TW201707552A - 屏蔽薄膜及屏蔽印刷電路板 - Google Patents

屏蔽薄膜及屏蔽印刷電路板 Download PDF

Info

Publication number
TW201707552A
TW201707552A TW105116308A TW105116308A TW201707552A TW 201707552 A TW201707552 A TW 201707552A TW 105116308 A TW105116308 A TW 105116308A TW 105116308 A TW105116308 A TW 105116308A TW 201707552 A TW201707552 A TW 201707552A
Authority
TW
Taiwan
Prior art keywords
shielding film
conductive adhesive
parts
weight
flame retardant
Prior art date
Application number
TW105116308A
Other languages
English (en)
Other versions
TWI699160B (zh
Inventor
Kouji Takami
Yoshihisa Yamamoto
Kenji Kamino
Original Assignee
Tatsuta Electric Wire & Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire & Cable Co Ltd filed Critical Tatsuta Electric Wire & Cable Co Ltd
Publication of TW201707552A publication Critical patent/TW201707552A/zh
Application granted granted Critical
Publication of TWI699160B publication Critical patent/TWI699160B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/088—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/095—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/098—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/40—Layered products comprising a layer of synthetic resin comprising polyurethanes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00—Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/005—Modified block copolymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/28—Metal sheet
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K17/00—Soil-conditioning materials or soil-stabilising materials
    • C09K17/40—Soil-conditioning materials or soil-stabilising materials containing mixtures of inorganic and organic compounds
    • C09K17/42—Inorganic compounds mixed with organic active ingredients, e.g. accelerators
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K21/00—Fireproofing materials
    • C09K21/06—Organic materials
    • C09K21/12—Organic materials containing phosphorus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0086—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single discontinuous metallic layer on an electrically insulating supporting structure, e.g. metal grid, perforated metal foil, film, aggregated flakes, sintering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/03—3 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/04—4 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/05—5 or more layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/06—Coating on the layer surface on metal layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/20—Inorganic coating
    • B32B2255/205—Metallic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/32—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2453/00—Presence of block copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Soil Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Adhesive Tapes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

本發明提供一種同時滿足優異之高速傳送特性與優異之阻燃性之屏蔽薄膜。根據本發明之實施形態之屏蔽薄膜，具備金屬層、及配置於金屬層之一側之導電性接著劑層。導電性接著劑層包含環氧樹脂與含羧基之彈性體之硬化物、有機磷系阻燃劑及導電性填料。金屬層之厚度為0.3μm~7μm。構成導電性接著劑層之導電性接著劑，相對於環氧樹脂及含羧基之彈性體之合計100重量份，含有10重量份~50重量份之有機磷系阻燃劑、及10重量份~80重量份之導電性填料。

