TW201630280A - Test socket having conductive particles in coupled form - Google Patents

Abstract

The purpose of the present invention is to provide a test socket, which: provides a conduction unit having conductive particles easily coupled by dot, line, and surface contact, and thus, when a semiconductor device is tested, has a lower and constant initial resistance value while the conduction unit and a terminal make contact; and can prevent the conductive particles from being separated from the conduction unit or sinking even if used for a long time, thereby preventing a significant increase of a resistance value. To this end, the present invention comprises: an insulation unit formed from silicone rubber; a plurality of conductive particles; and at least one conduction unit having a silicone rubber fused thereto so as to be formed to penetrate the insulation unit, wherein the conductive particles are formed in various column shapes, and two or more conductive particles are formed to be coupled in at least one direction by at least one of mechanical mixing, mechanical impact, and a magnetic force applied to the conduction unit.

Description

Test socket

The present invention relates to a test socket, and more particularly to a test socket for electrically connecting a terminal of a semiconductor component to be tested and a test board.

If the manufacturing process of the semiconductor element is completed, testing of the semiconductor element is required. In testing a semiconductor component, a test socket for electrically connecting the test device to the semiconductor component is required. The test socket is a dielectric member in which a signal emitted from the test can be transmitted to a semiconductor element as an object to be tested via a test board. For test sockets, mechanical contact capability to accurately contact the test board through individual semiconductors and a stable electrical contact capability that minimizes signal distortion in the contact point when transmitting signals is required.

The conductive portion of the conventional test socket is composed of a ruthenium rubber and a spherical particle disposed in the ruthenium rubber, that is, a conductive particle having an uneven shape. The conductive particles have a structure that is fixed by the ruthenium rubber.

Since the portion of the concave-convex shape that is in contact with the terminal of the semiconductor element under test is defined as a point contact, a concentrated load is generated. The gold plating of the conductive particles is easily damaged, and the shape is easily deformed and worn. As a result, the life of the test socket drops dramatically.

Further, the same phenomenon occurs not only in the portion in contact with the terminal of the semiconductor element to be tested but also in the conductive particles in the conductive portion because the movement of the conductive particles caused by the up and down movement of the semiconductor element to be tested is transmitted. The conductive particles change in position inside the ruthenium rubber, and friction is generated between the conductive particles, so that gold plating of the conductive particles is easily peeled off, and the shape is easily deformed and worn. Therefore, there is a problem that the conductive portion of the conductive particles having the uneven shape depending on the point contact is largely pressed by the terminal of the semiconductor element to be tested, and if the number of times increases, the electrical characteristics are drastically deteriorated.

1 is a view showing a test socket of the prior art, and FIG. 2 is a view showing a contact between a terminal of a conventional semiconductor element and a conductive portion.

The test socket 10 of the prior art is composed of a conductive portion 12 that is in contact with a terminal (ball lead: ball; 17) of the semiconductor element 16 and an insulating portion 13 that functions as an insulating layer between the conductive portions 12.

The upper end portion and the lower end portion of the conductive portion 12 are in contact with the terminal 17 of the semiconductor element 16 and the conductive pad 15 of the test board 14, respectively, thereby electrically connecting the terminal 17 and the conductive pad 15, wherein the test board 14 and the test device connection.

The conductive portion 12 is formed by mixing conductive particles (conductive metal powder, 12a) and ruthenium rubber 13a in a crucible, and functions as a current-driven conductor, and the conductive particles 12a utilize a spherical shape. Conductive particles 12a.

Referring to Fig. 2, in order to improve the contact characteristics for testing the contact of the semiconductor element 16, the conductive portion 12 of the test socket 10 is subjected to the upper and lower pressures. When the conductive portion 12 is pressurized, the spherical conductive particles 12a in the upper portion are extruded downward, and the spherical conductive particles 12a in the intermediate portion are extruded to both sides.

The spherical type, that is, the uneven-shaped conductive particles 12 used in the conductive portion 12 of the conventional test socket 10 is a structure in which particles having a small size are fixed by the yoke rubber 13a. Therefore, there has been a problem that the spherical conductive particles 12a are detached or sunk from the conductive portion after performing a plurality of semiconductor tests, and the electrical characteristics and mechanical properties of the test socket 10 are lowered.

