TW201529642A - 含倍半矽氧烷化合物及改性聚矽氧化合物之壓印材料 - Google Patents
含倍半矽氧烷化合物及改性聚矽氧化合物之壓印材料 Download PDFInfo
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- TW201529642A TW201529642A TW103136640A TW103136640A TW201529642A TW 201529642 A TW201529642 A TW 201529642A TW 103136640 A TW103136640 A TW 103136640A TW 103136640 A TW103136640 A TW 103136640A TW 201529642 A TW201529642 A TW 201529642A
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- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- DNBKBOHCTZPNEL-UHFFFAOYSA-N undec-1-en-1-one Chemical compound CCCCCCCCCC=C=O DNBKBOHCTZPNEL-UHFFFAOYSA-N 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
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Abstract
本發明之課題在於提供一種新穎的壓印材料、以及由該材料所製作且圖型經轉印之膜。
本發明之解決方法為一種壓印材料,其係含有(A)成分:具有以下述式(1)所示之重複單位,且具有2個以上式中X0所示之聚合性基的倍半矽氧烷化合物、(B)成分:具有以下述式(2)所示之重複單位,且末端具有2個聚合性基之聚矽氧化合物、(C)成分:光聚合起始劑以及(D)成分:溶劑,其中,對前述(A)成分及(B)成分之合計100質量%而言,該(B)成分之比例為5質量%以上25質量%以下。
□
(式中,R1及R2各自獨立地表示碳原子數1~3之烷基、R0表示碳原子數1~3之伸烷基、k表示0~3之整數。)
Description
本發明係關於一種壓印材料(壓印用膜形成組成物)及由該材料所製作且圖型經轉印之膜。更詳言之,是關於一形成有硬化膜之壓印材料,以及由該材料所製作且圖型經轉印之膜,該硬化膜係於硬化後、脫模時,前述圖型經轉印之膜可容易自模具剝離,同時具備有對超過200℃之溫度下的加熱步驟之耐熱性之硬化膜。
1995年,現普林斯頓大學之丘教授等人提倡一種稱為奈米壓印微影之新技術(專利文獻1)。奈米壓印微影係使具有任意圖型之模具與形成有樹脂膜之基材接觸,並在將該樹脂膜予以加壓的同時,用熱或光作為外部刺激,來使目的之圖型形成於已硬化之該樹脂膜上的技術,此奈米壓印微影相較於以往的半導體裝置製造的光微影等,具有可簡便、便宜地進行奈米規模加工之優點。
因此,奈米壓印微影在取代了光微影技術而成為適用
於半導體裝置、光學裝置、顯示器、記憶媒體、生物晶片等之製造所備受期待的技術,於是關於奈米壓印微影中用的光奈米壓印微影用硬化性組成物,係有各種報告提出(專利文獻2、專利文獻3)。再者,專利文獻4中則揭示有包含具聚矽氧骨架之化合物及光聚合起始劑之光壓印材料。
奈米壓印微影中,使用高價模具時,雖然被要求模具的長壽命化,但若自己硬化的樹脂膜剝除模具的力、即脫模時的剝除力(以下,在本說明書中簡稱為「脫模力」)大的話,樹脂容易附著在模具上,模具容易變成無法使用。因此,對奈米壓印微影中使用的材料(以下,在本說明書中簡稱為「壓印材料」)乃要求要低脫模力性(容易將已經硬化的樹脂膜自模具剝離之特性)。又,裝置製作乃具有經過烘烤、焊錫等加熱步驟者。視情況,也有在前述加熱步驟中曝於260℃左右的溫度等事,此時,若膜的耐熱性低,自該膜發生分解物的昇華,會成為污染裝置內部或製作裝置的裝置及機器之大問題。再者,根據裝置的種類,也有於受熱曝曬之處使用的情況,如此也會因發生同樣的問題,在固體攝影裝置、太陽電池、LED裝置、顯示器等之製品上,對於要製作成光學構件之構造物,則被要求要有高度的耐熱性。
但是,至今,壓印材料方面,雖揭示有各種的材料,但並沒有兼具低脫模力、在超過200℃的溫度例如260℃中不引起分解物之昇華的耐熱性之材料之報告。
〔專利文獻1〕美國專利第5772905號說明書
〔專利文獻2〕日本特開2008-105414號公報
〔專利文獻3〕日本特開2008-202022號公報
〔專利文獻4〕日本特開2013-065768號公報
本發明乃鑑於上述情事所成者,所欲解決之課題乃是提供一種壓印材料,其係於硬化後、脫模時,可容易自模具將已轉印有圖型之膜剝離,即具低脫模力性之壓印材料,及形成具有即使於超過200℃之溫度中亦不引起分解物之昇華的高耐熱性之硬化膜之壓印材料,再者,也提供自該材料所製作且圖型經轉印之膜。具體而言,係以提供一種對模具之脫模力大於0g/cm且為0.8g/cm以下,且可形成即使曝於例如260℃之溫度也不會引起分解物的昇華之硬化膜的材料為目的。
本發明者們為了解決上述課題而專致於檢討的結果發現,將含有具2個以上聚合性基之倍半矽氧烷化合物及末端具有2個聚合性基之聚矽氧化合物,且相對於
前述具2個以上聚合性基之倍半矽氧烷化合物與前述末端具有2個聚合性基之聚矽氧化合物之合計100質量%,使該末端具有2個聚合性基之聚矽氧化合物的比例為5質量%以上25質量%以下,並進一步含有光聚合起始劑及溶劑之組成物,使用作為壓印材料。其結果使本發明者們得到一個見解,亦即,於模具之具有凹凸形狀的面上,藉由該材料之光硬化將已轉印有模具之凹凸形狀圖型的硬化膜自模具之具有凹凸形狀的面剝離時,其所計測之脫模力特別地小,又由該材料所製作之經圖型轉印的膜即使在260℃之溫度下也未見分解物之昇華,因此遂得以完成本發明。