Description

屏蔽薄膜及屏蔽印刷電路板
本發明關於屏蔽薄膜及屏蔽印刷電路板。
背景技術
已知有為遮蔽自印刷電路板產生之電磁波雜訊或來自外部之電磁波雜訊，而於軟性印刷電路板之表面設置電磁波屏蔽薄膜(亦簡稱為屏蔽薄膜)。
近年來，因行動電子機器之高速傳送化，對使用於印刷電路板之材料要求優異之高速傳送特性、更詳細而言要求比介電常數及介電損失正切較低之特性。其結果，對屏蔽薄膜亦要求上述優異之高速傳送特性。另一方面，對屏蔽薄膜大多要求阻燃性。作為對屏蔽薄膜賦與阻燃性之技術，已知有於導電性接著劑使用無鹵素系阻燃劑(專利文獻1)。然而，經賦與阻燃性之屏蔽薄膜存在有比介電常數及介電損失正切在高速傳送化之要求程度上不足之問題。
如上所述，強烈謀求同時滿足優異之高速傳送特性與優異之阻燃性之屏蔽薄膜。
先行技術文獻 專利文獻
專利文獻1：日本特開2007-294918號公報
發明概要
本發明是為解決上述先前問題而完成者，其目的在於提供一種同時滿足優異之高速傳送特性與優異之阻燃性之屏蔽薄膜。
本發明之屏蔽薄膜具備金屬層、及配置於該金屬層之一側之導電性接著劑層。該導電性接著劑層包含環氧樹脂與含羧基之彈性體之硬化物、有機磷系阻燃劑及導電性填料。金屬層之厚度為0.3μm~7μm。構成導電性接著劑層之導電性接著劑，相對於環氧樹脂及含羧基之彈性體之合計100重量份，含有10重量份~50重量份之有機磷系阻燃劑、及10重量份~80重量份之導電性填料。
於一實施形態中，上述含羧基之彈性體為經以不飽和羧酸改性之苯乙烯-乙烯丙烯-苯乙烯共聚物。
於一實施形態中，上述有機磷系阻燃劑為次膦酸金屬鹽。
於一實施形態中，上述導電性接著劑層具有VTM-0或較其良好之阻燃性，且於1GHz下具有2.0~4.0之比介電常數及0.0015~0.0040之介電損失正切。
根據本發明之另一態樣，可提供一種屏蔽印刷電路 板。該屏蔽印刷電路板包含上述屏蔽薄膜。
根據本發明之實施形態，藉由於屏蔽薄膜之導電性接著劑層中組合使用特定之硬化性樹脂(結果為硬化物)與有機磷系阻燃劑，可獲得同時滿足優異之高速傳送特性(主要為低的比介電常數及介電損失正切)與優異之阻燃性之屏蔽薄膜。
10‧‧‧金屬層
20‧‧‧導電性接著劑層
30‧‧‧保護層
40‧‧‧離型薄膜
100‧‧‧屏蔽薄膜
圖1是本發明之一實施形態之屏蔽薄膜之概略剖面圖。
圖2是比較顯示實施例2及參考例1之屏蔽薄膜之特性阻抗之曲線圖。
圖3是比較顯示實施例2及參考例1之屏蔽薄膜之眼圖之像圖。
用以實施發明之形態
以下就本發明之具體實施形態進行說明，但本發明並不限定於其等實施形態。
A.屏蔽薄膜之整體構成
圖1是本發明之一實施形態之屏蔽薄膜之概略剖面圖。本實施形態之屏蔽薄膜100具備金屬層10、及配置於金屬層10之一側之導電性接著劑層20。屏蔽薄膜100視需要亦可進一步具備配置於金屬層10之與導電性接著劑層20成相反之側之保護層30。於實用上，於金屬層10(保護層30存在 時為保護層30)之外側及/或導電性接著劑層20之外側，可剝離地暫時接著有離型薄膜(隔片)40，在提供給使用之前之期間保護屏蔽薄膜。
B.金屬層
金屬層10為包含金屬薄膜之層。金屬層10可作為電磁波屏蔽層而起作用。
作為構成金屬層之金屬材料，例如可列舉：鋁、銀、銅、金、鎳、錫、鈀、鉻、鈦、及鋅、或包含其等二個以上之合金。金屬材料可視所期望之屏蔽特性而適當地選擇。
於一實施形態中，作為金屬層可使用金屬箔。於此實施形態中，金屬層可藉由軋延加工形成為任意之厚度。於其他實施形態中，金屬層可藉由任意之適當方法而形成。作為形成方法之具體例，可列舉：物理性蒸鍍(真空蒸鍍、濺鍍、離子束蒸鍍等)、CVD、鍍敷。以物理性蒸鍍為佳。其原因為：可減薄厚度，且即使減薄厚度亦可於面方向賦與優異之導電性，可以乾式製程簡便地形成。於此實施形態中，金屬層在屏蔽薄膜設置有後述之保護層時，可藉由塗佈法將保護層形成於該金屬層上。
金屬層之厚度宜為7μm以下，較佳為0.3μm~7μm，更佳為1μm~6μm，尤佳為2μm~6μm。若金屬層之厚度為7μm以下，可經濟的製造輕量薄型之屏蔽薄膜。又，若金屬層之厚度為0.3μm以上，則後述傳送特性變得良好。金屬層之厚度若於此範圍，藉由與後述之導電性 接著劑層之效果之相乘效果，於所獲得之屏蔽薄膜可兼具優異之高速傳送特性與阻燃性。
金屬層之表面電阻宜為0.001Ω~1Ω，較佳為0.001Ω~0.1Ω。金屬層之表面電阻若於此範圍，可維持金屬層之屏蔽特性，且使金屬層成為上述所期望之厚度。
C.導電性接著劑層
導電性接著劑層20包含環氧樹脂與含羧基之彈性體之硬化物、有機磷系阻燃劑及導電性填料。換言之，導電性接著劑層20藉由使包含含有環氧樹脂及含羧基之彈性體之樹脂成分、有機磷系阻燃劑及導電性填料之導電性接著劑組成物硬化而形成。
如上所述，導電性接著劑組成物包含含有環氧樹脂及含羧基之彈性體之樹脂成分、有機磷系阻燃劑及導電性填料。
