KR20210135790A - 3D vision module IC test handler and test method - Google Patents

Abstract

The present invention relates to a module IC test handler which determines, with an image, component attachment posture, soldering defect, non-attachment, overlapping, floating, cracking, and the like of an IC module manufactured in a manufacturing process, and a test method thereof and, more specifically, to a module IC test handler which rotates an IC module to be tested while moving between processes when the module IC to be tested is loaded into a loading unit so that a 2D or 3D image captured to determine whether parts attached to both sides of a substrate are defective, thereby sorting the module IC as a good or bad product, and a test method thereof. To this end, a module IC (30) to be tested is loaded and clamped to a module IC clamp unit (40) installed on a turntable (20) in a loading unit (51) and then the module IC (30) is rotated so that the front surface of the substrate of the module IC (30) clamped to the module IC clamp unit (40) faces upward. A module IC front vision photographing unit (91) captures an attachment state image of parts attached to the front surface of the substrate as a 2D or 3D image and transmits the captured image to a test unit (120). When the module IC (30) is rotated so that the rear surface of the board of the module IC (30) clamped to the module IC clamp unit (40) faces upward, a module IC rear vision photographing unit (92) captures an attachment state of parts attached to the rear surface of the board as a 2D or 3D image and transmits the 2D or 3D image to the test unit (120). Accordingly, an unloading unit (52) selects the module IC (30) as a good product or a bad product.

Description

Module IC test handler and test method {3D vision module IC test handler and test method}

The present invention relates to a module IC test handler and a test method for judging the part attachment posture, soldering defect, non-attachment, overlapping, lifting, cracking, etc. , More specifically, when the module IC to be tested is loaded in the loading part, it rotates while moving between processes to determine whether the parts attached to both sides of the board are defective by shooting the image as a 3D image and sorting them into good and bad products. It relates to test handlers and test methods.

In general, a module IC (memory module, SSD, etc.) refers to an independent circuit formed by soldering and fixing a plurality of ICs and components to both sides of a substrate.

Since these module ICs have higher added value than selling ICs individually, semiconductor manufacturers are developing them as main products.

Therefore, the module IC produced through the manufacturing process is an important component, and the reliability of the product is very important, so only products determined as good products through strict quality tests are shipped.

These module ICs are tested by the vision test handler, and the tested products go through a process of classifying them into good and bad according to the test results.

Here, the vision test handler is a device that takes a surface image of the module IC with a camera and compares the image with an image in a normal state to determine whether there is a defect.

In other words, the module IC tested by the vision test handler is expensive, so the reliability of the product is also very important. Only products judged as good products through strict quality tests are shipped, and the module ICs judged to be defective are modified or completely discarded. will do

Conventionally, a picker holds a module IC contained in a tray to load the module IC in a horizontal state in a carrier with an open bottom.

Accordingly, the upper surface of the module IC loaded horizontally on the carrier is exposed upward, and the lower surface is exposed downward because the lower part of the carrier is open.

As such, when the module IC loaded on the carrier is transferred to the vision unit with the upper and lower portions exposed, vision cameras are installed on the upper and lower portions of the vision unit. The test is conducted by photographing the exterior in a flat manner.

After the vision test of the module IC is completed through the process as described above, the unloading picker picks the module IC loaded in the carrier, selects a good product or a defective product according to the inspection result, and unloads the module IC into the unloading tray.

(Prior art literature)

(Patent Document 0001) Republic of Korea Patent Publication No. 10-1012633 (Registered on Jan. 27, 2011)

(Patent Document 0002) Republic of Korea Patent Publication No. 10-1076741 (Registered on October 19, 2011)

(Patent Document 0003) Republic of Korea Patent Publication No. 10-0724150 (Registered on May 25, 2007)

(Patent Document 0004) Republic of Korea Patent Publication No. 10-2019-0036588 (published on April 5, 2019)

However, the conventional handler having such a structure has several problems as follows.

First, as the camera takes a planar image while moving the module IC loaded in the carrier to test the appearance of the module IC, the accuracy of the vision test is lowered.

Second, it was impossible to realize the automation of vision test because the operator had to turn over the module IC manually after it was loaded on the carrier horizontally and finished the external inspection.

Third, the test efficiency is lowered because the vision test is carried out while transferring the module ICs placed on the carrier one by one.

Fourth, the picker holds the module IC inserted vertically in the tray and loads it horizontally in the carrier. After the vision test is completed, the unloading picker holds it and unloads it vertically in the unloading tray. The structure becomes complicated, and it takes a long time to load and unload the module IC.

