CN107535082A - 屏蔽膜及屏蔽印制布线板 - Google Patents

屏蔽膜及屏蔽印制布线板 Download PDF

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Publication number
CN107535082A
CN107535082A CN201680030492.6A CN201680030492A CN107535082A CN 107535082 A CN107535082 A CN 107535082A CN 201680030492 A CN201680030492 A CN 201680030492A CN 107535082 A CN107535082 A CN 107535082A
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China
Prior art keywords
electric conductivity
screened film
weight
parts
metal level
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Pending
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CN201680030492.6A
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English (en)
Inventor
高见晃司
山本祥久
上农宪治
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Tuo Da Wire Co Ltd
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Tuo Da Wire Co Ltd
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Publication of CN107535082A publication Critical patent/CN107535082A/zh
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Abstract

本发明提供一种同时满足优越的高速传送特性和优越的阻燃性的屏蔽膜。本发明实施方式涉及的屏蔽膜包括金属层和配置在该金属层一侧的导电性结合剂层。导电性接合剂层包括含有环氧树脂和含羧基弹性体的固化物、有机磷类阻燃剂、导电性填料。金属层的厚度为0.3µm~7µm。构成导电性接合剂层的导电性接合剂中，相对于合计100重量份的环氧树脂和含羧基弹性体来说包含有机磷类阻燃剂10重量份~50重量份、以及导电性填料10重量份~80重量份。

Description

屏蔽膜及屏蔽印制布线板
技术领域
本发明涉及屏蔽膜及屏蔽印制布线板。
背景技术
为屏蔽产生自印制布线板的电磁波噪声及来自外部的电磁波噪声而将电磁波屏蔽膜(也可简称为屏蔽膜)设于柔性印制布线板表面的做法广为人知。
近年来，随着便携电子机器的高速传送化，人们要求用于印制布线板的材料要有优越的高速传送特性，更详细来说，要有低相对介电常数和低介电损耗角正切的特性。其结果，屏蔽膜也被要求有这样优越的高速传送特性。另一方面，对屏蔽膜来说，很多时候要求其阻燃性。作为给予屏蔽膜阻燃性的技术，广为人知的做法是在导电性接合剂里使用无卤类阻燃剂(专利文献1)。然而，被给予了阻燃性的屏蔽膜会出现相对介电常数及介电损耗角正切不能充分达到高速传送化所要求的水准的问题。