Further, there is a problem in that when the terminal 17 and the spherical conductive particle 12a come into contact with each other, they are in point contact with each other and are subjected to a concentrated load, whereby electrical characteristics and mechanical properties are deteriorated due to damage of the contact portion.

Patent Document 1: Korean Laid-Open Patent Publication No. 2009-0071312 (July 01, 2009) "Hybrid Connector Containing Plate-Type Conductive Particles".

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a test socket in which a semiconductor element is tested by providing a conductive portion having conductive particles which are easily bonded by point, line, and surface contact. Low and stable when the contact between the conductive portion and the terminal The initial resistance value can also prevent the conductive particles from being detached or sunk from the conductive portion when used for a long period of time, so that the resistance value is not greatly increased.

In order to achieve the above object, the present invention provides a test socket, comprising: an insulating portion made of ruthenium rubber; and at least one conductive portion formed by fusing a plurality of conductive particles and ruthenium rubber Through the insulating portion, the conductive portion includes: a main body portion for constituting an appearance; and a first contact portion provided on one side of the main body portion and in contact with a terminal of the semiconductor element to be inspected, the conductive particles The first contact portion conductive particles included only in the first contact portion are formed into a plurality of pillar shapes, and are transmitted through at least one of mechanical mixing, mechanical shock, and magnetic force applied to the conductive portion. The conductive particles are formed to be bonded in at least one direction, and the first contact portion conductive particles include: a particle body portion for constituting an appearance; and at least one opening portion formed to open one of the particle body portions The side is provided with a space in such a manner that another conductive particle can be bonded, and the joint portion is provided so as to be formed to protrude from the opening portion and to be inserted through the opening portion. Bonding to the openings of the other conductive particles, the first contact portion of the conductive particles being transmitted through the upper surface of one of the two conductive particles having the same shape The upper surface of the other conductive particle has a height difference, and a joint portion of the one conductive particle is formed by being inserted into an opening of the other conductive particle, and the first contact conductive particle is The width of the opening portion is formed to be larger than the width of the joint portion by 1 um to 30 um.

In this case, the conductive portion further includes: A second contact portion is provided on the other side of the body portion and is in contact with the conductive pad of the test board.

Further, the upper end of the insulating portion further includes a guide plate having a guide hole for guiding the contact position between the terminal and the first contact portion while preventing the conductive particles from being detached and sagged to the outside.

In this case, the conductive particles also include the same conductive particles as the first contact portion conductive particles in the second contact portion.

In this case, in the bonding of the conductive particles of the first contact portions, the bonding portion of one conductive particle is bonded to the opening of the other conductive particle by contact with any one of a point, a line or a surface contact. unit

In this case, the first contact portion conductive particles are manufactured by MEMS (Micro Electro Mechanical Systems) engineering.

Further, the opening portion 122 of the first contact portion conductive particle 120 is manufactured in a "U" shape, a "V" shape, or " "At least one of the shapes."

Further, the opening portion 122 of the first contact portion conductive particle 120 is manufactured as a "head" shape, a "W" shape or " "At least one of the shapes."

Further, the conductive portion is configured to have a ratio of a weight of the ruthenium rubber to a weight of the conductive particles of 0.5 to 10 times.

Further, the first contact portion conductive particles are formed of any one of iron, copper, zinc, tin, chromium, nickel, cobalt, aluminum, and tantalum, or two of the raw materials. The double alloy of the above raw materials is formed.

Further, the conductive particles include first conductive particles and second conductive particles having a shape different from the first conductive particles, and the first conductive particles include: a first particle body a portion for forming an appearance; and at least one opening portion formed to open one side of the first particle body portion and having a space for coupling the second conductive particles, the second conductivity The particles include: a second particle body portion for constituting an appearance; and a bonding portion provided to protrude from the second particle body portion and to be inserted into each of the openings of the conductive particles to each other The upper surface of each of the conductive particles is combined such that the upper surface of the second conductive particles has a height difference with respect to the upper surface of the first conductive particles.

