TW201704713A - 熱擴散片 - Google Patents
熱擴散片 Download PDFInfo
- Publication number
- TW201704713A TW201704713A TW105109417A TW105109417A TW201704713A TW 201704713 A TW201704713 A TW 201704713A TW 105109417 A TW105109417 A TW 105109417A TW 105109417 A TW105109417 A TW 105109417A TW 201704713 A TW201704713 A TW 201704713A
- Authority
- TW
- Taiwan
- Prior art keywords
- adhesive layer
- sheet
- thickness
- heat
- graphite sheet
- Prior art date
Links
- 238000009792 diffusion process Methods 0.000 title claims abstract description 38
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 86
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 84
- 239000010439 graphite Substances 0.000 claims abstract description 84
- 239000012790 adhesive layer Substances 0.000 claims abstract description 47
- 239000010410 layer Substances 0.000 claims abstract description 45
- 229920006267 polyester film Polymers 0.000 claims abstract description 44
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 239000002131 composite material Substances 0.000 claims description 36
- 239000002313 adhesive film Substances 0.000 claims description 34
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 15
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 11
- 239000003522 acrylic cement Substances 0.000 abstract description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 2
- 229910052710 silicon Inorganic materials 0.000 abstract 2
- 239000010703 silicon Substances 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 description 17
- 230000001070 adhesive effect Effects 0.000 description 17
- 239000011521 glass Substances 0.000 description 13