The present invention has been devised to solve the problems described above in the prior art. When a plurality of module ICs to be tested in the loading unit are loaded into the module IC clamping unit installed at a predetermined interval on the turntable, the module IC is transferred between processes by rotation of the turntable. The purpose is to select good and defective products by shooting 2D or 3D images to determine whether the parts attached to both sides of the board are defective by rotating 90°, 180°, or 90° while moving.

Another object of the present invention is to separate the module IC clamping unit from the turntable when the module IC front and rear vision photographing units take pictures of the module IC so that vibrations caused by driving a motor or the like are not transmitted to the module IC.

Another object of the present invention is to install a plurality of module IC clamping units for handling the module IC (rotate at a predetermined angle) at a predetermined interval on the turntable, and to position the module IC rotating unit and the module IC vision capturing unit at the upper side of the turntable so that the handler It is to enable the implementation of the compact (compact) of

According to an aspect of the present invention for achieving the above object, there is provided a turntable that rotates one step at a time about an axis on a main body, and a module IC clamping unit installed on the turntable while maintaining a predetermined angle to rotatably clamp the module IC; , a loading and unloading unit for loading or unloading a plurality of module ICs to be tested by the picker into the module IC clamping unit, and rotating the module IC clamped in the module IC clamping unit by 90° so that the front side faces upward The first rotation unit, the module IC front vision photographing unit that captures the attachment state image of the component attached to the front surface of the module IC as a 3D image and transmits it to the test unit, and the module IC clamping after photographing the front side of the module IC A secondary rotating part that rotates the module IC clamped in the unit by 180° so that the rear surface faces upward, and a 2D or 3D image of the attachment state of the part attached to the back of the board of the module IC is taken as a 2D or 3D image and transmitted to the test unit A module IC rear vision photographing unit, a tertiary rotation unit for photographing the rear surface of the module IC, and then rotating the module IC clamped in the module IC clamping unit 90° to return to the original state, and front and rear vision photographing of the module IC A test unit that compares and judges the 2D or 3D image taken in the unit with a normal image, and a control unit that controls the turntable, module IC clamping unit, first, second, and third rotation units, and front and rear vision photographing units of the module IC There is provided a module IC test handler, characterized in that.

According to another aspect of the present invention, the module IC to be tested is loaded in the module IC clamp unit installed on the turntable in the loading unit, and then clamped to rotate the module IC so that the front side of the board of the module IC clamped in the module IC clamp unit faces upward. In this state, the module IC front vision photographing unit takes a 2D or 3D image of the attachment status image of the part attached to the front of the board and transmits it to the test unit. In the state that the module IC is rotated, the module IC rear vision photographing unit takes a 2D or 3D image of the attachment state of the parts attached to the back of the board and transmits it to the test unit. A module IC test method characterized by the present invention is provided.

According to another aspect of the present invention, there is provided a step of loading and clamping a plurality of module ICs to be tested by a picker on a turntable while maintaining a predetermined angle in a loading unit and clamping the installed module IC clamping unit, wherein the turntable is rotated by one step rotating the module IC clamped in the module IC clamping part by 90° so that the front side of the board faces upward, and the image of the attachment state of the part attached to the front side of the board is displayed in 2D or 3D with the turntable rotated one step Taking an image and transmitting it to a test unit; rotating the module IC clamped in the module IC clamping unit by 180° while the turntable is rotated by one step so that the rear surface of the substrate faces upward; A module IC clamped to the module IC clamping unit while the turntable is rotated by one step, taking a 2D or 3D image of the attachment state image of the part attached to the back side of the board and transmitting it to the test unit; Returning the module IC to its initial position by rotating 90°, and comparing and testing the 2D or 3D images photographed in the front and rear vision photographing units of the module IC with the normal image, and There is provided a module IC test method, characterized in that the loading part selects the module IC as good and bad products and unloads them sequentially.

The present invention has the following advantages over the prior art.

First, between the transfer of the module IC clamped to the module IC clamping unit, the module IC is rotated 90° and 180° so that the front and back sides of the board face upward, so automation of the vision test handler can be realized.

Second, the module IC clamping part is installed to maintain a predetermined distance on the turntable, and on the upper surface of the turntable, a rotating part that rotates the module IC and front and rear vision photographing parts of the module IC to take an image of the attachment state of the parts attached to the board are installed. Therefore, it is possible to compact the test handler.

Third, a plurality of camera modules (4 to 8) are installed at an angle of 60° in the front and rear vision photographing parts of the module IC, so that the image of the attachment state of the parts can be photographed as a 3D image, thereby improving the test quality.

Fourth, when the module IC front and rear vision photographing units capture the module IC clamped in the module IC clamping unit as a 3D image, the module IC clamping unit is spaced apart from the turntable to block vibration caused by driving the motor, etc. There will be N to shoot 3D images.

