JPH0740296A - Method and jig for dividing ceramic board - Google Patents

Abstract

PURPOSE:To reduce the rate at which a ceramic board breaks into shell-like chips by setting a fulcrum in a position facing a dividing groove on that side of the ceramic board which is opposite to the side where the dividing groove is formed, so that the fulcrum points in the direction of extension of the dividing groove and outside the side opposite to the groove. CONSTITUTION:To divide a ceramic board into chips using a dividing jig, the board 1 is first inserted into the slits 3a, 4a of right and left holding members 4,3 to hold the board 1 in place. Next, with the right holding member 4 held in position, a force in the direction of the arrow is exerted on one side end of the left holding member 3 to rotate the left holding member 3 about the rotating shaft 6 of a rotary plate 5, thereby exerting the board 1 with bending moment and dividing the board 1 into right and left chips 1b, 1a along a dividing groove 2. Since the fulcrum in this case points in the direction of extension of the dividing groove 2 and locates outside that side of the board 1 which is opposite to the side where the dividing groove is formed, the board is prevented from breaking into shell-like chips.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate dividing method and a dividing jig, and more particularly to a glaze substrate having a surface opposite to the dividing groove and a glass having the dividing groove. The present invention relates to a method for dividing a ceramic substrate such as a ceramic substrate such as a ceramic substrate along a dividing groove into chip pieces and a dividing jig.

[0002]

2. Description of the Related Art Conventionally, as a dividing jig for dividing a ceramic substrate having a dividing groove formed on one surface along the dividing groove, as shown in FIG. With one side 101a being held and fixed from above and below by the jig 103 with the dividing groove 102 as a boundary, a bending moment is applied in the direction of the arrow with the end portion of the other side 101b of the ceramic substrate 101 acting as an action point, and the ceramic substrate 101
There is known a structure in which the ceramic substrate 101 is divided along the dividing groove 102 with the dividing groove facing portion 104 on the surface opposite to the surface on which the dividing groove 102 is formed as a fulcrum (Japanese Patent Application Laid-Open No. Sho. 61-99305 gazette).

According to the method for dividing a ceramic substrate using this dividing jig, since the tip of the jig 103 is along the dividing groove 102 of the ceramic substrate 101, the dividing surface is notched or slanted. It has an advantage that it can be reduced.

[0004]

However, the above-mentioned ceramic substrate dividing method and dividing jig have the following problems. That is, since the fulcrum of the bending moment is located on the surface of the ceramic substrate opposite to the surface on which the dividing groove is formed, it faces the dividing groove, so that the ceramic substrate 101 as shown in FIG.
Since the fracture surface after division of the surface opposite to the surface in which the division groove 102 is formed comes into contact when the is divided, shell chipping 105 often occurs in the chip piece after division. If chipping occurs when the ceramic substrate is divided, the glaze substrate will be on the opposite side of the surface where the dividing groove is formed.
In addition, since the glass ceramic substrate is formed with the circuit on the side opposite to the dividing groove side, whether the circuit is formed after the division or is divided after the circuit is formed, an open defect due to a pattern defect or an increase in the resistance value is caused. Poor resistance value occurs. In particular, since the chip is generally divided after the circuit is formed, if chipping occurs, the ceramic substrate with added value becomes defective, and even if the occurrence of chipping is about 1%, the loss due to it becomes large. . There is a problem such as.

The present invention was devised to address such a problem, and its purpose is to provide a chipping that may occur on a fracture surface when a ceramic substrate such as a glaze substrate or a glass ceramic substrate is divided. An object of the present invention is to provide a method of dividing a ceramic substrate and a jig for dividing the occurrence rate of which is significantly reduced.