- 239000003795 chemical substances by application Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000178 monomer Substances 0.000 description 5
- 229920006243 acrylic copolymer Polymers 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- -1 methylol group Chemical group 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 3
- 238000003490 calendering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910021382 natural graphite Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000005361 soda-lime glass Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000037303 wrinkles Effects 0.000 description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- GPBBNPPLBQIADY-UHFFFAOYSA-N 4,4-dimethyloxane Chemical compound CC1(C)CCOCC1 GPBBNPPLBQIADY-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical group COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920001690 polydopamine Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000012286 potassium permanganate Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20472—Sheet interfaces
- H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/02—2 layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/706—Anisotropic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/72—Density
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/732—Dimensional properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
- B32B2309/08—Dimensions, e.g. volume
- B32B2309/10—Dimensions, e.g. volume linear, e.g. length, distance, width
- B32B2309/105—Thickness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/206—Organic displays, e.g. OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/8794—Arrangements for heating and cooling
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本發明提供一種延伸方向之導熱率較高且即便自被黏著體剝離亦可再使用之熱擴散片。
本發明提供一種熱擴散片2,其係將石墨片10之厚度設為20μm以上且未達80μm,並將厚度為5μm以上且15μm以下之範圍且不含有導熱性材料之丙烯酸系黏著劑層21、厚度為5μm以上且30μm以下之範圍之聚酯膜22、及較上述聚酯膜薄且厚度為2μm以上且25μm以下之範圍、不含有導熱性材料且剝離強度為0.005N/cm以上且1.0N/cm以下之聚矽氧黏著劑層23自石墨片10起依序積層而成。貼附聚矽氧黏著劑層23之被黏著體之發熱容易傳遞至石墨片10,又,剝離後亦容易再利用。
Description
本發明係關於一種用於散熱之熱擴散片,尤其係關於一種使熱沿熱擴散片之延伸方向擴散之熱擴散片。
近年來,電腦、行動電話、PDA等電子機器之性能明顯提高,其係由CPU之性能明顯提高所導致。伴隨著此種CPU之性能提高,CPU之發熱量亦明顯增加,而怎樣進行電子機器中之散熱成為重要之課題。
作為熱對策,有利用風扇而進行之空冷或使用熱管、水之水冷等方法,但該等存在如下缺點:均需要用於散熱之新穎之裝置,不僅會導致機器之重量增加,亦會導致噪音或使用電量增加等。
另一方面,使CPU所產生之熱儘可能迅速地以較寬之面積擴散之方法之目的在於提高冷卻效率,作為行動電話或電腦等電子機器中之冷卻方法係最現實之方法。
可是,於有機EL元件所代表之顯示裝置中,近年來,發展大型化,裝置之精度、尤其是均勻性受到重視。尤其是於有機EL元件中,已知由於元件本身係由有機物構成,故而因熱所導致之劣化會對元件之壽命尤其是發光特性、及色度變化造成影響,且存在因構成裝置之驅動電路
等之發熱而伴隨經時變化之情況。
作為此種用於散熱目的之導熱片,近年來,片狀之石墨受到較大之關注。
其原因在於,優質之石墨片具有100W/(m.K)以上且1000W/(m.K)以下之非常高之導熱性,與其他凝膠狀之散熱材料或片狀之散熱材料之導熱率之特性相比明顯為高性能,而最適合用於使熱擴散。
於專利文獻1中記載有用於使來自發熱體之熱直接傳遞至散熱構件之導熱性片材,於專利文獻2或專利文獻3中記載有使來自發熱體之熱沿平面方向擴散之熱擴散性之導熱性片材。
作為導熱性片材,並非專利文獻1之導熱性片材,而是專利文獻2或專利文獻3所記載之導熱性片材受到關注,尤其是使石墨片化之所謂之石墨片受到關注。
即,石墨片於平面方向上具有100W/(m.K)以上且1000W/(m.K)以下之高導熱性,使來自發熱體之熱擴散而使電子機器內之溫度均勻,藉此防止機器內所配置之零件之功能降低。
於專利文獻2之實施形態3(段落0048)揭示有將於PET膜等基材之兩面形成有黏著劑層之雙面膠帶預先貼附於石墨片之單面,並藉由該黏著劑層貼附於電子機器之貼附對象之表面(以下稱為被黏著面)之技術,通常黏著劑層不具有導熱性,而有降低片材整體之熱擴散效果之傾向。又,於通常用作黏著劑層之丙烯酸系黏著劑層中,難以為了重新貼附而進行剝離。
因此,於專利文獻3中嘗試如下:提供於石墨片之單面使聚
矽氧橡膠等彈性層(相當於黏著劑層)含有導熱性材料之石墨片(請求項1),藉此防止導熱率降低及使用於重新貼附之剝離變得容易。
然而,圖像面板尤其是OLED面板(有機EL面板)般之圖像顯示面板雖構成該面板之表面為玻璃而非常平滑,但若使黏著劑層含有導熱性材料,則會於黏著劑層表面形成凹凸,故而存在初始密接性降低之不良情況。該密接性之降低雖有助於容易剝離,但構成黏著劑層之樹脂成分之比率相對降低,因此無法避免接著可靠性降低(課題1)。
又,於石墨片之厚度為300μm以下之情況下,並不會產生這種問題,但若石墨片之厚度較300μm厚,則片材整體之剛性增高,結果,於剝離時難以使片材彎曲。
為此,於將石墨片自貼附有石墨片之表面剝離時,一面使石墨片與表面所成之角度不會變大,一面向上方側牽拉,此種情況下,聚矽氧黏著劑層容易凝聚破壞,其結果容易殘留於被黏著面(課題2)。
[專利文獻1]日本特開2007-180281號公報
[專利文獻2]日本特開2008-060527號公報
[專利文獻3]日本特開2007-012913號公報