Fifth, since the slider of the module IC clamping part is installed movably along the LM guide, it can be used universally without replacing the module IC clamping part even if the length of the module IC to be vision tested changes.

1 is a perspective view showing the configuration of the present invention;
2 is a plan view showing a state in which the turntable is rotatably installed on the main body;
3 is a perspective view showing a module IC clamping unit of the present invention;
4A and 4B are plan views showing a module IC clamping unit,
Figure 4a is a state in which the movable piece on which the gripper is rotatably installed is spread to both sides;
4B is a state diagram in which the movable piece on which the gripper is rotatably installed moves inward to clamp the module IC; FIG.
5 is a bottom perspective view showing the first, second, and third rotation parts of the present invention;
6a and 6b are front views showing the 1st, 2nd, and 3rd rotation parts,
Figure 6a is a state in which the rotator rotating the gripper is opened to both sides;
6B is a view showing the state in which the rotator moves inward and is coupled to the incision groove of the gripper;
7 is a perspective view showing the front and rear vision photographing unit of the module IC of the present invention;
8 is an exploded perspective view showing the vibration blocking means of the present invention;
9A and 9B are longitudinal cross-sectional views of the assembled state of FIG. 8,
9A is a state diagram in which the first mounting plate supporting the module IC clamping unit is connected to the turntable;
9B is a diagram illustrating a state in which the first mounting plate supporting the module IC clamping unit is spaced apart from the turntable;
10 is a flowchart for explaining the module IC test method of the present invention;

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those of ordinary skill in the art to which the present invention pertains can easily implement them. The present invention may be embodied in several different forms and is not limited to the embodiments described herein. It is noted that the drawings are schematic and not drawn to scale. Relative dimensions and proportions of parts in the drawings are shown exaggerated or reduced in size for clarity and convenience in the drawings, and any dimensions are illustrative only and not limiting. In addition, the same reference numerals are used to indicate like features to the same structure, element, or part appearing in two or more drawings.

1 is a perspective view showing the configuration of the present invention, FIG. 2 is a plan view showing a state in which the turntable is rotatably installed on the main body, and FIG. 3 is a perspective view showing the module IC clamping unit of the present invention. A module IC clamping unit 40 for rotatably clamping the module IC 30 rotatably as shown in FIGS. 1 and 2 is provided on the turntable 20 on the turntable 20. is installed while maintaining a predetermined angle (60° in the present invention).

In the present invention, as shown in FIG. 2, a picker (not shown) picks a plurality of module ICs 30 contained in a loading buffer or a carrier (not shown), and the module IC clamping unit 40 ) is provided with loading and unloading units 51 and 52 for loading or unloading.

Preferably, the turntable 20 includes a plurality of module IC clamping units 40 that are installed while maintaining a predetermined angle to clamp and rotate the module IC 30 , which can simultaneously hold the plurality of module ICs 30 . This is to increase the operation rate of expensive equipment by enabling vision test.

As shown in FIG. 3 , the module IC clamping part 40 includes a first mounting plate 41 fixed to the turntable 20 , and a first LM guide 42 on the first mounting plate 41 . A pair of movably installed first sliders 43, a support block 44 installed on each of the first sliders 43, and a rail 45a on one side of each support block 44 are moved along the rails 45a. A single-acting cylinder (45) installed operably, a movable piece (46) fixedly installed on the single-acting cylinder (45), and compressed air installed between the support block (44) and the movable piece (46) to the single-acting cylinder (45) A first elastic member (not shown) for pushing the movable piece 46 from the support block 44 when is not supplied, and rotatably installed on each movable piece 46, the first, second, and third It is rotated by the rotating parts 61, 62 and 63, and the front end is provided with a finger 48a and a stopper 48b for gripping the module IC 30, and the rear end is a gripper 48 having a cutout groove 48c. Consists of.

At this time, a first ball screw 50 rotating according to the driving of the first motor 49 is screw-coupled to the pair of first sliders 43 , and the first ball screw 50 has a center of the first ball screw 50 as a reference. A right-hand screw 50a is formed on one side and a left-hand screw 50b is formed on the other side. When the first ball screw 50 is rotated by the driving of the first motor 49, a pair of first sliders 43 will either retract or widen at the same time.

This is because the width of the first slider 43 of the module IC clamping unit 40 is adjusted without replacing the module IC clamping unit even if the length of the module IC 30 to be vision tested is different, so that various types of modules having different lengths This is to enable the vision test of the IC 30 .