作為環氧樹脂之具體例，可列舉：雙酚A型環氧樹脂、雙酚F型環氧樹脂或其等之氫化物；鄰苯二甲酸二縮水甘油酯、間苯二甲酸二縮水甘油酯、對苯二甲酸二縮水甘油酯、對羥基苯甲酸縮水甘油酯、四氫苯二甲酸二縮水甘油酯、琥珀酸二縮水甘油酯、己二酸二縮水甘油酯、癸二酸二縮水甘油酯、偏苯三酸三縮水甘油酯等縮水甘油酯系環氧樹脂；乙二醇二縮水甘油醚、丙二醇二縮水甘油醚、1,4-丁二醇二縮水甘油醚、1,6-己二醇二縮水甘油醚、三羥甲基丙烷三縮水甘油醚、季戊四醇四縮水甘油醚、四苯基縮水甘油醚乙烷、三苯基縮水甘油醚乙烷、山梨糖醇之聚 縮水甘油醚、聚甘油之聚縮水甘油醚等縮水甘油醚系環氧樹脂；三縮水甘油基異氰尿酸酯、四縮水甘油基二胺基二苯基甲烷等縮水甘油胺系環氧樹脂；環氧化聚丁二烯、環氧化大豆油等線狀脂肪族環氧樹脂等。又，亦可使用苯酚型酚醛環氧樹脂、鄰甲酚酚醛環氧樹脂、雙酚A酚醛環氧樹脂等酚醛型環氧樹脂。進而，可使用溴化雙酚A型環氧樹脂、含磷之環氧樹脂、含二環戊二烯骨架之環氧樹脂、含萘骨架之環氧樹脂、蒽型環氧樹脂、第三丁基鄰苯二酚、三苯基甲烷型環氧樹脂、四苯基乙烷型環氧樹脂、聯苯型環氧樹脂、雙酚S型環氧樹脂等。
環氧樹脂較佳為於一分子中具有2個以上之環氧基。其原因為，藉由與含羧基之苯乙烯系彈性體之反應而形成交聯構造，可展現較高之耐熱性。
含羧基之苯乙烯系彈性體可用以對硬化物(即導電性接著劑層)賦與所期望之介電特性(即高速傳送特性)而使用。含羧基之苯乙烯系彈性體，代表性者為將以共軛二烯化合物與芳香族乙烯基化合物之嵌段及無規構造為主體之共聚物、以及其氫化物經以不飽合羧酸改性者。作為芳香族乙烯基化合物，例如可列舉：苯乙烯、第三丁基苯乙烯、α-甲基苯乙烯、對甲基苯乙烯、二乙烯基苯、1,1-二苯基苯乙烯、N,N-二乙基-對胺基乙基苯乙烯、乙烯基甲苯、對第三丁基苯乙烯。又，作為共軛二烯化合物，例如可列舉：丁二烯、異戊二烯、1,3-戊二烯、2,3-二甲基-1,3-丁二烯等。
含羧基之苯乙烯系彈性體之改性，例如可藉由於苯乙烯系彈性體之聚合時使不飽和羧酸共聚合而進行。又，亦可藉由於有機過氧化物之存在下將苯乙烯系彈性體與不飽和羧酸加熱、混練而進行。作為不飽和羧酸，例如可列舉：丙烯酸、甲基丙烯酸、馬來酸、伊康酸、富馬酸、馬來酸酐、伊康酸酐、富馬酸酐。藉由不飽和羧酸之改性量例如為0.1重量%~10重量%。
作為含羧基之苯乙烯系彈性體之具體例，可列舉將苯乙烯-丁二烯嵌段共聚物、苯乙烯-乙烯丙烯嵌段共聚物、苯乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯-異戊二烯-苯乙烯嵌段共聚物、苯乙烯-乙烯丁烯-苯乙烯嵌段共聚物及苯乙烯-乙烯丙烯-苯乙烯嵌段共聚物等經以不飽和羧酸改性者。較佳為經以不飽和羧酸改性之苯乙烯-乙烯丙烯-苯乙烯嵌段共聚物。其原因為，與後述有機磷系阻燃劑之組合所產生之效果顯著，可非常良好地兼具優異之高速傳送特性(主要為低的比介電常數及介電損失正切)與優異之阻燃性。苯乙烯-乙烯丙烯-苯乙烯嵌段共聚物中之苯乙烯/乙烯丙烯之質量比，例如為10/90~90/10，較佳為10/90~50/50。質量比若於此範圍，可成為具有優異之介電特性之接著劑組成物。
含羧基之苯乙烯系彈性體之重量平均分子量Mw，較佳為1萬~50萬，更佳為3萬~30萬，尤佳為5萬~20萬。重量平均分子量Mw若於此範圍，可展現優異之接著性及介電特性。再者，於本說明書中，所謂重量平均分子量 Mw是將藉由凝膠滲透層析儀(以下亦稱為「GPC」)測定之分子量換算成苯乙烯之值。
樹脂成分中之環氧樹脂之調配量，相對於含羧基之苯乙烯系彈性體100重量份宜為1重量份~20重量份，較佳為3重量份~15重量份。
除了環氧樹脂及含羧基之苯乙烯系彈性體外，樹脂成分亦可進而含有其他樹脂。作為其他樹脂，例如可列舉熱塑性樹脂。作為熱塑性樹脂之具體例，可列舉：苯氧樹脂、聚醯胺樹脂、聚酯樹脂、聚碳酸酯樹脂、聚伸苯醚樹脂、聚胺基甲酸酯樹脂、聚縮醛樹脂、聚乙烯系樹脂、聚丙烯系樹脂、聚乙烯基系樹脂。其他樹脂之種類及樹脂成分中之調配量，可根據目的或所期望之特性而適當地設定。
有機磷系阻燃劑，代表性者為次膦酸(phosphinic acid)金屬鹽。作為次膦酸金屬鹽之具體例，可列舉：三-二乙基次膦酸鋁、三甲基乙基次膦酸鋁、三-二苯基次膦酸鋁、雙-二乙基次膦酸鋅、雙甲基乙基次膦酸鋅、雙-二苯基次膦酸鋅、雙-二乙基次膦酸氧鈦、四-二乙基次膦酸鈦、雙甲基乙基次膦酸氧鈦、四甲基乙基次膦酸鈦、雙-二苯基次膦酸氧鈦、四-二苯基次膦酸鈦。亦可使用次膦酸金屬鹽(例如有機次膦酸之鋁鹽)與多磷酸三聚氰胺之摻合物。次膦酸金屬鹽系阻燃劑有市售。作為市售之具體例，可列舉Clariant Japan公司製商品名「EXOLITE OP-930」、「EXOLITE OP-935」、「EXOLITE OP-1230」、「EXOLITE OP-1240」、「EXOLITE OP-1312」。
導電性接著劑組成物中之有機磷系阻燃劑之調配量，相對於環氧樹脂及含羧基之苯乙烯系彈性體之合計100重量份，宜為10重量份~50重量份，較佳為15重量份~40重量份。藉由使用上述特定的樹脂成分且以上述量調配有機磷系阻燃劑，可賦與優異之阻燃性且實現優異之高速傳送特性。