為了克服上述問題方面,本發明之目的在於提供一種可在充分地確保優異之導熱率之情況下高效率地傳遞元件或裝置所產生之熱之可再剝離之熱擴散片。
又,本發明之目的在於提供一種高接著可靠性之熱擴散片。
又,本發明之目的在於提供一種不使聚矽氧黏著劑層凝聚破壞便可將其剝離之熱擴散片。
為了達成上述目的之本發明之發明係一種熱擴散片,其具有石墨片、及配置於上述石墨片之表面之複合黏著劑膜,其特徵在於:上述石墨片之厚度為20μm以上且未達80μm,上述複合黏著劑膜之厚度為5μm以上且15μm以下之範圍,上述複合黏著劑膜具有:丙烯酸系黏著劑層,其配置於上述石墨片上,且不具有導熱性材料;聚酯膜,其配置於上述丙烯酸系黏著劑層上,且厚度為5μm以上且30μm以下之範圍;及聚矽氧黏著劑層,其配置於上述聚酯膜上,較上述聚酯膜薄,厚度為2μm以上且25μm以下之範圍,不含有導熱性材料,且剝離強度為0.005N/cm以上且1.0N/cm以下。
如上所述,本發明係將具有經複合化之黏著劑層之複合黏著劑膜用於石墨片之熱擴散片。於此種熱擴散片中發揮如下效果:首先,藉由使用石墨片而具有延伸方向上優異之導熱率,發熱元件所產生之熱沿熱擴散片之延伸方向傳遞而熱擴散片成為均勻之溫度,即便貼附有熱擴散片之被黏著體局部發熱,溫度亦會均勻地上升。
又,聚矽氧黏著劑層由於單面與聚酯膜牢固地黏著,另一面被製成可自玻璃板等被黏著體剝離之黏著力,因此可於自被黏著體剝離後再利用。
複合黏著劑膜之導熱率雖較低,但厚度形成為較薄,而複合黏著劑膜之膜厚方向之熱電阻被製成較小,因此被黏著體所產生之熱容易傳遞至石墨片。
2‧‧‧熱擴散片
10‧‧‧石墨片
11‧‧‧複合黏著劑膜
21‧‧‧丙烯酸系黏著劑層
22‧‧‧聚酯膜
23‧‧‧聚矽氧黏著劑層
圖1係用以說明本發明之熱擴散片之圖
根據下述項目對本發明之實施形態進行說明。
1.本發明之熱擴散片(附黏著劑之石墨片)
2.石墨片
3.複合黏著劑膜
4.丙烯酸系黏著劑層
5.聚酯膜
6.聚矽氧黏著劑層
7.聚酯膜與聚矽氧黏著劑層之關係
8.附黏著劑之石墨片之製造方法
圖1之符號2為本發明之熱擴散片,且具有石墨片10及複合黏著劑膜
11。
該熱擴散片2貼附於如有機EL元件所代表之顯示裝置之機器內及部位,並發揮使來自其熱源之熱擴散之作用。
本發明所使用之石墨片10主要係由天然石墨製造,具有高導熱性,且具有可調整為數十微米至數千微米之任意厚度之特性。
本發明所使用之石墨片10因其結晶性而導熱具有異向性,厚度方向之導熱率較低而難以傳遞熱,延伸方向(與片材之表面平行之方向)之導熱率較高而容易傳遞熱。向延伸方向之導熱率具有銅或鋁之數倍之大小,又,石墨片10與金屬片相比較輕。
石墨片之厚度通常具有50μm以上且2000μm以下之範圍,於本發明之熱擴散片2所使用之石墨片10之情況,為了用於如OLED之圖像面板般要求薄型化之機器或應對片材本身之柔軟性被損壞而容易產生褶皺等不良情況,較佳為未達80μm。而且,如下所述,本發明之複合黏著劑膜11於石墨片10之厚度為20μm以上之情況下、尤其是30μm以上之情況下適合薄型化,褶皺之產生亦得以防止。
再者,石墨片10之導熱率為200W/(m.K)以上且2000W/(m.K)以下,該導熱率會受石墨之配向、分子量或壓延密度等影響。
本發明之複合黏著劑膜11形成於上述石墨片10之單面,且具有將石墨片10貼附於貼附對象物之表面之作用。
又,由於複合黏著劑膜11如下所述般不含有導熱性材料,
故而複合黏著劑膜11之整體之導熱率為0.05W/(m.K)以上且0.5W/(m.K)以下之範圍。
因此,為了不損害石墨片10之導熱性且不對本發明之其他效果造成影響,較佳為將複合黏著劑膜11之總厚度設為20μm以上且100μm以下之範圍,尤佳為設為22μm以上且55μm以下之範圍。
關於複合黏著劑膜11,具體之構成係於聚酯膜22之單面設置丙烯酸系黏著劑層21,於該單面之相反側之面設置聚矽氧黏著劑層23而構成,丙烯酸系黏著劑層21之表面與石墨片10之表面接觸而將石墨片10與複合黏著劑膜11接著。