意即,本發明之第1觀點係關於一種壓印材料,其係含有下述(A)成分、(B)成分、(C)及(D)成分,且相對於前述(A)成分及(B)成分之合計100質量%,該(B)成分之比例為5質量%以上25質量%以下。
(A):具有以下述式(1)所示之重複單位,且具2個以上式中X0所示之聚合性基之倍半矽氧烷化合物
(B):具有下述式(2)所示之重複單位,且末端具有2個聚合性基之聚矽氧化合物
(C):光聚合起始劑
(D):溶劑
第2觀點係關於一種如第1觀點中記載的壓印材料,其中,前述(A)成分係由完全籠型構造及/或不完全籠型構造、與無規構造及階梯型構造之混合體所成。
第3觀點係關於一種如第1觀點或第2觀點中記載的壓印材料,其係進一步含有界面活性劑作為(E)成分。
第4觀點係關於一種如第1觀點~第3觀點之任一項中記載的壓印材料,其中,前述(A)成分及(B)成分之聚合性基係丙烯醯基氧基、甲基丙烯醯基氧基、乙烯基或烯丙基。
第5觀點係關於一種圖型已經轉印之膜,其係由如第1觀點~第4觀點之任一項中記載的壓印材料所製作者。
第6觀點係關於一種光學構件,其係於基材上具備有
如第5觀點中記載的圖型已經轉印之膜者。
第7觀點係關於一種固體攝影裝置,其係於基材上具備有如第5觀點中記載的圖型已經轉印之膜者。
第8觀點係關於一種LED裝置,其係於基材上具備有如第5觀點中記載的圖型已經轉印之膜者。
第9觀點係關於一種半導體元件,其係具備有如第5觀點中記載的圖型已經轉印之膜者。
第10觀點係關於一種太陽電池,其係於基板上具備有如第5觀點中記載的圖型已經轉印之膜者。
第11觀點係關於一種顯示器,其係於基材上具備有如第5觀點中記載的圖型已經轉印之膜者。
第12觀點係關於一種電子裝置,其係於基材上具備有如第5觀點中記載的圖型已經轉印之膜者。
由本發明之壓印材料所製作之硬化膜,乃具有低脫模力性,而且,即使暴露於例如260℃之溫度下,也未見分解物的昇華。
又本發明之壓印材料係可光硬化,且自模具具有凹凸形狀的面剝離時,因圖型的一部分不發生剝離之故,得以獲得可正確地形成所期望圖型之膜。因此,可形成良好的光壓印圖型。
又,本發明之壓印材料係可於任意基材上製膜,壓印後所形成之圖型已經轉印之膜,可適用於其中使用太陽電
池、LED裝置、顯示器等要求要高透明性構件的製品。
再者,本發明之壓印材料係可藉由改變前述(A)成分、(B)成分及(D)成分之化合物的種類及含有比例,來控制硬化速度、動的黏度、及所欲形成之硬化膜之膜厚。因此,本發明之壓印材料係可因應所欲製造的裝置種類與曝光製程及燒成製程之種類來設計材料,且可擴大製程界限之故,而適用於光學構件之製造。
作為(A)成分之具2個以上聚合性基之倍半矽氧烷化合物,其係顯示主鏈骨架為Si-O-Si鍵結,且前述式(1)所示之重複單位的式中具有1.5個氧原子,該式中具有2個以上的X0所示之聚合性基之化合物。該聚合性基方面,可舉例如丙烯醯基氧基、甲基丙烯醯基氧基、乙烯基、烯丙基。在此,丙烯醯基氧基可表現為丙烯醯氧基,甲基丙烯醯基氧基可表現為甲基丙烯醯氧基。再者,前述式(1)中,R0所示之碳原子數1~3之伸烷基方面,可舉例如亞甲基、亞乙基〔-CH(CH3)-基〕、丙烷-2,2-二基〔-C(CH3)2-基〕。
上述(A)成分之化合物係可以市售品取得,其具體例方面,可舉出AC-SQ TA-100、MAC-SQ TM-
100、AC-SQ SI-20、MAC-SQ SI-20、MAC-SQ HDM(以上,東亞合成股份公司製)。
前述(A)成分之化合物,例如,可使用下述式(3)所示之化合物或下述式(4)所示之化合物來合成。
上述式(3)所示之化合物方面,可舉例如3-丙烯醯基氧基丙基三甲氧基矽烷、3-丙烯醯基氧基丙基三乙氧基矽烷、甲基丙烯酸3-(三甲氧基矽烷基)丙基酯及甲基丙烯酸3-(三乙氧基矽烷基)丙基酯。上述式(4)所示之化合物方面,可舉例如3-丙烯醯基氧基丙基三氯矽烷、甲基丙烯酸3-(三氯矽烷基)丙基酯。
上述(A)成分之化合物係可使用重量平均分子量為例如700~7000之倍半矽氧烷化合物,如此的化合
物係可單獨使用或組合2種以上使用。
本發明之壓印材料中(A)成分,係可對圖型轉印後的膜賦予耐熱性,且在超過200℃的溫度例如260℃之溫度下,抑制分解物的昇華。又,藉由改變(A)成分的種類、分子量及含有比例,係可控制壓印材料之動的黏度、壓印時的硬化速度、及所形成之硬化膜的膜厚。
作為(B)成分之末端具有2個聚合性基之聚矽氧化合物,表示分子內具有聚矽氧骨架(矽氧烷骨架),且該分子的末端具有2個聚合性基之化合物。有關該聚矽氧骨架,雖可舉出前述式(2)中,R1及R2為各自獨立地表示甲基、乙基、丙基或異丙基的情況,特別是以R1及R2任一者皆表示甲基之二甲基聚矽氧骨架為佳。再者,前述聚合性基方面,可舉例如丙烯醯基氧基、甲基丙烯醯基氧基、乙烯基、烯丙基。在此,丙烯醯基氧基可表現為丙烯醯氧基,甲基丙烯醯基氧基可表現為甲基丙烯醯氧基。
上述(B)成分之化合物方面,可採用市售品,其具體例方面,可舉出X-22-164、X-22-164AS、X-22-164A、X-22-164B、X-22-164C、X-22-164E、X-22-2445、X-22-1602(以上,信越化學工業股份公司製)。
上述(B)成分之化合物,可單獨使用或組合2種以上使用。
本發明之壓印材料中(B)成分的比例,相對
於上述(A)成分與(B)成分之合計100質量%,為5質量%以上25質量%以下。此比例未達5質量%時,無法獲得充分的低脫模力性,而超過25%時,在暴露於超過200℃之溫度例如260℃之溫度下時,會發生分解物的昇華。