如上，人们迫切需要一种可同时满足优越的高速传送特性和优越的阻燃性的屏蔽膜。
在先技术文献
专利文献
专利文献1：特开(日本专利公开)2007-294918号公报。
发明内容
发明要解决的技术问题
本发明为解决上述以往的技术问题而诞生，其目的在于提供一种同时满足优越的高速传送特性和优越的阻燃性的屏蔽膜。
解决技术问题的技术手段
本发明的屏蔽膜包括：金属层、配置于所述金属层一侧的导电性接合剂层。所述导电性接合剂层含有：包含环氧树脂和含羧基弹性体的固化物、有机磷类阻燃剂、导电性填料。金属层的厚度为0.3μm~7μm。构成导电性接合剂层的导电性接合剂中，相对于合计100重量份的环氧树脂和含羧基弹性体来说包含有机磷类阻燃剂10重量份~50重量份、以及导电性填料10重量份~80重量份。
在一个实施方式中，所述含羧基弹性体是经不饱和羧酸改性的苯乙烯-乙烯-丙烯-苯乙烯的共聚物。
在一个实施方式中，所述有机磷类阻燃剂是次磷酸金属盐。
在一个实施方式中，所述导电性接合剂层具有VTM-0或比VTM-0更好的阻燃性，且在1GHz具有2.0~4.0的相对介电常数及0.0015~0.0040的介电损耗角正切。
基于本发明的别的场景，提供一种屏蔽印制布线板。所述屏蔽印制布线板包含所述屏蔽膜。
发明效果
基于本发明的实施方式，在屏蔽膜的导电性接合剂层通过组合使用特定的固化性树脂(就结果而言，即固化物)和有机磷类阻燃剂，可获得一种同时满足优越的高速传送特性(以低相对介电常数及低介电损耗角正切为代表)和优越的阻燃性的屏蔽膜。
附图说明
[图1] 基于本发明的一个实施方式的屏蔽膜的概略断面图；
[图2] 实施例2及参考例1的屏蔽膜的特性阻抗的对比图；
[图3] 实施例2及参考例1的屏蔽膜的眼图对比的示意图。
具体实施方式
以下，就本发明的具体实施方式进行说明，但本发明不限于所述这些实施方式。
A.屏蔽膜的整体结构
图1为基于本发明的一个实施方式的屏蔽膜的概略断面图。本实施方式的屏蔽膜100包括金属层10和配置于金属层10一侧的导电性接合剂层20。根据需要屏蔽膜100还可包括配置于金属层10的与导电性接合剂层20相反一侧的保护层30。就实用性而言，金属层10(若存在保护层30则为保护层30)的外侧及/或导电性接合剂层20的外侧临时贴附可剥离的离型膜(隔离膜)40，一直到使用前为止保护屏蔽膜。
B.金属层
金属层10是由金属的薄膜所构成的层。金属层10可作为电磁波屏蔽层发挥作用。
作为构成金属层的金属材料，比如可列举如下：铝、银、铜、金、镍、锡、钯、铬、钛、锌，或者包含其中2种以上的合金。金属材料可根据所希望的屏蔽特性进行适当选择。
在一种实施方式中，金属层可使用金属箔。在这种实施方式中，金属层可通过压延加工形成任意的厚度。在别的实施方式中，金属层可通过任意适当的方法形成。作为形成方法的具体例子，可列举为物理气相沉积(真空蒸镀、溅射、离子束蒸镀等)、CVD、镀覆。优选物理气相沉积。因为用物理气相沉积能使厚度薄，且即使厚度较薄也可以给予金属层在面方向上优越的导电性，且方便在干燥工序中成形。在此实施方式中，若屏蔽膜上设置了后述保护层，该金属层上的保护层可通过涂层法形成。
金属层的厚度优选7μm以下，更优选0.3μm~7μm，更加优选1μm~6μm，特别优选2μm~6μm。金属层的厚度为7μm以下时，就能够经济节省地制造出轻量薄型的屏蔽膜。又，金属层的厚度在0.3μm以上时，后述传送特性会变良好。金属层的厚度在所述范围之内时，通过和后述的导电性接合剂层的效果相辅相成，能够使所得屏蔽膜同时具有优越的高速传送特性和阻燃性。