[0006]

The method for dividing a ceramic substrate according to the present invention as means for achieving the above object sandwiches the dividing groove of the dividing groove forming surface in which the dividing groove of the ceramic substrate is formed. The left and right parts are used as fulcrums or points of action in the same direction, and the ceramic substrate is divided using the part facing the dividing groove on the opposite side of the dividing groove forming surface as the fulcrum or point of action opposite to the fulcrum or points of action of the left and right parts. In a method of dividing a ceramic substrate along a groove, a position of a fulcrum or an action point of the dividing groove facing portion is shifted in a groove depth extension direction of the dividing groove and outward of the opposite surface. And it has a configuration.

Further, the jig for dividing a ceramic substrate of the present invention is a left and right holding member for holding and fixing a ceramic substrate having a dividing groove formed on one surface in the left and right direction with the dividing groove interposed therebetween, and the left and right holding members. A rotating plate for rotating the ceramic substrate held and fixed to the member is provided, and the rotating plate is in the groove depth extension direction of the dividing groove of the ceramic substrate and on the dividing groove forming surface of the ceramic substrate. A rotary shaft is provided at a position shifted outward on the opposite surface, and a bending moment is applied to the ceramic substrate about the rotary shaft.

[0008]

According to the method of dividing a ceramic substrate of the present invention, the position of the fulcrum or the point of action of the division groove facing portion on the surface opposite to the division groove forming surface of the ceramic substrate is set in the groove depth extension direction of the division groove.
Moreover, since the position is shifted outward from the opposite surface, the fracture surfaces of the respective chip pieces divided at the time of division act so as to move in the directions away from each other.

Also, the jig for dividing a ceramic substrate of the present invention is located at a position displaced in the groove depth extension direction of the dividing groove of the ceramic substrate and outward of the surface opposite to the dividing groove forming surface of the ceramic substrate. Since the rotary plate having the rotary shaft is provided, and the rotary plate applies a bending moment to the ceramic substrate fixed and held by the left and right holding members about the rotary shaft,
At the time of division, the left and right holding members, which fix and hold the divided chip pieces, move in a direction in which they are separated from each other, and act to separate the fracture surfaces of the chip pieces.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. Here, FIG. 1 is an explanatory view showing an embodiment using a jig for dividing a ceramic substrate of the present invention.

The jig for dividing a ceramic substrate of this embodiment is a jig for dividing a ceramic substrate such as a glaze substrate or a glass ceramic substrate along a dividing groove into chip pieces. The ceramic substrate 1 is provided with left and right holding members 3 and 4 which hold and fix the ceramic substrate 1 in the left-right direction across the dividing groove 2, and a rotary shaft 6 which rotates the ceramic substrate 1 held and fixed by the left and right holding members 3 and 4. The rotary plate 5 is included.

The ceramic substrate 1 is a glaze substrate in which the opposite surface of the dividing groove 2 is glazed, a glass ceramic having the dividing groove 2 or the like, and the dividing groove 2 is formed on one surface. Here, the dividing groove 2 includes a so-called snap line for dividing the ceramic substrate 1.

The left and right holding members 3, 4 have slits 3a, 4a into which the ceramic substrate 1 is inserted, and the width and height of the slits 3a, 4a are divided.
It is appropriately selected according to the width and thickness of the. The left and right holding members 3 and 4 are composed of an upper member that presses the upper surface of the ceramic substrate 1 and a lower member that presses the lower surface of the ceramic substrate 1, and fixing means that fix these upper member and lower member, and have various thicknesses. The ceramic substrate 1 can be held and fixed.

The rotating plate 5 is opposite to the dividing groove forming surface of the ceramic substrate 1 and the left fixing plate 5a fixed to the outer surface of the left holding member 3 located on the surface opposite to the dividing groove forming surface of the ceramic substrate 1. A right fixing plate 5b fixed to the outer surface of the right holding member 4 located on the surface side, and the left fixing plate 5a and the right fixing plate 5b are extended in the groove depth extension direction of the dividing groove 2 of the ceramic substrate 1. Further, the ceramic substrate 1 is rotatably supported by a rotary shaft 6 which is located at a position displaced outward from the surface opposite to the division groove forming surface of the ceramic substrate 1. Here, the shift distance x can be changed to an arbitrary distance according to the shape of the dividing groove 2, the groove depth, and the like.