作為導電性填料，可使用任意之適當的導電性填料。作為導電性填料之具體例，可列舉：碳、銀、銅、鎳、焊料、鋁、對銅粉施以鍍銀之鍍銀銅填料、對樹脂球或玻璃珠等施以金屬鍍敷之填料。較佳為鍍銀銅填料或鎳。其原因為，較廉價且具有優異之導電性，且可靠性較高。導電性填料可單獨使用亦可組合二種以上使用。作為導電性填料之形狀，可視目的而採用任意之適當的形狀。作為具體例，可列舉：真球狀、小片狀、鱗片狀、板狀、樹枝狀、橢圓球狀、棒狀、針狀、不定形。
導電性接著劑組成物中之導電性填料之調配量，相對於環氧樹脂及含羧基之苯乙烯系彈性體之合計100重量份，宜為10重量份~80重量份，較佳為20重量份~60重量份。若調配量過多，有印刷電路板對接地電路之接著性變得不足且不能獲得良好之傳送特性之情形。若調配量過少，則有導電性變得不足且不能獲得良好之屏蔽特性。
導電性接著劑組成物視目的亦可進一步含有任意之適當的添加劑。作為添加劑之具體例，可列舉：黏著 賦與劑、聚合起始劑、硬化促進劑、偶合劑、抗熱老化劑、調平劑、消泡劑、無機填充劑、顏料及溶劑。所加入之添加劑之數量、種類及調配量，可視目的或所期望之特性而適當地設定。
導電性接著劑組成物可藉由任意之適當方法而硬化。作為硬化方法之代表例，可列舉熱壓。熱壓中之加熱溫度例如160℃~180℃，加壓壓力例如2MPa~5MPa，熱壓時間(硬化時間)例如30分鐘~60分鐘。
導電性接著劑層(導電性接著劑組成物之硬化物)之厚度宜為2μm~45μm，更佳為5μm~15μm。若為如此厚度，藉由與上述特定樹脂成分與有機磷系阻燃劑之組合所產生之效果及金屬層之厚度所產生之效果之相乘效果，於所獲得之屏蔽薄膜可兼具優異之高速傳送特性與阻燃性。
導電性接著劑層之比介電常數，於1GHz下宜為2.0~4.0，較佳為2.5~3.3，更佳為2.7~3.0。導電性接著劑層之介電損失正切於1GHz下宜為0.0015~0.0040，較佳為0.0015~0.0026。導電性接著劑層之阻燃性宜為VTM-0或較其良好。如此，可同時實現非常低之比介電常數及介電損失正切(結果為非常優異之高速傳送特性、尤其是高頻傳送特性)與優異之阻燃性為本發明之成果之一，此為藉由反覆修正及研究接著劑之樹脂成分、阻燃劑及各層之厚度與上述等特性之關係而初次獲得之未預期之優異效果。
C.保護層
保護層30代表性者為由任意之適當的樹脂薄膜構成。 所謂構成樹脂薄膜之樹脂，可為熱硬化性樹脂，亦可為熱塑性樹脂，亦可為電子束(例如可見光線、紫外線)硬化性樹脂。作為樹脂之具體例，可列舉：環氧樹脂、酚樹脂、醯胺樹脂、醇酸樹脂、胺基甲酸酯樹脂、(甲基)丙烯酸樹脂、聚醯亞胺樹脂、聚醯胺醯亞胺樹脂。
保護層之厚度例如為1μm~10μm。
本發明之實施形態中之屏蔽薄膜，與印刷電路板貼合後，曝露於高溫(約270℃)之回焊步驟。因此，對於屏蔽薄膜中包含樹脂之構成要素、即保護層及導電性接著劑層亦要求能耐回焊步驟之耐熱性。於本發明之實施形態中，保護層及導電性接著劑層皆藉由具有上述構成而可滿足能耐回焊步驟之耐熱性。其結果，本發明之屏蔽薄膜整體可滿足能耐回焊步驟之耐熱性。
D.屏蔽印刷電路板
本發明之實施形態中之屏蔽印刷電路板，包含印刷電路板與上述A項至C項所記載之屏蔽薄膜。印刷電路板具有形成有信號電路之基礎薄膜及覆蓋信號電路、設置於該基礎薄膜上之整個面之絕緣薄膜。於一個實施形態中，印刷電路板為軟性印刷電路板。屏蔽薄膜經由導電路接著劑層積層於印刷電路板之絕緣薄膜上。又，因為印刷電路板之構成為該業界所周知，故省略詳細說明。
[實施例]
以下，藉由實施例具體地說明本發明，但本發明並不限定於該等實施例。實施例中之評價項目如下所述。 又，於無特別載明之狀況下，實施例中之「份」及「%」為重量基準。
(1)比介電常數及介電損失正切
就實施例、參考例及比較例中製備之導電性接著劑組成物之硬化物，使用PNA-L網路分析儀N5230A(Agilent公司製)藉由共振腔微擾法(條件：23℃、1GHz)測定比介電常數(ε)及介電損失正切(tanδ)。
(2)阻燃性
就實施例、參考例及比較例中製備之導電性接著劑組成物之硬化物，藉由依據UL94規格之VTM燃燒性試驗評價阻燃性。
(3)特性阻抗
關於實施例2及參考例1所獲得之屏蔽薄膜之特性阻抗，使用由示波器、TDR模組及TDR探針構成之系統進行評價。示波器使用Tektronix公司製之DSC8200。TDR模組使用Tektronix公司製之80E04。TDR探針使用Tektronix公司製之P8018(單端：50Ω)及P80318(差動：100Ω)。
(4)眼圖
關於實施例2及參考例1所獲得之屏蔽薄膜之眼圖(傳送波形)，使用由資料產生器、示波器及取樣模組構成之系統進行評價。示波器使用Tektronix公司製之DSC8200。資料產生器使用Agilent公司製之81133A。取樣模組使用Tektronix公司製之80E03。使位元率(bit rate)以0.5Gbps、1.0Gbps、2.0Gbps及3.0Gbps變化進行測定。
<實施例1>
於形成有離型層之剝離性薄膜上塗佈包含丙烯酸系樹脂之保護層用樹脂組成物，進行乾燥，藉此形成厚度5μm之保護層。接著，將藉由軋延加工而製作之厚度2μm之銅箔貼合於保護層。