作為(C)成分之光聚合起始劑方面,若為對光硬化時使用的光源具有吸收者,並無特別限定,可舉例如tert-丁基過氧-iso-丁酸酯、2,5-二甲基-2,5-雙(苯甲醯基二氧基)己烷、1,4-雙〔α-(tert-丁基二氧基)-iso-丙氧基〕苯、二-tert-丁基過氧化物、2,5-二甲基-2,5-雙(tert-丁基二氧基)己烯氫過氧化物、α-(iso-丙基苯基)-iso-丙基氫過氧化物、tert-丁基氫過氧化物、1,1-雙(tert-丁基二氧基)-3,3,5-三甲基環己烷、丁基-4,4-雙(tert-丁基二氧基)戊酸酯、環己酮過氧化物、2,2’,5,5’-四(tert-丁基過氧羰基)二苯甲酮、3,3’,4,4’-四(tert-丁基過氧羰基)二苯甲酮、3,3’,4,4’-四(tert-戊基過氧羰基)二苯甲酮、3,3’,4,4’-四(tert-己基過氧羰基)二苯甲酮、3,3’-雙(tert-丁基過氧羰基)-4,4’-二羧基二苯甲酮、tert-丁基過氧苯甲酸酯、二-tert-丁基二過氧間苯二甲酸酯等之有機過氧化物;9,10-蒽醌、1-氯蒽醌、2-氯蒽醌、八甲基蒽醌、1,2-苯并蒽醌等之苯醌類;安息香甲基、安息香乙基醚、α-甲基安息香、α-苯基安息香等之安息香衍生物;2,2-二甲氧基-1,2-二苯基乙烷-1-酮、1-羥基-環己基-苯基-
酮、2-羥基-2-甲基-1-苯基-丙烷-1-酮、1-〔4-(2-羥基乙氧基)-苯基〕-2-羥基-2-甲基-1-丙烷-1-酮、2-羥基-1-〔4-{4-(2-羥基-2-甲基-丙醯基)苄基}-苯基〕-2-甲基-丙烷-1-酮、苯基乙醛酸甲基酯、2-甲基-1-〔4-(甲基硫代基)苯基〕-2-嗎啉基丙烷-1-酮、2-苄基-2-二甲基胺基-1-(4-嗎啉基苯基)-1-丁酮、2-二甲基胺基-2-(4-甲基-苄基)-1-(4-嗎啉-4-基-苯基)-丁烷-1-酮等之烷基苯酮系化合物;雙(2,4,6-三甲基苯甲醯基)-苯基膦氧化物、2,4,6-三甲基苯甲醯基-二苯基-膦氧化物等之醯基膦氧化物系化合物;1-〔4-(苯基硫代基)苯基〕-1,2-辛烷二酮2-(O-苯甲醯基肟)、1-〔9-乙基-6-(2-甲基苯甲醯基)-9H-咔唑-3-基〕乙酮O-乙醯基肟等之肟酯系化合物。
上述化合物可採用市售品,其具體例方面,可舉出IRGACURE(登錄商標)651、同184、同500、同2959、同127、同754、同907、同369、同379、同379EG、同819、同819DW、同1800、同1870、同784、同OXE01、同OXE02、同250、Darocur(登錄商標)1173、同MBF、同4265、Lucirin(登錄商標)TPO(以上,BASF JAPAN股份公司製)、KAYACURE(登錄商標)DETX、同MBP、同DMBI、同EPA、同OA(以上,日本化藥股份公司製)、VICURE-10、同55(以上,STAUFFER Co.LTD製)、ESACURE(登錄商標)KIP150、同TZT、同1001、同KTO46、同KB1、同KL200、同KS300、同EB3、Triazine-PMS、Triazine A、Triazine B
(以上,日本SIBER HEGNER股份公司製)、ADEKA OPTOMER N-1717、同N-1414、同N-1606(股份公司ADEKA製)。
上述(C)成分之光聚合起始劑,可單獨使用或組合2種以上使用。
本發明之壓印材料中(C)成分之含有量,相對於上述(A)成分及(B)成分之總質量,係以0.1phr~30phr者為佳、1phr~20phr者更佳。(C)成分之含有量之比例未達0.1phr時,無法獲得充分的硬化性,乃因圖型特性惡化所致。在此,所謂phr乃是相對於(A)成分及(B)成分之總質量100g表示光聚合起始劑之質量者。
作為本發明中(D)成分之溶劑,係擔任作為上述(A)成分之具2個以上聚合性基之倍半矽氧烷化合物及作為(B)成分之末端具有2個聚合性基之聚矽氧化合物的黏度調節之角色。
上述溶劑方面,可舉例如甲苯、p-二甲苯、o-二甲苯、苯乙烯、乙二醇二甲基醚、丙二醇單甲基醚、乙二醇單甲基醚、丙二醇單乙基醚、乙二醇單乙基醚、乙二醇單異丙基醚、乙二醇甲基醚乙酸酯、丙二醇單甲基醚乙酸酯、乙二醇乙基醚乙酸酯、二乙二醇二甲基醚、丙二醇單丁基醚、乙二醇單丁基醚、二乙二醇二乙基醚、二丙二醇單甲基醚、二乙二醇單甲基醚、二丙二醇單乙基醚、二
乙二醇單乙基醚、三乙二醇二甲基醚、二乙二醇單乙基醚乙酸酯、二乙二醇、1-辛醇、乙二醇、己二醇、二丙酮醇、糠基醇、四氫糠基醇、丙二醇、苯甲醇、1,3-丁烷二醇、1,4-丁烷二醇、2,3-丁烷二醇、γ-丁內酯、丙酮、甲基乙基酮、甲基異丙基酮、二乙基酮、甲基異丁基酮、甲基n-丁基酮、環己酮、2-庚酮、丙酮酸乙基酯、乙酸乙基酯、乙酸異丙基酯、乙酸n-丙基酯、乙酸異丁基酯、乙酸n-丁基酯、乳酸乙基酯、甲醇、乙醇、異丙醇、tert-丁醇、烯丙基醇、n-丙醇、2-甲基-2-丁醇、異丁醇、n-丁醇、2-甲基-1-丁醇、1-戊醇、2-甲基-1-戊醇、2-乙基己醇、三亞甲基二醇、1-甲氧基-2-丁醇、異丙基醚、1,4-二氧陸圜、N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基-2-吡咯啶酮、1,3-二甲基-2-四氫咪唑酮、二甲基亞碸、N-環己基-2-吡咯啶,且若為可調節上述(A)成分及(B)成分之黏度者即可,並無特別限定。
上述(D)成分之溶劑,可單獨使用或組合2種以上使用。
作為自包含上述(A)成分~(C)成分、與後述(E)成分及其他添加劑的全成分去除(D)成分之溶劑者所被定義的固形分,係以相對於本發明之壓印材料含有成為10質量%~90質量%之量為佳。
本發明之壓印材料中,係可添加界面活性劑來作為
(E)成分。作為(E)成分之界面活性劑,扮演了調整所得塗膜之製膜性的角色。