The first, second, and third rotation parts 61, 62, and 63 are provided with a support bar 65 installed to be supported by a pillar 64 on the upper surface of the main body 10 as shown in FIG. A pair of second sliders installed so as to be simultaneously retracted or spread along the second mounting plate 66 fixedly attached to the second mounting plate 66 and the second LM guide 67 fixed to the second mounting plate 66 (68), a second ball screw 69 screwed to the second slider 68 and having a right-hand thread 69a on one side and a left-hand thread 69b on the other side with respect to the center, and the A second motor 70 fixed to the second mounting plate 66 to rotate the second ball screw 69, and a rotator rotatably installed to each of the second sliders 68 to rotate the gripper 48 (71), the power transmission means 80 for transmitting the driving force of the third motor 72 fixed to the second mounting plate 66 to the rotator 71, and the driving force of the third motor 72 is It is provided on a pair of second sliders 68 so as to be transmitted and consists of a spline shaft 73 that simultaneously rotates the rotator 71 in the same direction.

In an embodiment of the present invention, as the power transmission means 80 , the driving pulley 81 rotates according to the driving of the third motor 72 , and is rotatably installed on the second mounting plate 66 . A driven pulley 83 that rotates together with a driving pulley 81 by a belt 82, and a spline shaft 73 fixed to the driven pulley 83 and fitted to a second slider 68 on one side. It consists of an idle pulley 84 rotatably installed, and a timing belt 86 wound in a zigzag manner around a pulley 85 fixed to the other end of the rotator 71 .

However, since the power transmission means can be applied by changing it into various shapes such as gears by experts in the field, it is not limited thereto.

Therefore, when the third motor 72 is driven, the power is transmitted to the second slider 68 on one side (right side in the drawing), and when the rotator 71 installed on the second slider 68 rotates counterclockwise A part of the power is transmitted to the second slider 68 located on the opposite side (left side in the drawing) through the spline shaft 73 to rotate the rotator 71 installed on the second slider 68 in a clockwise direction, so that the module IC is clamped. It is possible to rotate the module IC 30 clamped to the part 40 by a set angle (90° or 180°).

The module IC front and rear vision photographing units 91 and 92, as shown in FIG. 7 , include a fixed block 93 fixed to the main body 10 and an X-axis installed on the fixed block 93 . (94), the Y-axis block 96 is installed movably on the X-axis 94 and the Y-axis 95 is fixed, and the Y-axis block 96 is movable on the Y-axis 95 of the Y-axis block 96. It is installed and consists of a Z-axis block 98 to which the Z-axis 97 is fixed, and a camera module 99 installed so as to ascend and descend along the Z-axis 97 of the Z-axis block 98 .

At this time, a plurality of (4 to 8) cameras (not shown) are installed in the camera module 99 at an angle of 60° so that the attachment state of the parts attached to the substrate can be photographed as a 3D image.

In the present invention, when the module IC front and rear vision photographing units 91 and 92 take pictures of the defects of the parts attached to the board of the module IC 30, the module IC clamping unit 40 to obtain clearer resolution. There is further provided a vibration blocking means 100 for preventing the module IC 30 clamped to the tremor.

8 is an exploded perspective view showing the vibration blocking means of the present invention, and FIGS. 9a and 9b are longitudinal cross-sectional views of the assembled state of FIG. A support 102 fixed to the upper surface of the support 102 , an actuator 103 fixed to the upper surface of the support body 102 , a cam plate 104 fixed to the rod 103a of the actuator 103 , and the support 102 , ), a lifting block 106 provided with a roller 105 mounted on the cam plate 104 and a plurality of bushings 22 installed on the turntable 20, and the first installation One end is fixed to the plate 41 and fitted into the through hole 22a of each bushing 22, the support rod 23 composed of the expanded pipe part 23a and the small diameter part 23b, and the turntable 20 in the lower part A second elastic member 108 installed between the lifting plate 107 and the lower end of the support rod 23 fixed thereto, and installed between the respective bushings 22 and the lifting plate 107 to facilitate the lifting plate 107 downward. ) and a coil spring 109 for returning the lifting plate 107 when the roller 105 is positioned at the bottom dead center of the cam plate 104 with both ends fixed to the support 102 and the lifting block 106, respectively. Consists of.

At this time, an alignment pin 110 is fixed to the bottom surface of the lifting plate 107 , and an alignment block 111 into which the alignment pin 110 is inserted is fixed to the lifting block 106 .

This is because the lifting block 106 raises the lifting plate 107 more stably by driving the actuator 103 , so that the small diameter portion 23b of the support rod 23 is fixed to the turntable 20 through the bushing 22 . The module IC front and rear vision photographing units 91 and 92 are attached to the board of the module IC 30 to be spaced apart from (22a). Vibration due to driving of a motor, etc. This is to prevent it from being transmitted to the module IC clamping unit 40 .

Control of all the above-described components is configured to proceed sequentially by the control unit 130 .

Hereinafter, the operation of the present invention will be described.

