CN104345186B - 光电元件检测用的高频探针卡 - Google Patents

光电元件检测用的高频探针卡 Download PDF

Info

Publication number
CN104345186B
CN104345186B CN201410275427.2A CN201410275427A CN104345186B CN 104345186 B CN104345186 B CN 104345186B CN 201410275427 A CN201410275427 A CN 201410275427A CN 104345186 B CN104345186 B CN 104345186B
Authority
CN
China
Prior art keywords
probe
hole
frequency
ground
impedance matching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410275427.2A
Other languages
English (en)
Chinese (zh)
Other versions
CN104345186A (zh
Inventor
张嘉泰
杨惠彬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MJC Probe Inc
Original Assignee
MJC Probe Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MJC Probe Inc filed Critical MJC Probe Inc
Publication of CN104345186A publication Critical patent/CN104345186A/zh
Application granted granted Critical
Publication of CN104345186B publication Critical patent/CN104345186B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06772—High frequency probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
CN201410275427.2A 2013-07-23 2014-06-19 光电元件检测用的高频探针卡 Expired - Fee Related CN104345186B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW102126339 2013-07-23
TW102126339A TW201504631A (zh) 2013-07-23 2013-07-23 光電元件檢測用之高頻探針卡

Publications (2)

Publication Number Publication Date
CN104345186A CN104345186A (zh) 2015-02-11
CN104345186B true CN104345186B (zh) 2017-07-14

Family

ID=52388375

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410275427.2A Expired - Fee Related CN104345186B (zh) 2013-07-23 2014-06-19 光电元件检测用的高频探针卡

Country Status (4)

Country Link
US (1) US9535093B2 (enExample)
JP (1) JP2015021973A (enExample)
CN (1) CN104345186B (enExample)
TW (1) TW201504631A (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI564568B (zh) * 2015-03-26 2017-01-01 Use a coaxial pin with a cantilever probe card
TWI541512B (zh) * 2015-05-29 2016-07-11 Use a probe card with a coaxial pin
TWI606241B (zh) * 2015-09-16 2017-11-21 Mpi Corp Probe card with bypass line
US10663486B2 (en) * 2017-02-06 2020-05-26 International Business Machines Corporation Portable electrical noise probe structure
CN108872651B (zh) * 2017-05-08 2021-05-07 旺矽科技股份有限公司 探针卡
TWI661206B (zh) * 2018-01-19 2019-06-01 新加坡商美亞國際電子有限公司 測試用電路板
CN110716122B (zh) * 2018-07-13 2021-09-28 中华精测科技股份有限公司 高频探针卡装置及其信号传输模块
WO2020111076A1 (ja) * 2018-11-27 2020-06-04 日本発條株式会社 プローブユニット
TW202035995A (zh) * 2019-03-18 2020-10-01 旺矽科技股份有限公司 探針裝置
TWI679424B (zh) * 2019-03-29 2019-12-11 矽品精密工業股份有限公司 檢測裝置及其製法
US11346860B2 (en) * 2019-08-15 2022-05-31 Mpi Corporation Probe head for high frequency signal test and medium or low frequency signal test at the same time
CN112611916B (zh) * 2019-10-04 2024-09-03 旺矽科技股份有限公司 用于电路板阻抗测试的可调式探针装置
CN112710878B (zh) * 2019-10-24 2024-02-27 台湾中华精测科技股份有限公司 可拆式高频测试装置及其垂直式探针头
CN114354990B (zh) * 2020-10-14 2024-04-09 旺矽科技股份有限公司 整合不同电性测试的探针卡
US12158482B2 (en) * 2020-12-22 2024-12-03 Mediatek Inc. Probe card assembly
CN113848351B (zh) * 2021-08-16 2023-07-25 昆山德普福电子科技有限公司 高频探测组件