In order to divide the ceramic substrate 1 along the dividing grooves 2 into chip pieces by using the jig for dividing a ceramic substrate of this embodiment, first, as shown in FIG. The ceramic substrate 1 is inserted into the slits 3a and 4a of the left and right holding members 3 and 4, and the ceramic substrate 1 is held and fixed in the left and right direction with the dividing groove 2 interposed therebetween.

Thereafter, with the right holding member 4 among the left and right holding members 3 and 4 fixed, a force in the direction of the arrow is applied to the side end portion of the left holding member 3 to turn the turning plate 5. By rotating the left holding member 3 around the shaft 6 as shown in FIG. 1B, a bending moment is applied to the ceramic substrate 1 with the rotating shaft 6 of the rotating plate 5 as a fulcrum, and the ceramic substrate 1 is rotated. 1
Is divided into a left chip piece 1a and a right chip piece 1b along the dividing groove 2.

Here, since the position shifted in the groove depth extension direction of the dividing groove 2 of the ceramic substrate 1 and outward of the surface opposite to the dividing groove forming surface of the ceramic substrate 1 serves as a fulcrum, the left holding member. The left chip piece 1a and the right chip piece 1b held and fixed by the right holding member 4 and the right holding member 4 move in the directions in which the fracture surfaces (division surfaces) separate from each other during division, so that the division groove 2 is formed. It acts so that the corners of the divided groove facing portion on the surface opposite to the surface do not come into contact with each other. As a result, shell-like chipping due to abutting at the time of division does not occur on each of the divided chip pieces 1a and 1b, and the yield rate is improved.

Next, in order to confirm the effect of this embodiment,
The rate of chipping in the case of dividing the glaze substrate and the glass ceramic substrate was examined using the dividing jig shown in FIGS. This dividing jig has a rotating shaft 11
The flat plate 12 is fixed to the flat plate 12, the long holes 13 are formed in the flat plate 12, and the left holding member 14 can be vertically moved along the long holes 13 and 13 so that the left holding member 14 can be fixed at any position. On the other hand, the right holding member 15 is vertically movable in accordance with the position of the left holding member 14, is fixedly disposed at an arbitrary position, and is located at a division groove facing portion of the ceramic substrate 1 opposite to the division groove forming surface. The distance between the point F and the rotation center point E of the rotation shaft 11 can be adjusted.

Here, as the glaze substrate, the size and thickness of the sample are 270 mm × 56 mm × 1.0 mm.
Then, the depth of the dividing groove is set to be 35 to 38% of the substrate thickness by using a laser (when the depth is less than 35%, the breakability becomes difficult, and when it exceeds 38%, there is a possibility of cracking in the process. However, this is not limited to the depth because the beam diameter of the laser, the wedge mode, and the laser pitch influence the splittability.) In addition, the division width of one unit is 14.0 mm by inserting four division grooves in parallel with the longitudinal direction of the substrate.
And Further, as a glass ceramic substrate, as shown in FIG.
As shown in (a), the size and thickness of the sample is 65m.
m × 50 mm × 1.0 mm, the depth of the dividing groove is 0.15 mm in the die molding, and the dividing width of one unit in the longitudinal direction is 13.0 mm and the dividing width in the lateral direction is 10.0 mm. The dividing jig was used when dividing in the longitudinal direction as shown in FIG.

The distance between the points E and F of the dividing jig is changed to 0, 3, 6, 10, 15, 20 mm,
The number of chippings with a depth of 0.1 mm or more and the number of chippings with a depth of 0.2 mm or more are counted for the cumulative division length (50 m).
The ratio (%) of division defects that did not break along the division groove was calculated. The results are shown in Table 1 (glaze substrate) and Table 2 (glass ceramic substrate).

