CN200947107Y

CN200947107Y - Wafer measuring card

Info

Publication number: CN200947107Y
Application number: CN 200620122952
Authority: CN
Inventors: 王送来
Original assignee: Lih Duo International Co Ltd
Current assignee: Lih Duo International Co Ltd
Priority date: 2006-08-04
Filing date: 2006-08-04
Publication date: 2007-09-12
Anticipated expiration: 2016-08-04

Abstract

The utility model relates to a new testing card for the crystal grain and can be uesd to test the electric nature of the whole crystal ball. The utility model includes the baseboard and the conducting spring rubber under the baseboard. The baseboard is provided with the testing circuit and the conducting spring rubber has a soft insulating rubber layer. The soft insulating rubber layer has a conducting spring array formed by the conducting spring group arrayed as a matrix and connects with the testing circuit of the baseboard electrically though the conducting spring array. The connector of the testing card is the conducting spring array .The conducting spring array can be pressed to the connecting point mat of the crystal grain and a good and steady testing result can be achieved.

Description

A kind of wafer sort card

Technical field

The utility model relates to a kind of wafer sort card, and relating in particular to power spring rubber is the wafer sort card of wafer sort interface.

Background technology

The purpose of wafer sort is that every crystal grain on the wafer 50 as shown in Figure 1 60 is carried out testing electrical property, to eliminate the defective crystal grain 60 on the wafer 50.Wafer sort know technology, be to utilize a kind of probe of wafer probe cards to thrust contact pad (pad) on the crystal grain in existing technology with after constituting electrical contact, again that probe is measured test signal is sent to automatic test equipment (ATE) and does analysis and judge, to obtain the testing electrical property result of every crystal grain on the wafer.

As shown in Figure 2, in the well known structures of wafer probe cards, there is a kind of cantalever type probe card 10 to comprise that a substrate 11, is connected engagement plate 12 and the some cantalever type probes 13 that is provided with on this engagement plate 12 below this substrate 11.When carrying out wafer sort, this cantalever type probe card 10 constitutes and electrically contacts to have contact pad 61 on flexible cantalever type probe 13 and the crystal grain 60, so can be applicable to test the electrical characteristics test of every crystal grain 60.

But, this cantalever type probe card 10 has following shortcoming:

One, the cantalever type probe 13 of cantalever type probe card 10 is made with metal wire, and with manual dress pin, so the needle point flatness drop of each cantalever type probe 13 is bigger, is difficult for remaining on the same horizontal plane;

Its two, the cantalever type probe 13 of cantalever type probe card 10 need have the cantilever of lateral extension, can be restricted so that cantalever type probe card 10 is provided with the total quantity of cantalever type probe 13.Therefore, when carrying out wafer sort, cantalever type probe card 10 must adopt gradation in batches to carry out electric characteristics to all crystal grains of full wafer wafer and detect, and can not once finish electric characteristics simultaneously to all crystal grains of full wafer wafer and detect;

They are three years old, because the needle point flatness of each cantalever type probe 13 of cantalever type probe card 10 has drop, when carrying out wafer sort, the pin trace degree of depth that the needle point of each cantalever type probe 13 thrusts the contact pad (pad) of crystal grain differs the degree of depth, easily cause the error in the identification, even can cause the contact pad (pad) of crystal grain to damage because of bearing excessive pressure.

The utility model content

In order to overcome the defective of existing cantalever type probe card, fundamental purpose of the present utility model is to disclose a kind of wafer sort card, can once finish electric characteristics simultaneously to all crystal grains of full wafer wafer detects, its structure comprises that a substrate and is connected the power spring rubber below this substrate, wherein, this power spring rubber has an insulation flexible glue layer, and this insulation flexible glue layer is provided with the power spring array that is made of with arranged in length and breadth power spring group, and the P.e.c. of corresponding power spring array and this substrate is constituted electrically connect; When carrying out wafer sort; described wafer sort card is the wafer sort interface with the power spring array of power spring rubber; when the power spring array of the power spring rubber of wafer sort card is pressed the contact pad that contacts on the crystal grain; by the protection of insulation flexible glue layer and the elastic buffer effect of power spring; can avoid causing the contact pad of crystal grain to damage because of bearing excessive pressure; can obtain preferable and more stable testing electrical property result when therefore, carrying out wafer sort.

