, or can be moved along all of the two axes, in accordance with the mobility or fixedness of the loaded elements.

The lifter UD can raise and lower the pick-up module PM so that the semiconductor element can be gripped by the pick-up portion P, or the gripping of the semiconductor element can be released.

In addition, the mobile devices MA: 121, 171, and 191 further include a discriminating element R mounted on the reference pickup portion P ₀ .

Generally, since the distance between the picking sections P ₀ and P is accurately set, as long as the teaching points of the reference picking section P ₀ can be adjusted accurately, the teaching points of the remaining picking sections P ₀ and P will be automatically adjusted. Be adjusted. Therefore, as in this embodiment, in order to ensure the adjustment accuracy of the teaching point, it is preferable to consider the picking portions P ₀ and P that are in a fixed state without moving even when adjusting the distance between the picking portions P ₀ and P. Is the reference pickup portion P ₀ .

The discriminator R is provided for setting the reference position of the reference pickup portion P ₀ , and as shown in FIG. 3, the identification piece R is installed as a tube as a whole and inserted into the reference pickup portion P ₀ . Therefore, the center of the bottom surface of the identification member R according to the present embodiment is aligned with the center O of the bottom surface of the reference pickup portion P ₀ . Of course, since the identification element R is an element to control the reference pickup unit P ₀ of the bottom surface of the center O is used, so long as it is possible to accurately grasp the morphology of the bottom surface of the center O of the reference pick-up portion P _0, any structures can be preferably be considered. For example, the shape in which the identification member R is mounted may be a ring shape like a ring, or may be a disk shape. Furthermore, it may be an angled shape that can confirm only one or more points.

Furthermore, the identification member R may be provided with a material having elasticity so that it can be easily attached and detached, and may also be made of divided pieces, so that the pieces are combined with each other during installation. In this case, while reducing the time consumed in the installation procedure, it is possible to prevent the existing structural members from being damaged or distorted due to an excessive external force used for mounting on the pickup section or other structural members.

Such an identifier R is wider than the outer diameter D ₁ of the bottom surface of the reference pickup portion P ₀ , but has an outer diameter D ₂ in which the adjustment of the distance between the pickup portions P ₀ and P is not hindered. Here, the outer diameter D ₁ of the bottom surface of the reference pickup portion P ₀ specifically indicates the outer diameter of the suction pad 1.

In addition, the lower end of the discriminating member R is as close as possible to the suction pad 1 in order to prevent errors caused by the perspective on the images captured by the cameras 122, 172, and 192. A place where the reference pickup unit P _{0 is} gripping or releasing the electronic component from being gripped. For this reason, it is preferable to consider the configuration of the lower end of the identification member R as follows: the outer diameter and the content are somewhat expanded so that the upper portion of the suction pad 1 can be inserted into the lower end of the identification member R.

Furthermore, since the identifier R needs to enable the bottom surface of the reference pickup portion P ₀ (specifically, the bottom surface of the suction pad) to be clearly displayed on the images captured by the cameras 122, 172, and 192, it is preferably provided with Suction pads 1 different colors.

According to the embodiment of the present invention, the outer contour of the adsorption pad 1 can also have a color or a line different from the inner contour, so that the outer contour can function as the discriminating element R. However, if manufacturing costs and the like are considered, as in the present embodiment, it is more preferable that the identification member R is provided with a component different from that of the suction pad 1. ＜ Explanation for the camera ＞

Since the cameras 122, 172, and 192 need to photograph the bottom surface of the reference pickup portion P ₀ located at a specific position, it is preferably provided below the specific position, but the reflection pickup is used to photograph the reference pickup portion P ₀ located at a specific position. The way is enough. ＜ Explanation for model equipment ＞

In this embodiment, a model device is used to adjust the teaching point. Here, the model device is a prop specially manufactured to adjust the teaching point. When adjusting the teaching point, the model device plays the role of being grasped and moved by the pickup portion in the same way as the actual electronic component, but does not have an electronic circuit.

FIG. 4 is an exemplary diagram for the bottom surface of the model device M. FIG.

If the illustration is exaggerated, as shown in FIG. 5, preferably, the X-axis length and Y-axis length of the bottom surface of the model device M are longer than the actual electronic component D.

The model device M is used in order to improve the accuracy of the adjustment of the teaching point by preventing problems that may be accompanied when the teaching point of the actual electronic component D is adjusted.

