TW201500156A - Breaking tool of brittle material substrate and support fixture of brittle material substrate - Google Patents

Breaking tool of brittle material substrate and support fixture of brittle material substrate Download PDF

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Publication number
TW201500156A
TW201500156A TW103103666A TW103103666A TW201500156A TW 201500156 A TW201500156 A TW 201500156A TW 103103666 A TW103103666 A TW 103103666A TW 103103666 A TW103103666 A TW 103103666A TW 201500156 A TW201500156 A TW 201500156A
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Taiwan
Prior art keywords
substrate
plate
jig
groove
breaking
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TW103103666A
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Chinese (zh)
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TWI620632B (en
Inventor
Tomoko Kinoshita
Kenji Murakami
Masakazu Takeda
Kenji Otoda
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Mitsuboshi Diamond Ind Co Ltd
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Priority claimed from JP2013137209A external-priority patent/JP6163368B2/en
Priority claimed from JP2013137208A external-priority patent/JP2015009332A/en
Priority claimed from JP2013137207A external-priority patent/JP2015009331A/en
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW201500156A publication Critical patent/TW201500156A/en
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Publication of TWI620632B publication Critical patent/TWI620632B/en

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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033Apparatus for opening score lines in glass sheets
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/10Glass-cutting tools, e.g. scoring tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/02Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/08Severing cooled glass by fusing, i.e. by melting through the glass
    • C03B33/082Severing cooled glass by fusing, i.e. by melting through the glass using a focussed radiation beam, e.g. laser
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The present invention provides a breaking tool, which can orderly carry out breaking by manual work along scribe lines formed on a surface of a substrate and breaking can be surely achieved even when the cracks along the scribe lines penetrate shallower into the interior of the substrate or the spacing between the scribe lines is narrower. The breaking tool comprises a support fixture 1, which has a groove 3 on a surface for the insertion of one end portion W' of the substrate W; and a clamping fixture 2, which clamps and holds the substrate W in such a manner that the end portion W' of the substrate W containing a scribe line to be broken projects out. The clamping fixture 2 includes a first plate 8, a second plate 9, and intermediate boards 11 located between the substrate W and the two plates 8, 9. The intermediate boards 11 are formed of an elastic material. The width L1 of the intermediate boards 11 is smaller than the width L2 of the substrate W, and left and right portions of the substrate W comprise areas L3 that are not overlapping the intermediate boards 11.

Description

脆性材料基板之分斷工具及脆性材料基板之支持夾具 Breaking tool for brittle material substrate and supporting fixture for brittle material substrate

本發明涉及一種陶瓷等脆性材料基板之分斷工具。本發明尤其涉及一種以手工作業進行已於前段步驟中形成有劃線(切槽)之脆性材料基板(以下,簡稱為「基板」)之分斷操作之簡易方式之分斷工具。 The present invention relates to a breaking tool for a substrate such as a ceramic material. More particularly, the present invention relates to a cutting tool which is a simple method of performing a breaking operation of a slashed (grooved) brittle material substrate (hereinafter simply referred to as "substrate") in a previous step by hand.

以往,已知如下方法:利用刀輪(亦稱為劃線輪)或雷射光束等劃線機構,於基板表面形成相互正交之X方向以及Y方向之劃線,其後,自該劃線之相反側之面施加外力而使基板彎曲、或壓彎基板,從而將基板分斷為單位基板,例如專利文獻1或專利文獻2、專利文獻3等中有揭示。 Conventionally, there has been known a method in which a scribing mechanism such as a cutter wheel (also referred to as a scribing wheel) or a laser beam is used to form a cross line in the X direction and the Y direction orthogonal to each other on the surface of the substrate, and thereafter, from the plan An external force is applied to the surface on the opposite side of the line to bend the substrate or to bend the substrate, thereby dividing the substrate into a unit substrate. For example, Patent Document 1, Patent Document 2, and Patent Document 3 disclose.

又,用以沿劃線分斷基板之方法,自先前以來便已知有各種方法。 Further, in order to separate the substrate along the scribe line, various methods have been known since the prior art.

圖12表示一般所使用之分斷方法之一例。如圖12(a)所示,隔著緩衝片材21而將基板W載置於水平之平台20上。於該情況下,使基板之形成有劃線S之面成為下側。然後,如圖12(b)所示,使分斷桿22自基板W之上方下降而使基板W彎曲,由此,沿著劃線S分斷基板W(參照專利文獻1之圖5)。 Fig. 12 shows an example of a breaking method generally used. As shown in FIG. 12(a), the substrate W is placed on the horizontal stage 20 via the buffer sheet 21. In this case, the surface on which the scribe line S is formed on the substrate is set to the lower side. Then, as shown in FIG. 12(b), the breaking lever 22 is lowered from above the substrate W to bend the substrate W, whereby the substrate W is divided along the scribe line S (see FIG. 5 of Patent Document 1).

圖13表示另一分斷方法。該方法中,藉由配置夾持劃線S而支持基板W之一對支持刃23、23,且將分斷桿24自基板W之與設置有劃線S之面為相反側之面按壓於基板而使基板W彎曲,從而沿著劃線S分斷基板(參照專利文獻2之圖3)。 Fig. 13 shows another breaking method. In this method, one of the support pads 23 and 23 of the substrate W is supported by arranging the scribe line S, and the breaking lever 24 is pressed against the surface of the substrate W opposite to the surface on which the scribe line S is provided. The substrate W is bent by the substrate, and the substrate is separated along the scribe line S (see FIG. 3 of Patent Document 2).

圖14表示又一分斷方法。該方法中,於使基板W之應斷開之一端部分Wa自平台25之一端緣突出至外側之狀態下,將基板W載置於平台25上。於該情況下,預先使應斷開之劃線S朝向上方而與平台24之端緣一致。然後,使分斷桿26下降而下壓基板W之突出部分Wa,從而沿著劃線S分斷基板(參照專利文獻3之圖1~3)。 Figure 14 shows yet another method of breaking. In this method, the substrate W is placed on the stage 25 in a state where one end portion Wa of the substrate W is to be protruded from one end edge of the stage 25 to the outside. In this case, the scribe line S to be broken is placed upward to coincide with the end edge of the stage 24. Then, the breaking lever 26 is lowered to press down the protruding portion Wa of the substrate W, and the substrate is separated along the scribe line S (see FIGS. 1 to 3 of Patent Document 3).

上述之分斷方法均不可缺少用以將基板保持於平台上之保持機構、或沿垂直方向升降之分斷桿。因此,需要可升降地保持分斷桿之框架或用於升降之驅動源、及用以將基板穩定地保持於平台上之吸引機構或按壓構件等,由此裝置大型化而變得昂貴。又,必須於最初使裝置運行時進行平台上之基板之定位或進給間距、分斷桿之按壓壓力等動作部之各種初始設定,不適合分斷少量基板(即,非大量生產用之標準品以外之基板等)。 The above-mentioned breaking method is indispensable for the holding mechanism for holding the substrate on the platform or the breaking rod for lifting up and down in the vertical direction. Therefore, there is a need for a frame for holding the breaking rod or a driving source for lifting and lowering, and a suction mechanism or a pressing member for stably holding the substrate on the stage, whereby the apparatus becomes large and expensive. In addition, it is necessary to perform various initial settings of the operation portion such as the positioning or feed pitch of the substrate on the platform and the pressing pressure of the breaking rod when the device is initially operated, and it is not suitable for dividing a small number of substrates (that is, non-mass production standards). Other than the substrate, etc.).

