TW201612362A - Copper-tin alloy plating bath - Google Patents

Copper-tin alloy plating bath

Info

Publication number
TW201612362A
TW201612362A TW104125247A TW104125247A TW201612362A TW 201612362 A TW201612362 A TW 201612362A TW 104125247 A TW104125247 A TW 104125247A TW 104125247 A TW104125247 A TW 104125247A TW 201612362 A TW201612362 A TW 201612362A
Authority
TW
Taiwan
Prior art keywords
copper
plating bath
alloy plating
tin alloy
compound
Prior art date
Application number
TW104125247A
Other languages
English (en)
Other versions
TWI641729B (zh
Inventor
Takamitsu Tsujimoto
Toshimitsu Nagao
Kenji Hara
Junichi Katayama
Kuniaki Otsuka
Original Assignee
Okuno Chem Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okuno Chem Ind Co filed Critical Okuno Chem Ind Co
Publication of TW201612362A publication Critical patent/TW201612362A/zh
Application granted granted Critical
Publication of TWI641729B publication Critical patent/TWI641729B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/02—Alloys based on copper with tin as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
TW104125247A 2014-08-08 2015-08-04 Copper-tin alloy plating bath TWI641729B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014162294 2014-08-08
JP2014-162294 2014-08-08

Publications (2)

Publication Number Publication Date
TW201612362A true TW201612362A (en) 2016-04-01
TWI641729B TWI641729B (zh) 2018-11-21

Family

ID=55263710

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104125247A TWI641729B (zh) 2014-08-08 2015-08-04 Copper-tin alloy plating bath

Country Status (8)

Country Link
US (1) US20170204528A1 (zh)
EP (1) EP3178969B1 (zh)
JP (1) JP6048712B2 (zh)
CN (1) CN106661752B (zh)
CA (1) CA2957587C (zh)
HK (1) HK1232261A1 (zh)
TW (1) TWI641729B (zh)
WO (1) WO2016021439A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019052355A (ja) * 2017-09-15 2019-04-04 上村工業株式会社 電解Ｓｎ又はＳｎ合金めっき液及びＳｎ又はＳｎ合金めっき物の製造方法
JP6645609B2 (ja) * 2018-07-27 2020-02-14 三菱マテリアル株式会社 錫合金めっき液
CN110205659B (zh) * 2019-07-17 2020-06-16 广州三孚新材料科技股份有限公司 一种电镀锡添加剂及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3871013B2 (ja) * 1998-11-05 2007-01-24 上村工業株式会社 錫−銅合金電気めっき浴及びそれを使用するめっき方法
WO2002024979A1 (de) * 2000-09-20 2002-03-28 Dr.-Ing. Max Schlötter Gmbh & Co. Kg Elektrolyt und verfahren zur abscheidung von zinn-kupfer-legierungsschichten
EP1408141B1 (de) * 2002-10-11 2014-12-17 Enthone Inc. Verfahren und Elektrolyt zur galvanischen Abscheidung von Bronzen
JP4441726B2 (ja) * 2003-01-24 2010-03-31 石原薬品株式会社 スズ又はスズ合金の脂肪族スルホン酸メッキ浴の製造方法
US20060260948A2 (en) * 2005-04-14 2006-11-23 Enthone Inc. Method for electrodeposition of bronzes
WO2010055825A1 (ja) * 2008-11-11 2010-05-20 ユケン工業株式会社 ジンケート型亜鉛めっき浴
EP2221396A1 (en) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Lead-Free Tin Alloy Electroplating Compositions and Methods
JP5313773B2 (ja) * 2009-06-04 2013-10-09 三菱伸銅株式会社 めっき付き銅条材及びその製造方法
JP6133056B2 (ja) * 2012-12-27 2017-05-24 ローム・アンド・ハース電子材料株式会社 スズまたはスズ合金めっき液

Also Published As

Publication number Publication date
HK1232261A1 (zh) 2018-01-05
CN106661752B (zh) 2021-08-10
EP3178969A1 (en) 2017-06-14
JP6048712B2 (ja) 2016-12-21
JPWO2016021439A1 (ja) 2017-04-27
CN106661752A (zh) 2017-05-10
EP3178969B1 (en) 2020-01-01
TWI641729B (zh) 2018-11-21
CA2957587C (en) 2019-03-05
US20170204528A1 (en) 2017-07-20
CA2957587A1 (en) 2016-02-11
EP3178969A4 (en) 2017-12-27
WO2016021439A1 (ja) 2016-02-11

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