上述界面活性劑方面,可舉例如聚氧乙烯月桂基醚、聚氧乙烯硬脂醯基醚、聚氧乙烯鯨蠟基醚、聚氧乙烯油醯基醚等之聚氧乙烯烷基醚類、聚氧乙烯辛基苯基醚、聚氧乙烯壬基苯基醚等之聚氧乙烯烷基芳基醚類、聚氧乙烯‧聚氧丙烯嵌段共聚物類、山梨醇酐單月桂酸酯、山梨醇酐單棕櫚酸酯、山梨醇酐單硬脂酸酯、山梨醇酐單油酸酯、山梨醇酐三油酸酯、山梨醇酐三硬脂酸酯等之山梨醇酐脂肪酸酯類、聚氧乙烯山梨醇酐單月桂酸酯、聚氧乙烯山梨醇酐單棕櫚酸酯、聚氧乙烯山梨醇酐單硬脂酸酯、聚氧乙烯山梨醇酐三油酸酯、聚氧乙烯山梨醇酐三硬脂酸酯等之聚氧乙烯山梨醇酐脂肪酸酯類等之非離子系界面活性劑;商品名Eftop(登錄商標)EF301、同EF303、同EF352(三菱材料電子化成股份公司)、商品名Megafac(登錄商標)F-553、同F-554、同F-556、同F-477、同F171、同F173、同R-08、同R-30、同R-30N(DIC股份公司製)、FLUORAD FC430、同FC431(住友3M股份公司製)、商品名AsahiGuard(登錄商標)AG710、Surflon(登錄商標)S-382、同SC101、同SC102、同SC103、同SC104、同SC105、同SC106(旭硝子股份公司製)等之氟系界面活性劑;及有機矽氧烷聚合物KP341(信越化學工業股份公司製)。
上述界面活性劑,可單獨使用或組合2種以
上使用。使用界面活性劑時,其比例相對於上述(A)成分、(B)成分及(C)成分之總質量,較佳為0.01phr~40phr、更佳為0.01phr~10phr。
本發明之壓印材料,在不損及本發明之效果下,可因應需要而含有環氧化合物、光酸發生劑、光增感劑、紫外線吸收劑、抗氧化劑、密著補助劑或脫模性提昇劑。
上述環氧化合物方面,可舉例如X-22-2046、X-22-343、X-22-2000、X-22-4741、X-22-163、X-22-163A、X-22-163B、X-22-163C、X-22-169AS、X-22-169B、X-22-173BX、X-22-173DX、X-22-9002、KF-102、KF-101、KF-1001、KF-1002、KF-1005、KF-105(以上,信越化學工業股份公司製)、EPOLEAD(登錄商標)GT-401、同PB3600、CELLOXIDE(登錄商標)2021P、同2000、同3000、EHPE3150、EHPE3150CE、CYCLOMER(登錄商標)M100(以上,股份公司Daicel製)、EPICLON(登錄商標)840、同840-S、同N-660、同N-673-80M(以上,DIC股份公司製)。
上述光酸發生劑方面,可舉例如IRGACURE(登錄商標)PAG103、同PAG108、同PAG121、同PAG203、同CGI725(以上,BASF JAPAN股份公司製)、WPAG-145、WPAG-170、WPAG-199、WPAG-281、WPAG-336、WPAG-367(以上,和光純藥工業股份
公司製)、TFE-Triazine、TME-Triazine、MP-Triazine、二甲氧基三嗪、TS-91、TS-01(股份公司三和化學製)。
上述光增感劑方面,可舉例如硫代呫噸系、呫噸系、酮系、硫代吡喃鎓鹽系、鹼性苯乙烯基系、部花青素系、3-取代香豆素系、3,4-取代香豆素系、花青素系、吖啶系、噻嗪系、吩噻嗪系、蒽系、暈苯系、苯并蒽系、苝系、酮香豆素系、香豆素系、硼酸酯系。
上述光增感劑,可單獨使用或組合2種以上使用。藉由使用該光增感劑,係可調整UV領域之吸收波長。
上述紫外線吸收劑方面,可舉例如TINUVIN(登錄商標)PS、同99-2、同109、同328、同384-2、同400、同405、同460、同477、同479、同900、同928、同1130、同111FDL、同123、同144、同152、同292、同5100、同400-DW、同477-DW、同99-DW、同123-DW、同5050、同5060、同5151(以上,BASF JAPAN股份公司)。
上述紫外線吸收劑,可單獨使用或組合2種以上使用。藉由使用該紫外線吸收劑,係可控制光硬化時膜之最表面的硬化速度,可提昇脫模性。
上述抗氧化劑方面,可舉例如IRGANOX(登錄商標)1010、同1035、同1076、同1135、同1520L(以上,BASF JAPAN股份公司)。
上述抗氧化劑,可單獨使用或組合2種以上
使用。藉由使用該抗氧化劑,係可防止因氧化導致的膜變黃色。
上述密著補助劑方面,可舉例如3-甲基丙烯醯氧基丙基三甲氧基矽烷、3-丙烯醯氧基丙基三甲氧基矽烷。藉由使用該密著補助劑,可提昇與基材之密著性。該密著補助劑之含量,相對於上述(A)成分及上述(B)成分之總質量,較佳為5phr~50phr、更佳為10phr~50phr。
上述脫模性提昇劑方面,可舉例如含氟之化合物。含氟之化合物方面,可舉例如R-5410、R-1420、M-5410、M-1420、E-5444、E-7432、A-1430、A-1630(以上,DAIKIN工業股份公司製)。
本發明之壓印材料之調製方法,並無特別限定,如為混合(A)成分、(B)成分、(C)成分、(D)成分、與作為任意成分之(E)成分及所期望之其他添加劑而使壓印材料可成為均一的狀態即可。
又,混合(A)成分~(E)成分與所期望之其他添加劑時的順序,若可獲得均一的壓印材料則無問題,並無特別限定。該調製方法方面,可舉例如於(A)成分中以既定的比例混合(B)成分之方法。又,亦可舉出於其中進一步混合(C)成分、(D)成分、(E)成分,而為均一的壓印材料之方法。再者,可進一步在此調製方法的適
當階段中,因應需要而添加其他添加劑予以混合之方法。
本發明之壓印材料可藉由於基材上塗佈使其光硬化,來獲得所期望之硬化膜。塗佈方法方面,可舉出公知或周知之方法,例如、旋轉塗佈法、浸漬法、淋塗法、噴墨法、噴霧法、棒塗法、凹版塗佈法、狹縫塗佈法、輥筒塗佈法、轉印印刷法、刷毛塗佈、刮刀塗佈法、氣刀塗佈法。
經塗佈本發明之壓印材料之基材方面,可舉例如由矽晶圓、經銦錫氧化物(ITO)製膜之玻璃(以下,本說明書中簡稱為「ITO基板」)、經矽氮化物(SiN)製膜之玻璃(SiN基板)、經銦鋅氧化物(IZO)製膜之玻璃、聚乙烯對苯二甲酸酯(PET)、三乙醯基纖維素(TAC)、丙烯酸酯、塑膠、玻璃、石英、陶瓷等所成之基材。又,具可撓性之可撓性基材,係可使用由例如三乙醯基纖維素、聚乙烯對苯二甲酸酯、聚甲基丙烯酸甲酯、環烯烴(共)聚合物、聚乙烯基醇、聚碳酸酯、聚苯乙烯、聚醯亞胺、聚醯胺、聚烯烴、聚丙烯、聚乙烯、聚乙烯萘二甲酸酯、聚醚碸、與組合此等聚合物所成的共聚物來構成的基材。
