JP2019513161A - 研磨システム、並びにその製造方法及び使用方法 - Google Patents

研磨システム、並びにその製造方法及び使用方法 Download PDF

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Publication number
JP2019513161A
JP2019513161A JP2018543208A JP2018543208A JP2019513161A JP 2019513161 A JP2019513161 A JP 2019513161A JP 2018543208 A JP2018543208 A JP 2018543208A JP 2018543208 A JP2018543208 A JP 2018543208A JP 2019513161 A JP2019513161 A JP 2019513161A
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JP
Japan
Prior art keywords
polishing
abrasive
ceramic
substrate
polishing system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2018543208A
Other languages
English (en)
Japanese (ja)
Other versions
JP2019513161A5 (enExample
Inventor
ジョン ジェイ． ガグリアルディ，
ジョン ジェイ． ガグリアルディ，
エリック シー． コード，
エリック シー． コード，
ポール エス． ラグ，
ポール エス． ラグ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2019513161A publication Critical patent/JP2019513161A/ja
Publication of JP2019513161A5 publication Critical patent/JP2019513161A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1436—Composite particles, e.g. coated particles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Materials Engineering (AREA)
  • Composite Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2018543208A 2016-02-16 2017-02-10 研磨システム、並びにその製造方法及び使用方法 Pending JP2019513161A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662295760P 2016-02-16 2016-02-16
US62/295,760 2016-02-16
PCT/US2017/017379 WO2017142805A1 (en) 2016-02-16 2017-02-10 Polishing systems and methods of making and using same

Publications (2)

Publication Number Publication Date
JP2019513161A true JP2019513161A (ja) 2019-05-23
JP2019513161A5 JP2019513161A5 (enExample) 2020-03-19

Family

ID=58057347

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018543208A Pending JP2019513161A (ja) 2016-02-16 2017-02-10 研磨システム、並びにその製造方法及び使用方法

Country Status (6)

Country Link
US (1) US20210189175A1 (enExample)
JP (1) JP2019513161A (enExample)
KR (1) KR20180112004A (enExample)
CN (1) CN108603076A (enExample)
TW (1) TW201742136A (enExample)
WO (1) WO2017142805A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110462791B (zh) 2017-03-27 2023-06-16 株式会社力森诺科 悬浮液和研磨方法
WO2018179061A1 (ja) 2017-03-27 2018-10-04 日立化成株式会社 研磨液、研磨液セット及び研磨方法
WO2020021680A1 (ja) 2018-07-26 2020-01-30 日立化成株式会社 スラリ及び研磨方法
CN111819263A (zh) * 2018-03-22 2020-10-23 日立化成株式会社 研磨液、研磨液套剂和研磨方法
US12247140B2 (en) 2018-09-25 2025-03-11 Resonac Corporation Slurry and polishing method
WO2021061510A1 (en) * 2019-09-24 2021-04-01 Fujifilm Electronic Materials U.S.A., Inc. Polishing compositions and methods of use thereof
CN113039039B (zh) * 2019-10-15 2024-07-26 富士胶片电子材料美国有限公司 抛光组合物及其使用方法
CN114703433A (zh) * 2022-04-13 2022-07-05 常熟致圆微管技术有限公司 一种生物可降解的医用金属镁及镁合金板材的制备方法
KR102874526B1 (ko) * 2022-12-19 2025-10-21 한남대학교 산학협력단 Cmp 슬러리의 연마입자 표면에 코팅된 아크릴 폴리머 분산제의 특성연구
CN118271973B (zh) * 2024-05-29 2024-08-20 广东粤港澳大湾区黄埔材料研究院 悬浮抛光液及其制备方法和碳化硅的抛光方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000343411A (ja) * 1999-06-01 2000-12-12 Teijin Ltd 研磨用シート
CN1857865A (zh) * 2006-05-31 2006-11-08 天津晶岭微电子材料有限公司 蓝宝石衬底材料表面粗糙度的控制方法
JP2014522737A (ja) * 2011-07-11 2014-09-08 スリーエム イノベイティブ プロパティズ カンパニー ラッピングキャリア及びその使用方法
WO2015048011A1 (en) * 2013-09-25 2015-04-02 3M Innovative Properties Company Multi-layered polishing pads
WO2015047939A1 (en) * 2013-09-25 2015-04-02 3M Innovative Properties Company Composite ceramic abrasive polishing solution
JP2015188987A (ja) * 2014-03-28 2015-11-02 富士紡ホールディングス株式会社 研磨パッド

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NL296139A (enExample) 1963-08-02
NL145565B (nl) 1965-01-28 1975-04-15 Shell Int Research Werkwijze ter bereiding van een smeermiddelcompositie.
US3414347A (en) 1965-03-30 1968-12-03 Edroy Products Company Inc Binocular with pivoted lens plate
US3574576A (en) 1965-08-23 1971-04-13 Chevron Res Distillate fuel compositions having a hydrocarbon substituted alkylene polyamine
US3539633A (en) 1965-10-22 1970-11-10 Standard Oil Co Di-hydroxybenzyl polyamines
US3461172A (en) 1966-11-22 1969-08-12 Consolidation Coal Co Hydrogenation of ortho-phenolic mannich bases
US3448047A (en) 1967-04-05 1969-06-03 Standard Oil Co Lube oil dispersants
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US3726882A (en) 1968-11-08 1973-04-10 Standard Oil Co Ashless oil additives
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IN172215B (enExample) 1987-03-25 1993-05-08 Lubrizol Corp
US5157088A (en) 1987-11-19 1992-10-20 Dishong Dennis M Nitrogen-containing esters of carboxy-containing interpolymers
CA2001381C (en) 1988-10-24 2000-08-08 John E. Chandler Amide containing friction modifier for use in power transmission fluids
US6319108B1 (en) 1999-07-09 2001-11-20 3M Innovative Properties Company Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
US6551366B1 (en) 2000-11-10 2003-04-22 3M Innovative Properties Company Spray drying methods of making agglomerate abrasive grains and abrasive articles
WO2016183126A1 (en) * 2015-05-13 2016-11-17 3M Innovative Properties Company Polishing pads and systems for and methods of using same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000343411A (ja) * 1999-06-01 2000-12-12 Teijin Ltd 研磨用シート
CN1857865A (zh) * 2006-05-31 2006-11-08 天津晶岭微电子材料有限公司 蓝宝石衬底材料表面粗糙度的控制方法
JP2014522737A (ja) * 2011-07-11 2014-09-08 スリーエム イノベイティブ プロパティズ カンパニー ラッピングキャリア及びその使用方法
WO2015048011A1 (en) * 2013-09-25 2015-04-02 3M Innovative Properties Company Multi-layered polishing pads
WO2015047939A1 (en) * 2013-09-25 2015-04-02 3M Innovative Properties Company Composite ceramic abrasive polishing solution
JP2015188987A (ja) * 2014-03-28 2015-11-02 富士紡ホールディングス株式会社 研磨パッド

Also Published As

Publication number Publication date
TW201742136A (zh) 2017-12-01
CN108603076A (zh) 2018-09-28
WO2017142805A1 (en) 2017-08-24
KR20180112004A (ko) 2018-10-11
US20210189175A1 (en) 2021-06-24

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