[0021]

[Table 1]

[0022]

[Table 2]

From the above results, the distance between E and F is 0 mm.
In the case of, that is, in the case of the conventional dividing jig (same as the jig of FIG. 5), it is possible to divide along the dividing groove,
While a large number of chippings with a depth of 0.1 mm or more occur, when the distance between E and F is 3 to 10 mm, chipping with a depth of 0.2 mm or more that may result in a pattern defect does not occur. It was confirmed that when the length was 6 to 10 mm, the chipping of 0.1 to 0.2 mm was drastically reduced, and the quality after division was significantly improved.

It should be noted that the present invention is not limited to the above-described embodiment, but includes a configuration that can be modified and implemented within a range that does not change the gist of the present invention. Incidentally, in the above-described embodiment, the right holding member is fixed and the left holding member is rotated. However, the left holding member may be fixed and the right holding member may be rotated. Also, both the left and right holding members may be rotated with the rotation axis of the rotation plate as a fulcrum, and the rotation axis of the rotation plate may be used as an action point with both sides of the left and right holding members as fulcrums. Of course.

[0025]

As is apparent from the above description, according to the ceramic substrate dividing method and the dividing jig of the present invention, the fulcrum or function of the dividing groove facing portion of the ceramic substrate opposite to the dividing groove forming surface. Since the positions of the points are in the groove depth extension direction of the dividing groove and at positions displaced outward of the opposite surface, the fracture surfaces of the chip pieces divided at the time of division are separated from each other. Since it does not move and come into contact with, the occurrence of shell-like chipping is extremely reduced, yields are improved, and reliability is improved.

Therefore, according to the present invention, the method of dividing a ceramic substrate and the jig for dividing the ceramic substrate, which greatly reduce the occurrence rate of chipping that may occur on the fracture surface when the ceramic substrate such as the glaze substrate or the glass ceramic substrate is divided. Can be provided.

[Brief description of drawings]

FIG. 1 is an explanatory view showing an embodiment using a jig for dividing a ceramic substrate according to the present invention.

FIG. 2 is a plan view of a dividing jig used for a dividing test of a ceramic substrate and capable of changing a fulcrum.

FIG. 3 is a front view of FIG. 2.

FIG. 4 is an explanatory diagram of a test piece.

FIG. 5 is an explanatory diagram showing a method of dividing a ceramic substrate using a conventional dividing jig.

[Explanation of symbols]

1 ... Ceramic substrate, 1a, 1b ... Chip piece, 2 ... Dividing groove, 3, 14 ... Left holding member, 4,
15 ... Right holding member, 5 ... Rotating plate, 6, 11 ...
・ Rotating shaft, 12 ... Flat plate, 13 ... Long hole, 101 ...
..Ceramic substrates, 102 ... Dividing grooves, 101a
..One side of ceramic substrate with dividing groove as a boundary, 101
b: the other side of the ceramic substrate with the dividing groove as a boundary, 1
03 ... Jig, 104 ... Division groove facing part, 105
... Shell-shaped chipping

Claims (2)

[Claims] 1. A split groove forming surface of a ceramic substrate on which a split groove is formed has left and right portions sandwiching the split groove as fulcrums or points of action in the same direction, and a split groove facing portion on the opposite surface of the split groove forming surface. In the method for dividing the ceramic substrate, the ceramic substrate is divided along the dividing grooves as fulcrums or points of action opposite to the fulcrums or points of action of the left and right parts,
A method of dividing a ceramic substrate, wherein a position of a fulcrum or an action point of the divided groove facing portion is a position displaced in a groove depth extension direction of the divided groove and outward of the opposite surface. 2. A left / right holding member for holding / fixing a ceramic substrate having a dividing groove formed on one surface in the left / right direction with the dividing groove interposed therebetween, and a ceramic substrate held / fixed by the left / right holding member. A rotating plate for rotating the rotating plate in the groove depth extending direction of the dividing groove of the ceramic substrate and at a position displaced outward from the surface opposite to the dividing groove forming surface of the ceramic substrate. A jig for dividing a ceramic substrate, comprising a shaft, and applying a bending moment to the ceramic substrate about the rotation axis.