使本發明之壓印材料硬化之光源方面,並無特別限定,可舉例如高壓水銀燈、低壓水銀燈、無電極燈、金屬鹵素燈、KrF準分子雷射、ArF準分子雷射、F2
準分子雷射、電子線(EB)、極端紫外線(EUV)。又,波長上,一般而言,可使用436nm之G線、405nm之H線、365nm之I線、或GHI混合線。再者,曝光量較佳為30~2000mJ/cm2、更佳為30~1000mJ/cm2。
此外,使用作為前述(D)成分之溶劑時,在使溶劑蒸發為目的之下,亦可對光照射前的塗膜及光照射後的硬化膜之至少一方加入烘烤步驟。烘烤用的機器方面,並無特別地限定,例如,若為可使用加熱板、烘箱、加熱爐,而於適當的氛圍下,即大氣、氮等之惰性氣體、或真空中進行加熱者即可。烘烤溫度,在使溶劑蒸發之目的下,並無特別限定,例如,可於40℃~200℃進行。
實施光壓印的裝置,若為可獲得目的圖型者即可,並無特別限定,可舉例如東芝機械股份公司製的ST50、同公司製的ST50S-LED、Obducat公司製的Sindre(登錄商標)60、明昌機工股份公司製的NM-0801HB等之市售的裝置。並且,可使用使用該裝置而將於基材上塗佈之壓印材料與模具壓著,於光硬化後予以脫模之方法。
又,製作本發明之圖型已經轉印之膜時,使用的光壓印用模具材方面,可舉例如石英、矽、鎳、氧化鋁、羰基矽烷、玻璃石墨、聚二甲基聚矽氧,若可獲得目的之圖型即可,並無特別限定。又,模具為了提高脫模性,亦可對其表面進行形成氟系化合物等之薄膜的脫模處理。脫模處理中使用的脫模劑方面,可舉例如DAIKIN工業股份公司製的OPTOOL(登錄商標)HD、同DSX,但
若可獲得目的之圖型即可,並無特別限定。
光壓印的圖型大小為奈米等級,具體而言,係以未達1μ(微米)之圖型大小為準。
此外,本發明中,所謂評價脫模力之90°剝離試驗,一般係為下述測驗:將接著物(本發明中,相當於由壓印材料所形成之硬化膜)貼附於被接著物(本發明中,相當於作為基材使用之薄膜),並於既定時間後以既定的剝離速度向90°方向剝離時,測定所產生之抵抗力(張力)。通常,測定乃以參考JIS Z0237之評價法所實施。在此,係將所測之抵抗力以每單位被接著物的寬幅換算之值作為脫模力來予以評價。
而且,將本發明之壓印材料塗佈於薄膜上,並使該薄膜上之塗膜接著於模具之具有凹凸形狀的面,接著,使該塗膜直接接著於模具之具有凹凸形狀的面之下使其光硬化,之後,再將薄膜上的硬化膜自模具之具凹凸形狀的面90°剝離之試驗中所計測之脫模力,即,將該薄膜上的硬化膜自模具之具凹凸形狀的面完全剝離時的荷重,換算成該薄膜之横向寬幅每1cm的值,係以大於0g/cm且為0.8g/cm以下者為佳。此脫模力係以於前述範圍中愈小值愈佳。
如此,由本發明之壓印材料所製作且圖型已經轉印之膜,再者,具備有該膜之半導體元件以及於基材上具備有該膜之光學構件、固體攝影元件、LED裝置、太陽電池、顯示器及電子裝置,皆為本發明之對象。
以下,舉出實施例及比較例,以進一步詳細說明本發明,但本發明並不受限於此等之實施例。
後述合成例1所示之聚合物的重量平均分子量,乃是藉由膠體滲透層析(以下,本說明書中簡稱為GPC)所得之測定結果。測定中,係使用(股)島津製作所製GPC系統。該GPC系統之構成與測定條件係如下述。
系統控制器:CBM-20A、管柱烘箱:CTO-20、自動取樣機:SIL-10AF、檢出器:SPD-20A及RID-10A、排氣單元:DGU-20A3
GPC管柱:Shodex(登錄商標)KF-804L及KF-803L
管柱溫度:40℃
溶劑:四氫呋喃
流量:1mL/分
標準試料:不同重量平均分子量(197000、55100、12800、3950、1260、580)之聚苯乙烯6種
於2000mL之四口燒瓶中,置入3-丙烯醯基氧基丙基三甲氧基矽烷486.98g及甲醇400.53g,攪拌下冷卻至10℃,將0.1N鹽酸水溶液112.23g與甲醇200.26g之混合溶
液在10~25℃花30分鐘滴下。之後,室溫下攪拌1小時,迴流下攪拌3小時。於此溶液中,邊添加丙二醇單甲基醚乙酸酯(以下,本說明書中簡稱為PGMEA)820g邊予以減壓濃縮,取代為PGMEA溶液,並得600.0g之倍半矽氧烷化合物PGMEA溶液。於此倍半矽氧烷化合物PGMEA溶液中,加入丙二醇單甲基醚(以下,本說明書中簡稱為PGME)120.0g,在40℃加熱2小時,得到倍半矽氧烷化合物的PGMEA/PGME溶液(PS-1)。將所得之PS-1的固形分濃度以鹵素水分計(HR83-P、METTLER TOLEDO股份公司製)在150℃測定後,固形分濃度為50%。本合成例1中所得之倍半矽氧烷化合物的重量平均分子量以GPC測定的結果為1100。此倍半矽氧烷化合物乃具有前述式(1)所示之重複單位,該式中,X0表示丙烯醯基氧基、R0表示亞甲基、k表示3。
將AC-SQ TA-100(東亞合成股份公司製)(以下,本說明書中簡稱為「AC-SQTA-100」)9.5g、X-22-1602(信越化學股份公司製)(以下,本說明書中簡稱為「X-22-1602」)0.5g、Lucirin(登錄商標)TPO(BASF JAPAN股份公司製)(以下,本說明書中簡稱為「Lucirin TPO」)0.25g(對AC-SQ TA-100及X-22-1602之總量而言為2.5phr)、丙酮酸乙基酯19g予以混合,調
製壓印材料PNI-a1。本實施例中,對相當於(A)成分之AC-SQ TA-100及相當於(B)成分之X-22-1602之合計100質量%而言,該(B)成分的比例為5質量%。
混合9g的AC-SQ TA-100、1g的X-22-1602、0.25g的Lucirin TPO(對AC-SQ TA-100及X-22-1602之總量而言為2.5phr)、丙酮酸乙基酯19g,調製壓印材料PNI-a2。本實施例中,對相當於(A)成分之AC-SQ TA-100及相當於(B)成分之X-22-1602的合計100質量%而言,該(B)成分的比例為10質量%。