10 is a flowchart for explaining the module IC test method of the present invention. When the module IC clamping unit 40 is positioned in the loading unit 51 as shown in FIG. 2, the picker is a loading buffer or carrier (not shown). The plurality of module ICs 30 contained in the are picked and moved to the upper side of the module IC clamping unit 40. At this time, the movable piece 46 constituting the module IC clamping unit 40 is a single-acting cylinder 45 as shown in FIG. 4A. ) is supplied with compressed air, the single-acting cylinder 45 is spread on both sides along the rail 45a, so that the first elastic member (not shown) installed between the support block 44 and the movable piece 46 is compressed. is the state

In this state, after the module IC 30 picked up in the picker is placed between the grippers 48, the supply of compressed air supplied to the single-acting cylinder 45 is stopped. They move inwardly by the restoring force of the elastic member, and accordingly, the fingers 48a formed on each gripper 48 grip the side surface of the module IC 30 as shown in FIG. 4B .

After the picker loads the plurality of module ICs 30 to be vision tested by the loading unit 51 into the module IC clamping unit 40 and the gripper 48 clamps them, the picker releases the picking state of the module IC 30 . and returns to the loading position (not shown) and waits until the next module IC 30 is loaded (S100).

After the module IC clamping unit 40 clamps the module IC 30 by the above operation, the turntable 20 rotates by one step (by 60°), so the module IC clamping unit clamping the module IC 30 (40) reaches directly below the primary rotating part (61).

When the module IC clamping unit 40 reaches directly below the primary rotating unit 61 as shown in FIG. 6A , a pair of second sliders 68 are spread apart from each other, causing interference with the module IC clamping unit 40 . doesn't happen

In this state, when the second motor 70 drives and rotates the second ball screw 69 a set number of times, the pair of second sliders 68 simultaneously move inward, so that the rotator 71 moves inward as shown in FIG. 6b. It is simultaneously fitted into the cutout groove 48c of the gripper 48 .

After that, when the third motor 72 is driven, power is transmitted by the power transmission means 80 , so that the rotator 71 installed on the second slider 68 rotates the module IC 30 by 90° and at the same time Part of the power of the power transmission means 80 is transmitted to the second slider 68 on the other side through the spline shaft 73 so that the rotator 71 installed on the second slider 68 also rotates by 90° and the third Since the driving of the motor 72 is stopped, the front surface of the board of the module IC 30 clamped by the gripper 48 of the module IC clamping unit 40 faces upward ( S200 ).

After the first rotation unit 61 rotates the module IC 30 by 90°, the second motor 70 is reversely driven, so that the pair of second sliders 68 return to their initial state.

After rotating the module IC 30 clamped to the gripper 48 of the module IC clamping unit 40 by 90° and the turntable 20 rotates by 60°, the set angle, with the front side of the board facing upward, the module The module IC 30 clamped to the IC clamping unit 40 is positioned in the front vision capturing unit 91 of the module IC.

After the module IC 30 reaches the front vision capturing unit 91 of the module IC, the actuator 103 is driven to push the cam plate 104 to the left side of FIG. 9A, and accordingly, the roller mounted on the cam plate 104 Since the 105 is raised by the inclined surface of the cam plate 104 , the lifting block 106 installed on the support 102 so as to be able to ascend and descend is ascended while tensioning the coil spring 109 .

When the lifting block 106 rises, the lifting plate 107 located at the bottom dead center by the restoring force of the second elastic member 108 compresses the second elastic member 108 and is connected to the support rod 23 while ascending. The first mounting plate 41 of the module IC clamping unit 40 is raised as shown in FIG. 9B.

Before the lifting plate 107 rises, the expanded pipe portion 23a of the support rod 23 is closely fitted into the through hole 22a of the bushing 22 as shown in FIG. 9A, so that the turntable 20 rotates one step at a time. Each module IC clamping part 40 rotates together with the turntable 20 in a stable state, but when the lifting plate 107 rises while compressing the second elastic member 108, it expands in the through hole 22a of the bushing 22. Since the pipe part 23a comes out and the small-diameter part 23b is located in the through-hole 22a, a gap t is generated between the through-hole 22a of the bushing 22 and the small-diameter part 23b of the support rod 23. Fundamentally solves the phenomenon that the vibration generated by driving the 1, 2, 3 motors 49, 70, 72 and the turntable driving motor (not shown) is transmitted to the module IC clamping unit 40 be able to do

In this state, the camera module 99 of the front vision capturing unit 91 of the module IC moves sequentially along the X, Y, and Z axes 94, 95, and 97 while the gripper 48 of the module IC clamping unit 40 moves. ), the image of the attachment state of the component attached to the front surface of the board of the module IC 30 clamped to the module IC 30 is taken as a 2D or 3D image and transmitted to the test unit 120 (S300), and the module IC clamping unit 40 is a turntable. In the state spaced apart from (20), the module IC front vision photographing unit 91 takes an image as a 2D or 3D image, so it has the advantage of obtaining a clearer image.

