TWI692642B - Conductive contact and anisotropic conductive sheet with the same - Google Patents

Abstract

The present invention relates to a test used for inspecting semiconductor elements, etc. An anisotropic conductive sheet such as a socket, more specifically, the present invention relates to an anisotropic conductive sheet including a plurality of contact portions and an insulating portion, the plurality of contact portions including a conductive spring and a conductive powder, the insulating portion The adjacent contact portion is insulated and supports the contact portion. The present invention provides an anisotropic conductive sheet that is disposed between an element to be inspected and an inspection device, and electrically connects the terminal of the element and the contact pad of the inspection device to each other. The anisotropic conductive sheet includes: a plurality of contact portions arranged at positions corresponding to the terminals of the above-mentioned elements and contact pads of the inspection device, and having conductivity in the thickness direction; and an insulating portion, which insulates adjacent contact portions from each other, and Support contact. In addition, the contact portion includes: an elastic matrix; a conductive spring arranged in the elastic matrix; and a plurality of conductive particles arranged in the thickness direction of the elastic matrix. The present invention is characterized in that the conductive particles are arranged at a high density to the peripheral portion of the wire constituting the conductive spring compared to the center of the elastic matrix. In the present invention, the conductive particles are concentratedly arranged to the peripheral portion of the wire constituting the conductive spring, thereby having the advantages of reducing the amount of conductive particles and improving the conductivity of the contact portion.

Description

Conductive contact and anisotropic conductive sheet including the same

The present invention relates to an anisotropic conductive sheet for testing sockets and the like used for inspecting semiconductor elements, and more specifically, the present invention relates to an anisotropic conductive sheet including a plurality of contact portions and insulating portions, The plurality of contact portions include a conductive spring and conductive powder, and the insulating portion insulates adjacent contact portions and supports the contact portions.

After manufacturing the semiconductor element, it is necessary to check the performance of the manufactured semiconductor element. When inspecting a semiconductor element, it is necessary to use a test socket that electrically connects the contact pad of the inspection device and the terminal of the semiconductor element.

The test socket includes an anisotropic conductive sheet including a contact portion in which conductive powder is arranged along the longitudinal direction of the silicone rubber, and an insulating portion that insulates the adjacent contact portion and supports the insulating portion of the contact portion, and has the following advantages: It can absorb mechanical impact or deformation to achieve a soft connection, and the manufacturing cost is low.

FIG. 1 is a diagram showing an anisotropic conductive sheet of a conventional test socket. The anisotropic conductive sheet 10 of the test socket of the prior art includes: a contact portion 11 that contacts the terminal 2 of the semiconductor element 1; and an insulating portion 15 that insulates the adjacent contact portion 11 and supports the contact portion. The upper and lower ends of the contact portion 11 are The terminal 2 of the body element 1 and the contact pad 4 of the semiconductor inspection device 3 are in contact to electrically connect the terminal 2 and the contact pad 4. The contact portion 11 is formed by mixing spherical conductive particles 12 of a smaller size in silicone resin and solidifying it, and it functions as a conductive conductor.

Although not shown, a metal frame is joined to the peripheral portion of the anisotropic conductive sheet 10. A guide hole corresponding to a guide pin (not shown) of the inspection device 3 is formed in the metal frame. The guide pin and the guide hole are used to align the test socket to the inspection device 3.

When the contact portion 11 of the anisotropic conductive sheet 10 comes into contact for inspection of the semiconductor element 1, it is pressed up and down. When pressure is applied to the contact portion 11, the conductive particles 12 at both ends of the contact portion 11 move downward, and the conductive particles 12 at the middle portion gradually move sideways. Therefore, there is a problem that after performing multiple inspections, the spherical conductive particles 12 are separated from the contact portion 11 and the electrical characteristics and mechanical characteristics of the anisotropic conductive sheet 10 are degraded. That is, the conventional anisotropic conductive sheet 10 has a problem of short life.

In order to solve this problem, the Korean registered patent No. 10-1493898 discloses the following semiconductor test sockets: as shown in FIG. 2, a conductive spring 23 is arranged inside the silicone rubber matrix 21, and a conductive spring is arranged The conductive particles 22 are arranged in a space other than the space 23 to form the contact portion 20, and the adjacent contact portion 20 is insulated by the silicone rubber 25 while supporting the contact portion. Such a semiconductor test socket has the advantages of extended life due to conductive springs and increased current capacity.