Description of drawings

Fig. 1 is a kind of structural representation of knowing of wafer.

Fig. 2 is the structural representation of the cantalever type probe card known, is used for illustrating that test error takes place when carrying out wafer sort this cantalever type probe easily.

Wafer sort card structure synoptic diagram shown in Fig. 3 the utility model.

Fig. 4 is to use wafer sort card shown in Figure 3 crystal grain on the full wafer wafer to be carried out the cross-section structure part enlarged drawing of testing electrical property.

The accompanying drawing sign

10 ... cantalever type probe card 11 ... substrate

12 ... engagement plate 13 ... cantalever type probe

20 ... wafer sort card 30 ... substrate

40 ... power spring rubber 41 ... insulation flexible glue layer

45 ... power spring array 50 ... wafer

60 ... crystal grain 61 ... contact pad

Embodiment

Wafer sort card 20 shown in the utility model as shown in Figures 3 and 4, comprises a substrate 30 and be provided with a power spring rubber 40 below this substrate 30.Wherein, described substrate 30 is provided with test circuit 31, is applied to the crystal grain on the testing electrical property wafer.

This power spring rubber 40 has an insulation flexible glue layer 41, and this insulation flexible glue layer 41 is provided with the power spring array 45 that is made of with arranged in length and breadth power spring group.Every power spring of power spring rubber 40 has conductive characteristic and elastic buffer effect, and the coating and the protection of the flexible glue layer 41 that all is subjected to insulating.So the power spring array 45 of this power spring rubber 40 can not be subjected to external force and take place crooked or bending, long-term repeated use still can keep original function.

As shown in Figure 4, the wafer sort card 20 shown in the utility model was located at power spring rubber 40 after substrate 30 following, and power spring rubber 40 constitutes with the test circuit 31 of corresponding power spring array 45 and described substrate 30 and electrically connects.Therefore, when using wafer sort card 20 of the present utility model to carry out wafer sort, be that power spring array 45 with power spring rubber 40 is as the wafer sort interface.Especially, wafer sort card 20 of the present utility model can once be finished electric characteristics simultaneously to all crystal grains 60 of full wafer wafer and detects.

So, when carrying out wafer sort, the contact pad 61 that wafer sort card 20 of the present utility model is pressed on all crystal grains 60 that touches the full wafer wafer with the power spring array 45 of power spring rubber 40, and after constituting electrically contact, the test circuit 31 that again power spring array 45 measured test signals is passed through described substrate 30 is sent to automatic test equipment (ATE) and does analysis and judge, to obtain the electric characteristics test result of every crystal grain 60.And, even the height of the contact pad 61 that crystal grain 60 is set differs, elastic buffer effect by power spring rubber 40, still can make power spring array 45 press the contact pad 61 that contacts on the crystal grain 60 really, except that the contact pad 61 that can avoid causing crystal grain 60 because of bearing excessive pressure damages, and can avoid taking place in the identification error, therefore, can obtain preferable and more stable testing electrical property result when carrying out wafer sort.

The above content that discloses, it is the preferable specific embodiment of the utility model, all with creation purpose of the present utility model and the effect that can reach, constitute so-called equivalence or equalization, and belong to know this operator can unlabored simple and easy modification, modification, improvement or variation, all do not break away from the patent right category that the utility model is contained opinion.

Claims

1, a kind of wafer sort card comprises that one is provided with the substrate of test circuit, and be provided with a power spring rubber below this substrate, it is characterized in that,

This power spring rubber has an insulation flexible glue layer, and this insulation flexible glue layer is provided with the power spring array that is made of with arranged in length and breadth power spring group, and this power spring rubber and constitute with the test circuit of described power spring array and this substrate electrically connects.