TW201531793A - 曝光用遮罩的製造方法、曝光用遮罩的製造系統、及半導體裝置的製造方法 - Google Patents

曝光用遮罩的製造方法、曝光用遮罩的製造系統、及半導體裝置的製造方法 Download PDF

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Publication number
TW201531793A
TW201531793A TW103146548A TW103146548A TW201531793A TW 201531793 A TW201531793 A TW 201531793A TW 103146548 A TW103146548 A TW 103146548A TW 103146548 A TW103146548 A TW 103146548A TW 201531793 A TW201531793 A TW 201531793A
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TW
Taiwan
Prior art keywords
pattern
mask
blank
euv exposure
exposure
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TW103146548A
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English (en)
Chinese (zh)
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TWI563336B (https=
Inventor
阿部隆幸
山口哲男
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紐富來科技股份有限公司
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Publication of TW201531793A publication Critical patent/TW201531793A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/22—Masks or mask blanks for imaging by radiation of 100nm or shorter wavelength, e.g. X-ray masks, extreme ultraviolet [EUV] masks; Preparation thereof

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Electron Beam Exposure (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW103146548A 2014-01-16 2014-12-31 曝光用遮罩的製造方法、曝光用遮罩的製造系統、及半導體裝置的製造方法 TW201531793A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014006241A JP6339807B2 (ja) 2014-01-16 2014-01-16 露光用マスクの製造方法、露光用マスクの製造システム、及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW201531793A true TW201531793A (zh) 2015-08-16
TWI563336B TWI563336B (https=) 2016-12-21

Family

ID=53521288

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103146548A TW201531793A (zh) 2014-01-16 2014-12-31 曝光用遮罩的製造方法、曝光用遮罩的製造系統、及半導體裝置的製造方法

Country Status (4)

Country Link
US (1) US9406573B2 (https=)
JP (1) JP6339807B2 (https=)
KR (1) KR101720991B1 (https=)
TW (1) TW201531793A (https=)

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* Cited by examiner, † Cited by third party
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JP5841710B2 (ja) * 2010-03-17 2016-01-13 株式会社ニューフレアテクノロジー 荷電粒子ビーム描画装置及び荷電粒子ビーム描画方法
JP5764364B2 (ja) 2011-03-31 2015-08-19 株式会社ニューフレアテクノロジー 半導体装置の製造方法、描画装置、プログラム及びパターン転写装置
DE102014217907B4 (de) * 2014-09-08 2018-12-20 Carl Zeiss Smt Gmbh Verfahren zum Herstellen einer Maske für den extrem ultra-violetten Wellenlängenbereich und Maske
DE102014223811B4 (de) * 2014-11-21 2016-09-29 Carl Zeiss Smt Gmbh Abbildende Optik für die EUV-Projektionslithographie, Projektionsbelichtungsanlage und Verfahren zur Herstellung eines strukturierten Bauteils
CN105719981B (zh) * 2014-12-04 2018-09-07 中芯国际集成电路制造(上海)有限公司 半导体结构及其形成方法
TWI805795B (zh) * 2018-07-20 2023-06-21 美商應用材料股份有限公司 基板定位設備與方法
JP7492456B2 (ja) * 2018-11-07 2024-05-29 Hoya株式会社 多層反射膜付き基板、反射型マスクブランク、反射型マスクの製造方法、及び半導体装置の製造方法
US11119404B2 (en) * 2019-10-10 2021-09-14 Kla Corporation System and method for reducing printable defects on extreme ultraviolet pattern masks
CN113296356B (zh) * 2020-02-24 2024-06-18 中芯国际集成电路制造(上海)有限公司 修正掩膜图案的方法
US11874597B2 (en) * 2020-02-25 2024-01-16 Synopsys, Inc. Stochastic optical proximity corrections

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JP3412898B2 (ja) * 1994-03-02 2003-06-03 キヤノン株式会社 反射型マスクの作製方法と作製装置、これによる反射型マスクを用いた露光装置とデバイス製造方法
JP2001033941A (ja) 1999-07-16 2001-02-09 Toshiba Corp パターン形成方法及び露光装置
JP2004170948A (ja) * 2002-10-30 2004-06-17 Nikon Corp パターン転写用マスク、マスク作製方法及び露光方法
JP2004193269A (ja) * 2002-12-10 2004-07-08 Hitachi Ltd マスクの製造方法および半導体集積回路装置の製造方法
JP2005134747A (ja) * 2003-10-31 2005-05-26 Toshiba Corp マスク評価方法、マスク評価システム、マスク製造方法およびプログラム
TWI261726B (en) * 2004-04-09 2006-09-11 Allied Integrated Patterning C Acceptable defect positioning and manufacturing method for large-scaled photomask blanks
KR100710960B1 (ko) * 2004-09-29 2007-04-24 호야 가부시키가이샤 마스크 블랭크용 기판, 마스크 블랭크, 노광용 마스크,마스크 블랭크용 기판의 제조방법 및 반도체 제조방법
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Also Published As

Publication number Publication date
JP2015135874A (ja) 2015-07-27
JP6339807B2 (ja) 2018-06-06
US20150198896A1 (en) 2015-07-16
US9406573B2 (en) 2016-08-02
TWI563336B (https=) 2016-12-21
KR101720991B1 (ko) 2017-03-29
KR20150085790A (ko) 2015-07-24

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