Prior technical literature

Patent Literature

Japanese Registered Patent No. 04379949

Korea Registered Utility Model No. 20-0312740

Korean Registered Patent No. 10-1493898

Korean Registered Patent No. 10-1566995

Korean Registered Patent No. 10-1493901

However, recently, as the interval between the terminals of the semiconductor element becomes narrower, the interval between the contact portions of the anisotropic conductive sheet also becomes narrower, and the diameter of the contact portion also becomes smaller. If the diameter of the contact portion becomes smaller, the size and amount of conductive particles included in the contact portion also need to be reduced. Therefore, there is a need for a method that can reduce the amount of conductive particles and improve the conductivity of the contact portion.

The present invention is for meeting such a demand, and its object is to provide an anisotropic conductive sheet capable of reducing the amount of conductive particles and improving the conductivity of the contact portion.

In addition, an object of the present invention is to provide a contact portion that is attached to an anisotropic conductive sheet or the like and electrically connects a terminal of an element and a contact pad of an inspection device.

In order to achieve the above object, the present invention provides an anisotropic conductive sheet disposed between an element to be inspected and an inspection device, and electrically connecting the terminal of the element and the contact pad of the inspection device to each other.

The anisotropic conductive sheet includes: a plurality of contact portions arranged at positions corresponding to the terminals of the above-mentioned elements and contact pads of the inspection device, and having conductivity in the thickness direction; and an insulating portion, which insulates adjacent contact portions from each other, and Support contact.

In addition, the contact portion includes: an elastic matrix; a conductive spring arranged in the elastic matrix; and a plurality of conductive particles arranged in the thickness direction of the elastic matrix.

The present invention is characterized in that the conductive particles are arranged at a high density to the peripheral portion of the wire constituting the conductive spring compared to the center of the elastic matrix. According to such structural characteristics, the present invention has the ability to reduce the amount of conductive particles, and The advantage of improving the electrical conductivity of the contact.

In addition, the present invention provides an anisotropic conductive sheet characterized in that the conductive particles are disposed at both ends of the elastic matrix at a higher density than in the center of the elastic matrix.

In the present invention, the conductive spring may be a coil spring.

In addition, in the additional characteristic configuration, the ratio of the thickness of the insulating portion to the length of the contact portion may be 0.7 or more and less than 0.9. According to such a structural feature, there is an advantage that the insulating portion can be prevented from contacting the semiconductor element during inspection, so that the semiconductor element can be prevented from being contaminated or the semiconductor element and the insulating portion being stuck together. The contact portion of the present invention includes a conductive spring, so it is easy to make the thickness of the contact portion thicker than the insulating portion.

In addition, an anisotropic conductive sheet is provided, characterized in that the conductive spring is a spiral spring in the form of an hourglass having a larger diameter from the center toward both ends. According to this structural feature, there is an advantage that the contact portion can be more easily bent in a direction perpendicular to the thickness direction, so that even if a misalignment occurs between the terminal and the contact pad, a smooth connection state can be maintained.

In addition, the present invention provides an anisotropic conductive sheet, further comprising a conductive plate disposed inside the elastic matrix so as to be adjacent to at least one of both end portions of the conductive spring. According to such a structural feature, there is an advantage that the terminal of the element and the contact pad of the inspection device can be prevented from being damaged by the relatively sharp tip portion of the conductive spring.

In addition, there is provided an anisotropic conductive sheet characterized in that a through hole is formed in the central portion of the conductive plate.

In addition, according to the present invention, a conductive contact is provided, which includes: Matrix, a conductive spring arranged in the elastic matrix, and a plurality of conductive particles arranged in the thickness direction of the elastic matrix. Compared to the central portion of the elastic matrix, the conductive particles are arranged at a high density to the peripheral portion of the wire constituting the conductive spring.

According to the present invention, the conductive particles are concentratedly arranged to the edge of the wire constituting the conductive spring, thereby having the advantages of reducing the amount of conductive particles and improving the conductivity of the contact portion. In more detail, the conductive powder concentrated around the wire constituting the conductive spring fills the space between the wires of the conductive spring, thereby having the advantage that the elongated conductive path formed by the conductive spring is changed to be shorter and thicker , The electrical conductivity of the contact is improved.

In addition, it also has the advantage that the conductive particles are concentrated, thereby preventing the lifespan from being shortened due to the short circuit of the contact part.