接著，將以下所示之原料以以下所示之比例添加於附有攪拌裝置之1000ml燒瓶中，於室溫下攪拌6小時溶解，藉此製備固體成分濃度20%之液狀導電性接著劑組成物。將其使用刮刀(板狀之刮刀)塗佈於銅箔上，以100℃×3分鐘之條件進行乾燥，形成導電性接著劑層。再者，作為環氧樹脂使用甲酚酚醛型環氧樹脂(DIC公司製、EPICLON N-655-EXP)。作為含羧基之彈性體使用順丁烯二酸改性苯乙烯-乙烯丙烯-苯乙烯嵌段共聚物(Kuraray公司製、Septon2007)。作為有機磷系阻燃劑使用三-二乙基次膦酸鋁(Clariant Japan公司製、EXOLITE OP-935)。作為導電性填料使用樹枝狀之鍍銀銅粉(平均粒徑13μm)。
環氧樹脂：10份
含羧基之彈性體：100份
有機磷系阻燃劑：30份
導電性填料：20份
咪唑系硬化促進劑(四國化成公司製、Curezol C11-Z)：0.2重量份
溶劑(甲苯/甲基乙基酮=90：10質量比)：400重量份
如上所述，製成具有金屬層/導電性接著劑層之構成之 屏蔽薄膜。將所獲得之屏蔽薄膜進行上述(1)~(2)評價。將結果顯示於表1。
<實施例2>
除了使用厚度為5.5μm之銅箔外，以與實施例1相同方法獲得屏蔽薄膜。將所獲得之屏蔽薄膜進行上述(1)~(4)評價。將比介電常數、介電損失正切及阻燃性之結果顯示於表1。將特性阻抗之結果與參考例1之結果一併顯示於圖2。將眼圖之結果與參考例1及比較例6之結果一併顯示於圖3。
<實施例3>
除了有機磷系阻燃劑之添加量如表1所示外，以與實施例2相同方法獲得屏蔽薄膜。將所獲得之屏蔽薄膜進行上述(1)~(4)評價。將比介電常數、介電損失正切及阻燃性之結果顯示於表1。
<實施例4>
除了有機磷系阻燃劑之添加量如表1所示外，以與實施例2相同方法獲得屏蔽薄膜。將所獲得之屏蔽薄膜進行上述(1)~(4)評價。將比介電常數、介電損失正切及阻燃性之結果顯示於表1。
<實施例5>
除了有機磷系阻燃劑及導電性填料之添加量如表1所示外，以與實施例2相同方法獲得屏蔽薄膜。將所獲得之屏蔽薄膜進行上述(1)~(4)評價。將比介電常數、介電損失正切及阻燃性之結果顯示於表1。
<參考例1>
除了未使用阻燃劑外，以與實施例1相同方法獲得屏蔽薄膜。將所獲得之屏蔽薄膜進行上述(1)~(4)評價。將比介電常數、介電損失正切及阻燃性之結果顯示於表1。將特性阻抗之結果與實施例2之結果一併顯示於圖2。將眼圖之結果與實施例2及比較例6之結果一併顯示於圖3。
<比較例1>
除了取代有機磷系阻燃劑30份，使用氮系阻燃劑(氰尿酸三聚氰胺、日產化學公司製、MC-4500)30份外，以與實施例1相同方法獲得屏蔽薄膜。將所獲得之屏蔽薄膜進行上述(1)~(2)評價。將結果顯示於表1。
<比較例2>
除了作為樹脂成分使用改性環氧樹脂(丙烯酸改性環氧樹脂、日本化藥公司製、ZCR-1798H)外，以與實施例1相同方法獲得屏蔽薄膜。將所獲得之屏蔽薄膜進行上述(1)~(2)評價。將結果顯示於表1。
<比較例3>
除了蒸鍍銀形成金屬層(厚度0.1μm)、作為樹脂成分使用含磷之環氧樹脂(新日鐵化學公司製、FX-305BEK)、將導電性接著劑層之厚度設為10μm、以及使用氮系阻燃劑外，以與實施例1相同方法獲得屏蔽薄膜。將所獲得之屏蔽薄膜進行上述(1)~(2)評價。將結果顯示於表1。
<比較例4>
除了有機磷系阻燃劑之添加量如表1所示外，以與實施例2相同方法獲得屏蔽薄膜。將所獲得之屏蔽薄膜進行上述 (1)~(4)評價。將比介電常數、介電損失正切及阻燃性之結果顯示於表1。
<比較例5>
除了有機磷系阻燃劑之添加量如表1所示外，以與實施例2相同方法獲得屏蔽薄膜。將所獲得之屏蔽薄膜進行上述(1)~(4)評價。將比介電常數、介電損失正切及阻燃性之結果顯示於表1。
<比較例6>
除了有機磷系阻燃劑及導電性填料之添加量如表1所示外，以與實施例2相同方法獲得屏蔽薄膜。將所獲得之屏蔽薄膜進行上述(1)~(4)評價。將比介電常數、介電損失正切及阻燃性之結果顯示於表1。將眼圖之結果與實施例2及參考例1之結果一併顯示於圖3。
<評價>
由表1可知，藉由於屏蔽薄膜之導電性接著劑層中組合使用特定之樹脂成分、特定量之有機磷系阻燃劑與特定量之導電性填料，可賦與優異之阻燃性且可實現非常低之比介電常數及介電損失正切(即優異之高速傳送特性)。又，如圖2所示，可知實施例2之屏蔽薄膜與參考例1之屏蔽薄膜相比，阻抗變化較小。進而，如圖3所示，可知實施例2之屏蔽薄膜與參考例1及比較例6之屏蔽薄膜相比，眼圖較優異(尤其是位元率越大越明顯)。即，圖2及圖3明確顯示藉由於屏蔽薄膜之導電性接著劑層中於特定之樹脂成分中添加有機磷系阻燃劑，不僅阻燃性、傳送特性亦明顯改善。此是藉由組合特定之樹脂成分與有機磷系阻燃劑之未預期之優異效果。
產業上之可利用性
根據本發明之實施形態之屏蔽薄膜，可適合用作印刷電路板之電磁波屏蔽薄膜。
10‧‧‧金屬層
20‧‧‧導電性接著劑層
30‧‧‧保護層
40‧‧‧離型薄膜
100‧‧‧屏蔽薄膜