After the module IC front vision photographing unit 91 captures the attachment state image of the component attached to the front of the board of the module IC 30 as a 2D or 3D image and transmits it to the test unit 120, the turntable 20 returns to 1 Since the step is rotated, the module IC 30 clamped to the gripper 48 of the module IC clamping unit 40 is located directly below the secondary rotating unit 62. In the above-described primary rotating unit 61, the vertical state Although the module IC 30 is rotated 90° so that it is in a horizontal state, the secondary rotation unit 62 rotates the module IC 30 clamped to the gripper 48 by 180° so that the parts attached to the back of the board face upward. to do so (S400).

As described above, when the part attached to the back of the board of the module IC 30 faces upward, the turntable 20 rotates by one step, so that the module IC 30 clamped to the gripper 48 of the module IC clamping unit 40 is It is located directly below the module IC rear vision photographing unit 92 .

When the module IC 30 is located in the rear vision capturing unit 92 of the module IC, the camera module 99 captures the attachment state image of the part as a 2D or 3D image before the turntable 20 by the vibration blocking means 100 ) is spaced apart from the first mounting plate 41, and since this operation has been described in the module IC front vision photographing unit (), a detailed description thereof will be omitted.

After the first mounting plate 41 is separated from the turntable 20 by the vibration blocking means 100, the camera module 99 moves along the X, Y, Z axes 94 like the module IC front vision photographing unit 91. ) (95) (97) while moving sequentially along the module IC clamping unit (40) clamped to the gripper (48) of the module IC (30) attached to the back side of the substrate attached state image of the 2D or 3D image taken to transmit to the test unit 120 (S500).

After the module IC rear vision capturing unit 92 captures the attachment state image of the parts attached to the back of the board as a 2D or 3D image and transmits it to the test unit 120, the turntable 20 rotates one step to clamp the module IC. The module IC 30 clamped to the gripper 48 because the rotator 71 rotates the gripper 48 by 90° as described above after placing the part 40 directly below the third rotation part 63. is returned to the initial position as when loaded (S600).

During the operation as described above, in the test unit 120 , the 2D or 3D video image captured by the camera module 99 of the module IC front and rear vision photographing units 91 and 92 is inputted to the normal test unit 120 . It is determined whether the module IC 30 that has been subjected to the vision test by comparing it with the image is a good product or a bad product (S700).

When the turntable 20 rotates one step while the test unit 120 determines whether the module IC 30 is a good product or a defective product, the vision test completed module IC 30 is placed in the unloading unit 52 .

In this state, the picker clamps the module IC 30 clamped to the gripper 48 of the module IC clamping unit 40, and at the same time the single-acting cylinder 45 drives the pair of movable pieces 46 with the first elastic When the member is opened while compressing, the clamping of the module IC 30 is released from the gripper 48 of the module IC clamping part 40, so that the picker classifies the module IC 30 as good or defective products and unloads them according to the test results. becomes (S800).

What has been described so far is that after the picker picks a plurality of module ICs 30 in the loading unit 51 and loads them in the module IC clamping unit 40, the turntable 20 rotates one step at a time and the module IC 30 Rotate 90° - Take a 2D or 3D image of the front image of the module IC 30 - Rotate the module IC 30 180° - Capture the rear image of the module IC 30 as a 2D or 3D image - Module IC ( 30) rotated by 90° - The process of classifying and unloading products as good or defective products according to the test results is sequentially described. When the module IC 30 to be vision tested is loaded in the loading unit 51, it continues to operate in the same order While doing this, a vision test will be conducted.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, those of ordinary skill in the art to which the present invention pertains will understand that the present invention may be implemented in other specific forms without changing the technical spirit or essential features. will be.

Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention described in the above detailed description is indicated by the following claims, meaning and All changes or modifications derived from the scope and its equivalents should be construed as being included in the scope of the present invention.