For example, if the illustration is exaggerated as shown in FIG. 6, the area of the placement groove S on which the elements are stacked is made considerably wider than the area of the bottom surface of the actual electronic component D. That is, more specifically, both the X-axis length and the Y-axis length of the seating groove S are longer than the X-axis length and the Y-axis length of the electronic component D. The reason is that even if there are many variables, the actual electronic component D can be mounted in a state where it is properly inserted into the mounting groove S. However, contrary to the fact that the manufacturing tolerance of the actual electronic component D is 0.1 mm, the placement groove S of the stacking element can be made more precisely with a manufacturing tolerance of 0.02 mm to 0.08 mm. If the point where the area of the mounting slot S is wider than the bottom area of the actual electronic component D and the manufacturing tolerances of the mounting slot S and the actual electronic component D are taken into consideration, the actual electronic component D of the current mounting slot S is The maximum relative manufacturing tolerance is 0.68mm. The above-mentioned maximum tolerance of 0.68 mm means that even when the actual electronic component D is held by the reference pickup portion P ₀ , the center of the actual electronic component D may deviate from the center O of the suction pad 1 by a distance of 0.68 mm. Was arrested. If the diameter of the suction pad 1 is 1.5 mm, for an actual electronic component D such as a semiconductor element having a bottom surface area of 3 mm × 4 mm, the left and right margins will only be 0.75 mm respectively. If the above maximum tolerance of 0.68 mm is compared with the margin of 0.75 mm, the adjustment of the teaching point using the actual electronic component D may lose its meaning. That is, as shown in FIG. 7 with an exaggerated illustration, if the actual electronic component D to be used for the adjustment of the teaching point is in a state (a) deviating from the side of the placement groove S, or is on the vertical axis (Z (Axis) is the rotation axis (b), the teaching point adjustment error will still occur.

Therefore, although the X-axis and Y-axis lengths of the bottom surface of the model device M are shorter than the X-axis and Y-axis lengths of the mounting groove S, they are longer than the X-axis and Y-axis lengths of the bottom surface of the actual electronic component D, thus exaggerating the illustration. As shown in (c) and (d) of FIG. 7, it is possible to minimize the degree of error of the model equipment M being placed toward the placement groove S (a) or being placed in a rotated state (b), thereby enabling error-free 2. Adjust the teaching point accurately. Here, it is preferable that the area of the bottom surface of the model equipment M and the area of the installation groove S are almost the same so that the model equipment M can be loaded in a state of being inserted into the installation groove S almost completely without flaws. To prevent poor stacking, it is necessary to control the manufacturing tolerance to 0.01 mm to 0.07 mm, so that it can be manufactured more precisely than the manufacturing tolerance of the mounting slot S.

In addition, the model device M preferably has a color that can be contrasted with the colors of the surrounding constituent parts, so that it can be clearly distinguished from the images captured by the cameras 122, 172, and 192. For example, as in an actual electronic component, there are one or more pickup portions P ₀ , P, a pickup module PM, and a large number of wirings among the constituent components around the model device M. Therefore, even when only the suction pad 1 at the lower end of the reference pickup portion P ₀ needs to be photographed, the shape of the suction pad 1 at the lower end of the reference pickup portion P ₀ in the images of the cameras 122, 172, and 192 is also mixed around. The constituent parts cannot be distinguished from each other, and therefore, it is more important to equip the model device M with a color that can be clearly distinguished from the surrounding constituent parts. Furthermore, the so-called model equipment can be equipped with colors that can be clearly distinguished from these surrounding components, which fully demonstrates that the use of the model equipment M is more advantageous than actual electronic components. Here, in order to more clearly confirm the center O ′ of the model device M in the image, the bottom center O ′ of the model device M preferably has a color different from the background color. Further, preferably, the undercut groove T is formed at a center O ′ of the bottom surface of the model electronic device M within a tolerance range of 0.01 mm, and the inside of the undercut groove T has a color that can be contrasted with the background color, thereby enabling The center O 'of the bottom surface of the model device M is accurately confirmed by the cameras 122, 172, and 192.

Of course, in order to obtain clear images by the cameras 122, 172, and 192, lighting can also be provided. Therefore, it is preferable that the paint applied to the model equipment M or the etched groove T including the center O 'be provided with a material for preventing diffuse reflection. .

In addition, as described above, the model equipment M may be provided as a component that is always provided on the sorting machine 100, or may be provided to the sorting machine 100 when an operator performs a teaching point adjustment operation. However, even in the latter case, the operator can provide the model equipment M to the sorting machine 100 when the teaching point is adjusted, and the model equipment M functions as a component of the sorting machine 100. In this case, it should also be understood that the model device M is a constituent component constituting the sorting machine 100. ＜ Description of control device ＞

The control device CA uses the images captured by the cameras 122, 172, and 192 to determine whether the teaching point is defective, and adjusts the teaching point when the teaching point is defective.