因此,提出如專利文獻4之第8圖所示之以手工作業分斷基板之簡單之工具。 Therefore, a simple tool for dividing a substrate by a manual operation as shown in Fig. 8 of Patent Document 4 has been proposed.

該分斷工具如本案之圖15所示,於工作台27之表面設置有多條凹槽28,藉由將基板W之一端部分插入至該凹槽28中,並用手握著基板W之上端部分向圖15(b)之箭頭所示之前後方向搖動,而自位於凹槽28附近位置之劃線S分斷基板W。 As shown in FIG. 15 of the present invention, the breaking tool is provided with a plurality of grooves 28 on the surface of the table 27, by inserting one end portion of the substrate W into the groove 28, and holding the upper end of the substrate W by hand. The portion is swung in the front and rear directions as indicated by the arrow in Fig. 15(b), and the substrate W is separated from the scribe line S located at a position near the groove 28.

[背景技術文獻] [Background literature] [專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2013-071335號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2013-071335

[專利文獻2]日本專利特開2013-079171號公報 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2013-079171

[專利文獻3]日本專利特開2009-227550號公報 [Patent Document 3] Japanese Patent Laid-Open Publication No. 2009-227550

[專利文獻4]日本專利特公平05-37097號公報 [Patent Document 4] Japanese Patent Special Publication No. 05-37097

通常,若折彎具有厚度之板材,則折彎部位之內角側被施加壓縮應力,並且外角側被施加拉伸應力。上述圖12~14所示之分斷方法中,當利用分斷桿使基板彎曲時,設置有劃線之面成為被施加拉伸應力之外角側(凸面側),而促進劃線之裂紋之滲透,從而易於斷開。 Generally, if a plate having a thickness is bent, a compressive stress is applied to the inner corner side of the bent portion, and a tensile stress is applied to the outer corner side. In the breaking method shown in FIGS. 12 to 14 described above, when the substrate is bent by the breaking rod, the surface on which the scribe line is provided becomes the outer side (the convex side) to which the tensile stress is applied, and the crack of the scribe line is promoted. Infiltrate, making it easy to break.

然而,上述圖15之分斷工具中,因為以用手握著基板上端部分進行折彎之方式前後搖動而分斷,因此位於基板根部分之劃線交替地承受拉伸應力與壓縮應力,於劃線達到斷裂臨界點時一下子被分斷。因此,基板斷開面變得雜亂,有產生圖16(a)中符號29所示之稱為「裂片」、或符號30之稱為「缺口」之現象之情況。 However, in the above-mentioned breaking tool of FIG. 15, since the upper end portion of the substrate is bent by being held by bending by hand, the scribe line at the root portion of the substrate is alternately subjected to tensile stress and compressive stress. When the scribe line reaches the critical point of fracture, it is suddenly broken. Therefore, the broken surface of the substrate becomes disordered, and there is a case where a phenomenon called "split" shown in the reference numeral 29 in Fig. 16(a) or a "notch" in the symbol 30 is generated.

又,當以用手握著基板上端部分進行折彎之方式使基板傾倒時,有對基板W之左右兩端部分施加之力不均等,而導致於斷開後之基板兩端部產生圖16(b)中符號31所示之稱為「突角」之現象。此種「裂片」或「缺口」、「突角」會使分斷後之產品之品質變差,因此導致出現不合格品。 Further, when the substrate is tilted by holding the upper end portion of the substrate and bending, the force applied to the left and right end portions of the substrate W is uneven, and the both ends of the substrate after the disconnection are generated. (b) The phenomenon shown as symbol "31" in "symbol". Such "splits", "notches" and "bumps" will deteriorate the quality of the products after the break, resulting in defective products.

再者,因為以用手握著基板上端部分進行折彎之方式分斷,因此有以下擔憂,即於分斷時需要較大之力,並且自與所瞄準之位置不同之劃線斷開、或產生分離不良(非劃線部分斷裂)。該等不良情況於劃線之裂紋滲透較淺之基板、或劃線之間距較窄之基板中變得更為顯著,例如,若係劃線之裂紋滲透為基板厚度之10%以下、且劃線之間距為3mm以下之基板,則存在產生率變高而幾乎無法用於實用之問題。 Furthermore, since the upper end portion of the substrate is held by hand to be bent, the following is a problem, that is, a large force is required at the time of breaking, and the scribe line is disconnected from the position to be aimed at, Or poor separation (non-lined partial fracture). These defects are more pronounced in a substrate having a shallower penetration of the cracked line of the scribe line or a substrate having a narrower distance between the scribe lines, for example, if the crack of the scribe line penetrates to 10% or less of the thickness of the substrate, and A substrate having a line spacing of 3 mm or less has a problem that the generation rate becomes high and it is hardly practical.

因此,本發明之目的在於解決上述課題,而提供一種分斷工具,可用手整齊地分斷基板,並且即便為裂紋滲透較淺之基板、或劃線之間距較窄之基板,亦可確實地分斷。 Accordingly, an object of the present invention is to solve the above problems, and to provide a breaking tool which can divide a substrate neatly by hand, and can be surely formed even if the substrate is shallowly penetrated by a crack or a substrate having a narrow distance between the scribe lines. Break.

為了解決上述課題,本發明中想到如下技術性方法。即,本發 明之分斷工具設為如下構成,即包括:支持夾具,其於表面具有插入基板之一端部分之凹槽;及夾入夾具,其於使上述基板之包含應斷開之劃線之一端部分自前端突出之狀態下夾入而保持上述基板;且上述夾入夾具包括隔開夾入上述基板之間隔且以平行姿勢組裝之第一板材及第二板材,且可調整上述第一板材與第二板材之間隔地形成。 In order to solve the above problems, the following technical methods are conceived in the present invention. That is, this hair The breaking tool of the present invention is configured to include: a supporting jig having a groove inserted into one end portion of the substrate on the surface; and a clamping jig for causing one end of the streaking line of the substrate to be broken The substrate is sandwiched and held in a state in which the front end is protruded; and the sandwiching jig includes a first plate and a second plate which are assembled in a parallel posture with a space sandwiched between the substrates, and the first plate and the second plate are adjustable The sheets are formed at intervals.