10: body 20: turntable
22: bushing 22a: through hole
23: support rod 23a: expansion part
23b: small diameter part 30: module IC
40: module IC clamping part 41: first mounting plate
43: first slider 44: support block
45: single acting cylinder 46: movable piece
47: first elastic member 48: gripper
50: first ball screw 51, 52: loading and unloading unit
61, 62, 63: 1st, 2nd, 3rd rotation part 66: 2nd mounting plate
68: second slider 69: second ball screw
71: rotator 73: spline axis
80: power transmission means
91, 92: module IC front and rear vision recording unit
99: camera module 100: vibration blocking means
103: actuator 104: cam plate
105: roller 106: elevating block
108: second elastic member 109: coil spring
110: align pin 111: align block

Claims (14)

A turntable 20 that rotates one step at a time about an axis 21 in the main body 10, and a module IC installed on the turntable 20 while maintaining a predetermined angle to rotatably clamp the module IC 30 A clamping unit 40, loading and unloading units 51 and 52 for loading or unloading a plurality of module ICs 30 to be tested by a picker into the module IC clamping unit 40, and the module IC clamping unit The first rotating part 61 for rotating the module IC 30 clamped to the part 40 by 90° so that the front side faces upward, and the attachment state image of the component attached to the upper surface of the board of the module IC 30 A module IC front vision photographing unit 91 that captures a 2D or 3D image and transmits it to the test unit 120, and a module IC clamped to the module IC clamping unit 40 after photographing the front of the module IC 30 A test unit by taking a 2D or 3D image of the secondary rotating part 62 that rotates 30 by 180° so that the rear surface faces upward, and the attachment state image of the component attached to the rear surface of the board of the module IC 30 The module IC rear vision photographing unit 92 transmitted to 120 and the rear side of the module IC 30 are photographed and then the module IC clamped to the module IC clamping unit 40 is rotated 90° to return to the initial state. A reducing tertiary rotation unit 63, a test unit 120 for comparing and determining the 2D or 3D images photographed by the module IC front and rear vision photographing units 91 and 92 with a normal image, and the turntable 20 ), the module IC clamping unit 40, the 1st, 2nd, 3rd rotation units 61, 62, 63, the module IC front and rear vision capturing units 91 and 92 for controlling the driving of the control unit 130 Module IC test handler, characterized in that consisting of.
The method according to claim 1,
The turntable 20 is provided with a plurality of module IC clamping units 40 for clamping and rotating the module IC 30 , so that the plurality of module ICs 30 are attached to the module IC clamping unit 40 in the loading unit 51 . Module IC test handler, characterized in that it is loaded.
The method according to claim 1 or 2,
The module IC clamping unit 40,
a first mounting plate 41 fixed to the turntable 20;
A pair of first sliders (43) movably installed along the first LM guide (42) on the first mounting plate (41);
a support block 44 installed on each of the first sliders 43;
A single-acting cylinder (45) movably installed along the rail (45a) on one side of each of the support blocks (44);
A movable piece 46 fixed to the single-acting cylinder 45 and
A first elastic member installed between the support block 44 and the movable piece 46 to push the movable piece 46 from the support block 44 when compressed air is not supplied to the single-acting cylinder 45;
A finger 48a and a stopper that is rotatably installed on each movable piece 46 and rotates by the first, second, and third rotation parts 61, 62, 63 and holds the module IC 30 at the tip. A module IC test handler, characterized in that it comprises a gripper (48) provided with a (48b) and having a cutout groove (48c) formed at the rear end.
4. The method according to claim 3,
A first motor 49 by screwing a first ball screw 50 having a right-hand screw 50a on one side and a left-hand screw 50b on the other side with respect to the center of the pair of first sliders 46. ), the width of the first slider (43) is variable as the first ball screw (50) rotates by driving the module IC test handler.
The method according to claim 1,
The first, second, and third rotation parts 61, 62, 63 are,
A support rod 65 installed to be supported by a pillar 64 on the upper surface of the main body 10,
A second mounting plate 66 fixedly installed to be suspended from the support rod 65, and
A pair of second sliders 68 installed so as to be simultaneously retracted or spread along the second LM guide 67 fixed to the second mounting plate 66;
a second ball screw 69 screwed to the second slider 68 and having a right-hand thread 69a on one side and a left-hand thread 69b on the other side with respect to the center;
a second motor 70 fixed to the second mounting plate 66 to rotate the second ball screw 69;
a rotator (71) rotatably installed on each of the second sliders (68) to rotate the gripper (48);
a power transmission means (80) for transmitting the driving force of the third motor (72) fixed to the second mounting plate (66) to the rotator (71);
Module IC test handler, characterized in that it is installed on a pair of second sliders (68) to transmit the driving force of the third motor (72) and consists of a spline shaft (73) that simultaneously rotates the rotator (71) in the same direction. .
The method according to claim 1,
The module IC front and rear vision photographing units 91 and 92,
A fixing block 93 fixed to the main body 10,
An X-axis 94 installed on the upper portion of the fixing block 93,
