TW201504631A - 光電元件檢測用之高頻探針卡 - Google Patents

光電元件檢測用之高頻探針卡 Download PDF

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Publication number
TW201504631A
TW201504631A TW102126339A TW102126339A TW201504631A TW 201504631 A TW201504631 A TW 201504631A TW 102126339 A TW102126339 A TW 102126339A TW 102126339 A TW102126339 A TW 102126339A TW 201504631 A TW201504631 A TW 201504631A
Authority
TW
Taiwan
Prior art keywords
probe
hole
high frequency
ground
impedance matching
Prior art date
Application number
TW102126339A
Other languages
English (en)
Chinese (zh)
Other versions
TWI460432B (enExample
Inventor
jia-tai Zhang
hui-bin Yang
Original Assignee
Mpi Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mpi Corp filed Critical Mpi Corp
Priority to TW102126339A priority Critical patent/TW201504631A/zh
Priority to CN201410275427.2A priority patent/CN104345186B/zh
Priority to JP2014148870A priority patent/JP2015021973A/ja
Priority to US14/338,797 priority patent/US9535093B2/en
Application granted granted Critical
Publication of TWI460432B publication Critical patent/TWI460432B/zh
Publication of TW201504631A publication Critical patent/TW201504631A/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW102126339A 2013-07-23 2013-07-23 光電元件檢測用之高頻探針卡 TW201504631A (zh)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW102126339A TW201504631A (zh) 2013-07-23 2013-07-23 光電元件檢測用之高頻探針卡
CN201410275427.2A CN104345186B (zh) 2013-07-23 2014-06-19 光电元件检测用的高频探针卡
JP2014148870A JP2015021973A (ja) 2013-07-23 2014-07-22 光電子ユニット測定用高周波プローブカード
US14/338,797 US9535093B2 (en) 2013-07-23 2014-07-23 High frequency probe card for probing photoelectric device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW102126339A TW201504631A (zh) 2013-07-23 2013-07-23 光電元件檢測用之高頻探針卡

Publications (2)

Publication Number Publication Date
TWI460432B TWI460432B (enExample) 2014-11-11
TW201504631A true TW201504631A (zh) 2015-02-01

Family

ID=52388375

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102126339A TW201504631A (zh) 2013-07-23 2013-07-23 光電元件檢測用之高頻探針卡

Country Status (4)

Country Link
US (1) US9535093B2 (enExample)
JP (1) JP2015021973A (enExample)
CN (1) CN104345186B (enExample)
TW (1) TW201504631A (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564568B (zh) * 2015-03-26 2017-01-01 Use a coaxial pin with a cantilever probe card
TWI541512B (zh) * 2015-05-29 2016-07-11 Use a probe card with a coaxial pin
TWI606241B (zh) * 2015-09-16 2017-11-21 Mpi Corp Probe card with bypass line
US10663486B2 (en) * 2017-02-06 2020-05-26 International Business Machines Corporation Portable electrical noise probe structure
CN108872651B (zh) * 2017-05-08 2021-05-07 旺矽科技股份有限公司 探针卡
TWI661206B (zh) * 2018-01-19 2019-06-01 新加坡商美亞國際電子有限公司 測試用電路板
CN110716122B (zh) * 2018-07-13 2021-09-28 中华精测科技股份有限公司 高频探针卡装置及其信号传输模块
MY206126A (en) 2018-11-27 2024-11-30 Nhk Spring Co Ltd Probe unit
TW202035995A (zh) * 2019-03-18 2020-10-01 旺矽科技股份有限公司 探針裝置
TWI679424B (zh) * 2019-03-29 2019-12-11 矽品精密工業股份有限公司 檢測裝置及其製法
US11346860B2 (en) * 2019-08-15 2022-05-31 Mpi Corporation Probe head for high frequency signal test and medium or low frequency signal test at the same time
CN112611916B (zh) * 2019-10-04 2024-09-03 旺矽科技股份有限公司 用于电路板阻抗测试的可调式探针装置
CN112710878B (zh) * 2019-10-24 2024-02-27 台湾中华精测科技股份有限公司 可拆式高频测试装置及其垂直式探针头
CN114354990B (zh) * 2020-10-14 2024-04-09 旺矽科技股份有限公司 整合不同电性测试的探针卡
US12158482B2 (en) * 2020-12-22 2024-12-03 Mediatek Inc. Probe card assembly
CN113848351B (zh) * 2021-08-16 2023-07-25 昆山德普福电子科技有限公司 高频探测组件

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3205373B2 (ja) * 1992-03-12 2001-09-04 株式会社日立製作所 液晶表示装置
JPH0650991A (ja) * 1992-07-31 1994-02-25 Toho Denshi Kk プローブ装置
JP2790074B2 (ja) * 1995-03-31 1998-08-27 日本電気株式会社 プローブ装置
JP4060984B2 (ja) * 1999-04-07 2008-03-12 株式会社日本マイクロニクス プローブカード
US7254889B1 (en) * 2000-09-08 2007-08-14 Gabe Cherian Interconnection devices
TW459405B (en) * 2000-10-17 2001-10-11 Advanced Epitaxy Technology In Manufacturing method of III-nitride device
TWI321820B (en) * 2006-08-25 2010-03-11 Star Techn Inc Integrated circuits probing apparatus having a temperature-adjusting mechanism
WO2008059767A1 (fr) 2006-11-15 2008-05-22 Japan Electronic Materials Corp. Appareil d'inspection de dispositif optique
TW200829922A (en) * 2007-01-08 2008-07-16 Microelectonics Technology Inc High frequency probe
US7595651B2 (en) * 2007-02-13 2009-09-29 Mpi Corporation Cantilever-type probe card for high frequency application
CN101788573A (zh) * 2009-01-23 2010-07-28 京元电子股份有限公司 探针卡
US8503186B2 (en) * 2009-07-30 2013-08-06 Megica Corporation System-in packages
US8570055B2 (en) * 2009-12-31 2013-10-29 Mapper Lithography Ip B.V. Capacitive sensing system
US8884640B2 (en) * 2011-04-28 2014-11-11 Mpi Corporation Integrated high-speed probe system
CN103543304B (zh) * 2012-07-13 2016-05-18 旺矽科技股份有限公司 高频探针卡

Also Published As

Publication number Publication date
US9535093B2 (en) 2017-01-03
TWI460432B (enExample) 2014-11-11
US20150028911A1 (en) 2015-01-29
CN104345186B (zh) 2017-07-14
JP2015021973A (ja) 2015-02-02
CN104345186A (zh) 2015-02-11

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MM4A Annulment or lapse of patent due to non-payment of fees