上述夾入夾具設為如下構成為佳,即包括:第一板材及第二板材,其等隔開夾入上述基板之間隔且以平行姿勢組裝;以及中間板材(例如板狀之緩衝構件),介於該等板材與上述基板之間,且包含彈性材料。 Preferably, the clamping jig is configured to include: a first plate member and a second plate member, which are equally spaced apart from each other and assembled in a parallel posture; and an intermediate plate member (for example, a plate-shaped cushioning member), Between the plates and the substrate, and comprising an elastic material.

上述中間板材設為如下構成為佳,即左右寬度以較上述基板之左右寬度小之尺寸形成。 The intermediate plate member is preferably configured such that the left and right widths are formed to be smaller than the left and right widths of the substrate.

上述夾入夾具之第一板材與第二板材藉由調整螺絲連結,且可藉由操作該調整螺絲而調整上述間隔為佳。 The first plate and the second plate of the clamping jig are coupled by an adjusting screw, and the interval can be adjusted by operating the adjusting screw.

本發明中,因為可藉由夾入夾具之第一板材及第二板材沿著所要分斷之劃線夾緊基板,而牢固地固定基板,因此即便為沿著劃線滲透至基板內部之裂紋之滲透較淺之基板(例如裂紋深度為基板厚度之10%以下之情況)、或劃線之間距較窄之基板(例如劃線之間距為3mm以下之情況),亦可消除基板自基板之劃線以外之部分折斷、或於所期望之劃線以外之劃線斷開之情況,並且藉由以夾入夾具之前端部為支點使基板傾倒,而可應用「槓桿」原理以較輕之力分斷。 In the present invention, since the substrate can be firmly fixed by sandwiching the substrate between the first plate and the second plate sandwiching the jig along the line to be broken, even if the substrate penetrates into the inside of the substrate along the scribe line The substrate with a shallow penetration (for example, a crack depth of 10% or less of the substrate thickness) or a substrate having a narrow distance between the scribe lines (for example, a case where the distance between the scribe lines is 3 mm or less) can also eliminate the substrate from the substrate. The portion other than the scribe line is broken, or the scribe line other than the desired scribe line is broken, and the substrate is tilted by tying the end portion before the clamp is clamped, and the "leverage" principle can be applied to lighter Force breaking.

又,根據包含彈性材料之中間板材介於第一、第二板材與基板之間之實施形態(第二實施形態),可預防對基板表面造成損傷,並且即便各調整螺絲之緊固力略有偏差,亦可藉由中間板材之彈性力而確實地夾持保持基板。由此,能夠以大致均等之力按壓基板之整個面使之傾倒,因此亦可抑制「突角」之產生。 Further, according to the embodiment in which the intermediate plate including the elastic material is interposed between the first plate and the second plate and the substrate (the second embodiment), damage to the surface of the substrate can be prevented, and even if the fastening force of each adjusting screw is slightly The deviation can also be surely held by the elastic force of the intermediate plate to hold the substrate. Thereby, the entire surface of the substrate can be pressed with a substantially equal force to be tilted, so that the occurrence of the "bump" can be suppressed.

尤其係根據以較上述基板之左右寬度小之尺寸形成中間板材之左右寬度之實施形態(第三實施形態),與以較基板之左右寬度大之尺寸形成中間板材之左右寬度之情況相比,可進一步抑制「突角」之產生。認為此係因為分斷時對基板兩端部施加之負載變小之故。即,認為於以較基板之左右寬度大之尺寸形成中間板材之左右寬度之情況下,尤其於中間板材為彈性材料之情況下,若緊固基板及中間板材,則中間板材被壓縮,中間板材之未與基板相向之部分成為相對性地膨脹之狀態,與基板之中央部分相比,對基板之端面、尤其與中間板材接觸之端部會施加過大之應力,由此,於分斷時向不自然之方向施加應力而引起「突角」之產生。與此相對,認為以較基板之左右寬度小之尺寸形成中間板材之左右寬度之實施形態中,由於基板之端部處於開放之狀態,因此於分斷時不會對基板之端部施加不必要之應力,裂紋沿著劃線自然地擴展而抑制「突角」之產生。 In particular, according to the embodiment in which the left and right widths of the intermediate plate are formed in a size smaller than the left and right widths of the substrate (the third embodiment), the left and right widths of the intermediate plate are formed in a size larger than the left and right widths of the substrate. It can further suppress the occurrence of "bursts". It is considered that this is because the load applied to both end portions of the substrate becomes small at the time of breaking. That is, in the case where the left and right widths of the intermediate plate are formed in a size larger than the left and right widths of the substrate, especially in the case where the intermediate plate is an elastic material, if the substrate and the intermediate plate are fastened, the intermediate plate is compressed, and the intermediate plate is compressed. The portion that is not opposed to the substrate is relatively expanded, and an excessive stress is applied to the end surface of the substrate, particularly the end portion in contact with the intermediate plate, compared with the central portion of the substrate, thereby Stress is applied in an unnatural direction to cause a "burst". On the other hand, in the embodiment in which the left and right widths of the intermediate plate are formed in a size smaller than the left and right widths of the substrate, since the end portion of the substrate is in an open state, no unnecessary portion is applied to the end portion of the substrate at the time of breaking. The stress, the crack naturally expands along the scribe line to suppress the occurrence of "bursts".

又,藉由使自夾入夾具之前端突出之基板前端部分之劃線接近夾入夾具之前端,可令使夾入夾具傾倒時對基板施加之彎曲應力聚集於該劃線。由此,可使劃線之裂紋沿基板之厚度方向垂直地滲透,而抑制於斷開面產生「裂片」或「缺口」。又,有以下效果,即於斷開時沿劃線之延伸方向筆直地產生龜裂,可抑制龜裂之走向傾斜或蜿蜒,從而可獲得具有高品質之斷開面之單位產品。 Further, by causing the scribe line of the front end portion of the substrate protruding from the front end of the jig to be clamped to the front end of the jig, the bending stress applied to the substrate when the jig is tilted can be concentrated on the scribe line. Thereby, the crack of the scribe line can be vertically infiltrated in the thickness direction of the substrate, and the occurrence of "split" or "notch" on the broken surface can be suppressed. Further, there is an effect that the crack is generated straight in the extending direction of the scribe line at the time of the disconnection, and the tendency of the crack to be inclined or twisted can be suppressed, and a unit product having a high-quality fracture surface can be obtained.

於本發明中,上述支持夾具設為如下構成為佳,即可沿槽寬方向移動而進行調整地形成有形成上述凹槽之一側壁之構件,且可沿凹槽之深度方向移動而進行調整地形成有形成上述凹槽之底面之構件。 In the present invention, it is preferable that the support jig is configured such that a member forming one side wall of the groove can be formed by moving in the groove width direction and adjusted, and can be adjusted by moving in the depth direction of the groove. A member forming the bottom surface of the above groove is formed.

由此,可配合於應斷開之基板之厚度或劃線之間距而調整凹槽之寬度或深度,從而可用於各種基板之分斷。 Thereby, the width or depth of the groove can be adjusted in accordance with the thickness of the substrate to be broken or the distance between the scribe lines, so that it can be used for the division of various substrates.