構成丙烯酸系黏著劑層21之材料包含成為基礎聚合物之丙烯酸共聚物(a)、與基礎聚合物相溶而表現黏著性之黏著賦予劑(b)、及調整丙烯酸共聚物(a)之凝聚力之硬化劑(c),於丙烯酸系黏著劑層21與石墨片10接觸之前,丙烯酸系聚物(a)與硬化劑(c)之反應雖並不完整,但結束。
作為丙烯酸共聚物(a),可使用選自作為具有甲基丙烯醯基、羥基、羧基、羥甲基、或胺基等官能基之單體之由除甲基丙烯酸2-羥基乙酯以外的丙烯酸、甲基丙烯酸、丙烯酸2-羥基乙酯或丙烯酸2-羥基丙酯、甲基丙烯酸2-羥基丙酯、N-羥甲基丙烯醯胺、N-羥甲基甲基丙烯醯胺、丙烯醯胺或甲基丙烯醯胺等構成之單體的丙烯酸共聚物。又,作為黏著賦予劑(b),可使用由酚系樹脂、萜烯系樹脂、松香系樹脂、氫化松香系樹脂、二甲苯樹脂、丙烯酸樹脂構成之低分子聚合物。
作為硬化劑(c),於含有具有羥基等之單體等作為丙烯酸共
聚物(a)之成分之情況下,可使用異氰酸酯型硬化劑等,另一方面,於含有具有環氧基等官能基之單體等之情況下,可使用伸乙亞胺型硬化劑等。
丙烯酸系黏著劑層21之厚度為5μm以上且15μm以下,尤其是10μm以下。於比5μm薄之情況下,有與被黏著體之接著力變得不足之不良情況,另一方面,於比15μm厚之情況下,雖亦取決於聚酯膜22之厚度,但有熱電阻上升而無法獲得良好之導熱之不良情況。於10μm以下之情況下熱電阻進一步減小。
再者,不含有導熱性材料與下述聚矽氧黏著劑層23同樣。
聚酯膜22具有下述作用:可產生複合黏著劑膜11整體之強度,且視與下述聚矽氧黏著劑層23之厚度之關係而容易剝離。
又,亦發揮於將丙烯酸系黏著劑層21與聚矽氧黏著劑層23直接積層時防止兩層被混合之作用。
聚酯膜22較佳可使用聚對苯二甲酸乙二酯(PET),其厚度較佳為5μm以上且30μm以下之範圍,尤佳為10μm以上,又,較佳為25μm以下之範圍。於使用經二軸延伸加工之PET膜之情況下,關於拉伸強度,於縱延伸方向上較佳為100MPa以上且300MPa以下之範圍,於橫延伸方向上較佳為10MPa以上且50MPa以下之範圍。
而且,關於儲存模數,較佳為1000Pa以上且10000MPa以下之範圍。
聚矽氧黏著劑層23係由加成反應型聚矽氧樹脂構成,且係根據對OLED等圖像面板(玻璃)之附著力(剝離強度)為0.005N/cm以上且1.0N/
cm以下之觀點而進行選擇。具體而言,可使用二甲基矽氧烷等有機矽氧烷。
再者,如上所述,複合黏著劑膜11係藉由聚酯膜22而提高強度,因此本發明無需使聚矽氧黏著劑層23形成為較厚,具體而言,關於聚矽氧黏著劑層23之厚度,因需要接著性,因此較佳為2μm以上之厚度,尤佳為5μm以上,就使剝離性良好之觀點而言,較佳為25μm以下,尤佳為20μm以下之厚度。
又,聚矽氧黏著劑層23與上述丙烯酸系黏著劑層21同樣,不含有導熱性材料。
聚酯膜22與聚矽氧黏著劑層23和丙烯酸系黏著劑層21不同,會影響剝離性,較佳為伴隨著石墨片10之厚度或所欲之面積而變更其厚度之關係。
例如,於石墨片10之厚度為50μm以上且未達80μm、其面積相對較小為25cm2以上且300cm2以下(例如為12cm×6.7cm)之情況下,較佳為將聚酯膜22之厚度設為10μm以上且20μm以下之範圍,使聚矽氧黏著劑層23之厚度薄於聚酯膜22之厚度並設為5μm以上且10μm以下。
即,相對於聚矽氧黏著劑層23之厚度,較佳為將聚酯膜22之厚度設為大於1.0倍且4.0倍以下之範圍。
又,於石墨片10之面積相對較大為4000cm2以上且15000cm2以下(例如121.7cm×68.5cm)之情況下,較佳為將聚酯膜22之厚度設為20μm以上且30μm以下,且於聚矽氧黏著劑層23之厚度薄於聚酯膜22之厚度之條件之下將其設為大於10μm且25μm以下。即,相對於聚矽氧
黏著劑層23之厚度,較佳為將聚酯膜22之厚度設為大於1.0倍且3.0倍以下。