金属层的表面电阻优选0.001Ω~1Ω，更加优选0.001Ω~0.1Ω。金属层的表面电阻在所述范围之内时，在维持金属层的屏蔽特性的同时，金属层也能够形成上述所希望的厚度。
C.导电性接合剂层
导电性接合剂层20包含：环氧树脂和含羧基弹性体的固化物、有机磷类阻燃剂、导电性填料。换言之，导电性接合剂层20是由导电性接合剂组成物固化而成的，其中所述导电性接合剂组成物包括含有环氧树脂及含羧基弹性体的树脂成分、有机磷类阻燃剂、导电性填料。
如上所述，导电性接合剂组成物包括：含有环氧树脂及含羧基弹性体的树脂成分、有机磷类阻燃剂、导电性填料。
作为环氧树脂具体的例子，可列举如下：双酚A型环氧树脂、双酚F型环氧树脂、或所述物质的氢化物；邻苯二甲酸二缩水甘油酯、间苯二甲酸二缩水甘油酯、对苯二甲酸二缩水甘油酯、对羟基苯甲酸缩水甘油酯、四氢邻苯二甲酸二缩水甘油酯、丁二酸二缩水甘油酯、己二酸二缩水甘油酯、癸二酸二缩水甘油酯、偏苯三甲酸三缩水甘油酯等的缩水甘油酯类环氧树脂；乙二醇二缩水甘油醚、丙二醇二缩水甘油醚、1，4-丁二醇二缩水甘油醚、1，6-己二醇二缩水甘油醚、三羟甲基丙烷三缩水甘油醚、季戊四醇缩水甘油醚、四苯基缩水甘油醚乙烷、三苯基缩水甘油醚乙烷、山梨醇的聚缩水甘油醚、聚甘油的聚缩水甘油醚等的缩水甘油醚类环氧树脂；三缩水甘油异氰尿酸酯、四缩水甘油基二氨基二苯基甲烷等的缩水甘油胺类环氧树脂;环氧化聚丁二烯、环氧化大豆油等的线型脂肪族环氧树脂等。又，也可以用苯酚酚醛型（novolak）环氧树脂、邻甲苯酚酚醛型（novolak）环氧树脂、双酚A酚醛型（novolak）环氧树脂等酚醛（novolak）型环氧树脂。而且，还可以用溴化双酚A型环氧树脂、含磷环氧树脂、含有二环戊二烯骨架的环氧树脂、含有萘骨架的环氧树脂、蒽型环氧树脂、对叔丁基邻苯二酚型环氧树脂、三苯基甲烷型环氧树脂、四苯基甲烷型环氧树脂、联苯型环氧树脂、双酚S型环氧树脂等。
环氧树脂优选一个分子中含有2个以上环氧基。因为这样一来在和含羧基苯乙烯类弹性体的反应中形成交联结构，能够呈现出高耐热性。
含羧基苯乙烯类弹性体可被用于给予固化物(即，导电性接合剂层)所希望的介电特性(就结果而言为高速传送特性)。含羧基苯乙烯类弹性体中的代表性物有：由共轭二烯基化合物和芳香族乙烯基化合物的嵌段及无规结构为主体形成的共聚物、以及其氢化物，经不饱和羧酸改性后的所得物。芳香族乙烯基化合物可列举如下：比如，苯乙烯、t-丁基苯乙烯、α-甲基苯乙烯、p-甲基苯乙烯、二乙烯基苯、1，1-联苯苯乙烯、Ｎ，Ｎ-二乙基-p-胺乙基苯乙烯、乙烯基甲苯、p-叔丁基甲苯。又，共轭二烯基化合物可列举如下：比如，丁二烯、异戊二烯、1，3-戊二烯、2，3-二甲基-1，3-丁二烯等。
含羧基苯乙烯类弹性体的改性例如可如下进行：在苯乙烯类弹性体聚合时让不饱和羧酸与其共聚。又，还可如下进行：把苯乙烯类弹性体和不饱和羧酸在有机过氧化物的存在下加热混合来进行。不饱和羧酸可列举如下，比如，丙烯酸、甲基丙烯酸、马来酸、衣康酸、富马酸、马来酸酐、衣康酸酐、富马酸酐。基于不饱和羧酸的改性量为，比如0.1重量%~10重量%。