1‧‧‧支持夾具 1‧‧‧Support fixture

2‧‧‧夾入夾具 2‧‧‧Clamping fixture

3‧‧‧凹槽 3‧‧‧ Groove

3a‧‧‧固定側壁構件 3a‧‧‧Fixed sidewall members

3b‧‧‧可動側壁構件 3b‧‧‧ movable side wall members

3c‧‧‧可動底板構件 3c‧‧‧ movable floor member

4‧‧‧工作台 4‧‧‧Workbench

5‧‧‧支撐板 5‧‧‧Support board

6‧‧‧第一調整螺栓 6‧‧‧First adjustment bolt

7‧‧‧第二調整螺栓 7‧‧‧Second adjustment bolt

8‧‧‧第一板材 8‧‧‧ first plate

8a‧‧‧夾持面 8a‧‧‧ clamping surface

9‧‧‧第二板材 9‧‧‧Second plate

9a‧‧‧夾持面 9a‧‧‧ clamping surface

10‧‧‧調整螺絲 10‧‧‧Adjustment screws

11‧‧‧中間板材 11‧‧‧Intermediate sheet

20‧‧‧平台 20‧‧‧ platform

21‧‧‧緩衝片材 21‧‧‧buffer sheet

22‧‧‧分斷桿 22‧‧‧ broken rod

23‧‧‧支持刃 23‧‧‧Support blade

24‧‧‧分斷桿 24‧‧‧ broken rod

25‧‧‧平台 25‧‧‧ platform

26‧‧‧分斷桿 26‧‧‧ broken rod

27‧‧‧工作台 27‧‧‧Workbench

28‧‧‧凹槽 28‧‧‧ Groove

29‧‧‧裂片 29‧‧‧Splinter

30‧‧‧缺口 30‧‧‧ gap

31‧‧‧突角 31‧‧‧ horn

A‧‧‧分斷工具 A‧‧‧ breaking tool

L1‧‧‧中間板材之左右寬度 Left and right width of L1‧‧‧ intermediate plate

L2‧‧‧基板之左右寬度 The left and right width of the L2‧‧‧ substrate

L3‧‧‧未重疊有中間板材之區域 L3‧‧‧ areas without intermediate plates

W‧‧‧脆性材料基板 W‧‧‧Battery material substrate

W'‧‧‧自夾入夾具之前端突出之基板一端部分 W'‧‧‧ One end of the substrate protruding from the front end of the clamp

Wa‧‧‧一端部分 One end of Wa‧‧‧

S‧‧‧劃線 S‧‧‧

S1‧‧‧縱向劃線 S1‧‧‧ vertical line

S2、S2'‧‧‧橫向劃線 S2, S2'‧‧‧ horizontal line

圖1係表示本發明之分斷工具之一實施例(第一實施形態)之立體 圖。 Figure 1 is a perspective view showing an embodiment (first embodiment) of the breaking tool of the present invention. Figure.

圖2係圖1之分斷工具之剖面圖。 Figure 2 is a cross-sectional view of the breaking tool of Figure 1.

圖3(a)-(c)係表示使用圖1之分斷工具進行之基板之分斷步驟之說明圖。 3(a)-(c) are explanatory views showing a step of dividing a substrate by using the breaking tool of Fig. 1.

圖4係表示本發明之分斷工具之一實施例(第二實施形態)之立體圖。 Fig. 4 is a perspective view showing an embodiment (second embodiment) of the breaking tool of the present invention.

圖5係圖4之分斷工具之剖面圖。 Figure 5 is a cross-sectional view of the breaking tool of Figure 4.

圖6(a)-(c)係表示使用圖4之分斷工具進行之基板之分斷步驟之說明圖。 6(a)-(c) are explanatory views showing a step of dividing a substrate by using the breaking tool of Fig. 4.

圖7係表示本發明之分斷工具之一實施例(第三實施形態)之立體圖。 Fig. 7 is a perspective view showing an embodiment (third embodiment) of the breaking tool of the present invention.

圖8係圖7之分斷工具之剖面圖。 Figure 8 is a cross-sectional view of the breaking tool of Figure 7.

圖9(a)-(c)係表示使用圖7之分斷工具進行之基板之分斷步驟之說明圖。 9(a)-(c) are explanatory views showing a step of dividing a substrate by using the breaking tool of Fig. 7.

圖10係表示圖7之分斷工具中之夾入夾具之前視圖。 Fig. 10 is a front view showing the clipping tool in the breaking tool of Fig. 7.

圖11係表示藉由本發明之分斷工具分斷之基板之一例之俯視圖。 Fig. 11 is a plan view showing an example of a substrate which is separated by the breaking tool of the present invention.

圖12(a)、(b)係表示現有之普通之分斷方法之一例之說明圖。 Fig. 12 (a) and (b) are explanatory views showing an example of a conventional conventional breaking method.

圖13係表示現有之分斷方法之另一例之說明圖。 Fig. 13 is an explanatory view showing another example of the conventional breaking method.

圖14係表示現有之分斷方法之又一例之說明圖。 Fig. 14 is an explanatory view showing still another example of the conventional breaking method.

圖15(a)、(b)係表示現有之分斷方法之又一例之說明圖。 15(a) and 15(b) are explanatory views showing still another example of the conventional breaking method.

圖16(a)、(b)係分斷時於基板斷開面產生之加工不良現象之說明圖。 Fig. 16 (a) and (b) are explanatory views of the processing failure phenomenon occurring on the substrate breaking surface at the time of cutting.

以下,基於圖1~11詳細地說明本發明之分斷工具。 Hereinafter, the breaking tool of the present invention will be described in detail based on Figs.

本發明之分斷工具A包括:支持夾具1,於表面具有插入基板W之一端部分之直線狀凹槽3;及夾入夾具2,於使基板W之應斷開之一 端部分W'自前端(圖1之下端)突出之狀態下夾入該基板W而保持。圖1~3係與第一實施形態之夾入夾具相關之圖式,圖4~6係與第二實施形態之夾入夾具相關之圖式,圖7~10係與第三實施形態之夾入夾具相關之圖式。 The breaking tool A of the present invention comprises: a supporting jig 1 having a linear groove 3 inserted into one end portion of the substrate W on the surface; and a clamping jig 2 for disconnecting the substrate W The end portion W' is sandwiched by the substrate W while being protruded from the front end (the lower end in Fig. 1). 1 to 3 are views relating to the sandwiching jig of the first embodiment, and Figs. 4 to 6 are drawings relating to the sandwiching jig of the second embodiment, and Figs. 7 to 10 are sandwiched between the third embodiment and the third embodiment. Enter the relevant diagram of the fixture.

支持夾具1包括:固定側壁構件3a,其形成凹槽3之一側壁;可動側壁構件3b,其形成另一側壁;可動底板構件3c,其形成凹槽3之底面;及工作台4,其保持該等構件。 The support jig 1 includes: a fixed side wall member 3a that forms one side wall of the recess 3; a movable side wall member 3b that forms another side wall; a movable bottom plate member 3c that forms a bottom surface of the recess 3; and a table 4 that holds These components.

