TW201535759A - 太陽電池用互連器及太陽電池模組 - Google Patents
太陽電池用互連器及太陽電池模組 Download PDFInfo
- Publication number
- TW201535759A TW201535759A TW104102352A TW104102352A TW201535759A TW 201535759 A TW201535759 A TW 201535759A TW 104102352 A TW104102352 A TW 104102352A TW 104102352 A TW104102352 A TW 104102352A TW 201535759 A TW201535759 A TW 201535759A
- Authority
- TW
- Taiwan
- Prior art keywords
- based alloy
- solar cell
- alloy solder
- interconnector
- intermetallic compound
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 claims description 162
- 229910045601 alloy Inorganic materials 0.000 claims description 161
- 239000000956 alloy Substances 0.000 claims description 161
- 239000010949 copper Substances 0.000 claims description 64
- 229910052802 copper Inorganic materials 0.000 claims description 46
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 42
- 229910052759 nickel Inorganic materials 0.000 claims description 36
- 239000012535 impurity Substances 0.000 claims description 4
- 229910000765 intermetallic Inorganic materials 0.000 abstract description 65
- 230000008646 thermal stress Effects 0.000 abstract description 25
- 230000003647 oxidation Effects 0.000 description 16
- 238000007254 oxidation reaction Methods 0.000 description 16
- 238000002845 discoloration Methods 0.000 description 14
- 239000011800 void material Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- 238000011156 evaluation Methods 0.000 description 11
- 238000007747 plating Methods 0.000 description 11
- 239000000758 substrate Substances 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- 229910017482 Cu 6 Sn 5 Inorganic materials 0.000 description 8
- 230000006378 damage Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- 229910052797 bismuth Inorganic materials 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 238000005498 polishing Methods 0.000 description 7
- 229910017937 Ag-Ni Inorganic materials 0.000 description 6
- 229910017984 Ag—Ni Inorganic materials 0.000 description 6
- 229910052787 antimony Inorganic materials 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 239000013078 crystal Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 5
- 229910020882 Sn-Cu-Ni Inorganic materials 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- 229910052738 indium Inorganic materials 0.000 description 5
- 229910052745 lead Inorganic materials 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000011148 porous material Substances 0.000 description 5
- 229910052707 ruthenium Inorganic materials 0.000 description 5
- 229910002482 Cu–Ni Inorganic materials 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000000445 field-emission scanning electron microscopy Methods 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910052732 germanium Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000013081 microcrystal Substances 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000002524 electron diffraction data Methods 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010884 ion-beam technique Methods 0.000 description 2
- RYZCLUQMCYZBJQ-UHFFFAOYSA-H lead(2+);dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Pb+2].[Pb+2].[Pb+2].[O-]C([O-])=O.[O-]C([O-])=O RYZCLUQMCYZBJQ-UHFFFAOYSA-H 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910017692 Ag3Sn Inorganic materials 0.000 description 1
- 229910005578 NiBi Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020938 Sn-Ni Inorganic materials 0.000 description 1
- 229910007116 SnPb Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018726 Sn—Ag—Sb Inorganic materials 0.000 description 1
- 229910008937 Sn—Ni Inorganic materials 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001036 glow-discharge mass spectrometry Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000399 optical microscopy Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000004876 x-ray fluorescence Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
