TW201742136A - 拋光系統及其製造與使用方法 - Google Patents

拋光系統及其製造與使用方法 Download PDF

Info

Publication number
TW201742136A
TW201742136A TW106104914A TW106104914A TW201742136A TW 201742136 A TW201742136 A TW 201742136A TW 106104914 A TW106104914 A TW 106104914A TW 106104914 A TW106104914 A TW 106104914A TW 201742136 A TW201742136 A TW 201742136A
Authority
TW
Taiwan
Prior art keywords
polishing
substrate
ceramic
abrasive
layer
Prior art date
Application number
TW106104914A
Other languages
English (en)
Chinese (zh)
Inventor
約翰 詹姆士 蓋格里雅迪
保羅 史都華 拉格
艾瑞克 卡爾 庫德
Original Assignee
３Ｍ新設資產公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ３Ｍ新設資產公司 filed Critical ３Ｍ新設資產公司
Publication of TW201742136A publication Critical patent/TW201742136A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW106104914A 2016-02-16 2017-02-15 拋光系統及其製造與使用方法 TW201742136A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201662295760P 2016-02-16 2016-02-16

Publications (1)

Publication Number Publication Date
TW201742136A true TW201742136A (zh) 2017-12-01

Family

ID=58057347

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106104914A TW201742136A (zh) 2016-02-16 2017-02-15 拋光系統及其製造與使用方法

Country Status (6)

Country Link
US (1) US20210189175A1 (enExample)
JP (1) JP2019513161A (enExample)
KR (1) KR20180112004A (enExample)
CN (1) CN108603076A (enExample)
TW (1) TW201742136A (enExample)
WO (1) WO2017142805A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11566150B2 (en) 2017-03-27 2023-01-31 Showa Denko Materials Co., Ltd. Slurry and polishing method
WO2018179061A1 (ja) 2017-03-27 2018-10-04 日立化成株式会社 研磨液、研磨液セット及び研磨方法
WO2020021680A1 (ja) 2018-07-26 2020-01-30 日立化成株式会社 スラリ及び研磨方法
JP6973620B2 (ja) 2018-03-22 2021-12-01 昭和電工マテリアルズ株式会社 研磨液、研磨液セット及び研磨方法
US12247140B2 (en) 2018-09-25 2025-03-11 Resonac Corporation Slurry and polishing method
US20210087431A1 (en) * 2019-09-24 2021-03-25 Fujifilm Electronic Materials U.S.A., Inc. Polishing compositions and methods of use thereof
KR20220083728A (ko) 2019-10-15 2022-06-20 후지필름 일렉트로닉 머티리얼스 유.에스.에이., 아이엔씨. 연마 조성물 및 이의 사용 방법
CN114703433A (zh) * 2022-04-13 2022-07-05 常熟致圆微管技术有限公司 一种生物可降解的医用金属镁及镁合金板材的制备方法
KR102874526B1 (ko) * 2022-12-19 2025-10-21 한남대학교 산학협력단 Cmp 슬러리의 연마입자 표면에 코팅된 아크릴 폴리머 분산제의 특성연구
CN118271973B (zh) * 2024-05-29 2024-08-20 广东粤港澳大湾区黄埔材料研究院 悬浮抛光液及其制备方法和碳化硅的抛光方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3036003A (en) 1957-08-07 1962-05-22 Sinclair Research Inc Lubricating oil composition
US3236770A (en) 1960-09-28 1966-02-22 Sinclair Research Inc Transaxle lubricant
NL296139A (enExample) 1963-08-02
NL145565B (nl) 1965-01-28 1975-04-15 Shell Int Research Werkwijze ter bereiding van een smeermiddelcompositie.
US3414347A (en) 1965-03-30 1968-12-03 Edroy Products Company Inc Binocular with pivoted lens plate
US3574576A (en) 1965-08-23 1971-04-13 Chevron Res Distillate fuel compositions having a hydrocarbon substituted alkylene polyamine
US3539633A (en) 1965-10-22 1970-11-10 Standard Oil Co Di-hydroxybenzyl polyamines
US3461172A (en) 1966-11-22 1969-08-12 Consolidation Coal Co Hydrogenation of ortho-phenolic mannich bases
US3448047A (en) 1967-04-05 1969-06-03 Standard Oil Co Lube oil dispersants
US3586629A (en) 1968-09-16 1971-06-22 Mobil Oil Corp Metal salts as lubricant additives
US3634515A (en) 1968-11-08 1972-01-11 Standard Oil Co Alkylene polyamide formaldehyde
US3591598A (en) 1968-11-08 1971-07-06 Standard Oil Co Certain condensation products derived from mannich bases
US3725480A (en) 1968-11-08 1973-04-03 Standard Oil Co Ashless oil additives
US3726882A (en) 1968-11-08 1973-04-10 Standard Oil Co Ashless oil additives
US3980569A (en) 1974-03-15 1976-09-14 The Lubrizol Corporation Dispersants and process for their preparation
IN172215B (enExample) 1987-03-25 1993-05-08 Lubrizol Corp
US5157088A (en) 1987-11-19 1992-10-20 Dishong Dennis M Nitrogen-containing esters of carboxy-containing interpolymers
KR0146707B1 (ko) 1988-10-24 1998-08-01 죤 제이.마혼 아미드 함유 마찰 개질제를 함유한 전동유체
JP2000343411A (ja) * 1999-06-01 2000-12-12 Teijin Ltd 研磨用シート
US6319108B1 (en) * 1999-07-09 2001-11-20 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
US6551366B1 (en) 2000-11-10 2003-04-22 3M Innovative Properties Company Spray drying methods of making agglomerate abrasive grains and abrasive articles
CN100556619C (zh) * 2006-05-31 2009-11-04 天津晶岭微电子材料有限公司 蓝宝石衬底材料表面粗糙度的控制方法
US20130017765A1 (en) * 2011-07-11 2013-01-17 3M Innovative Properties Company Lapping carrier and method of using the same
WO2015047939A1 (en) * 2013-09-25 2015-04-02 3M Innovative Properties Company Composite ceramic abrasive polishing solution
KR102252673B1 (ko) * 2013-09-25 2021-05-18 쓰리엠 이노베이티브 프로퍼티즈 컴파니 다층화된 폴리싱 패드
JP6283940B2 (ja) * 2014-03-28 2018-02-28 富士紡ホールディングス株式会社 研磨パッド
CN107614200B (zh) * 2015-05-13 2020-05-08 3M创新有限公司 抛光垫和使用抛光垫的系统和方法

Also Published As

Publication number Publication date
KR20180112004A (ko) 2018-10-11
US20210189175A1 (en) 2021-06-24
CN108603076A (zh) 2018-09-28
WO2017142805A1 (en) 2017-08-24
JP2019513161A (ja) 2019-05-23

Similar Documents

Publication Publication Date Title
TWI699257B (zh) 拋光墊及使用該拋光墊之系統及方法
US10293458B2 (en) Composite ceramic abrasive polishing solution
CN107614200B (zh) 抛光垫和使用抛光垫的系统和方法
TW201742136A (zh) 拋光系統及其製造與使用方法
CN101678533B (zh) 合成磨石
TW201623546A (zh) 拋光溶液及其使用方法
KR20020029075A (ko) 다공성 세라믹 연마 복합체를 포함하는 금속 결합 연마제품 및 가공물을 연마하기 위한 그의 사용 방법
CN111032284B (zh) 具有增强的共平面性的微复制型抛光表面
JP2017209772A (ja) 研磨システム、及び被加工物を研磨する方法
JP2016082127A (ja) 研磨工具