In this case, the bonding portion of the second conductive particles is bonded to the first conductive particles by contact with any one of a point, a line, or a surface contact with respect to bonding of the respective conductive particles. Opening.

In this case, the width of the opening of the first conductive particles is formed to be larger than the width of the joint portion of the second conductive particles by 1 um to 30 um.

The test socket of the present invention provides the following effects: providing mechanical mixing Electroconductive particles which are easily combined with each other by mechanical impact and magnetic force, whereby the contact area caused by the point, line, and surface contact increases when contacting the terminals of the semiconductor element, so that stable and low initial resistance can be obtained. value.

Thereby, it is provided that the contact stability between the conductive particles and the semiconductor element is increased, and it is possible to cope with a high-frequency electrical signal transmitted to the semiconductor element with the development of the technology, and can cope with a compact pitch of the semiconductor element. (Pitch).

Further, according to the present invention, it is provided that the conductive particles in the bonded state are applied to the conductive portion, thereby forming a point, a line, and a surface contact when contacting the terminal of the semiconductor element, and can be dispersed in an existing spherical shape, that is, an irregular shape. The concentrated load generated in the conductive particles can provide an effect of maintaining the gold plating and shape of the conductive particles more permanently.

Therefore, even if the contact points are frequently generated, the damage and the positional deformation of the portion where the conductive portion is in contact can be minimized, and the bonding structure between the conductive particles can be maintained even if local deformation occurs, thereby improving the existing conductivity. Compared with the particles, the effect of stably maintaining the contact point can be improved.

Further, according to the present invention, by producing conjugated conductive particles by MEMS engineering, it is possible to produce bonded conductive particles from a plurality of materials, and it is possible to provide an effect of improving the durability of the conductive particles by double gold plating.

100‧‧‧Test socket

110‧‧‧Electrical Department

111‧‧‧ Main body

112‧‧‧First contact

113‧‧‧Second contact

120‧‧‧Electrical particles

120a‧‧‧ upper surface

121‧‧‧Particle body

122‧‧‧ openings

122a‧‧‧First contact surface

122b‧‧‧second contact surface

123‧‧‧Combination Department

130‧‧‧Insulation

131‧‧‧矽 rubber

140‧‧‧ test board

150‧‧‧Electrical gasket

160‧‧‧Semiconductor components

170‧‧‧ terminals

180‧‧‧ Guide plate

181‧‧‧ Guide hole

210‧‧‧First conductive particles

210a‧‧‧ upper surface

211‧‧‧First particle body

212‧‧‧ openings

220‧‧‧Second conductive particles

221‧‧‧Second particle body

222‧‧‧Combination Department

a‧‧‧Width of the opening

b‧‧‧Width of the joint

Fig. 1 is a view showing a test socket of the prior art.

2 is a view showing a state in which a terminal and a conductive portion of a conventional semiconductor element are in contact with each other.

Fig. 3 is a view showing a test socket according to an embodiment of the present invention.

Fig. 4 is a view showing conductive particles according to an embodiment of the present invention.

FIG. 5 is a view showing a state in which conductive particles are contained in a conductive portion according to an embodiment of the present invention.

Fig. 6 is a view showing an example in which conductive particles are in contact with each other according to an embodiment of the present invention.

Fig. 7 is a view showing an example of the shape of a conductive particle according to an embodiment of the present invention.

Fig. 8 is a view showing another example of installation of conductive particles according to an embodiment of the present invention.

Fig. 9 is a view showing a terminal of a semiconductor element in contact with a conductive portion according to an embodiment of the present invention.

FIG. 10 is a view schematically showing a state of change when the terminal of the semiconductor element according to the embodiment of the present invention is in contact with conductive particles that are not bonded to the upper surface.

Fig. 11 is a view showing conductive particles according to another embodiment of the present invention.

Fig. 12 is a view showing the results of electrical resistance tests of conductive particles and conventional conductive particles according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings, it is possible to specifically achieve the above object. Preferred embodiments of the invention are described. In the description of the embodiment, the same names and the same reference numerals are used for the same structures, and the additional description about this is omitted in the following.

3 is a view showing a test socket according to an embodiment of the present invention, FIG. 4 is a view showing conductive particles according to an embodiment of the present invention, and FIG. 5 is a view showing conductive particles according to an embodiment of the present invention. A diagram of the state of the conductive portion.