固定側壁構件3a經由支撐板5而固定於工作台4。可動側壁構件3b係僅可沿槽寬方向滑動地被載置於工作台4上,且以可藉由第一調整螺栓6調整槽寬之方式形成。又,可動底板構件3c配置於工作台4與固定側壁構件3a之間,且以可藉由第二調整螺栓7沿凹槽3之深度方向移動而進行調整地被保持。 The fixed side wall member 3a is fixed to the table 4 via the support plate 5. The movable side wall member 3b is placed on the table 4 only in a sliding manner in the groove width direction, and is formed so as to be adjustable by the first adjusting bolt 6. Further, the movable floor member 3c is disposed between the table 4 and the fixed side wall member 3a, and is held in adjustment by the second adjustment bolt 7 moving in the depth direction of the groove 3.

第一實施形態中,夾入夾具2包含隔開夾入基板W之間隔且以平行姿勢組裝之包含金屬等硬質材料之第一板材8及第二板材9。第一板材8以及第二板材9包括相互對向之平坦之夾持面8a、9a,該等夾持面8a、9a於保持平行姿勢之狀態下,藉由左右之調整螺絲10連結,藉由緊固該調整螺絲10而可夾持保持基板W。又,藉由旋鬆該調整螺絲10而可使位於兩板材8、9間之基板W依次向下方移動、或裝卸基板W。 In the first embodiment, the sandwiching jig 2 includes a first plate member 8 and a second plate member 9 which are made of a hard material such as metal which is assembled in a parallel posture with the interval between the substrates W interposed therebetween. The first plate member 8 and the second plate member 9 include clamping faces 8a and 9a which are opposed to each other, and the clamping faces 8a and 9a are connected by the left and right adjusting screws 10 while being held in a parallel posture. The adjusting screw 10 is tightened to hold and hold the substrate W. Further, by loosening the adjusting screw 10, the substrate W positioned between the two sheets 8 and 9 can be sequentially moved downward or the substrate W can be attached or detached.

第二實施形態中,夾入夾具2包含:第一板材8及第二板材9,其等隔開夾入基板W之間隔且以平行姿勢組裝,包含金屬等硬質材料;以及中間板材(例如板狀之緩衝構件)11、11,其等分別介於該等板材8、9與基板W之間。該中間板材11較佳為包含硬度相對較高之天然或合成橡膠等材料。第一板材8以及第二板材9包括相互對向之平坦之夾持面8a、9a,於該等夾持面8a、9a之間,隔著中間板材11、11而夾持基板W。 In the second embodiment, the sandwiching jig 2 includes a first plate member 8 and a second plate member 9 which are assembled in a parallel posture with a space therebetween and sandwiched therebetween, and include a hard material such as metal; and an intermediate plate member (for example, a plate) The cushioning members 11 and 11, which are respectively interposed between the plates 8 and 9 and the substrate W. The intermediate plate 11 preferably contains a material such as natural or synthetic rubber having a relatively high hardness. The first plate member 8 and the second plate member 9 include clamping faces 8a and 9a which are flat toward each other, and the substrate W is sandwiched between the sandwiching faces 8a and 9a via the intermediate sheets 11 and 11.

第二實施形態中,如圖4所示,於中間板材11之兩端部分設置有 螺絲插通孔12,藉由使上述之調整螺絲10貫穿該插通孔12,而將中間板材11保持於夾入夾具2。於該情況下,中間板材11之前端以未自第一板材8以及第二板材9之前端突出之方式安裝。然而,雖然省略圖示,但亦可使中間板材11之左右寬度為正好嵌於左右之調整螺絲10、10間之尺寸,而僅使中間板材11之左右寬度介於基板W與各板材8、9之間。 In the second embodiment, as shown in FIG. 4, the both ends of the intermediate plate 11 are provided with The screw insertion hole 12 is inserted into the insertion jig 2 by inserting the above-mentioned adjustment screw 10 through the insertion hole 12. In this case, the front end of the intermediate plate 11 is attached so as not to protrude from the front ends of the first plate 8 and the second plate 9. However, although not shown in the drawings, the left and right widths of the intermediate plate 11 may be exactly the size between the left and right adjustment screws 10 and 10, and only the left and right widths of the intermediate plate 11 may be interposed between the substrate W and the respective plates 8. Between 9.

第三實施形態中,夾入夾具2包含:第一板材8及第二板材9,其等隔開夾入基板W之間隔且以平行姿勢組裝,包含金屬等硬質材料;以及中間板材11、11,其等分別介於該等板材8、9與基板W之間。該中間板材11包含硬度相對較高之天然或合成橡膠等彈性材料。第一板材8以及第二板材9包括相互對向之平坦之夾持面8a、9a,於該等夾持面8a、9a之間,隔著中間板材11、11而夾持基板W。再者,中間板材11以其前端(圖7中之下端部分)未自第一板材8以及第二板材9之前端突出之方式安裝。 In the third embodiment, the sandwiching jig 2 includes a first plate member 8 and a second plate member 9 which are assembled in a parallel posture with a space therebetween and sandwiched therebetween, and include a hard material such as metal; and intermediate plates 11 and 11 They are respectively between the plates 8, 9 and the substrate W. The intermediate plate 11 contains an elastic material such as natural or synthetic rubber having a relatively high hardness. The first plate member 8 and the second plate member 9 include clamping faces 8a and 9a which are flat toward each other, and the substrate W is sandwiched between the sandwiching faces 8a and 9a via the intermediate sheets 11 and 11. Further, the intermediate plate 11 is attached such that its front end (lower end portion in Fig. 7) does not protrude from the front ends of the first plate member 8 and the second plate member 9.

又,第一板材8與第二板材9藉由左右之調整螺絲10連結,且藉由緊固該調整螺絲10而可夾持保持基板W。又,藉由旋鬆該調整螺絲10而可使位於兩板材8、9間之基板W依次向下方移動、或裝卸基板W。 Further, the first plate member 8 and the second plate member 9 are coupled by the left and right adjusting screws 10, and the holding plate W can be held by the fastening screw 10. Further, by loosening the adjusting screw 10, the substrate W positioned between the two sheets 8 and 9 can be sequentially moved downward or the substrate W can be attached or detached.

再者,第三實施形態中,如圖10所示,以中間板材11之左右寬度L1成為較基板W之左右寬度L2小之尺寸之方式形成,於所夾持之基板W之左右兩端部分殘留有未重疊中間板材11之區域L3。該區域L3較佳為基板W之左右寬度L2之3~30%(尤其係5~15%)左右。例如於基板W之左右寬度為50mm之情況下,區域L3之長度宜為1.5~15.0mm(較佳為2.5~7.5mm)。 In the third embodiment, as shown in FIG. 10, the left and right widths L1 of the intermediate plate 11 are formed to be smaller than the left and right widths L2 of the substrate W, and the left and right ends of the substrate W are sandwiched. A region L3 in which the intermediate plate 11 is not overlapped remains. The region L3 is preferably about 3 to 30% (especially 5 to 15%) of the width L2 of the substrate W. For example, in the case where the width of the substrate W is 50 mm, the length of the region L3 is preferably 1.5 to 15.0 mm (preferably 2.5 to 7.5 mm).