作为含羧基苯乙烯类弹性体的具体例子，可列举如下：苯乙烯-丁二烯嵌段共聚物、苯乙烯-乙烯丙烯嵌段共聚物、苯乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯-异戊二烯-苯乙烯嵌段共聚物、苯乙烯-乙烯-丁烯-苯乙烯嵌段共聚物及苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚物等经不饱和羧酸改性所得物。优选经不饱和羧酸改性的苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚物。因为，其和后述有机磷类阻燃剂的组合效果显著，能够非常出色地同时确保优越的高速传送特性(以低相对介电常数及介电损耗角正切为代表)和优越的阻燃性。在苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚物中的苯乙烯/乙烯及苯乙烯/丙烯的质量比为，比如10/90~90/10，优选10/90~50/50。若质量比在这个范围内，即可获得具有优越介电特性的接合剂组成物。
含羧基苯乙烯类弹性体的重量平均分子量Mw优选为1万~50万，更优选为3万~30万，更加优选为5万~20万。若重量平均分子量Mw在这个范围内，就能够呈现出优越的接合性和介电特性。而且，在本说明书中，重量平均分子量Mw是把通过凝胶渗透色谱法(以下也称“GPC”)测定的分子量进行聚苯乙烯换算所得的值。
关于树脂成分中的环氧树脂的添加量，相对于含羧基苯乙烯类弹性体100重量份来说，其优选为1重量份~20重量份，更加优选为3重量份~15重量份。
树脂成分中除了环氧树脂及含羧基苯乙烯类弹性体以外还可包含其他树脂。其他树脂可列举为，比如热塑性树脂。作为热塑性树脂的具体例子，可列举如下：含苯氧基的树脂、聚酰胺树脂、聚酯树脂、聚碳酸酯树脂、聚苯醚树脂、聚氨酯树脂、聚缩醛树脂、聚乙烯类树脂、聚丙烯类树脂、聚乙烯类树脂。其他树脂的种类及在树脂成分中的添加量可根据目的和所希望的特性进行适当设定。
有机磷类阻燃剂代表性的是次磷酸金属盐。作为次磷酸金属盐具体例子，可列举如下：三-二乙基次膦酸铝、三-甲基乙基次膦酸铝、三-联苯基次膦酸铝、二-二乙基次膦酸锌、二-甲基乙基次膦酸锌、二-联苯基次膦酸锌、二-二乙基次膦酸氧钛、四-二乙基次膦酸钛、二-甲基乙基次膦酸氧钛、四-甲基乙基次膦酸钛、二-联苯基次膦酸氧钛、四-联苯基次膦酸钛。也可用次磷酸金属盐(比如，有机次磷酸的铝盐)和聚磷酸三聚氰胺的混合物。次磷酸金属盐类阻燃剂在市面上有售。作为市面销售品的具体例子，可以列举如下：ClariantJapan制商品名“EXOLITE OP-930”、“EXOLITE OP-935”、“EXOLITE OP-1230”、“EXOLITE OP-1240”、“EXOLITE OP-1312”。
在导电性接合剂组成物中的有机磷类阻燃剂的添加量相对于共计100重量份的环氧树脂及含羧基苯乙烯类弹性体来说优选10重量份~50重量份，更加优选15重量份~40重量份。使用如上所述特定的树脂成分且按照如上的量来添加有机磷类阻燃剂，这样一来，在获得优越的阻燃性的同时，还可以实现优越的高速传送特性。
作为导电性填料可使用任意的适合的导电性填料。作为导电性填料的具体例子，可列举如下：碳、银、铜、镍、焊锡、铝、对铜粉镀银所获得的银包铜填料、对树脂球和玻璃微珠等镀金属所获得的填料。优选银包铜填料或者镍。因其相比较来说价格便宜、导电性优越，且有较高的可信赖性。导电性填料既可单独使用，也可2种以上组合使用。导电性填料的形状可根据不同目的采用任意合适的形状。作为具体例子，可列举如下：正圆球状、薄片状、鳞片状、板状、树枝状、椭圆球状、棒状、针状、不特定形状。