6 is a view showing an example in which conductive particles are in contact with each other according to an embodiment of the present invention, FIG. 7 is a view showing an example of a shape of a conductive particle according to an embodiment of the present invention, and FIG. 8 is a view showing an example of the shape of the conductive particles of the present invention. A view showing another example of the arrangement of the conductive particles of one embodiment.

9 is a view showing a terminal of a semiconductor element according to an embodiment of the present invention in contact with a conductive portion, and FIG. 10 is a view schematically showing a terminal of the semiconductor element according to an embodiment of the present invention and being bonded to an upper surface. FIG. 11 is a view showing a conductive particle according to another embodiment of the present invention, in which the same conductive particles are in contact with each other. FIG.

Next, Fig. 12 is a view showing the results of electrical resistance tests of conductive particles and conventional conductive particles according to an embodiment of the present invention.

As shown in FIG. 3, the test socket 100 of an embodiment of the present invention may include an insulating portion 130 and a conductive portion 110.

The insulating portion 130 is formed of the yoke rubber 131 and constitutes a main body of the test socket 100, and plays a supporting role when each of the conductive portions 110 to be described later receives a contact load.

More specifically, when the terminal 170 or the conductive pad 150 is in contact At this time, the insulating portion 130 formed of the yoke rubber 131 functions to absorb the contact force and protect the conductive spacer 150 and the respective terminals 170.

The tantalum rubber 131 used for the insulating portion 130 may be a diene rubber such as polybutadiene, natural rubber, polyisoprene, SBR, NBR or the like and a hydrogen compound thereof, such as styrene butadiene block copolymerization. Of block copolymers of styrene, isoprene isoprene copolymers and the like and their compounds, chloroprene, urethane rubber, polyethylene rubber, chloroester rubber, ethylene-propylene copolymer and ethylene propylene diene copolymer Any one.

The conductive portion 110 is formed by fusing a plurality of conductive particles 120 and a ruthenium rubber 131 and is provided to penetrate the insulating portion 130. At this time, the conductive particles 120 of the embodiment of the present invention are formed into a plurality of pillar shapes, and are formed into two or more kinds of conductive materials by at least one of mechanical mixing, mechanical shock, and magnetic force applied to the conductive portion. The particles 120 are combined in at least one direction.

According to an embodiment of the present invention, it is proposed that the conductive portion 110 including the conductive particles 120 is provided in the insulating portion 130. However, the conductive portion 110 is not limited thereto, and at least one or more of the semiconductor test elements may be formed in a size suitable for the size of the semiconductor test element. A plurality of the conductive portions 110.

At this time, the conductive portion 110 may include: a body portion 111 for constituting an appearance; a first contact portion 112 provided on one side of the body portion 111 and in contact with the terminal 170 of the semiconductor element 160; and a second contact portion 113 provided On the other side of the main body portion 111 and in contact with the conductive pad 150 of the test board 140. That is, the first contact portion 112 is provided for contact with the terminal 170, and the second contact portion 113 is provided for contact with the conductive pad 150, the body The portion 111 is provided to connect the first contact portion 112 and the second contact portion 113.

Further, a guide plate 180 having a guide hole 181 may be further included at the upper end of the insulating portion 130. This is provided to prevent the phenomenon that the first contact portion 112 is provided in the guide hole 181 of the guide plate 180 to guide the contact position between the terminal 170 of the semiconductor element to be inspected and the first contact portion 112. The conductive particles 120 of the first contact portion 112 are detached or sagged toward the outside due to the impact of the terminal 170 at the time of contact with each other.

As shown in FIGS. 4 and 5, the conductive particles 120 according to an embodiment of the present invention may include a particle main body portion 121, an opening portion 122, and a joint portion 123 for constituting an appearance.

At this time, the opening portion 122 is formed to be one side of the particle main body portion 121 and formed in a space state in which the other conductive particles 120 can be joined, and the joint portion 123 is formed to protrude from the opening portion 122 and is inserted through the opening portion 122. The openings 122 of the other conductive particles 120 are bonded to each other.