夾入夾具2之第一板材8以及第二板材9之前端外緣,以越往前端越接近夾持面8a、9a之傾斜面切割而成為前端尖細狀。再者,較佳為 如圖1、圖4及圖7所示,連結第一板材8與第二板材9之調整螺絲10於上下各設置有一對而共設置有4根。由此,能夠確實地保持兩板材8、9之平行間隔而以均等之緊固力穩定性佳地夾持基板W,但亦可僅由左右一對形成。 The outer edge of the front end of the first plate member 8 and the second plate member 9 sandwiched between the jigs 2 is cut toward the inclined surface of the grip faces 8a and 9a toward the front end, and has a tip end tapered shape. Furthermore, preferably As shown in Fig. 1, Fig. 4, and Fig. 7, the adjusting screws 10 that connect the first plate member 8 and the second plate member 9 are provided in a pair on the upper and lower sides, and a total of four are provided. Thereby, it is possible to reliably hold the parallel intervals of the two sheets 8 and 9 and to sandwich the substrate W with uniform fastening force stability, but it may be formed only by a pair of right and left.

其次,對使用上述分斷工具A分斷基板W之方法進行說明。 Next, a method of dividing the substrate W using the above-described breaking tool A will be described.

作為所要分斷之基板W,本實施例中使用50mm×60mm見方之尺寸、且厚度為1.0mm之氧化鋁基板。如圖11所示,於基板W之表面,於先行進行之劃線步驟中加工有縱向劃線S1以及橫向劃線S2。再者,本實施例中之各個劃線之間隔(間距)為2.5mm。 As the substrate W to be divided, in the present embodiment, an alumina substrate having a size of 50 mm × 60 mm square and having a thickness of 1.0 mm was used. As shown in FIG. 11, on the surface of the substrate W, a longitudinal scribe line S1 and a horizontal scribe line S2 are processed in the preceding scribing step. Further, the interval (pitch) of each of the scribe lines in this embodiment was 2.5 mm.

第一實施形態中如圖1~3所示,將該基板W夾入於夾入夾具2之第一板材8與第二板材9之間而保持,第二實施形態及第三實施形態中如圖4~10所示,將該基板W夾入於位於夾入夾具2之第一板材8側之中間板材11、與位於第二板材9側之中間板材11之間而保持。此時,如圖2、圖5及圖8所示,預先使包括要最初切開之橫向劃線S2'之基板一端部分W'自夾入夾具2之前端突出。又,應斷開之劃線S2'設為儘可能地接近夾入夾具2之第一板材8以及第二板材9之前端之狀態為佳。 In the first embodiment, as shown in Figs. 1 to 3, the substrate W is sandwiched between the first plate member 8 and the second plate member 9 of the sandwiching jig 2, and the second embodiment and the third embodiment are as shown in the second embodiment. As shown in FIGS. 4 to 10, the substrate W is sandwiched between the intermediate plate member 11 on the side of the first plate member 8 of the sandwiching jig 2 and the intermediate plate member 11 on the side of the second plate member 9. At this time, as shown in FIG. 2, FIG. 5, and FIG. 8, the one end portion W' of the substrate including the horizontal scribe line S2' to be initially cut is previously protruded from the front end of the jig 2. Further, it is preferable that the broken line S2' is set as close as possible to the state in which the first plate 8 and the second plate 9 of the jig 2 are sandwiched.

另一方面,支持夾具1之凹槽3之寬度及深度,預先配合於應斷開之基板W之厚度以及突出之一端部分W'之尺寸而加以調整。即,凹槽3之槽寬係利用第一調整螺栓6使可動側壁構件3b移動而調整為可使突出之基板一端部分W'無晃動地插入之尺寸。又,槽深係利用第二調整螺栓7使可動底板構件3c移動而預先調整為自應斷開之劃線S2'至突出之基板一端部分W'之端緣為止之長度(相當於劃線S2之間距之長度)。 On the other hand, the width and depth of the groove 3 of the support jig 1 are adjusted in advance in accordance with the thickness of the substrate W to be broken and the size of the one end portion W'. That is, the groove width of the groove 3 is adjusted by the first adjusting bolt 6 to move the movable side wall member 3b so that the protruding one end portion W' can be inserted without shaking. Further, the groove depth is adjusted by the second adjusting bolt 7 to move the movable bottom plate member 3c to a length from the scribe line S2' to be broken to the end edge of the projecting end portion W' of the substrate (corresponding to the scribe line S2). The length of the distance).

圖3表示使用圖1之分斷工具(夾入夾具)分斷基板W之步驟,圖6表示使用圖4之分斷工具(夾入夾具)分斷基板W之步驟,圖9表示使用圖7之分斷工具(夾入夾具)分斷基板W之步驟。 Figure 3 shows the step of breaking the substrate W using the breaking tool (clamping jig) of Figure 1, and Figure 6 shows the step of breaking the substrate W using the breaking tool (clamping jig) of Figure 4, and Figure 9 shows the use of Figure 7. The step of breaking the substrate W by the breaking tool (clamping the jig).

如圖3(a)、圖6(a)及圖9(a)所示,用手握著夾入夾具2之上部,將自夾具2之前端突出之基板一端部分W'如圖3(b)、圖6(b)及圖9(b)般插入至支持夾具1之凹槽3。其次,如圖3(c)、圖6(b)及圖9(b)般,使夾入夾具2向劃線S2'之相反側傾倒而自劃線S2'分斷基板一端部分W'。當使該夾入夾具2傾倒時,由於已將第一板材8以及第二板材9之前端外緣切割為傾斜面而形成前端尖細狀,因此可於使夾入夾具2之變得尖細之前端接觸於支持夾具1之表面之狀態下,以該接觸部為支點而使夾入夾具2傾倒。 As shown in Fig. 3 (a), Fig. 6 (a) and Fig. 9 (a), the upper end portion of the substrate protruding from the front end of the jig 2 is held by hand, and the end portion of the substrate W' protruded from the front end of the jig 2 is as shown in Fig. 3 (b). ), as shown in FIG. 6(b) and FIG. 9(b), inserted into the recess 3 of the support jig 1. Next, as shown in FIGS. 3(c), 6(b) and 9(b), the sandwiching jig 2 is tilted to the opposite side of the scribe line S2', and the substrate end portion W' is cut from the scribe line S2'. When the sandwiching jig 2 is tilted, since the outer edge of the front end of the first plate member 8 and the second plate member 9 is cut into an inclined surface to form a tip end tapered shape, the pinching jig 2 can be tapered. When the front end is in contact with the surface of the support jig 1, the sandwiching jig 2 is tilted with the contact portion as a fulcrum.