导电性接合剂组成物中的导电性填料的添加量相对于共计100重量份的环氧树脂及含羧基苯乙烯类弹性体来说优选10重量份~80重量份，更加优选20重量份~60重量份。若添加量过多，在与印制布线板的接地回路的接合性不充分的同时，也有可能得不到良好的传送特性。若添加量过少，在导电性变得不充分的同时，也有可能得不到良好的屏蔽特性。
导电性接合剂组成物还可根据不同目的包含任意合适的添加剂。作为添加剂的具体例子，可列举如下：增粘剂、聚合引发剂、固化促进剂、偶联剂、热老化防止剂、整平剂、消泡剂、无机填充剂、颜料、及溶剂。所添加的添加剂的数量、种类及添加量可根据目的和所希望的特性进行适当设定。
导电性接合剂组成物可通过任意适当的方法被固化。作为固化方法的代表例子，可列举加热冲压法。在加热冲压中的加热温度为比如160℃~180℃，冲压压力为比如2MPa~5MPa，加热冲压时间(固化时间)为比如30分钟~60分钟。
导电性接合剂层(导电性接合剂组成物的固化物)的厚度优选2μm~45μm，更加优选5μm~15μm。若为所述厚度，上述特定的树脂成分和有机磷类阻燃剂的组合效果会和金属层厚度所带来的效果相辅相成，所制得的屏蔽膜就能够同时拥有优越的高速传送特性和阻燃性。
导电性接合剂层的相对介电常数在1GHz条件优选2.0~4.0，更优选2.5~3.3，更加优选2.7~3.0。导电性接合剂层的介电损耗角正切在1GHz条件优选0.0015~0.0040，更加优选0.0015~0.0026。导电性接合剂层的阻燃性优选VTM-0或更优。如此，本发明的成果之一就是同时实现了非常低的相对介电常数、介电损耗角正切(就结果而言体现为非常优越的高速传送特性,特别是高频传送特性)和优越的阻燃性，这是通过对接合剂的树脂成分、阻燃剂、各层的厚度与上述特性之间的关系进行反复实验和讨论才得到的超出预期的优越效果。
C.保护层
保护层30由任意适合的树脂膜构成，这是一种代表性的方式。构成树脂膜的树脂既可以是热固性树脂，又可以是热塑性树脂，还可以是电子束(比如,可视光线、紫外线)固性树脂。作为树脂的具体例，可列举如下：环氧树脂、苯酚树脂、氨基树脂、醇酸树脂、氨基甲酸乙酯树脂、甲基丙烯酸树脂、聚酰亚胺树脂、聚酰胺酰亚胺树脂。
保护层的厚度为，比如1μm~10μm。
基于本发明的实施方式的屏蔽膜在被贴到印制布线板上之后会暴露于高温(约270℃)的回流焊工序中。因此，在屏蔽膜中包含有树脂的构成要素，即保护层及导电性接合剂层也被要求有能够经得起回流焊工序的耐热性。在本发明的实施方式中，不管是保护层还是导电性接合剂层都因上述结构而能够满足经得起回流焊工序这一耐热性要求。因此，本发明的屏蔽膜整体都满足能够经得起回流焊工序这一耐热性要求。
D.屏蔽印制布线板
基于本发明的实施方式的屏蔽印制布线板包括印制布线板、以及从上述A项到C项中所述的屏蔽膜。印制布线板包括：形成有信号回路的基础膜、覆盖信号回路且设置在该基础膜的整个面上的绝缘膜。在一个实施方式中，印制布线板为柔性印制布线板。屏蔽膜通过导电性接合剂层被层叠在印制布线板的绝缘膜上。而且，由于印制布线板的结构为该行业所周知，因此省略详细说明。
实施例
以下，通过实施例对本发明进行具体说明，但本发明不限于这些实施例。对实施例的评价项目如下。而且，如无特别标注，在实施例中的“份”及“%”为重量基准。
(1)相对介电常数及介电损耗角正切
在实施例、参考例及比较例中，对于调制好的导电性接合剂组成物的固化物，用PNA-LNETWORK ANALYZER N5230A(Agilent公司制)通过谐振腔摄动法(条件：23℃、1GHz)来测定相对介电常数(ε)及介电损耗角正切(tanδ)。
(2)阻燃性
在实施例、参考例及比较例中，对调制好的导电性接合剂组成物的固化物，通过依照UL94规格的VTM燃烧性试验评价其阻燃性。
