TW201710390A - 組成物、硬化膜、硬化膜的製造方法、半導體元件的製造方法及半導體元件 - Google Patents

組成物、硬化膜、硬化膜的製造方法、半導體元件的製造方法及半導體元件 Download PDF

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Publication number
TW201710390A
TW201710390A TW105125755A TW105125755A TW201710390A TW 201710390 A TW201710390 A TW 201710390A TW 105125755 A TW105125755 A TW 105125755A TW 105125755 A TW105125755 A TW 105125755A TW 201710390 A TW201710390 A TW 201710390A
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Taiwan
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group
compound
mass
solvent
composition
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TW105125755A
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English (en)
Chinese (zh)
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Ichiro Koyama
Akinori Shibuya
Yu Iwai
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Fujifilm Corp
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Publication of TW201710390A publication Critical patent/TW201710390A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/32—Compounds containing nitrogen bound to oxygen
    • C08K5/33—Oximes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/037—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyamides or polyimides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
TW105125755A 2015-08-31 2016-08-12 組成物、硬化膜、硬化膜的製造方法、半導體元件的製造方法及半導體元件 TW201710390A (zh)

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Application Number Priority Date Filing Date Title
JP2015171304 2015-08-31

Publications (1)

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TW201710390A true TW201710390A (zh) 2017-03-16

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TW105125755A TW201710390A (zh) 2015-08-31 2016-08-12 組成物、硬化膜、硬化膜的製造方法、半導體元件的製造方法及半導體元件

Country Status (3)

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JP (1) JP6606186B2 (ja)
TW (1) TW201710390A (ja)
WO (1) WO2017038664A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10354932B2 (en) 2017-03-22 2019-07-16 Asahi Kasei Kabushiki Kaisha Semiconductor device including semiconductor element and redistribution layer electrically connected thereto, and method of manufacturing the device
CN115038755A (zh) * 2020-02-03 2022-09-09 富士胶片株式会社 固化性树脂组合物、树脂膜、固化膜、层叠体、固化膜的制造方法及半导体器件
TWI832816B (zh) * 2017-06-30 2024-02-21 日商住友電木股份有限公司 感光性樹脂組成物、樹脂膜及電子裝置

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TWI763883B (zh) * 2017-07-14 2022-05-11 日商富士軟片股份有限公司 熱硬化性樹脂組成物及其硬化膜、積層體、半導體裝置、以及該等的製造方法
EP3672944A4 (en) * 2017-08-22 2021-06-02 FUJIFILM Electronic Materials U.S.A, Inc. CLEANING COMPOSITIONS
JP6958332B2 (ja) * 2017-12-20 2021-11-02 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
TW201934586A (zh) * 2017-12-20 2019-09-01 日商日立化成杜邦微系統股份有限公司 感光性樹脂組成物、圖案硬化膜的製造方法、硬化膜、層間絕緣膜、覆蓋塗層、表面保護膜和電子零件
US20200339754A1 (en) * 2018-01-18 2020-10-29 Toray Industries, Inc. Resin composition for display substrate, resin film for display substrate and laminate body containing this, image display device, organic el display, and manufacturing method of these
JP7313180B2 (ja) * 2018-04-23 2023-07-24 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法
JP7136894B2 (ja) * 2018-06-26 2022-09-13 旭化成株式会社 感光性樹脂組成物、硬化レリーフパターンの製造方法、及び半導体装置
WO2020031240A1 (ja) * 2018-08-06 2020-02-13 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
JP7409087B2 (ja) * 2018-08-09 2024-01-09 東レ株式会社 感光性樹脂組成物、感光性シート、ならびにそれらの硬化膜およびその製造方法、電子部品
WO2020066976A1 (ja) * 2018-09-27 2020-04-02 富士フイルム株式会社 樹脂組成物、硬化膜、積層体、硬化膜の製造方法、および半導体デバイス
WO2020071422A1 (ja) 2018-10-03 2020-04-09 日立化成デュポンマイクロシステムズ株式会社 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品
WO2020080216A1 (ja) * 2018-10-19 2020-04-23 富士フイルム株式会社 硬化膜の製造方法、樹脂組成物、硬化膜、積層体の製造方法および半導体デバイスの製造方法
SG11202105555VA (en) * 2018-12-05 2021-06-29 Fujifilm Corp Pattern forming method, photosensitive resin composition, cured film, laminate, and device
JP7334247B2 (ja) * 2019-06-06 2023-08-28 富士フイルム株式会社 ネガ型硬化性組成物、硬化膜、積層体、硬化膜の製造方法、及び、半導体デバイス
JP7431696B2 (ja) * 2020-08-04 2024-02-15 信越化学工業株式会社 ポジ型感光性樹脂組成物、ポジ型感光性ドライフィルム、ポジ型感光性ドライフィルムの製造方法、パターン形成方法、硬化被膜形成方法、層間絶縁膜、表面保護膜、及び電子部品
WO2022172913A1 (ja) * 2021-02-12 2022-08-18 住友ベークライト株式会社 感光性樹脂組成物
WO2024070845A1 (ja) * 2022-09-30 2024-04-04 東レ株式会社 感光性樹脂組成物、感光性樹脂シート、硬化物、硬化物の製造方法、半導体装置、表示装置、樹脂の製造方法

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JPH08227154A (ja) * 1994-11-17 1996-09-03 Hitachi Ltd 感光性樹脂組成物及びパターン形成方法およびそれを用いた電子装置の製造方法
JP2001139806A (ja) * 1999-11-16 2001-05-22 Toray Ind Inc 耐熱性感光性樹脂組成物
JP5515560B2 (ja) * 2008-09-30 2014-06-11 大日本印刷株式会社 感光性樹脂組成物、当該感光性樹脂組成物からなるパターン形成用材料、パターン形成方法、及び当該感光性樹脂組成物を用いた物品、並びに光潜在性樹脂硬化促進剤
KR20130058658A (ko) * 2010-04-16 2013-06-04 아사히 가라스 가부시키가이샤 함불소 공중합체 조성물 및 그 제조 방법
KR101728820B1 (ko) * 2013-12-12 2017-04-20 제일모직 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자
JP6462983B2 (ja) * 2014-01-28 2019-01-30 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10354932B2 (en) 2017-03-22 2019-07-16 Asahi Kasei Kabushiki Kaisha Semiconductor device including semiconductor element and redistribution layer electrically connected thereto, and method of manufacturing the device
TWI691525B (zh) * 2017-03-22 2020-04-21 日商旭化成股份有限公司 半導體裝置及其製造方法
TWI832816B (zh) * 2017-06-30 2024-02-21 日商住友電木股份有限公司 感光性樹脂組成物、樹脂膜及電子裝置
CN115038755A (zh) * 2020-02-03 2022-09-09 富士胶片株式会社 固化性树脂组合物、树脂膜、固化膜、层叠体、固化膜的制造方法及半导体器件

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WO2017038664A1 (ja) 2017-03-09
JPWO2017038664A1 (ja) 2018-06-14

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