Claims (5)

  1. 一種屏蔽薄膜，具備金屬層、及配置於該金屬層之一側之導電性接著劑層；該導電性接著劑層包含環氧樹脂與含羧基之彈性體之硬化物、有機磷系阻燃劑及導電性填料；該金屬層之厚度為0.3μm~7μm；構成該導電性接著劑層之導電性接著劑，相對於該環氧樹脂及該含羧基之彈性體合計100重量份，含有10重量份~50重量份之該有機磷系阻燃劑、及10重量份~80重量份之該導電性填料。
  2. 如請求項1之屏蔽薄膜，其中前述含羧基之彈性體為經以不飽和羧酸改性之苯乙烯-乙烯丙烯-苯乙烯共聚物。
  3. 如請求項1或2之屏蔽薄膜，其中前述有機磷系阻燃劑為次膦酸金屬鹽。
  4. 如請求項1至3中任一項之屏蔽薄膜，其中前述導電性接著劑層具有VTM-0或較其良好之阻燃性，且於1GHz下具有2.0~4.0之比介電常數及0.0015~0.0040之介電損失正切。
  5. 一種屏蔽印刷電路板，包含如請求項1至4中任一項之屏蔽薄膜。
TW105116308A 2015-05-26 2016-05-25 屏蔽薄膜及屏蔽印刷電路板 TWI699160B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-106549 2015-05-26
JP2015106549 2015-05-26

