CN108603076A - 抛光系统以及制备和使用抛光系统的方法 - Google Patents

抛光系统以及制备和使用抛光系统的方法 Download PDF

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Publication number
CN108603076A
CN108603076A CN201780010242.0A CN201780010242A CN108603076A CN 108603076 A CN108603076 A CN 108603076A CN 201780010242 A CN201780010242 A CN 201780010242A CN 108603076 A CN108603076 A CN 108603076A
Authority
CN
China
Prior art keywords
polishing
abrasive
ceramic
polishing system
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201780010242.0A
Other languages
English (en)
Chinese (zh)
Inventor
约翰·J·加戈里亚迪
埃里克·C·科德
保罗·S·勒格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN108603076A publication Critical patent/CN108603076A/zh
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Materials Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN201780010242.0A 2016-02-16 2017-02-10 抛光系统以及制备和使用抛光系统的方法 Withdrawn CN108603076A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662295760P 2016-02-16 2016-02-16
US62/295,760 2016-02-16
PCT/US2017/017379 WO2017142805A1 (en) 2016-02-16 2017-02-10 Polishing systems and methods of making and using same

Publications (1)

Publication Number Publication Date
CN108603076A true CN108603076A (zh) 2018-09-28

Family

ID=58057347

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780010242.0A Withdrawn CN108603076A (zh) 2016-02-16 2017-02-10 抛光系统以及制备和使用抛光系统的方法

Country Status (6)

Country Link
US (1) US20210189175A1 (enExample)
JP (1) JP2019513161A (enExample)
KR (1) KR20180112004A (enExample)
CN (1) CN108603076A (enExample)
TW (1) TW201742136A (enExample)
WO (1) WO2017142805A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113039039A (zh) * 2019-10-15 2021-06-25 富士胶片电子材料美国有限公司 抛光组合物及其使用方法
CN114703433A (zh) * 2022-04-13 2022-07-05 常熟致圆微管技术有限公司 一种生物可降解的医用金属镁及镁合金板材的制备方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11566150B2 (en) 2017-03-27 2023-01-31 Showa Denko Materials Co., Ltd. Slurry and polishing method
WO2018179061A1 (ja) 2017-03-27 2018-10-04 日立化成株式会社 研磨液、研磨液セット及び研磨方法
WO2020021680A1 (ja) 2018-07-26 2020-01-30 日立化成株式会社 スラリ及び研磨方法
JP6973620B2 (ja) 2018-03-22 2021-12-01 昭和電工マテリアルズ株式会社 研磨液、研磨液セット及び研磨方法
US12247140B2 (en) 2018-09-25 2025-03-11 Resonac Corporation Slurry and polishing method
US20210087431A1 (en) * 2019-09-24 2021-03-25 Fujifilm Electronic Materials U.S.A., Inc. Polishing compositions and methods of use thereof
KR102874526B1 (ko) * 2022-12-19 2025-10-21 한남대학교 산학협력단 Cmp 슬러리의 연마입자 표면에 코팅된 아크릴 폴리머 분산제의 특성연구
CN118271973B (zh) * 2024-05-29 2024-08-20 广东粤港澳大湾区黄埔材料研究院 悬浮抛光液及其制备方法和碳化硅的抛光方法

Citations (4)

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WO2001004227A2 (en) * 1999-07-09 2001-01-18 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
CN103648716A (zh) * 2011-07-11 2014-03-19 3M创新有限公司 研磨载体及其使用方法
WO2015047939A1 (en) * 2013-09-25 2015-04-02 3M Innovative Properties Company Composite ceramic abrasive polishing solution
WO2015048011A1 (en) * 2013-09-25 2015-04-02 3M Innovative Properties Company Multi-layered polishing pads

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CN100556619C (zh) * 2006-05-31 2009-11-04 天津晶岭微电子材料有限公司 蓝宝石衬底材料表面粗糙度的控制方法
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001004227A2 (en) * 1999-07-09 2001-01-18 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
CN103648716A (zh) * 2011-07-11 2014-03-19 3M创新有限公司 研磨载体及其使用方法
WO2015047939A1 (en) * 2013-09-25 2015-04-02 3M Innovative Properties Company Composite ceramic abrasive polishing solution
WO2015048011A1 (en) * 2013-09-25 2015-04-02 3M Innovative Properties Company Multi-layered polishing pads

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113039039A (zh) * 2019-10-15 2021-06-25 富士胶片电子材料美国有限公司 抛光组合物及其使用方法
US11732157B2 (en) 2019-10-15 2023-08-22 Fujifilm Electronic Materials U.S.A., Inc. Polishing compositions and methods of use thereof
CN114703433A (zh) * 2022-04-13 2022-07-05 常熟致圆微管技术有限公司 一种生物可降解的医用金属镁及镁合金板材的制备方法

Also Published As

Publication number Publication date
TW201742136A (zh) 2017-12-01
KR20180112004A (ko) 2018-10-11
US20210189175A1 (en) 2021-06-24
WO2017142805A1 (en) 2017-08-24
JP2019513161A (ja) 2019-05-23

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Application publication date: 20180928

WW01 Invention patent application withdrawn after publication