1: Semiconductor components

2: terminal

3: Check the device

4: contact pad

21: Silicone rubber matrix

25: Silicone rubber

10, 100, 200, 300, 400: anisotropic conductive sheet

11, 20, 110, 210, 310, 410: contact

111, 211, 311, 411: elastic matrix

12, 22, 112, 212, 312, 412: conductive particles

23, 113, 213, 313, 413: conductive spring/coil spring

15, 115, 215, 315, 415: insulation

416: conductive plate

l: length

t: thickness

1 and 2 are diagrams showing an anisotropic conductive sheet of a conventional test socket.

3 is a diagram showing an anisotropic conductive sheet according to an embodiment of the present invention.

4 is a cross-sectional view showing changes in the contact portion according to the pressure applied in the thickness direction.

FIG. 5 is a diagram showing an anisotropic conductive sheet according to another embodiment of the present invention.

6 is a diagram showing an anisotropic conductive sheet according to still another embodiment of the present invention.

7 is a diagram showing an anisotropic conductive sheet according to still another embodiment of the present invention.

Hereinafter, referring to the accompanying drawings, embodiments of the present invention will be described in detail. However, the present invention can be implemented in various forms, and is not limited to the embodiments disclosed below. These embodiments are only for the complete disclosure of the present invention and for those who have common knowledge in the technical field of the present invention to completely explain the invention Scope. The same symbol in the figure indicates the same element.

3 is a diagram showing an anisotropic conductive sheet according to an embodiment of the present invention.

The anisotropic conductive sheet 100 functions to electrically connect the contact pad 4 of the inspection device 3 and the terminal 2 of the semiconductor element 1. The anisotropic conductive sheet 100 has conductivity in the thickness direction at a position corresponding to the contact pad 4 of the inspection device 3 and the terminal 2 of the semiconductor element 1. However, it does not have conductivity in the direction perpendicular to the thickness direction.

As shown in FIG. 3, the anisotropic conductive sheet 100 according to an embodiment of the present invention includes a contact portion 110 and an insulating portion 115. The contact portions 110 are respectively arranged at positions corresponding to the terminals 2 of the semiconductor element 1 and the contact pads 4 of the inspection device 3. The contact portion 110 has conductivity in the thickness direction.

The contact portion 110 includes an elastic substrate 111, a conductive spring 113, and conductive particles 112. The contact portion 110 may be formed integrally with the insulating portion 115 or may be formed so as to be separable from the insulating portion 115. In the case of being detachable from the insulating portion 115, there is an advantage that only the defective contact portion 115 can be replaced alone.

In this embodiment, the elastic substrate 111 is substantially cylindrical. The elastic substrate 111 functions to support the conductive spring 113 and the conductive particles 112. In addition, it functions to elastically deform during measurement to reduce the pressure applied to the terminal 2 and the contact pad 4, and to tightly contact the contact portion 110 to the terminal 2 and the contact pad 4.

The elastic matrix 111 may be formed of various polymer substances. For example, silicone rubber may be included. Silicone rubber can be obtained by hardening liquid silicone rubber. The hardness of the silicone rubber is preferably 10 to 40 (shore A), and the elongation is preferably about 300% to 700%. When the hardness exceeds 40, the semiconductor device 1 may cause micro die cracks. In addition, when the elongation is less than 300%, the contact portion 110 acts as its restraining force when it shrinks or expands, which causes an increase in the load. When the elongation is 700% or more, it recovers when recovering The risk of weakening.

The conductive spring 113 includes a substance excellent in conductivity. The conductive spring 113 may include stainless steel, aluminum, bronze, nickel, gold, silver, palladium, etc. or alloys thereof. In addition, a plating layer with high conductivity can be provided. The conductive spring 113 may be in the form of a cylindrical coil spring made of a spirally wound wire. The conductive spring 113 preferably has an outer diameter equal to or slightly smaller than the diameter of the elastic substrate 111. Also, the length of the conductive spring 113 may be equal to or longer than the thickness of the insulating portion 115.

The outer diameter of the conductive spring 113 is preferably about 10% larger than the size of the terminal 2 of the semiconductor element 1. If the outer diameter is smaller than this range, there is a problem that the electrical conductivity decreases, the spring constant increases, and the load increases. If the outer diameter is larger than this range, interference will occur to the adjacent terminal 2.

In addition, the spring constant is preferably 30 or less. When the spring constant exceeds 30, the object to be measured may be damaged.