Further, in the bonding of the respective conductive particles 120, the bonding portion 123 of one conductive particle 120 can be bonded to the opening of the other conductive particle 120 by contact with any one of a dot, a line, or a surface contact.

In this case, it is preferable that the opening portion 122 of the conductive particle 120 is provided around the space: the first contact surface 122a is provided to be in contact with one side of the joint portion 123; and the second contact surface 122b is provided as a supply The other side of the joint portion 123 is in contact.

More specifically, as shown in FIG. 6 , when the joint portion 123 of the conductive particles 120 is bonded to the opening portion 122 of the other conductive particle 120 , the joint portion 123 transmits any one of a point, a line or a surface contact. The contact is coupled to the first contact surface 122a of the opening portion 122, or is coupled to the first contact surface 122a and the second contact surface 122b by any one of a point, a line or a surface contact. Therefore, the fastening force between each other increases due to an increase in the contact area between the bonded conductive particles 120.

Further, in the process of manufacturing the conductive portion 110, each of the conductive particles 120 included in the conductive portion 110 is disposed in a state in which the pillars are erected, that is, the flat surface portion of the bonded conductive particles 120 can be combined with the semiconductor. The conductive particles 120 are disposed in such a manner that the terminals 170 of the element are in contact with each other. Needless to say, the conductive particles 120 may be disposed in a state in which the pillars are lying in the manufacturing process, that is, the conductive particles may be disposed in a state where the pillar surface portion of the bonded conductive particles 120 is in contact with the terminal 170 of the semiconductor element. 120, but in the process of combining the respective conductive particles 120, it is naturally possible to obtain a preferable phenomenon in which more conductive particles 120 are disposed in a vertical state.

Thereby, the conductive particles 120 bonded to the terminal 170 of the semiconductor element are also in contact with each other by point contact, line or surface contact, and the impact load is dispersed and transmitted to the conductive particles 120. Alleviate. Therefore, the resistance value is kept stable while having a low resistance value, so that the life of the product can be improved, and the phenomenon of detachment and sagging of the respective conductive particles 120 due to an increase in the contact area can be prevented.

In addition, as shown in FIG. 10, each of the conductive particles 120 may be The upper surface 120a of the other conductive particle 120 has a height difference with respect to the upper surface 120a of one conductive particle 120. At this time, for convenience of explanation, any of both surfaces of the conductive particles 120 is referred to as an upper surface 120a. Therefore, when the combined conductive particles 120 are inverted, the surface located at the lower portion may also be referred to as an upper surface.

When the conductive particles 120 bonded in this state are in contact with the terminal 170 of the semiconductor element, the contact load of the terminal 170 pressed from the upper portion and the elastic force of the yoke rubber 131 fastened to the bonded conductive particles 120 are applied to the upper portions. The surface 120a can move in the same planar state without a height difference.

The conductive particles 120 can be fabricated by MEMS engineering. The MEMS (micro electro mechanical system) engineering mainly utilizes a photomask process and an imprint technique of semiconductor integrated circuit fabrication technology.

By producing the conductive particles 120 by MEMS engineering, the conductive particles 120 having a uniform size and shape can be produced, and the electrical stability of the conductive particles 120 can be obtained.

Further, it is possible to manufacture the conductive particles 120 of various other shapes different from the conductive particles of the conventional spherical shape, that is, the uneven shape, and in particular, since the contact areas are increased, the contact area is increased, and the ruthenium rubber 131 and the conductive material can be increased. The fastening force between the particles 120.

Further, compared with the conventional spherical conductive particles, the contact range of the conductive particles and the ruthenium rubber 131 can be made wider, and the contact range with the terminal 170 of the semiconductor element can be made wider, and a lower initial can be obtained. At the same time as the initial resistance value, it is possible to prevent the conductive particles 120 from being detached or sunk from the yoke rubber 131 due to the contact impact of the terminals.

Further, the conductive particles 120 can be produced using a plurality of kinds of raw materials, and the durability of the conductive particles 120 by the double gold plating process can be ensured.

The conductive particles 120 according to an embodiment of the present invention are particles which are manufactured to have one opening portion 122 and particles which are manufactured to have two openings 122.