混合9g的AC-SQ TA-100、1g的X-22-1602、0.25g的Lucirin TPO、0.0051g的Mcgafac(登錄商標)R-30N(DIC股份公司製)(以下,本說明書中簡稱為「R-30N」)(對AC-SQ TA-100、X-22-1602及Lucirin TPO之總量而言為0.05phr)、丙酮酸乙基酯19g,調製壓印材料PNI-a3。本實施例中,對相當於(A)成分之AC-SQ TA-100及相當於(B)成分之X-22-1602的合計100質量%而言,該(B)成分的比例為10質量%。
混合8g的AC-SQ TA-100、2g的X-22-1602、0.25g
的Lucirin TPO(對AC-SQ TA-100及X-22-1602之總量而言為2.5phr)、丙酮酸乙基酯19g,調製壓印材料PNI-a4。本實施例中,對相當於(A)成分之AC-SQ TA-100及相當於(B)成分之X-22-1602的合計100質量%而言,該(B)成分的比例為20質量%。
混合8g的AC-SQ TA-100、2g的X-22-1602、0.25g的Lucirin TPO(對AC-SQ TA-100及X-22-1602之總量而言為2.5phr)、0.0051g的R-30N(對AC-SQ TA-100、X-22-1602及Lucirin TPO之總量而言為0.05phr)、丙酮酸乙基酯19g,調製壓印材料PNI-a5。本實施例中,對相當於(A)成分之AC-SQ TA-100及相當於(B)成分之X-22-1602的合計100質量%而言,該(B)成分的比例為20質量%。
混合7.5g的AC-SQ TA-100、2.5g的X-22-1602、0.25g的LucirinTPO(對AC-SQ TA-100及X-22-1602之總量而言為2.5phr)、丙酮酸乙基酯19g,調製壓印材料PNI-a6。本實施例中,對相當於(A)成分之AC-SQ TA-100及相當於(B)成分之X-22-1602的合計100質量%而言,該(B)成分的比例為25質量%。
混合9.5g的合成例1所得之PS-1(固形分濃度50質量%)、0.25g的X-22-1602、0.125g的Lucirin TPO(對自PS-1去除了溶劑之固形分及X-22-1602之總量而言為2.5phr)、4.77g的PGMEA,調製壓印材料PNI-a7。本實施例中,對相當於(A)成分之自PS-1去除了溶劑之固形分及相當於(B)成分之X-22-1602之合計100質量%而言,該(B)成分的比例為5質量%。
混合9g的合成例1所得之PS-1、0.5g的X-22-1602、0.125g的Lucirin TPO(對自PS-1去除了溶劑之固形分及X-22-1602之總量而言為2.5phr)、5.02g的PGMEA,調製壓印材料PNI-a8。本實施例中,對相當於(A)成分之自PS-1去除了溶劑之固形分及相當於(B)成分之X-22-1602之合計100質量%而言,該(B)成分的比例為10質量%。
混合9g的合成例1所得之PS-1、0.5g的X-22-1602、0.125g的Lucirin TPO(對自PS-1去除了溶劑之固形分及X-22-1602之總量而言為2.5phr)、0.0026g的R-30N(對自PS-1去除了溶劑之固形分、X-22-1602及Lucirin TPO之總量而言為0.05phr)、5.02g的PGMEA,
調製壓印材料PNI-a9。本實施例中,對相當於(A)成分之自PS-1去除了溶劑之固形分及相當於(B)成分之X-22-1602之合計100質量%而言,該(B)成分的比例為10質量%。
混合8g的合成例1所得之PS-1、1g的X-22-1602、0.125g的Lucirin TPO(對自PS-1去除了溶劑之固形分及X-22-1602之總量而言為2.5phr)、5.52g的PGMEA,調製壓印材料PNI-a10。本實施例中,對相當於(A)成分之自PS-1去除了溶劑之固形分及相當於(B)成分之X-22-1602之合計100質量%而言,該(B)成分的比例為20質量%。
混合8g的合成例1所得之PS-1、1g的X-22-1602、0.125g的Lucirin TPO(對自PS-1去除了溶劑之固形分及X-22-1602之總量而言為2.5phr)、0.0026g的R-30N(對自PS-1去除了溶劑之固形分、X-22-1602及Lucirin TPO之總量而言為0.05phr)、5.52g的PGMEA,調製壓印材料PNI-a11。本實施例中,對相當於(A)成分之自PS-1去除了溶劑之固形分及相當於(B)成分之X-22-1602之合計100質量%而言,該(B)成分的比例為20質量%。
混合7.5g的合成例1所得之PS-1、1.25g的X-22-1602、0.125g的Lucirin TPO(對自PS-1去除了溶劑之固形分及X-22-1602之總量而言為2.5phr)、5.77g的PGMEA,調製壓印材料PNI-a12。本實施例中,對相當於(A)成分之自PS-1去除了溶劑之固形分及相當於(B)成分之X-22-1602之合計100質量%而言,該(B)成分的比例為25質量%。
混合10g的AC-SQ TA-100、0.25g的Lucirin TPO(對AC-SQ TA-100之,量而言為2.5phr)、丙酮酸乙基酯19g,調製壓印材料PNI-b1。本比較例中,(B)成分的比例為0質量%。
混合7g的AC-SQ TA-100、3g的X-22-1602、0.25g的Lucirin TPO(對AC-SQ TA-100、X-22-1602之總量而言為2.5phr)、丙酮酸乙基酯19g,調製壓印材料PNI-b2。本比較例中,對相當於(A)成分之AC-SQ TA-100及相當於(B)成分之X-22-1602的合計100質量%而言,該(B)成分的比例為30質量%。