將以此方式分斷之基板一端部分W'自支持夾具1之凹槽3中取出,而成為長方形之短條狀基板W1(參照圖11)。 The one end portion W' of the substrate which is separated in this manner is taken out from the recess 3 of the support jig 1 to form a rectangular short strip substrate W1 (see Fig. 11).

然後,自支持夾具1之凹槽3去除基板一端部分W'後,旋鬆夾入夾具2之調整螺絲10而將基板W拉出至下一應切掉之基板一端部分W'突出之位置。然後,緊固調整螺絲10而再次夾持並保持基板W後,以與上述相同之方式將突出之基板一端部分W'插入至支持夾具1之凹槽3且使夾入夾具2傾倒,而分斷突出之基板一端部分W'。藉由依次重複進行上述操作,自所有橫向劃線S2分斷基板W而取出多個短條狀基板W1。 Then, after the one end portion W' of the substrate is removed from the recess 3 of the supporting jig 1, the adjusting screw 10 of the jig 2 is loosened to pull the substrate W to the position where the end portion W' of the next substrate to be cut is protruded. Then, after the adjusting screw 10 is tightened to hold and hold the substrate W again, the protruding one end portion W' of the substrate is inserted into the recess 3 of the supporting jig 1 and the clamping jig 2 is tilted, and is divided. The protruding one end portion W' of the substrate is broken. By repeating the above operations in sequence, the substrate W is separated from all the lateral scribe lines S2, and the plurality of short strip substrates W1 are taken out.

其後,於將縱向劃線S1橫放之狀態、且使應斷開之基板一端部分W'突出之狀態下,將短條狀之基板W1安裝於夾入夾具2。然後,以與上述相同之方式將突出之基板一端部分W'插入至支持夾具1之凹槽3,依次自劃線S1分斷,而完成圖11所示之單位產品W2。 Then, in a state where the vertical scribe line S1 is placed horizontally and the one end portion W' of the substrate to be broken is protruded, the short-length substrate W1 is attached to the nip jig 2. Then, the projecting one end portion W' of the substrate is inserted into the recess 3 of the supporting jig 1 in the same manner as described above, and is sequentially separated from the scribe line S1, and the unit product W2 shown in Fig. 11 is completed.

當利用上述之分斷工具A斷開基板時,因為基板W被夾入夾具2之第一板材8與第二板材9夾持而被牢固地固定,因此即便為沿劃線滲透至基板內部之裂紋之滲透較淺之基板(例如裂紋深度為基板厚度之10%以下之情況)、或劃線之間距較窄之基板(例如劃線之間距為3mm以下之情況),亦可消除基板自基板之劃線以外之部分折斷、或於所 期望之劃線以外之劃線斷開之情況,並且藉由應用以夾入夾具2之前端接觸部為支點之「槓桿」之原理而能以較輕之力斷開。又,因為可藉由第一板材8與第二板材9以均等之力按壓基板W之整個面,因此亦可抑制開始所敍述之「突角」之產生。 When the substrate is disconnected by the above-described breaking tool A, since the substrate W is firmly fixed by being sandwiched between the first plate member 8 and the second plate member 9 sandwiched between the jigs 2, even if it penetrates into the inside of the substrate along the scribe line A substrate having a shallow penetration of cracks (for example, a crack depth of 10% or less of the thickness of the substrate) or a substrate having a narrow distance between the scribe lines (for example, a case where the distance between the scribe lines is 3 mm or less) can also eliminate the substrate from the substrate. Part of the line other than the line, or The scribe line other than the desired scribe line is broken, and can be broken with a light force by applying the principle of "lever" which is sandwiched by the front end contact portion of the jig 2 as a fulcrum. Further, since the entire surface of the substrate W can be pressed with the first plate member 8 and the second plate member 9 with equal force, it is possible to suppress the occurrence of the "burst" described at the outset.

當利用上述分斷工具A斷開基板時,因為基板W被夾入夾具2之第一板材8與第二板材9夾持而被牢固地固定,因此即便為沿劃線滲透至基板內部之裂紋之滲透較淺之基板(例如裂紋深度為基板厚度之10%以下之情況)、或劃線之間距窄之基板(例如劃線之間距為3mm以下之情況),亦可消除基板自基板之劃線以外之部分折斷、或於所期望之劃線以外之劃線斷開之情況,並且藉由應用以夾入夾具2之前端接觸部為支點之「槓桿」之原理而以較輕之力斷開。 When the substrate is disconnected by the above-described breaking tool A, since the substrate W is firmly fixed by being sandwiched between the first plate member 8 and the second plate member 9 sandwiched between the jigs 2, even if it is a crack that penetrates into the inside of the substrate along the scribe line. The substrate with a shallow penetration (for example, a crack depth of 10% or less of the substrate thickness) or a substrate having a narrow distance between the scribe lines (for example, a case where the distance between the scribe lines is 3 mm or less) can also eliminate the substrate from the substrate. A portion other than the line is broken, or the scribe line is broken outside the desired scribe line, and is broken by a light lever by applying the principle of "lever" which is a fulcrum of the front end of the clamp 2 open.

又,第二實施形態中,因為於各板材8、9與基板W之間介置著包含彈性材料之中間板材11,因此可防止對基板W表面造成損傷,並且即便各調整螺絲10之緊固力略有偏差,亦可藉由中間板材11之彈性力而確實地夾持保持基板W。由此,因為能夠以均等之力對基板W之整個表面按壓使之傾倒,因此亦可抑制開始所敍述之「突角」之產生。 Further, in the second embodiment, since the intermediate plate material 11 including the elastic material is interposed between the respective plate members 8, 9 and the substrate W, damage to the surface of the substrate W can be prevented, and even if the respective adjusting screws 10 are fastened The force is slightly deviated, and the substrate W can be surely held by the elastic force of the intermediate plate 11. Thereby, since the entire surface of the substrate W can be pressed and tilted with equal force, it is possible to suppress the occurrence of the "burst" described at the outset.

尤其係第三實施形態中,認為之因此能夠抑制「突角」之產生,係因為以較基板W之左右寬度L2小之尺寸形成中間板材11之左右寬度L1,而於被夾持之基板W之左右兩端部分殘留著未重疊有中間板材11之區域L3,因此分斷時對基板兩端部施加之負載變小。 In particular, in the third embodiment, it is considered that the occurrence of the "bump" can be suppressed, and the left and right width L1 of the intermediate plate member 11 is formed to be smaller than the width L2 of the substrate W, and the substrate W is held. In the left and right end portions, the region L3 in which the intermediate plate 11 is not overlapped remains, so that the load applied to both end portions of the substrate at the time of breaking becomes small.