More specifically, as shown in FIG. 7, the conductive particles 120 are formed in a column shape having both surfaces and have one opening portion 122, and the opening portion 122 can be manufactured in a "U" shape, a "V" shape, or " Any shape in the shape.

Further, the conductive particles 120 are formed to have two opening portions 122, and can be manufactured in a "head" shape, a "W" shape, or " "At least one of the shapes."

Needless to say, although the shape of the conductive particles 120 is not illustrated, if it is a cross shape including at least one opening portion 122 and the joint portion 123, a slit shape, and a LEGO ( The shape in which the shape, the spring shape, the tube shape, or the irregular shape can be combined with each other can be manufactured into any shape. However, in view of convenience in manufacturing, it is preferable to manufacture the shape described above.

The conductive particles 120 as described above cannot be manufactured by a conventional mechanical manufacturing method. That is, the conductive particles 120 of several tens of um in size can be manufactured by MEMS engineering.

Preferably, the conductive particles 120 of an embodiment of the present invention are formed in a uniform shape in a range of a dimensional tolerance of -10 um to +10 um; preferably, the conductive portion 110 has a weight and a bonding type of the ruthenium rubber 131. The ratio of the weight of the conductive particles 120 is 0.5 to 10 times. In other words, when the conductive particles 120 are formed at a ratio of 10 times or more with respect to the weight of the ruthenium rubber, there is a possibility that the conductive particles 120 are detached due to the insufficient amount of the ruthenium rubber 131.

Further, preferably, the width a of the opening portion 122 of the conductive particles 120 is formed to be larger than the width b of the joint portion 123 by 1 um to 30 um. The 1 um to 30 um is a range in which stable contact with respect to a point, a line, and a surface can be formed when the conductive particles 120 are bonded between each of the conductive particles 120 by an external force caused by mechanical mixing, mechanical shock, and magnetic force, and is a terminal that is subjected to a semiconductor element. When the contact load of 170 is 170, the range of the slit is generated so as to be able to move between the bonded conductive particles 120.

The conductive particles 120 may be formed of any one of iron, copper, zinc, tin, chromium, nickel, silver, cobalt, aluminum, and rhodium, or may be formed of a double alloy of two or more of these materials. .

The conductive particles 120 of one embodiment of the present invention can be chrome-plated to improve strength and durability. Further, the method of plating the conductive particles 120 is not particularly limited, and for example, gold plating can be performed by an electroless gold plating or an electrolytic gold plating method.

The conductive particles 120 of one embodiment of the present invention may be included in at least one of the first contact portion 112 and the second contact portion 113.

As shown in FIG. 3 and FIG. 8, in the embodiment of the present invention, The case where the conductive particles 120 are included in the first contact portion 112 and the case where the conductive particles 120 are included in the first contact portion 112 and the second contact portion 113 are obtained. Although not shown, the conductive particles 120 may be formed only on the second contact portion 113 and may be formed over the entire conductive portion 110.

In one embodiment of the present invention, conductive particles in which conductive particles of the same shape and structure are combined with each other are proposed. In another embodiment of the present invention, conductive particles combined with each other are formed in other shapes. Happening.

In this case, the same features as those proposed in one embodiment of the present invention, for example, a method of manufacturing each conductive particle, a size, a weight ratio, a material, and the like are omitted.

That is, as shown in FIG. 11, the conductive particles of another embodiment of the present invention may include the first conductive particles 210 and the second conductive particles 220.

At this time, the first conductive particles 210 may include: a first particle body portion 211 for constituting an appearance; and at least one opening portion 212 formed to open one side of the first particle body portion 211 and capable of being second The conductive particles 220 have a space in which they are combined.

The second conductive particles 220 may include: a second particle body portion 221 for constituting an appearance; and a bonding portion 222 provided to protrude from the second particle body portion 221 and to be inserted into the first conductive particles 220 Each of the openings 212 can be coupled to each other.

That is, another embodiment of the present invention is provided such that the first conductive particles 210 are formed as an opening portion 212 having a concave shape, and the second conductive The particles 220 are formed into a joint portion 222 having a convex shape, so that a mutual bond can be achieved.