關於本發明之附黏著劑之石墨片之製造方法,可準備以上所說明之石墨片10,並於該石墨片10依序形成丙烯酸系黏著劑層21、聚酯膜22及聚矽氧黏著劑層23,又,亦可準備於聚酯膜22之單面形成有與聚酯膜22接觸之丙烯酸系黏著劑層21,於另一面形成有與聚酯膜22接觸之聚矽氧黏著劑層23之兩面黏著片之複合黏著劑膜,使該複合黏著劑膜之丙烯酸系黏著劑層21側與石墨片10接觸,將複合黏著劑膜貼附於石墨片10而製造本發明之熱擴散片(附黏著劑之石墨片)2。
又,亦可形成「於聚酯膜22形成有聚矽氧黏著劑層23」之中間片A,另一方面,預先形成「於剝離膜上形成有丙烯酸系黏著劑層21」之中間片B,使上述中間片A之聚酯膜22之表面與上述中間片B之丙烯酸系黏著劑層21之表面接觸,使中間片A與中間片B貼附而製作作為兩面黏著片之複合黏著劑膜11,將該丙烯酸系黏著劑層21側之剝離膜去除,使露出之丙烯酸系黏著劑層21之表面與石墨片10之表面接觸而將複合黏著劑膜11貼附於石墨片10,從而製造本發明之熱擴散片2。
又,亦可準備於聚酯膜22設置有聚矽氧黏著劑層23之中間片A與於石墨片10塗佈有丙烯酸系黏著劑層21之材料而設置有丙烯酸系黏著劑層21之中間片C,使中間片A之聚酯膜22之表面露出,並使上述中間片C之丙烯酸系黏著劑層21之表面接觸該露出之表面而貼附於該表面,從而製造本發明之熱擴散片2。
以下,根據實施例對本發明具體地進行說明。
將使天然石墨100重量份浸漬於將過錳酸鉀溶解於濃硫酸而成之混合液約為15重量份中而獲得之鱗片狀石墨加熱至約900℃,對膨脹為以容積比計約為150cm3/g之膨脹石墨進行加壓成形而獲得密度約為1.5g/cm3之膨脹石墨。自上述膨脹石墨進而去除雜質,獲得密度約為1.7g/cm3之膨脹石墨。進而對其進行壓延處理,獲得厚度0.127mm、0.106mm、0.076mm、0.051mm、0.040mm之膜狀之膨脹石墨壓延片。利用可測定平面方向之熱擴散率之熱波分析儀(thermal wave analyzer)對其進行測定,結果,熱擴散率分別為4×10-4m2/s、4×10-4m2/s、4×10-4m2/s、3×10-4m2/s、3×10-4m2/s。
將市售之聚醯亞胺膜(Kaneka(股)製造.Apical AH之厚度25、50、75、125、225μm)夾於石墨板,使用電爐於氮氣環境下升溫至1000℃,然後於1000℃進行1小時熱處理並進行碳化處理(碳化處理),將所獲得之碳化膜以利用板狀之平滑之石墨自上方夾持之狀態保持於長方體狀之石墨容器內,利用以焦炭作為主成分之碳粉末覆蓋容器,藉由並非環境加熱而是對容器及碳粉末整體通電直流電壓而加熱至3000℃為止,製作厚度0.040mm、0.025mm之石墨膜。利用可測定平面方向之熱擴散率之熱波分析儀對其進行測定,結果熱擴散率均為1×10-3m2/s。
使用Meyer bar # 3將向由具有乙烯基作為烯基之有機二甲基聚矽氧烷與有機氫化聚矽氧烷構成之加成型有機聚矽氧烷[信越化學(股)製造:商品名「KS-847H」;固形物成分30質量%]10質量份中添加甲苯與甲基乙基酮之混合溶劑(以質量比計為6:4)15質量份、及鉑觸媒[信越化學(股)製造:商品名「PL-50T」]0.1質量份而製備之塗佈液(固形物成分12質量%)分別塗佈於厚度12μm與厚度20μm之兩種聚酯膜22[帝人杜邦膜(股)製造之聚對苯二甲酸乙二酯膜:商品名「G2」],並於160℃使其等乾燥60秒,而於聚酯膜22上形成由聚矽氧彈性體構成且具有微黏著性之聚矽氧黏著劑層23。
以塗佈量1.0g/m2塗佈塗佈液而形成厚度20μm之聚矽氧黏著劑層23,又,塗佈其1/4之塗佈量而形成厚度5μm之聚矽氧黏著劑層23。
向混合有丙烯酸單體及丙烯酸聚合物之樹脂液55重量份中添加作為黏著賦予劑之氫化松香即[荒川化學工業(股)公司製造 商品名「KE311」]5重量份並進行混合,進而添加甲苯40重量份並進行混合直至變得均勻。向其中添加作為TDI系異氰酸酯改質交聯劑之[Nippon Polyurethane工業(股)公司製造:商品名「Coronate L」]2重量份,進而進行混合直至變得均勻。使用Meyer bar # 3以塗佈量10g/m2將該塗佈液塗佈於厚度38μm之脫模膜上,並於130℃使其乾燥120秒,而於脫模膜上形成厚度10μm之丙烯酸系黏著劑層21。又,以一半之塗佈量於脫模膜上形成厚度5μm之丙烯酸系黏著劑層21。