混合7g的合成例1所得之PS-1、1.5g的X-22-1602、0.125g的Lucirin TPO(對自PS-1去除了溶劑之固形分及X-22-1602之總量而言為2.5phr)、6.02g的PGMEA,調製壓印材料PNI-b3。本比較例中,對相當於(A)成分之自PS-1去除了溶劑之固形分及相當於(B)成分之X-22-1602之合計100質量%而言,該(B)成分的比例為30質量%。
混合10g的X-22-1602、0.25g的Lucirin TPO、丙酮酸乙基酯19g,調製壓印材料PNI-b4。本比較例中,(B)成分的比例為100質量%。
將實施例1~實施例12及比較例1~比較例4中所得之各壓印材料,使用棒塗佈機(全自動薄膜塗抹器KT-AB3120、COTEC股份公司製),塗佈於厚度80μm之三乙醯基纖維素薄膜(使用Fuji Film股份公司製的FUJITAC(登錄商標))(以下,本說明書中簡稱為「TAC薄膜」)上,乾燥去除溶劑。之後,使該TAC薄膜上的塗膜朝向蛾眼圖型模具進行滾輪壓著。接著,對該塗膜,從TAC薄膜側以無電極均一照射裝置(QRE-4016A、股份公司OAK製作所製)實施350mJ/cm2之曝光,進行光硬化。然後,參考JIS Z0237,進行90°剝離試驗,並
測定與模具具凹凸形狀之面接著之TAC薄膜上所形成之硬化膜即圖型已經轉印之膜,自模具具凹凸形狀之面完全地剝離時的荷重。而且,計算薄膜之寬幅每1cm的荷重來作為脫模力(g/cm)。將所得之結果顯示於表1。
將實施例1~實施例12及比較例1~比較例4中所得之各壓印材料旋轉塗佈於無鹼玻璃基板上。之後,對該無鹼玻璃基板上的塗膜接著矽晶圓,並設置於奈米壓印裝置(NM-0801HB、明昌機工股份公司製)上,花費10秒鐘加壓至100N為止來去除膜中的氣泡,花費10秒鐘去除壓力之後,以無電極均一照射裝置來實施350mJ/cm2之曝光。然後,將上述矽晶圓剝離,於無鹼玻璃基板上製造厚度2μm之硬化膜,於保持在260℃之加熱板上烘烤20分鐘。而後,以目視觀察烘烤時中有無發煙。將所得之結果顯示於表1。
[表1]
從表1的結果可知,使用實施例1~實施例12中所得之壓印材料時,脫模力均為0.8g/cm以下,所得之硬化膜在260℃之溫度下的烘烤時沒有發煙,未見分解物的昇華。另一方面,使用比較例1~比較例4中所得之壓印材料時,脫模力較0.8g/cm更大許多,或者對所得之硬化膜在260℃之溫度下烘烤時,因可觀察到發煙而確認了分解物的昇華。以上,由本發明之壓印材料所得之硬化膜,乃具有0.8g/cm以下較低的脫模力,且為耐熱性優異者。
本發明之壓印材料,因可自模具輕易地剝離由該材料所形成之硬化膜(圖型已經轉印之膜),且耐熱性亦優之故,由該壓印材料所得之硬化膜,乃適用於太陽電池、LED裝置、顯示器等之製品中。
Claims (12)
- 一種壓印材料,其係含有下述(A)成分、(B)成分、(C)及(D)成分,且相對於前述(A)成分及(B)成分之合計100質量%,該(B)成分之比例為5質量%以上25質量%以下,(A):具有以下述式(1)所示之重複單位,且具2個以上式中X0所示之聚合性基之倍半矽氧烷化合物(B):具有下述式(2)所示之重複單位,且末端具有2個聚合性基之聚矽氧化合物(C):光聚合起始劑(D):溶劑
- 如請求項1中記載的壓印材料,其中,前述(A) 成分係由完全籠型構造及/或不完全籠型構造、與無規構造及階梯型構造之混合體所成者。
- 如請求項1或請求項2中記載的壓印材料,其係進一步含有界面活性劑作為(E)成分。
- 如請求項1~請求項3中任一項記載的壓印材料,其中,前述(A)成分及(B)成分之聚合性基係丙烯醯基氧基、甲基丙烯醯基氧基、乙烯基或烯丙基。
- 一種圖型已經轉印之膜,其係由如請求項1~請求項4中任一項記載的壓印材料所製作者。
- 一種光學構件,其係於基材上具備有如請求項5中記載的圖型已經轉印之膜者。
- 一種固體攝影裝置,其係於基材上具備有如請求項5中記載的圖型已經轉印之膜者。
- 一種LED裝置,其係於基材上具備有如請求項5中記載的圖型已經轉印之膜者。
- 一種半導體元件,其係具備有如請求項5中記載的圖型已經轉印之膜者。
- 一種太陽電池,其係於基材上具備有如請求項5中記載的圖型已經轉印之膜者。
- 一種顯示器,其係於基材上具備有如請求項5中記載的圖型已經轉印之膜者。
- 一種電子裝置,其係於基材上具備有如請求項5中記載的圖型已經轉印之膜者。
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JP (1) | JP6429031B2 (zh) |
KR (1) | KR102226670B1 (zh) |
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WO (1) | WO2015064310A1 (zh) |
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WO2016027619A1 (ja) * | 2014-08-21 | 2016-02-25 | 日産化学工業株式会社 | インプリント材料 |
EP3298181A1 (de) * | 2015-05-21 | 2018-03-28 | EV Group E. Thallner GmbH | Verfahren zur aufbringung einer überwuchsschicht auf eine keimschicht |
JP6332717B2 (ja) * | 2016-05-11 | 2018-05-30 | Dic株式会社 | 光インプリント用硬化性組成物及びそれを用いたパターン転写方法 |
KR102452035B1 (ko) * | 2017-04-14 | 2022-10-11 | 삼성디스플레이 주식회사 | 소프트 몰드용 조성물, 이를 이용하여 제조된 소프트 몰드 |