In addition, the effective number of turns of the coil spring is preferably once every 0.128mm. When it is less than this value, the spring constant may increase and the load may increase. When it exceeds this value, there is a problem that the maximum operating range decreases. .

The conductive particles 112 are arranged in the thickness direction of the elastic substrate 111. The conductive particles 112 and the conductive spring 113 face the anisotropic conductive sheet 100 in the thickness direction Give conductivity. When a pressure is applied to the terminal 2 of the semiconductor element 1 and the contact pad 4 of the inspection device 3 in order to inspect the semiconductor element 1, the anisotropic conductive sheet 100 disposed between the terminal and the contact pad is compressed in the thickness direction . Furthermore, the conductive particles 112 are close to each other, and the electrical conductivity is further increased.

The conductive particles 112 may be realized by a single conductive metal material such as iron, copper, zinc, chromium, nickel, silver, cobalt, aluminum, etc., or an alloy material of two or more of the above metal materials. In addition, the conductive particles 112 can also be realized by coating the surface of the core metal with a metal such as gold having excellent conductivity.

4 is a cross-sectional view showing changes in the contact portion according to the pressure applied in the thickness direction. As shown in FIGS. 3 and 4, in the present invention, the conductive particles 112 are not uniformly arranged on the elastic substrate 111, but are arranged at various positions with different densities. That is, the conductive particles 112 are arranged at a high density to the peripheral portion of the wire constituting the conductive spring 113, that is, around the wire, to fill the space between the wires. In addition, the conductive particles 112 are arranged to both ends of the elastic matrix 111 at a higher density than in the center of the elastic matrix 111. As a result, the conductive spring 113 and the conductive particles 112 constitute a substantially cylindrical shape.

In addition, as shown in FIG. 4, when pressure is applied, the conductive particles 112 move toward the center of the elastic matrix 111 having a low density of the conductive particles 112 and the conductive particles 112 that do not contact each other when the pressure is low also contact each other. Thus, the contact area is further increased. As a result, the conductivity further increases.

The insulating portion 115 functions to insulate adjacent contact portions 110 from each other. In addition, it also functions to support the contact portion 110. The insulating portion 115 is not particularly limited as long as it is an insulating material having elastic force. For example, silicone, polybutadiene, polyisoprene, styrene-butadiene rubber (Styrene Butadiene Rubber, SBR), Nitrile Butadiene Rubber (NBR) and its hydrogen compounds are realized by diene rubber. In addition, it can also be realized by block copolymers such as styrene-butadiene block copolymers, styrene-isoprene block copolymers, and their hydrogen compounds. In addition, it can also be realized by chloroprene, polyurethane rubber, polyethylene rubber, epichlorohydrin rubber, ethylene-propylene copolymer, ethylene propylene diene copolymer, and the like.

Although not shown, a metal frame may be joined to the periphery of the insulating portion 115. The metal frame is formed with guide holes into which guide pins provided in the inspection device 3 are inserted. The guide pin and the guide hole are used to align the anisotropic conductive sheet to the inspection device 3.

FIG. 5 is a diagram showing an anisotropic conductive sheet according to another embodiment of the present invention. The anisotropic conductive sheet 200 of this embodiment includes a contact portion 210 and an insulating portion 215. The contact portion 210 includes an elastic substrate 211, a conductive spring 213, and conductive particles 212.

Unlike the embodiment shown in FIG. 3, the length of the contact portion 210 is longer than the thickness of the insulating portion 215 in this embodiment. The ratio of the thickness t of the insulating portion 215 to the length l of the contact portion 210 may be 0.7 or more and less than 0.9. As shown in FIG. 5, the contact portion 210 may protrude at both ends, or one of the two ends may protrude. The present embodiment having such a configuration feature has the advantage that the insulating portion 215 can be prevented from contacting the semiconductor element 1 during inspection, so that the semiconductor element 1 can be prevented from being contaminated or the semiconductor element 1 and the insulating portion 215 being stuck together. Since the contact portion 210 of the present invention includes the conductive spring 213, it is easy to make the thickness of the contact portion 210 thicker than the insulating portion 215.

6 is a diagram showing an anisotropic conductive sheet according to still another embodiment of the present invention. The anisotropic conductive sheet 300 of this embodiment includes a contact portion 310 and an insulating portion 315. The contact portion 310 includes an elastic substrate 311, a conductive spring 313, and conductive particles 312.

