TW201709268A - 元件層製造方法、分離裝置、捲繞有層積體之卷體、層積體、以及分離方法 - Google Patents
元件層製造方法、分離裝置、捲繞有層積體之卷體、層積體、以及分離方法 Download PDFInfo
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- TW201709268A TW201709268A TW105111100A TW105111100A TW201709268A TW 201709268 A TW201709268 A TW 201709268A TW 105111100 A TW105111100 A TW 105111100A TW 105111100 A TW105111100 A TW 105111100A TW 201709268 A TW201709268 A TW 201709268A
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015091830 | 2015-04-28 | ||
| JP2015156221 | 2015-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201709268A true TW201709268A (zh) | 2017-03-01 |
Family
ID=57199236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW105111100A TW201709268A (zh) | 2015-04-28 | 2016-04-08 | 元件層製造方法、分離裝置、捲繞有層積體之卷體、層積體、以及分離方法 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2017034225A (ja) |
| TW (1) | TW201709268A (ja) |
| WO (1) | WO2016175014A1 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7275683B2 (ja) * | 2018-03-15 | 2023-05-18 | 大日本印刷株式会社 | 配線基板、及び配線基板の製造方法 |
| JP7362378B2 (ja) * | 2019-09-12 | 2023-10-17 | 株式会社東芝 | キャリア及び半導体装置の製造方法 |
| JP7521258B2 (ja) | 2020-05-26 | 2024-07-24 | Ｔｏｐｐａｎホールディングス株式会社 | 基板ユニット、基板ユニットの製造方法及び半導体装置の製造方法 |
| CN118380337B (zh) * | 2024-06-25 | 2024-09-06 | 日月新半导体(威海)有限公司 | 一种半导体晶片的封装结构及其形成方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5473413B2 (ja) * | 2008-06-20 | 2014-04-16 | 株式会社半導体エネルギー研究所 | 配線基板の作製方法、アンテナの作製方法及び半導体装置の作製方法 |
| JP2012018952A (ja) * | 2010-07-06 | 2012-01-26 | Furukawa Electric Co Ltd:The | プリント配線基板、半導体装置、プリント配線基板の製造方法及び半導体装置の製造方法 |
| JP5882266B2 (ja) * | 2013-08-20 | 2016-03-09 | 藤森工業株式会社 | 表面保護フィルム、及びそれが貼合された光学部品 |
| JP6201610B2 (ja) * | 2013-10-08 | 2017-09-27 | 富士通株式会社 | 電子装置の製造方法及び回路基板 |
-
2016
- 2016-04-08 TW TW105111100A patent/TW201709268A/zh unknown
- 2016-04-08 WO PCT/JP2016/061551 patent/WO2016175014A1/ja active Application Filing
- 2016-04-08 JP JP2016078303A patent/JP2017034225A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2017034225A (ja) | 2017-02-09 |
| WO2016175014A1 (ja) | 2016-11-03 |
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