KR102242545B1 (ko) * | 2017-09-27 | 2021-04-19 | 주식회사 엘지화학 | 항균성 고분자 코팅 조성물 및 항균성 고분자 필름 |
JP7408587B2 (ja) | 2018-07-20 | 2024-01-05 | イルミナ インコーポレイテッド | 樹脂組成物およびそれを組み込んだフローセル |
EP3632950A1 (en) * | 2018-10-05 | 2020-04-08 | Essilor International | Storage-stable heat-curable hybrid epoxy functional composition and transparent heat-cured coatings prepared therefrom |
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JPS6423273A (en) * | 1987-07-17 | 1989-01-25 | Fujitsu Ltd | Process for forming hologram protective film |
US5772905A (en) | 1995-11-15 | 1998-06-30 | Regents Of The University Of Minnesota | Nanoimprint lithography |
US7041748B2 (en) * | 2003-01-08 | 2006-05-09 | International Business Machines Corporation | Patternable low dielectric constant materials and their use in ULSI interconnection |
JP5196933B2 (ja) | 2006-09-27 | 2013-05-15 | 富士フイルム株式会社 | 光ナノインプリントリソグラフィ用硬化性組成物およびそれを用いたパターン形成方法 |
JP2008202022A (ja) | 2007-01-23 | 2008-09-04 | Fujifilm Corp | 光ナノインプリントリソグラフィ用硬化性組成物およびそれを用いたパターン形成方法 |
JP5328263B2 (ja) * | 2008-03-18 | 2013-10-30 | 昭和電工株式会社 | 磁気記録媒体の製造方法、磁気記録媒体、及び磁気記録再生装置 |
JP2010013513A (ja) | 2008-07-02 | 2010-01-21 | Fujifilm Corp | ナノインプリント用硬化性組成物、これを用いた硬化物、並びに、液晶表示装置用部材 |
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TWI425643B (zh) * | 2009-03-31 | 2014-02-01 | Sony Corp | 固態攝像裝置及其製造方法、攝像裝置和抗反射結構之製造方法 |
JP5757242B2 (ja) * | 2009-10-22 | 2015-07-29 | 日産化学工業株式会社 | ケイ素化合物を用いる膜形成組成物 |
BR112012020797B1 (pt) | 2010-07-22 | 2020-07-28 | Nsk Ltd | unidade de mancal de rolamento com codificador para o suporte de uma roda |
CN103097485B (zh) * | 2010-09-16 | 2014-08-27 | 积水化学工业株式会社 | 粘合剂组合物、粘合带、以及晶片的处理方法 |
JP2012099638A (ja) * | 2010-11-02 | 2012-05-24 | Fujifilm Corp | インプリント用硬化性組成物 |
JP5794420B2 (ja) * | 2011-09-20 | 2015-10-14 | 日産化学工業株式会社 | シリコーン骨格を有する化合物を含む光インプリント材料 |
JP2013138179A (ja) * | 2011-11-30 | 2013-07-11 | Central Glass Co Ltd | 光重合性組成物並びにそれを用いたパターン形成方法 |
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- 2014-10-06 KR KR1020167008223A patent/KR102226670B1/ko active IP Right Grant
- 2014-10-06 US US15/030,909 patent/US10351651B2/en active Active
- 2014-10-06 WO PCT/JP2014/076702 patent/WO2015064310A1/ja active Application Filing
- 2014-10-23 TW TW103136640A patent/TW201529642A/zh unknown
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WO2015064310A1 (ja) | 2015-05-07 |
US20160251469A1 (en) | 2016-09-01 |
US10351651B2 (en) | 2019-07-16 |
JPWO2015064310A1 (ja) | 2017-03-09 |
KR20160078336A (ko) | 2016-07-04 |
JP6429031B2 (ja) | 2018-11-28 |
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