Publications (2)

Publication Number Publication Date
TW201707552A true TW201707552A (zh) 2017-02-16
TWI699160B TWI699160B (zh) 2020-07-11

Family

ID=57393943

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105116308A TWI699160B (zh) 2015-05-26 2016-05-25 屏蔽薄膜及屏蔽印刷電路板

Country Status (6)

Country Link
US (1) US10196545B2 (zh)
JP (1) JP6534442B2 (zh)
KR (1) KR101996977B1 (zh)
CN (1) CN107535082A (zh)
TW (1) TWI699160B (zh)
WO (1) WO2016190278A1 (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI637405B (zh) * 2017-03-15 2018-10-01 臻鼎科技股份有限公司 低介電樹脂組合物及應用其的膠片及電路板
TWI713845B (zh) * 2017-08-07 2020-12-21 日商拓自達電線股份有限公司 導電性接著劑
TWI727167B (zh) * 2017-08-07 2021-05-11 日商拓自達電線股份有限公司 導電性接著劑
TWI796476B (zh) * 2018-10-22 2023-03-21 日商拓自達電線股份有限公司 導電性接著片

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10685943B2 (en) * 2015-05-14 2020-06-16 Mediatek Inc. Semiconductor chip package with resilient conductive paste post and fabrication method thereof
US10196545B2 (en) 2015-05-26 2019-02-05 Tatsuta Electric Wire & Cable Co., Ltd. Shielding film and shielded printed wiring board
WO2018084587A1 (ko) * 2016-11-04 2018-05-11 주식회사 아모텍 기능성 컨택터
WO2018147426A1 (ja) * 2017-02-13 2018-08-16 タツタ電線株式会社 シールドフィルム、シールドプリント配線板及びシールドプリント配線板の製造方法
KR102467723B1 (ko) * 2017-02-13 2022-11-16 타츠타 전선 주식회사 그라운드 부재, 차폐 프린트 배선판 및 차폐 프린트 배선판의 제조 방법
EP3618081A4 (en) * 2017-04-28 2020-12-23 Nanchang Unitetec Technology Co., Ltd. ELECTROMAGNETIC SHIELDING FILM FOR CABLE
KR102579269B1 (ko) * 2017-12-28 2023-09-14 가부시끼가이샤 레조낙 접착제 필름
JP6511550B1 (ja) * 2018-01-30 2019-05-15 タツタ電線株式会社 電磁波シールドフィルム
JP7090428B2 (ja) * 2018-02-05 2022-06-24 デクセリアルズ株式会社 接着剤組成物、熱硬化性接着シート及びプリント配線板
CN109247003A (zh) * 2018-04-12 2019-01-18 庆鼎精密电子（淮安）有限公司 电磁屏蔽膜及其制作方法
JP6968041B2 (ja) * 2018-07-11 2021-11-17 タツタ電線株式会社 導電性接着剤
JP6555403B1 (ja) 2018-07-30 2019-08-07 東洋インキＳｃホールディングス株式会社 電磁波シールドシート付きプリント配線板
JP7141275B2 (ja) * 2018-08-07 2022-09-22 信越ポリマー株式会社 高周波回路基板
JP2020183469A (ja) * 2019-05-07 2020-11-12 信越ポリマー株式会社 導電性接着剤組成物、電磁波シールドフィルム、及び回路基板
TWI768742B (zh) * 2020-03-03 2022-06-21 韓商利諾士尖端材料有限公司 黏結膜、其黏結膜附著層疊體及其金屬箔層疊體