The Y-axis block 96 is movably installed on the X-axis 94 and the Y-axis 95 is fixed;
A Z-axis block 98 that is movably installed on the Y-axis 95 of the Y-axis block 96 and the Z-axis 97 is fixed;
Module IC test handler, characterized in that it is composed of a camera module (99) installed so as to ascend and descend along the Z-axis (97) of the Z-axis block (98).
7. The method of claim 6,
Module IC test handler, characterized in that a plurality of cameras are installed at an angle of 60° to the camera module (99).
The method according to claim 1,
Module characterized in that it further comprises a vibration blocking means (100) for separating the module IC clamping part (40) from the turntable (20) at the point where the front and rear vision photographing parts (91, 92) of the module IC are located. IC test handler.
9. The method of claim 8,
The vibration blocking means 100,
Stone plate 101, and
a support 102 fixedly installed on the upper surface of the stone crystal plate 101;
an actuator 103 fixedly installed on the upper surface of the support 102;
a cam plate 104 fixedly installed on the rod 103a of the actuator 103;
A lifting block 106 provided with a roller 105 mounted on the cam plate 104, which is installed so as to be able to ascend and descend on the support 102, and;
A plurality of bushings 22 installed on the turntable 20;
A support rod 23 having one end fixed to the first mounting plate 41 and fitted into the through hole 22a of each bushing 22, and comprising an enlarged pipe portion 23a and a small diameter portion 23b;
a lifting plate 107 installed at the lower portion of the turntable 20 and fixed to the lower end of the support rod 23;
a second elastic member 108 installed between the respective bushings 22 and the lifting plate 107 to bias the lifting plate 107 downward;
Both ends are fixed to the support 102 and the lifting block 106, respectively, and the roller 105 is located at the bottom dead center of the cam plate 104. It consists of a coil spring 109 for returning the lifting plate 107. module IC test handler.
10. The method of claim 9,
Module IC test handler, characterized in that the alignment pin 110 is fixed to the bottom surface of the lifting plate 107 and the alignment block 111 into which the alignment pin 110 is inserted is fixed to the lifting block 106 .
The module IC 30 to be tested is loaded into the module IC clamp unit 40 installed on the turntable 20 by the loading unit 51 and then clamped to the substrate of the module IC 30 clamped to the module IC clamp unit 40 . In a state in which the module IC 30 is rotated so that the front side faces upward, the module IC front vision photographing unit 91 captures an image of the attachment state of the part attached to the front of the board as a 2D or 3D image and sends it to the test unit 120 . After transmission, in a state in which the module IC 30 is rotated so that the back side of the board of the module IC 30 clamped to the module IC clamp unit 40 faces upward, the module IC rear vision photographing unit 92 is attached to the back side of the board A module IC test method, characterized in that the module IC (30) is classified into good and bad products in the unloading unit (52) by taking a 2D or 3D image of the attachment state of the finished part and transmitting it to the test unit (120).
12. The method of claim 11,
The module IC 30 clamped to the module IC clamping unit 40 while rotating the turntable 20 at a predetermined angle by 1 step by installing the module IC clamp unit 40 to the turntable 20 to maintain a predetermined angle. ) with the front or rear of the module IC facing upward, the module IC front and rear vision photographing units 91 and 92 take the front and rear images of the module IC 30 as 2D or 3D images, and the test unit 120 ) module IC test method, characterized in that it is transmitted.
Loading and clamping a plurality of module ICs 30 to be tested by a picker in a loading unit 51 into a module IC clamping unit 40 installed while maintaining a predetermined angle on the turntable 20; Rotating the module IC 30 clamped to the module IC clamping unit 40 by 90° in the one-step rotation state so that the front surface of the substrate faces upward, and the turntable 20 is rotated by one step In the step of capturing the attachment state image of the component attached to the front of the board as a 2D or 3D image and transmitting it to the test unit 120, the turntable 20 is rotated by one step and the module IC clamping unit 40 Rotating the clamped module IC 30 by 180° so that the back side of the board faces upward, and in a state in which the turntable 20 is rotated 1 step, 2D or 3D image of the attachment state of the component attached to the back side of the board The step of capturing an image and transmitting it to the test unit 120, and rotating the module IC 30 clamped to the module IC clamping unit 40 by 90° while the turntable 20 is rotated by one step to rotate the module IC The step of returning to the initial position, the step of comparing the 2D or 3D image photographed by the front and rear vision photographing units 91 and 92 of the module IC with the normal image, and testing, and the unloading unit according to the test result In (52), the module IC test method, characterized in that the step of unloading the module IC (30) by sorting it into a good product and a bad product is performed sequentially.
14. The method according to claim 11 or 13,
In a state in which the module IC clamping unit 40 is spaced apart from the turntable 20, the module IC front and rear vision photographing units 91 and 92 capture the front and rear images of the module IC 30 as 2D or 3D images. Module IC test method, characterized in that.

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