(3)特性阻抗
对在实施例2及参考例1中所制得的屏蔽膜的特性阻抗，用示波器、TDR模块和TDR探头所构成的系统进行评价。示波器使用Tektronix公司制的DSC8200。TDR模块使用Tektronix公司制的80E04。TDR探头使用Tektronix公司制的P8018(单端：50Ω)及P80318(差分：100Ω)。
(4)眼图
对于在实施例2及参考例1中所制得的屏蔽膜的眼图(传送波形)，用由数据生成器、示波器和采样构件所构成的系统进行评价。示波器使用Tektronix公司制DSC8200。数据生成器使用Agilent公司制的81133A。采样构件使用Tektronix公司制的80E03。将比特率变化为0.5Gbps、1.0Gbps、2.0Gbps及3.0Gbps进行测定。
<实施例1>
在形成有离型层的剥离性膜上施以含有丙烯酸类树脂的保护层用树脂组成物涂层并干燥，由此形成厚度5μm的保护层。接下来，把通过压延加工制作的厚度2μm的铜箔贴合在保护层上。
接下来，通过把如下所示的原料以如下所示的比例添加到带搅拌装置的1000ml的烧瓶中，并在室温下搅拌6小时使其溶解，调制出固体成分浓度20%的液状导电性接合剂组成物。用刮片(板状刮刀)把所述液状导电性接合剂组成物涂抹到铜箔上，在100℃×3分钟的条件下使其干燥，就形成了导电性接合剂层。而且，环氧树脂使用甲苯酚酚醛型环氧树脂(DIC公司制，EPICLON N-655-EXP)。含羧基弹性体使用马来酸改性苯乙烯-乙烯-丙烯-苯乙烯嵌段共聚物(Kuraray公司制、SEPTON2007)。有机磷类阻燃剂使用三-二乙基次膦酸铝(Clariant Japan公司制、EXOLITE OP-935)。导电性填料使用树枝状银包铜粉(平均粒子直径13μm)。
环氧树脂：10份
含羧基弹性体：100份
有机磷类阻燃剂：30份
导电性填料：20份
咪唑类固化促进剂(四国化成公司制、CUREZOL C11-Z)：0.2重量份
溶剂(甲苯/甲基乙基酮=90：10质量比)：400重量份
这样，就制成了含有金属层/导电性接合剂层结构的屏蔽膜。所得屏蔽膜用上述(1)~(2)进行评价。结果如表1所示。
<实施例2>
使用厚度为5.5μm的铜箔，除此以外，与实施例1同样地制得屏蔽膜。所得屏蔽膜用上述(1)~(4)进行评价。相对介电常数、介电损耗角正切及阻燃性的结果如表1所示。特性阻抗的结果连同参考例1的结果一并显示在图2。眼图的结果连同参考例1及比较例6的结果一并显示在图3。
<实施例3>
有机磷类阻燃剂的添加量如表1所示，除此以外，与实施例2同样地制得屏蔽膜。所得屏蔽膜用上述(1)~(4)进行评价。相对介电常数、介电损耗角正切及阻燃性的结果如表1所示。
<实施例4>
有机磷类阻燃剂的添加量如表1所示，除此以外，与实施例2同样地制得屏蔽膜。所得屏蔽膜用上述(1)~(4)进行评价。相对介电常数、介电损耗角正切及阻燃性的结果如表1所示。
<实施例5>
有机磷类阻燃剂及导电性填料的添加量如表1所示，除此以外，与实施例2同样地制得屏蔽膜。所得屏蔽膜用上述(1)~(4)进行评价。相对介电常数、介电损耗角正切及阻燃性的结果如表1所示。
<参考例1>
除没有用阻燃剂以外，与实施例1同样地制得屏蔽膜。所得屏蔽膜用上述(1)~(4)进行评价。相对介电常数、介电损耗角正切及阻燃性的结果如表1所示。特性阻抗的结果连同实施例2的结果一并显示在图2。眼图的结果连同实施例2及比较例6的结果一并显示在图3。
<比较例1>