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100874302B1 (ko) * 2005-02-18 2008-12-18 도요 잉키 세이조 가부시끼가이샤 전자파 차폐성 접착필름, 그 제조방법 및 피착체의 전자파차폐방법
JP4914262B2 (ja) 2006-03-29 2012-04-11 タツタ電線株式会社 シールドフィルム及びシールドプリント配線板
KR101046200B1 (ko) * 2010-06-23 2011-07-05 에스디플렉스(주) 전자파 차폐필름의 제조방법 및 이에 의해 제조된 전자파 차폐필름
US10015915B2 (en) 2011-11-24 2018-07-03 Tatsuta Electric Wire & Cable Co., Ltd. Shield film, shielded printed wiring board, and method for manufacturing shield film
JP5976112B2 (ja) * 2012-07-11 2016-08-23 タツタ電線株式会社 硬化性導電性接着剤組成物、電磁波シールドフィルム、導電性接着フィルム、接着方法及び回路基板
TWI550650B (zh) * 2012-07-18 2016-09-21 東洋油墨Ｓｃ控股股份有限公司 導電性片以及電子零件
JP5955156B2 (ja) 2012-08-10 2016-07-20 ナミックス株式会社 樹脂組成物、ならびに、それによる接着フィルムおよびカバーレイフィルム
JP2014141603A (ja) * 2013-01-25 2014-08-07 Toyo Ink Sc Holdings Co Ltd 誘電特性に優れる接着剤組成物、それを用いた接着剤シート、およびプリント配線板
JP6081819B2 (ja) * 2013-02-28 2017-02-15 藤森工業株式会社 Ｆｐｃ用電磁波シールド材
WO2014147903A1 (ja) 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
CN105579542B (zh) 2013-09-20 2018-05-18 东亚合成株式会社 阻燃性粘接剂组合物及使用其的覆盖膜和挠性覆铜板
JP5861790B1 (ja) * 2015-02-25 2016-02-16 東洋インキＳｃホールディングス株式会社 電磁波シールドシート、電磁波シールド性配線回路基板および電子機器
US10196545B2 (en) 2015-05-26 2019-02-05 Tatsuta Electric Wire & Cable Co., Ltd. Shielding film and shielded printed wiring board

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI637405B (zh) * 2017-03-15 2018-10-01 臻鼎科技股份有限公司 低介電樹脂組合物及應用其的膠片及電路板
TWI713845B (zh) * 2017-08-07 2020-12-21 日商拓自達電線股份有限公司 導電性接著劑
TWI727167B (zh) * 2017-08-07 2021-05-11 日商拓自達電線股份有限公司 導電性接著劑
TWI796476B (zh) * 2018-10-22 2023-03-21 日商拓自達電線股份有限公司 導電性接著片

Also Published As

Publication number Publication date
JPWO2016190278A1 (ja) 2018-03-01
KR101996977B1 (ko) 2019-07-05
TWI699160B (zh) 2020-07-11
US20180134920A1 (en) 2018-05-17
KR20170140350A (ko) 2017-12-20
JP6534442B2 (ja) 2019-06-26
US10196545B2 (en) 2019-02-05
WO2016190278A1 (ja) 2016-12-01
CN107535082A (zh) 2018-01-02

Similar Documents

Publication Publication Date Title
TW201707552A (zh) 屏蔽薄膜及屏蔽印刷電路板
KR102287528B1 (ko) 접착제층을 갖는 적층체, 및 이것을 사용한 플렉시블 동장 적층판 및 플렉시블 플랫 케이블
US9422412B2 (en) Halogen-free resin composition and copper clad laminate and printed circuit board using same
US20100300744A1 (en) Electromagnetic shielding article
US9279051B2 (en) Halogen-free resin composition, and copper clad laminate and printed circuit board using same
JP6079890B2 (ja) 難燃性接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JPWO2014147903A1 (ja) 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
US11098227B2 (en) Conductive adhesive
JPWO2017077912A1 (ja) 低誘電難燃性接着剤組成物
WO2021131268A1 (ja) 接着剤組成物
CN101792573A (zh) 无卤高导热的树脂组合物及涂树脂铜箔
TW201531520A (zh) 一種無鹵樹脂組合物及其用途
WO2018103199A1 (zh) 一种热固性树脂组合物
KR20190065158A (ko) 전자파 차폐 필름
JP2010275374A (ja) フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板
WO2018103276A1 (zh) 一种热固性树脂组合物
JP7095133B2 (ja) 接着フィルム、これを含む接着フィルム付き積層体、及びこれを含む金属箔積層体
WO2022131151A1 (ja) 熱硬化性樹脂組成物の相容性評価方法、熱硬化性樹脂組成物、プリプレグ、樹脂フィルム、積層板、多層プリント配線板及び半導体パッケージ
JP2020007484A (ja) 導電性接着剤
KR101935882B1 (ko) 전자파 차폐필름 및 이의 제조방법
TWI795825B (zh) 黏接劑組成物
TWI632190B (zh) 無鹵素樹脂組成物
JP2023032287A (ja) 低誘電性接着剤組成物
JP2005089685A (ja) ノンハロゲン難燃接着性樹脂混和物およびそれを用いたフレキシブルプリント配線基板関連製品