More specifically, the control device CA uses the images captured by the cameras 122, 172, and 192 to grasp the center O of the reference pickup portion P ₀ and the center O ′ of the model device M to adjust the teaching point.

Next, adjustment of teaching points realized in the sorting machine 100 having the aforementioned characteristics will be described. < Method for Adjusting Teaching Points at Initial Arrangement - Refer to the Flowchart of FIG. 8 > 1. The bottom surface of the imaging reference pickup section P ₀ (S1)

For example, as shown in FIG. 9, the coordinates of a specific position captured by the cameras 122, 172, and 192 are (0, 0), and the coordinate value of the position of the bottom center O 'of the model device M is (-2, -10) . Here, the determined position (-2, -10) of the model equipment M is an arbitrarily determined position in the placement slot S existing in the stowage element, and it may have at least one for each stowage element as described above. . If the original teaching point is accurately adjusted, the center O of the reference pickup portion P ₀ needs to be moved to the center position (-2, -10) of the model device M as accurately as possible.

Therefore, first, the bottom surface of the reference pickup portion P ₀ is captured by the cameras 122, 172, and 192 with the reference pickup portion P ₀ placed above a specific position.

Here, the specific position may be located on a path moved by the reference picking section P ₀ so that the electronic part can be moved on the moving path of the electronic part, but it may also be a place that is separated from a general electronic part moving path , The reference pickup portion P ₀ can also be located. It is merely that such a specific position is sufficient if its coordinate value is accurately set as described below.

Of course, preferably, a specific location in the reference pickup unit P ₀ of the moved region only, and within the region of each reference pickup unit P ₀ moved, as long as enough is arranged a camera 122,172,192. The purpose is to prevent collisions that may occur in the case where the moving areas overlap between the pickup modules PM of mobile devices MA that are different from each other. Of course, the specific position is a position where the cameras 122, 172, 192 exist, and it may also correspond to the center of the cameras 122, 172, 192. 2. Setting of the position of the reference pickup section P ₀ (S2)

The center O of the reference pickup portion P ₀ is grasped from the image captured in step S1, and the center O of the reference pickup portion P _{0 and} the center of the image O ₀ (the center of the camera) are aligned as shown in FIG. 10. (Refer to arrow "a") to accurately set the reference position (for example, the center of the pad is (0, 0)). Here, since the center O of the reference pickup portion P _{0 is} the center O of the discriminator R, the center O of the reference pickup portion P ₀ can be easily grasped by grasping the center of the discriminator R. At this time, the reference position of the reference pickup section P ₀ can be set only by the image captured in step S1, but to ensure accuracy, it is also possible to compare the stored reference image with the captured image to realise. 3. Holding of model equipment M (S3)

The reference device P _{0 having} the reference position set in step S2 is used to hold the model device M at the coordinates (-2, -10). 4. Movement of the reference pickup section P ₀ (S4)

The reference pickup portion P _{0 of} the grip model device M is moved to a specific position with coordinates (0, 0). 5. Acquire the bottom image of the model device M (S5)

The bottom surface of the reference pickup portion P ₀ is captured by the cameras 122, 172, and 192. At this time, since the reference pickup portion P _{0 is} in a state of holding the model device M, it is possible to acquire a bottom image of the model device M from the captured image. 6. Return of model equipment M (S6)

After performing step S5, the control device CA returns the model device M to the original position, that is, the coordinates (-2, -10). 7. Image comparison and analysis (S7)

While executing step S6, the control device CA compares and analyzes the center O ₀ of the image captured in step S5 with the center O ′ of the bottom surface of the model device M.

The above step S7 may be performed at the same time as the above step S6, or may be performed earlier than the step S6. That is, according to the setting mode, step S6 and step S7 may be interchanged in time sequence relationship, and may also be performed at the same time. 8. Teaching point adjustment (S8)

The value obtained by the comparison and analysis in step S7 is used to adjust the teaching point of the reference pickup section P ₀ .