At this time, with respect to the bonding of the respective conductive particles 210 and 220, the bonding portion 222 of the second conductive particles 220 can be bonded to the opening portion 212 of the first conductive particle 210 by contact with any one of a dot, a line or a surface contact. .

Further, the upper surface 220a combined into the second conductive particles 220 has a height difference with respect to the upper surface 210a of the first conductive particles 210.

Further, preferably, the width of the opening portion 220 of the first conductive particles 210 is formed to be larger than the width of the joint portion 222 of the second conductive particles by 1 um to 30 um.

In addition, as shown in FIG. 11, in another embodiment of the present invention, it is proposed that the opening portion has a "U" shape and " The shape is manufactured, but if any one of the first conductive particles 210 or the second conductive particles 220 has the opening portion 212 and the other conductive particle has the shape of the joint portion 222, it can be manufactured in all shapes. This conductive particle is taken for granted.

In another embodiment of the invention as described above, the same actions and effects as those of an embodiment of the present invention can be obtained, and thus detailed description is omitted.

The operation of the test socket having the bonded conductive particles according to an embodiment of the present invention will be described below with reference to Figs. 9 and 10 .

First, prepare a test board provided with the test socket 100 140. At this time, the conductive portion 110 of the test socket 100 includes conductive particles bonded so that the upper surface 120a of the conductive particles 120 have the same plane, and conductive particles bonded in a different manner.

Next, the second contact portion 113 of the conductive portion 110 is in electrical contact with the conductive pad 150 of the test board 140. At this time, the conductive particles 120 included in the conductive portion 110 are bonded by the magnetic force of mechanical mixing, mechanical shock, and electrical connection.

Next, as shown in FIG. 9, the terminal 170 of the semiconductor element 160 transferred to the upper portion of the test socket 100 pressurizes the first contact portion 112 of the conductive portion 110 at a predetermined pressure and is electrically connected by elastic contact. At this time, as shown in FIG. 10a to FIG. 10c, the conductive particles combined to be different in the upper surface 120a are deformed by the impact of the contact load of the terminal 170 and the elastic force of the yoke rubber in the same plane. Here, FIG. 10a is a view showing conductive particles that are bonded to each other with different upper surfaces, FIG. 10b is a cross-sectional view of 10a, and FIG. 10c is a view showing a state in which conductive particles are deformed when they are in contact with a terminal.

In the state as described above, the test signal is transmitted to the semiconductor element 160 via the test board 140 and with the test socket 100 as a medium, thereby forming a test project.

In addition, FIG. 12 is a graph showing the results of testing the electric resistance between the conductive particles in which the through-holes are formed in the conventional clamp portion and the conductive particles 120 of the embodiment of the present invention, and the vertical axis represents the resistance value and the horizontal axis. A test point indicating each conductive particle.

As shown in the chart, the following results can be obtained: the existing guide The electric resistance value of the electric particles is unstable, and the value exceeding the range is repeated. On the contrary, the electric resistance value of the electroconductive particle 120 of one embodiment of the present invention is stable, and compared with the conventional conductive particles. Low resistance value.

As described above, the present invention is not limited to the specific preferred embodiments described above, and various modifications can be made by those skilled in the art to which the present invention pertains without departing from the spirit and scope of the invention as claimed. This is within the scope of the invention.

120‧‧‧Electrical particles

120a‧‧‧ upper surface

121‧‧‧Particle body

122‧‧‧ openings

122a‧‧‧First contact surface

122b‧‧‧second contact surface

123‧‧‧Combination Department

Claims (13)