- C23C2/08—Tin or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/34—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the shape of the material to be treated
- C23C2/36—Elongated material
- C23C2/38—Wires; Tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014010921 | 2014-01-24 | ||
PCT/JP2015/051421 WO2015111587A1 (ja) | 2014-01-24 | 2015-01-20 | 太陽電池用インターコネクタ及び太陽電池モジュール |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201535759A true TW201535759A (zh) | 2015-09-16 |
Family
ID=53681390
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104102352A TW201535759A (zh) | 2014-01-24 | 2015-01-23 | 太陽電池用互連器及太陽電池模組 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2015111587A1 (ja) |
TW (1) | TW201535759A (ja) |
WO (1) | WO2015111587A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108788511A (zh) * | 2018-06-25 | 2018-11-13 | 深圳市博士达焊锡制品有限公司 | 一种具有高抗氧化能力的有铅焊料及其制备方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105382443B (zh) * | 2015-12-18 | 2018-07-03 | 黄河水电光伏产业技术有限公司 | 一种合金焊料的制备方法 |
JP6585554B2 (ja) * | 2016-06-28 | 2019-10-02 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板及び電子制御装置 |
JP6916243B2 (ja) * | 2016-06-28 | 2021-08-11 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板及び電子制御装置 |
JP6471765B2 (ja) * | 2017-04-17 | 2019-02-20 | 三菱電機株式会社 | 太陽電池モジュール |
CN108274147A (zh) * | 2017-12-22 | 2018-07-13 | 占卫君 | 一种低温高效焊带、制备方法及光伏组件 |
CN108555472B (zh) * | 2017-12-29 | 2020-12-01 | 西安泰力松新材料股份有限公司 | 一种光伏焊带合金焊料及其制备方法 |
JP6369620B1 (ja) | 2017-12-31 | 2018-08-08 | 千住金属工業株式会社 | はんだ合金 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3796181B2 (ja) * | 2002-02-14 | 2006-07-12 | 新日本製鐵株式会社 | 無鉛ハンダ合金、ハンダボール及びハンダバンプを有する電子部材 |
JP2011005542A (ja) * | 2009-06-23 | 2011-01-13 | Nihon Superior Co Ltd | In含有鉛フリーはんだ合金及び当該はんだを用いたはんだ接合部 |
MY160620A (en) * | 2010-03-17 | 2017-03-15 | Nippon Steel Corp | Metal tape material and interconnector for solar cell collection |
WO2012131861A1 (ja) * | 2011-03-28 | 2012-10-04 | 千住金属工業株式会社 | 鉛フリーはんだボール |
KR101609036B1 (ko) * | 2011-05-27 | 2016-04-04 | 신닛테츠스미킨 카부시키카이샤 | 태양 전지용 인터커넥터 및 태양 전지 모듈 |
JP2013065728A (ja) * | 2011-09-17 | 2013-04-11 | Nippon Joint Kk | セラミック電子部品及びその製造方法 |
-
2015
- 2015-01-20 JP JP2015559075A patent/JPWO2015111587A1/ja active Pending
- 2015-01-20 WO PCT/JP2015/051421 patent/WO2015111587A1/ja active Application Filing
- 2015-01-23 TW TW104102352A patent/TW201535759A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108788511A (zh) * | 2018-06-25 | 2018-11-13 | 深圳市博士达焊锡制品有限公司 | 一种具有高抗氧化能力的有铅焊料及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2015111587A1 (ja) | 2017-03-23 |
WO2015111587A1 (ja) | 2015-07-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201535759A (zh) | 太陽電池用互連器及太陽電池模組 | |
TWI567211B (zh) | Connection lines for semiconductor devices | |
TWI574279B (zh) | Connecting wires for semiconductor devices | |
TWI605559B (zh) | Bonding wire for semiconductor device | |
TWI652693B (zh) | 半導體裝置用接合導線 | |
JP5285079B2 (ja) | はんだ合金および半導体装置 | |
TW200944319A (en) | Bonding wire for semiconductor device | |
KR20160036038A (ko) | 전자·전기 기기용 구리 합금, 전자·전기 기기용 구리 합금 소성 가공재, 전자·전기 기기용 부품 및 단자 | |
JP5700834B2 (ja) | 酸化膜密着性に優れた高強度銅合金板 | |
JP5036545B2 (ja) | 太陽電池用電極線材の製造方法 | |
TW201228764A (en) | Pb-free solder alloy mainly containing Zn | |
JP6487108B1 (ja) | パラジウム被覆銅ボンディングワイヤ及びその製造方法 | |
WO2019193771A1 (ja) | ボールボンディング用貴金属被覆銀ワイヤおよびその製造方法、ならびにボールボンディング用貴金属被覆銀ワイヤを使用した半導体装置およびその製造方法 | |
EP2690196B1 (en) | Method for processing thin cu plate | |
TW201204502A (en) | Bi-Al-Zn-based Pb-free solder alloy | |
JP6927844B2 (ja) | 銅合金板材およびその製造方法 | |
JP2008182170A (ja) | 太陽電池用はんだめっき線及びその製造方法並びに太陽電池 | |
WO2012111185A1 (ja) | はんだめっき銅線およびその製造方法 | |
TW201936934A (zh) | 半導體裝置用接合導線 | |
KR102312145B1 (ko) | 반도체 장치용 본딩 와이어 | |
JP2019071423A5 (ja) | ||
JP6445186B2 (ja) | 半導体装置用ボンディングワイヤ | |
TW202307225A (zh) | 半導體裝置用接合線 | |
WO2019193770A1 (ja) | ボールボンディング用貴金属被覆銀ワイヤおよびその製造方法、ならびにボールボンディング用貴金属被覆銀ワイヤを使用した半導体装置およびその製造方法 | |
TWI743315B (zh) | 半導體裝置用接合線 |