For example, if the image captured in step S5 is as illustrated in FIG. 11, the error of the teaching point is equivalent to the center O ₀ of the image as the center of the cameras 122, 172, and 192 and the center O ′ of the model device M. Since the distance L between them, the control device CA controls the mobile devices MA: 121, 171, and 191 so that the reference pickup section is located at a teaching point adjusted later. For reference, the reference position of the reference pickup section is set in step S2. Therefore, as shown in FIG. 11, the center O of the bottom surface of the reference pickup section P ₀ and the center O ₀ of the image as the center of the cameras 122, 172, and 192. alignment. 9. Check whether the teaching point is bad (S9)

If it is completed to step S8, it will repeat from step S3 to S8 to confirm the defect of the teaching point. That is, at this step S9, the reference for setting a reference position of the pickup unit P ₀ of the job is omitted.

Of course, if the teaching point is good, it is judged that the adjustment of the teaching point is completed, and the confirmation operation is suspended. ＜ How to adjust the teaching point when replacing parts ＞

For example, when various parts (customer trays, test trays, etc.) are replaced in accordance with the specifications change of the electronic components to be tested, etc., the teaching point needs to be reset.

As described above, in the case where the component is replaced, the reference position of the reference pickup portion P ₀ is set, and therefore, steps S1 and S2 can be omitted in the flowchart of FIG. 8. Therefore, the procedure for adjusting the teaching point when replacing a part is only required to execute steps S3 to S9 in the flowchart of FIG. 8. ＜ When using transparent model equipment ＞

In the case where the model equipment M is toughened glass or toughened plastic and is made of a transparent material, the reference equipment P ₀ and the identifier can be reflected even when the reference equipment P ₀ grips the model equipment M. Shooting of images.

Therefore, in the case of using a transparent model device, steps S1 and S2 in the flowchart of FIG. 8 may also be omitted, and only steps S3 to S9 need to be performed.

For reference, when a larger number of electronic components are mounted than the pickup sections P ₀ and P provided in one stack-loaded element mobile device M, the teaching point of the reference pickup section may be set for one stack-loaded element. Exists in multiple places. However, if any one of the teaching points on a stacking element can be accurately set, the remaining teaching points can be automatically set by calculation based on standardized data, so there is no need to perform adjustments for the remaining teaching points. operation. However, installation tolerances may also occur in the procedure for installing the stowage element. Therefore, according to the embodiment, two places can be taught for one stowage element, so that the installation tolerance can be corrected. ＜ Modifications ＞

In the above embodiment, by using the pickup unit P is mounted to the reference element R is set to ₀ the identification of the reference position of the pickup unit P _0.

However, as shown in FIG. 12, the pickup module PM may be further equipped with a separate setting camera SC instead of the identifier R, so as to set the position of the reference pickup portion P ₀ .

In the example shown in FIG. 12, the pickup module PM is moved at an initial stage, and the cameras 122, 172, and 192 located below are captured by the setting camera SC. And it is determined whether the center of the image captured by the camera SC is aligned with the center of the cameras 122, 172, and 192, and the pickup module PM is moved according to the above determination result, so that the center of the image captured by the camera SC is set Align with the centers of cameras 122, 172, 192. According to the procedure described above, if the centers of the cameras 122, 172, and 192 are located at the center of the image captured by the setting camera SC, the position of the reference pickup section P ₀ is set in this state. Here, the relative coordinates between the camera SC and the reference picking section P ₀ have been determined, and the electronic components are held by the cameras 122, 172, 192 or from other loading elements (customer tray, test tray, sorting table, etc.) Or the coordinates of the place where the electronic component is placed are set in a fixed coordinate form. Therefore, if the coordinates of the camera SC are set to the coordinates of the cameras 122, 172, and 192, the coordinates of the reference pickup portion P ₀ can be determined by simple calculation.

That is, according to the embodiment, various methods can be adopted for the method of setting the reference position of the reference pickup portion P ₀ . Therefore, although the specific description of the present invention has been made based on the embodiments described with reference to the drawings, the above-mentioned embodiments have only described the preferred embodiments of the present invention as an example, and therefore, the present invention should not be It is understood that it is limited to the above embodiments, and the scope of rights of the present invention should be understood as the scope of the scope of patent application and the scope equivalent thereto.

100‧‧‧ Sorting machine for electronic component testing

MA (121, 171, 191) ‧‧‧ mobile device

PM‧‧‧Pick up module

HM ₁ ‧‧‧The first horizontal moving machine

HM ₂ ‧‧‧Second horizontal moving machine

O'‧‧‧ Center

R‧‧‧ Identification

SC‧‧‧Set Camera

122, 172, 192‧‧‧ cameras

150‧‧‧ Connected device

CA‧‧‧Control Device

M‧‧‧ Model Equipment

T‧‧‧Cut

FIG. 1 is a schematic plan configuration view of a sorter for testing electronic components according to an embodiment of the present invention.