A test socket, comprising: an insulating portion (130) composed of a ruthenium rubber (131); and at least one conductive portion (110) formed by a plurality of conductive particles and a ruthenium rubber (131) phase The insulating portion (130) is fused and penetrates, the conductive portion (110) includes: a main body portion (111) for constituting an appearance; and a first contact portion (112) provided at the main body portion The side is in contact with the terminal (170) of the semiconductor element (160) to be inspected, and the first contact portion conductive particles (120) included in the first contact portion (112) of the conductive particles are formed as a plurality of pillar shapes, two or more conductive particles (120) being formed to be bonded in at least one direction by at least one of mechanical mixing, mechanical shock, and magnetic force applied to the conductive portion, the first contact portion The conductive particles (120) include: a particle body portion (121) for constituting an appearance; at least one opening portion (122) formed to open one side of the particle body portion (121) and to provide another conductivity The method in which the particles (120) are combined has a space; and the joint portion (123) is provided as a The opening portion (122) is formed to protrude from the center and is inserted into the opening portion (122) of the other conductive particle (120) to be coupled to each other, and the first contact portion conductive particle (120) In combination with the upper surface (120a) of one of the two electroconductive particles (120) having the same shape, the upper surface (120a) of the other electroconductive particle (120) has a height difference, Inserting a junction of a conductive particle into the The opening of the other conductive particle is formed, and the first contact portion conductive particle (120) is formed such that the width of the opening (122) is larger than the width of the bonding portion (123) by 1 um to 30 um. The test socket according to claim 1, wherein the conductive portion (110) further comprises: a second contact portion (113) provided on the other side of the main body portion (111) and with the test board The conductive pad (150) of (140) is in contact. The test socket according to claim 2, characterized in that the upper end of the insulating portion (130) further includes a guide plate (180) having a guide hole (181) for guiding the terminal (170) and the first The contact position between the contact portions (111) prevents the conductive particles (120) from being detached and depressed to the outside. The test socket according to claim 3, characterized in that the second contact portion (113) also includes the same conductive particles as the first contact portion conductive particles. The test socket according to claim 1, characterized in that, for the combination of the first contact portion conductive particles (120), the bonding portion (123) of one conductive particle (120) transmits dots, lines, Or any one of the surface contacts is bonded to the opening portion (122) of the other conductive particle (120). The test socket according to claim 5, characterized in that the first contact portion conductive particles (120) are manufactured by MEMS engineering. The test socket according to claim 1, characterized in that the opening portion (122) of the first contact portion conductive particles (120) is manufactured in a "U" shape, a "V" shape or " "At least one of the shapes." The test socket according to claim 1, characterized in that the opening portion (122) of the first contact portion conductive particles (120) is manufactured in a "head" shape, a "W" shape or " "At least one of the shapes." The test socket according to claim 1, wherein the conductive portion (110) is formed by a ratio of a weight of the ruthenium rubber to a weight of the conductive particles (120) of 0.5 to 10 times. . The test socket according to claim 1, wherein the first contact conductive particles (120) are made of any one of iron, copper, zinc, tin, chromium, nickel, cobalt, aluminum, and antimony. The material is formed or formed of a double alloy of two or more of the raw materials. A test socket, comprising: an insulating portion (130) composed of a ruthenium rubber (131); and At least one conductive portion (110) is formed by fusing a plurality of conductive particles (120) and a ruthenium rubber (131) and penetrating through the insulating portion (130), and the conductive particles (120) are formed For a plurality of pillar shapes, two or more conductive particles (120) are formed to be bonded in at least one direction by at least one of mechanical mixing, mechanical shock, and magnetic force applied to the conductive portion, the conductive particles (120) comprising first conductive particles (210) and second conductive particles (220) having a shape different from the first conductive particles, the first conductive particles (210) comprising: first particles a body portion (211) for constituting an appearance; and at least one opening portion (212) formed to open one side of the first particle body portion (211) and to supply the second conductive particles (220) The combined manner has a space, and the second conductive particles (220) include: a second particle body portion (221) for constituting an appearance; and a bonding portion (222) provided from the second particle body The portion (221) is formed to protrude and is inserted into each of the openings of the conductive particles (210) (2) 12) in combination with each other, each of the conductive particles (210, 220) is combined into an upper surface (220a) of the second conductive particles (220) with respect to the first conductive particles (210) The upper surface (210a) has a height difference. The test socket according to claim 11, characterized in that, for the combination of the respective conductive particles (210, 220), the joint portion (222) of the second conductive particles (220) transmits dots, lines or faces In contact An opening (212) that is bonded to the first conductive particles (210). The test socket according to claim 12, wherein a width of the opening portion (212) of the first conductive particle (210) is formed to be a joint portion with the second conductive particle (220) The width of (222) is 1um~30um.