Unlike the embodiment shown in FIG. 3, the present embodiment uses an hourglass-shaped coil spring 313. This embodiment has the following advantages: the contact portion 310 can be more easily aligned with the thickness The direction is perpendicular to the bend, so even if the terminal 2 and the contact pad 4 are misaligned, the smooth connection state can be maintained.

7 is a diagram showing an anisotropic conductive sheet according to still another embodiment of the present invention. The anisotropic conductive sheet 400 of this embodiment includes a contact portion 410 and an insulating portion 415. The contact portion 410 includes an elastic substrate 411, a conductive spring 413, and conductive particles 412.

Unlike the embodiment shown in FIG. 3, this embodiment further includes a conductive plate 416 disposed adjacent to the upper and lower ends of the coil spring 413. Through holes are formed in the conductive plates 416, respectively. The through hole is a passage through which the conductive particles 412 and the elastic matrix 411 can pass.

This embodiment has the advantage that the terminal 2 and the contact pad 4 can be prevented from being damaged by the front end portion of the coil spring 413. In addition, it also has the advantage that the conductive plate 416 directly contacts the terminal 2 and the contact pad 4 or the conductive particles 412 disposed between the terminal and the contact pad can increase the current capacity.

The above has been described with reference to the drawings and embodiments, but those skilled in the art should understand that various modifications and changes can be made to the present invention without departing from the technical idea of the present invention described in the patent application scope of the following invention change.

For example, although it is shown in FIG. 7 that the conductive plate is disposed at both ends of the coil spring, it may be disposed only at one of the upper end or the lower end.

1: Semiconductor components

2: terminal

3: Check the device

4: contact pad

100: anisotropic conductive sheet

110: contact

111: elastic matrix

112: conductive particles

113: conductive spring

115: Insulation

Claims (13)

An anisotropic conductive sheet disposed between an element to be inspected and an inspection device, and electrically connecting terminals of the element and contact pads of the inspection device to each other, the anisotropic conductive sheet includes a plurality of A contact portion and an insulating portion, the plurality of contact portions are arranged at positions corresponding to the terminals of the element and the contact pads of the inspection device, and the plurality of contact portions have conductivity in the thickness direction, The insulating portion insulates the plurality of adjacent contact portions from each other and supports the plurality of contact portions, each of the plurality of contact portions includes an elastic matrix, a conductive spring disposed in the elastic matrix, and a rim The plurality of conductive particles arranged in the thickness direction of the elastic matrix are arranged at a high density to the peripheral portion of the wire constituting the conductive spring as compared with the center of the elastic matrix. The anisotropic conductive sheet as described in item 1 of the patent application range, wherein the plurality of conductive particles are disposed at both ends of the elastic matrix at a higher density than in the central portion of the elastic matrix unit. The anisotropic conductive sheet as described in item 1 of the patent application range, wherein the conductive spring is a coil spring. The anisotropic conductive sheet as described in item 1 of the patent application range, wherein the ratio of the thickness of the insulating portion to the length of each of the plurality of contact portions is 0.7 or more and less than 0.9. An anisotropic conductive sheet as described in item 1 of the patent application range, wherein the conductive spring is an hourglass-shaped coil spring having a larger diameter from the center toward both ends. An anisotropic conductive sheet as described in item 1 of the patent application scope, which includes The conductive plate is disposed inside the elastic matrix so as to be adjacent to at least one of both end portions of the conductive spring. The anisotropic conductive sheet as described in Item 6 of the patent application range, wherein a through hole is formed in the central portion of the conductive plate. A conductive contact includes: an elastic matrix, a conductive spring arranged in the elastic matrix, and a plurality of conductive particles arranged along the thickness direction of the elastic matrix; and compared to the central portion of the elastic matrix, the A plurality of conductive particles are arranged at a high density to the peripheral portion of the wire constituting the conductive spring. The conductive contact according to item 8 of the patent application range, wherein the plurality of conductive particles are arranged to both ends of the elastic matrix at a higher density than in the central portion of the elastic matrix. The conductive contact as described in item 8 of the patent application range, wherein the conductive spring is a coil spring. The conductive contact as described in item 8 of the patent application range, wherein the conductive spring is an hourglass-shaped coil spring having a larger diameter from the center toward both ends. The conductive contact as described in item 8 of the patent application scope further includes a conductive plate disposed inside the elastic matrix in a manner adjacent to at least one of both ends of the conductive spring. The conductive contact according to item 12 of the patent application scope, wherein a through hole is formed in the central portion of the conductive plate.

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