FIG. 2 is a schematic configuration diagram of a mobile device applied to the sorting machine of FIG. 1.

FIG. 3 is an extraction diagram of an identification element applied to the mobile device of FIG. 2.

4 to 7 are reference diagrams for explaining a model device applied to the sorting machine of FIG. 1.

FIG. 8 is a flowchart for a method of teaching point adjustment performed in the sorting machine of FIG. 1.

9 to 11 are reference diagrams for reference when explaining the flowchart of FIG. 8.

FIG. 12 is a schematic configuration diagram for a modified example of the mobile device according to FIG. 2.

Domestic hosting information (please note in order of hosting institution, date, and number) None

Information on foreign deposits (please note in order of deposit country, institution, date, and number) None

Claims (11)

A sorting machine for testing electronic components, comprising: a plurality of mobile devices that move electronic components located in a teaching area at a front end to a teaching area at a rear end on a moving path of a semiconductor element; The test position on the moving path electrically connects the electronic component to the testing machine; at least one camera for determining whether the teaching of the electronic component of at least one of the plurality of mobile devices is poor or not; the control device controls The plurality of mobile devices, the connection device, and the at least one camera, and at least one of the plurality of mobile devices includes: a pickup module having at least one pickup section, and the at least one pickup section includes a A reference pickup unit that grips or releases an electronic component; and a mobile machine for moving the pickup module between a teaching area at a front end and a teaching area at a rear end, and the camera captures an image located at a specific area Position of the bottom surface of the specific electronic component held by the reference pickup section, the control device uses the After the image of the bottom surface of the specific electronic component captured by the camera and held by the reference pickup section at the position is judged to be poor or not, the teaching of the reference pickup section is poor. , Then adjust the teaching point of the reference pickup section. The sorting machine for electronic component testing according to claim 1, wherein the control device performs the analysis and adjusts the first time after taking a bottom image of the reference pickup section at the specific position using the camera. The teaching point of the reference picking section is then used to determine whether the teaching of the reference picking section is poor or not by using the bottom surface image of the specific electronic component held by the reference picking section for the first time adjusting the teaching point. The sorting machine for electronic component testing according to claim 2, wherein the control device uses the bottom surface image of the reference pickup section to align the center of the bottom surface of the reference pickup section with the center of the camera, and aligns the bottom surface The center of the bottom surface image of the specific electronic component held by the reference pickup section whose center is aligned with the center of the camera is compared with the center of the camera to determine whether the teaching of the reference pickup section is bad . The sorting machine for electronic component testing according to claim 1, wherein the specific electronic component is a model device made to judge whether the teaching of the reference pickup unit is defective or not. The sorting machine for electronic component testing according to claim 4, wherein the X-axis length and Y-axis length of the bottom surface of the model equipment are longer than the X-axis length and Y-axis length of the bottom surface of the actual electronic component, respectively. The sorting machine for testing electronic components according to claim 4, wherein a bottom portion of the model device is provided with a marking portion having a color different from a background color at a predetermined place. The sorting machine for testing electronic components according to claim 1, wherein the mobile device further comprises: an identification member, which is coupled to the reference picking section for setting a reference position of the reference picking section. The sorting machine for testing electronic components according to claim 7, wherein the identification member has a structure that is inserted into the reference pick-up section in a pipe form. The sorting machine for testing electronic components according to claim 1, wherein the mobile device further includes a setting camera whose relative coordinates with the reference pickup section have been determined, and the control device after shooting the camera through the setting camera To determine whether the center of an image captured by the setting camera is aligned with the center of the camera, thereby setting a reference position of the reference pickup section. A teaching point adjustment method in a sorting machine for testing electronic components includes the following steps: a holding step, which uses a reference picking unit to hold a model device at a predetermined position; a moving step, which holds the model device The reference picking section moves to a specific position; an image acquisition step, which uses a camera to acquire a bottom image of the model device held by the reference picking section located at the specific position; a return step, moving the reference picking section to After the predetermined position, the model device is returned to the original position; the analysis step compares and analyzes the image obtained in the image acquisition step and the image during normal grip; the adjustment step uses the analysis step The analyzed value is used to adjust the teaching point of the reference pickup section. For example, the method for adjusting teaching points in a sorting machine for testing electronic components according to item 10 further includes the following steps: a confirmation step of re-holding the reference point in the reference picking section adjusted by the teaching point in the adjusting step; The model equipment returned in the returning step is described, and then the moving step, the image acquiring step, and the analyzing step are performed again to confirm whether the teaching point is bad.