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW459405B (en) * 2000-10-17 2001-10-11 Advanced Epitaxy Technology In Manufacturing method of III-nitride device
TW200811974A (en) * 2006-08-25 2008-03-01 Star Techn Inc Integrated circuits probing apparatus having a temperature-adjusting mechanism
US7595651B2 (en) * 2007-02-13 2009-09-29 Mpi Corporation Cantilever-type probe card for high frequency application
CN101583860A (zh) * 2006-11-15 2009-11-18 日本电子材料株式会社 光学设备用检查装置
CN101788573A (zh) * 2009-01-23 2010-07-28 京元电子股份有限公司 探针卡

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3205373B2 (ja) * 1992-03-12 2001-09-04 株式会社日立製作所 液晶表示装置
JPH0650991A (ja) * 1992-07-31 1994-02-25 Toho Denshi Kk プローブ装置
JP2790074B2 (ja) * 1995-03-31 1998-08-27 日本電気株式会社 プローブ装置
JP4060984B2 (ja) * 1999-04-07 2008-03-12 株式会社日本マイクロニクス プローブカード
US7254889B1 (en) * 2000-09-08 2007-08-14 Gabe Cherian Interconnection devices
TW200829922A (en) * 2007-01-08 2008-07-16 Microelectonics Technology Inc High frequency probe
KR101332225B1 (ko) * 2009-07-30 2013-11-25 메키트 에퀴지션 코포레이션 시스템-인 패키지들
US20110261344A1 (en) * 2009-12-31 2011-10-27 Mapper Lithography Ip B.V. Exposure method
US8884640B2 (en) * 2011-04-28 2014-11-11 Mpi Corporation Integrated high-speed probe system
CN103543304B (zh) * 2012-07-13 2016-05-18 旺矽科技股份有限公司 高频探针卡

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW459405B (en) * 2000-10-17 2001-10-11 Advanced Epitaxy Technology In Manufacturing method of III-nitride device
TW200811974A (en) * 2006-08-25 2008-03-01 Star Techn Inc Integrated circuits probing apparatus having a temperature-adjusting mechanism
CN101583860A (zh) * 2006-11-15 2009-11-18 日本电子材料株式会社 光学设备用检查装置
US7595651B2 (en) * 2007-02-13 2009-09-29 Mpi Corporation Cantilever-type probe card for high frequency application
CN101788573A (zh) * 2009-01-23 2010-07-28 京元电子股份有限公司 探针卡

Also Published As

Publication number Publication date
US20150028911A1 (en) 2015-01-29
TWI460432B (enExample) 2014-11-11
US9535093B2 (en) 2017-01-03
TW201504631A (zh) 2015-02-01
JP2015021973A (ja) 2015-02-02
CN104345186A (zh) 2015-02-11

Similar Documents

Publication Publication Date Title
CN104345186B (zh) 光电元件检测用的高频探针卡
TWI512300B (zh) Cantilever high frequency probe card
TWI564568B (zh) Use a coaxial pin with a cantilever probe card
TWI541512B (zh) Use a probe card with a coaxial pin
TWI700500B (zh) 測試裝置
US9470716B2 (en) Probe module
TWI522623B (zh) Probe module (1)
CN104714057B (zh) 测试治具
US9759746B2 (en) Probe module
TWI506280B (zh) Probe module (2)
CN106885927A (zh) 探针模块
CN105277754B (zh) 探针卡及其转接电路板与讯号馈入结构
TWI564567B (zh) Probe card and its probe module and signal probe
CN104714055B (zh) 检测治具
CN110301073A (zh) 连接器结构
TWI537566B (zh) Probe module
KR20240059374A (ko) 컨택트 단자 및 컨택트 단자를 포함하는 소켓
TWI592077B (zh) Probe card and its probe module and power probe
KR101895012B1 (ko) 삽입형 고주파수 신호 전송커넥터 및 상기 삽입형 고주파수 신호 전송커넥터를 사용하는 프로브카드
JP2020020659A (ja) 半導体デバイスの検査治具及び検査方法
KR20180040324A (ko) 프로브 팁 조립체
TWM459405U (zh) 高頻探針結構及其高頻探針卡

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170714

Termination date: 20200619

CF01 Termination of patent right due to non-payment of annual fee