以1kg/cm之線壓並利用可加熱之裝置對所獲得之上述組成物進行層壓,製作於聚酯膜22之單面配置有聚矽氧黏著劑層23且於其相反側之面配置有丙烯酸系黏著劑層21之構造之複合黏著劑膜11。
對於上述步驟中製造之石墨片10(該石墨片10包含膨脹石墨壓延片與碳化石墨片之兩者)與複合黏著劑膜11進行真空加熱加壓,藉此獲得丙烯酸系黏著劑層21接觸並固定於石墨片10之熱擴散片2。
製作該熱擴散片2為積層體且聚酯膜為25μm之熱擴散片2(實施例1、4)與12μm之熱擴散片2(實施例2、3、5)。
將不含有導熱性材料且於兩面形成有丙烯酸黏著劑層之兩面黏著片(「市售品1」)代替本發明所使用之複合黏著劑膜11作為複合黏著劑膜貼附於石墨片10之單面而製作熱擴散片。該兩面黏著片於比較例1中,於石墨片側與被黏著體側形成有10μm之丙烯酸黏著劑層,於比較例2中,於石墨片側與被黏著體側形成有30μm之丙烯酸黏著劑層,石墨片層之厚度為106μm與127μm。
於被黏著體貼附有丙烯酸黏著劑層,因此剝離性較差。
於厚度12μm之聚酯膜形成厚度10μm之丙烯酸系黏著劑層與厚度20μm之聚矽氧黏著劑層,並將丙烯酸系黏著劑層貼附於厚度127μm之石墨片。聚矽氧黏著劑層使用Dexerials(股)製造之聚矽氧黏著劑片[商品
名T4082S]。
聚矽氧黏著劑層之厚度較聚酯膜厚而難以剝離,又,聚酯膜存在變形之情況而作業性較差。
將上述聚矽氧黏著劑層用之塗佈液塗佈於上述步驟中所製造之石墨片並使其乾燥,形成聚矽氧黏著劑層23而獲得熱擴散片。並未使用複合黏著劑膜。
對各實施例1~5與比較例1~4之熱擴散片進行下述試驗。
○熱擴散率試驗
利用打孔機將熱擴散片裁切為15mm×15mm,使用熱擴散率測定裝置(熱波分析儀TA3:BETHEL(股)製造)算出於25℃之溫度下達到平衡狀態時之熱擴散率。熱擴散率之數值越高越佳,期待為10-4m2/s以上。
○剝離性試驗
以1kg/cm之線壓將熱擴散片層壓於玻璃板(鈉鈣玻璃),於常溫下經過7天後,確認是否可將複合黏著劑片自玻璃板剝離。進而,確認剝離後之剝離殘渣是否殘留於玻璃板之表面上。
○接著可靠性試驗
以1kg/cm之線壓將熱擴散片層壓於玻璃板(鈉鈣玻璃),並將其投入至被調整為60℃ 75%RH之大氣恆溫恆濕烘箱中,確認經過1000Hr後之外觀。
○測定值
將各試驗之結果示於下述表1、2。
○剝離性之評價
於表1、2中之剝離性之欄中表示下述評價。
A良好:可以較小之力自玻璃板剝離,且自玻璃板剝離之面並未殘留殘渣
B可:還算可以自玻璃板剝離。自玻璃板剝離之面雖並未殘留殘渣,但聚酯膜產生變形。
C不良:自玻璃板剝離必需極大之力。自玻璃板剝離之面殘留有殘渣
○接著可靠性之評價
於表1、2中,於接著可靠性之欄中表示下述評價。
A良好:完全未產生隆起,端部亦牢固地接著
B可:幾乎未產生隆起,但端部局部翹起
C不良:產生隆起,且端部翹起
2‧‧‧熱擴散片
10‧‧‧石墨片
11‧‧‧複合黏著劑膜
21‧‧‧丙烯酸系黏著劑層
22‧‧‧聚酯膜
23‧‧‧聚矽氧黏著劑層
Claims (1)
- 一種熱擴散片,其具有石墨片、及配置於上述石墨片之表面之複合黏著劑膜,其特徵在於:上述石墨片之厚度為20μm以上且未達80μm,上述複合黏著劑膜之厚度為5μm以上且15μm以下之範圍;上述複合黏著劑膜具有:丙烯酸系黏著劑層,其配置於上述石墨片上,且不具有導熱性材料;聚酯膜,其配置於上述丙烯酸系黏著劑層上,且厚度為5μm以上且30μm以下之範圍;及聚矽氧黏著劑層,其配置於上述聚酯膜上,較上述聚酯膜薄,厚度為2μm以上且25μm以下之範圍,不含有導熱性材料,且剝離強度為0.005N/cm以上且1.0N/cm以下。
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