又,因為劃分自夾入夾具2之前端突出之基板一端部分W'之劃線S2位於儘可能地接近夾入夾具2之前端之位置,因此使夾入夾具2傾倒時對基板W施加之彎曲應力集中地施加於劃線S2。由此,可使劃線S2之裂紋沿基板W之厚度方向垂直地滲透,且可抑制於斷開面產生「裂片」。 Further, since the scribe line S2 of the one end portion W' of the substrate which is protruded from the front end of the clip-in jig 2 is located as close as possible to the front end of the clip-in jig 2, the bending applied to the substrate W when the clip-in jig 2 is tilted is applied. Stress is applied to the scribe line S2 intensively. Thereby, the crack of the scribe line S2 can be vertically permeated in the thickness direction of the substrate W, and the occurrence of "splits" on the broken surface can be suppressed.

再者,因為夾入夾具2之前端係於接近劃線S2之位置沿著劃線S2 配置,因此斷開時龜裂沿著劃線之延伸方向筆直地產生,可抑制龜裂之走向傾斜或蜿蜒,從而可獲得具有高品質之斷開面之單位產品W2。 Furthermore, since the front end of the clamp 2 is attached to the position close to the scribe line S2 along the scribe line S2 Since it is disposed, the crack is generated straight along the extending direction of the scribe line, and the tendency of the crack to be inclined or smashed can be suppressed, so that the unit product W2 having the high-quality fracture surface can be obtained.

以上,對本發明之代表性實施例進行了說明,但本發明並非必須僅特定為上述實施例之構造。例如上述實施例中,以支持夾具1之凹槽3朝向上方之方式形成,但亦可橫向形成凹槽3。此外,本發明中,可於達成發明目的、且不脫離申請專利範圍之範圍內適當地進行修正、變更。 The representative embodiments of the present invention have been described above, but the present invention is not necessarily limited to the configuration of the above embodiments. For example, in the above embodiment, the groove 3 supporting the jig 1 is formed upward, but the groove 3 may be formed laterally. In addition, the present invention can be appropriately modified or changed within the scope of the invention without departing from the scope of the invention.

[產業上之可利用性] [Industrial availability]

本發明可應用於用手分斷包含玻璃、陶瓷、藍寶石等脆性材料之基板之分斷工具。 The present invention is applicable to a breaking tool for breaking a substrate containing a brittle material such as glass, ceramics, sapphire or the like by hand.

1‧‧‧支持夾具 1‧‧‧Support fixture

2‧‧‧夾入夾具 2‧‧‧Clamping fixture

3‧‧‧凹槽 3‧‧‧ Groove

3a‧‧‧固定側壁構件 3a‧‧‧Fixed sidewall members

3b‧‧‧可動側壁構件 3b‧‧‧ movable side wall members

3c‧‧‧可動底板構件 3c‧‧‧ movable floor member

4‧‧‧工作台 4‧‧‧Workbench

5‧‧‧支撐板 5‧‧‧Support board

6‧‧‧第一調整螺栓 6‧‧‧First adjustment bolt

7‧‧‧第二調整螺栓 7‧‧‧Second adjustment bolt

8‧‧‧第一板材 8‧‧‧ first plate

8a‧‧‧夾持面 8a‧‧‧ clamping surface

9‧‧‧第二板材 9‧‧‧Second plate

9a‧‧‧夾持面 9a‧‧‧ clamping surface

10‧‧‧調整螺絲 10‧‧‧Adjustment screws

11‧‧‧中間板材 11‧‧‧Intermediate sheet

A‧‧‧分斷工具 A‧‧‧ breaking tool

W‧‧‧脆性材料基板 W‧‧‧Battery material substrate

W'‧‧‧自夾入夾具之前端突出之基板一端部分 W'‧‧‧ One end of the substrate protruding from the front end of the clamp

Claims (6)

一種脆性材料基板之分斷工具,其包括:支持夾具,其於表面具有插入基板之一端部分之凹槽;及夾入夾具,其於使上述基板之包含應斷開之劃線之一端部分自前端突出之狀態下夾入而保持上述基板;且上述夾入夾具包含隔開夾入上述基板之間隔且以平行姿勢組裝之第一板材及第二板材,且可調整上述第一板材與第二板材之間隔地形成。 A breaking tool for a brittle material substrate, comprising: a supporting jig having a groove inserted into one end portion of the substrate on the surface; and a clamping jig for causing one end of the streaking line of the substrate to be broken The substrate is sandwiched and held in a state in which the front end is protruded; and the sandwiching jig includes a first plate and a second plate which are assembled in a parallel posture with a space sandwiched between the substrates, and the first plate and the second plate are adjustable The sheets are formed at intervals. 如請求項1之脆性材料基板之分斷工具,其中上述夾入夾具包含上述第一板材及第二板材、以及介於該等板材與上述基板之間之中間板材而形成,上述中間板材包含彈性材料而形成,且可調整上述第一板材與第二板材之間隔地形成。 The breaking tool for a brittle material substrate according to claim 1, wherein the sandwiching jig comprises the first plate and the second plate, and an intermediate plate interposed between the plates and the substrate, wherein the intermediate plate comprises elasticity The material is formed and can be formed by adjusting the interval between the first plate and the second plate. 如請求項2之脆性材料基板之分斷工具,其中上述中間板材之左右寬度以較上述基板之左右寬度小之尺寸形成。 The breaking tool of the brittle material substrate of claim 2, wherein the left and right widths of the intermediate plate are formed to be smaller than the left and right widths of the substrate. 如請求項1至3中任一項之脆性材料基板之分斷工具,其中上述夾入夾具之第一板材與第二板材藉由調整螺絲連結,且以可藉由操作該調整螺絲而調整上述間隔之方式形成。 The breaking tool for a brittle material substrate according to any one of claims 1 to 3, wherein the first plate and the second plate of the clamping jig are coupled by an adjusting screw, and the adjusting screw can be adjusted by operating the adjusting screw Formed by the interval. 如請求項1至3中任一項之脆性材料基板之分斷工具,其中上述支持夾具係其形成上述凹槽之一側壁之構件可沿槽寬方向移動調整地形成,且形成上述凹槽之底面之構件可沿凹槽之深度方向移動調整地形成。 The breaking tool for a brittle material substrate according to any one of claims 1 to 3, wherein the supporting jig is formed by a member which forms a side wall of the groove, and is formed to be movable in a groove width direction, and the groove is formed. The member of the bottom surface is formed to be movable in the depth direction of the groove. 一種脆性材料基板之支持夾具,其係用以支持基板之一端部分以將該基板沿著形成於該基板之表面之劃線分斷者,且於表面具有插入上述基板之一端部分之凹槽,形成上述凹槽之一側壁之構件可朝槽寬方向移動調整地形 成,且形成上述凹槽之底面之構件可朝凹槽之深度方向移動調整地形成。 A supporting fixture for a brittle material substrate for supporting one end portion of a substrate to separate the substrate along a line formed on a surface of the substrate, and having a groove inserted into one end portion of the substrate on the surface, The member forming the side wall of one of the grooves can be moved in the groove width direction to adjust the terrain The member forming the bottom surface of the groove may be formed to be moved in the depth direction of the groove.
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