用30份的氮类阻燃剂(三聚氰胺氰脲酸盐，日产化学公司制，MC-4500)来代替30份的有机磷类阻燃剂，除此以外，与实施例1同样地制得屏蔽膜。所得屏蔽膜用上述(1)~(2)进行评价。结果如表1所示。
<比较例2>
树脂成分使用改性环氧树脂(丙烯酸改性环氧树脂、日本化药公司制、ZCR-1798H)，除此以外，与实施例1同样地制得屏蔽膜。所得屏蔽膜用上述(1)~(2)进行评价。结果如表1所示。
<比较例3>
蒸镀银形成金属层(厚度0.1μm)、树脂成分使用含磷环氧树脂(新日铁化学公司制、FX-305BEK)、导电性接合剂层的厚度为10μm、以及使用氮类阻燃剂，除此以外，与实施例1同样地制得屏蔽膜。所得屏蔽膜用上述(1)~(2)进行评价。结果如表1所示。
<比较例4>
有机磷类阻燃剂的添加量如表1所示，除此以外，与实施例2同样地制得屏蔽膜。所得屏蔽膜用上述(1)~(4)进行评价。相对介电常数、介电损耗角正切、及阻燃性的结果如表1所示。
<比较例5>
有机磷类阻燃剂的添加量如表1所示，除此以外，与实施例2同样地制得屏蔽膜。所得屏蔽膜用上述(1)~(4)进行评价。相对介电常数、介电损耗角正切、及阻燃性结果如表1所示。
<比较例6>
有机磷类阻燃剂及导电性填料的添加量如表1所示，除此以外，与实施例2同样地制得屏蔽膜。所得屏蔽膜用上述(1)~(4)进行评价。相对介电常数、介电损耗角正切、及阻燃性的结果如表1所示。眼图的结果连同实施例2及参考例1的结果一并显示在图3。
[表1]
<评价>
从表1可清楚地看出，在屏蔽膜的导电性接合剂层通过组合使用特定的树脂成分、特定量的有机磷类阻燃剂和特定量的导电性填料，在获得优越的阻燃性的同时，还可实现非常低的相对介电常数及介电损耗角正切(即，优越的高速传送特性)。又，从图2可以看出，和参考例1的屏蔽膜相比，实施例2的屏蔽膜的阻抗变化更小。而且，从图3可以看出，和参考例1及比较例6的屏蔽膜相比，实施例2的屏蔽膜的眼图更优(特别是，比特率越大越显著)。即，图2及图3清楚地表明，在屏蔽膜的导电性接合剂层通过往特定的树脂成分里添加有机磷类阻燃剂，不但使阻燃性得到了显著改善，传送特性也得到了显著改善。这就是通过特定的树脂成分和有机磷类阻燃剂的组合所获得的超出预期的效果。
产业上的可利用性
基于本发明的实施方式的屏蔽膜，可恰到好处地被用作印制布线板的电磁波屏蔽膜。
符号说明
10 金属层
20 导电性接合剂层
30 保护层
40 离型膜
100 屏蔽膜

Claims (5)

1.一种屏蔽膜，包括：金属层、配置于所述金属层一侧的导电性接合剂层；
其中，所述导电性接合剂层包含含有环氧树脂和含羧基弹性体的固化物、有机磷类阻燃剂、导电性填料，
所述金属层的厚度为0.3μm~7μm，
构成所述导电性接合剂层的导电性接合剂中，相对于共计100重量份的所述环氧树脂及所述含羧基弹性体来说含有10重量份~50重量份的所述有机磷类阻燃剂、以及10重量份~80重量份的所述导电性填料。
2.根据权利要求1所述的屏蔽膜，其特征在于：
所述含羧基弹性体为经不饱和羧酸改性的苯乙烯-乙烯-丙烯-苯乙烯共聚物。
3.根据权利要求1或2所述的屏蔽膜，其特征在于：
所述有机磷类阻燃剂为次磷酸金属盐。
4.根据权利要求1~3的任意一项所述的屏蔽膜，其特征在于：
所述导电性接合剂层具有VTM-0或比VTM-0更好的阻燃性，且在1GHz具有2.0~4.0的相对介电常数及0.0015~0.0040的介电损耗角正切。
5.一种屏蔽印制布线板，包含根据权利要求1~4的任意一项所述的屏蔽膜。
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