JP2000238034A - Ceramic board and separating method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a ceramic board, the warpage developing in which is small and, at the same time, in which the occurrence of defective separation is small, and its separating method. SOLUTION: Primary breaking grooves 1 are engraved on one side of a ceramic green sheet and secondary breaking grooves 2 are engraved normal to the primary breaking grooves 1 on the opposite side of the sheet so as to fire the sheet in order to obtain a ceramic board A. In addition, at the engraving of the primary breaking grooves 1 on the ceramic green sheet, positioning through holes are bored simultaneously. Further, at the separation of the ceramic board A by being pinched between a small diametral roller and a large diametral roller, the large diametral roller is abutted against the disposed surface of the primary grooves 1 at the separating process of the primary breaking grooves 1 and the disposed surface of the secondary grooves 2 at the separating process of the secondary breaking grooves 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic substrate used for manufacturing a chip-type electronic component, and a method for dividing the ceramic substrate.

[0002]

2. Description of the Related Art Conventionally, electronic components such as a chip-type resistor and a chip-type capacitor using a ceramic substrate as a substrate are shown in FIG.
As shown in FIG. 4A, a ceramic green sheet b in which a plurality of primary break grooves 10 and secondary break grooves 20 are arranged orthogonal to each other is fired (FIG. 4B), and a large ceramic substrate B is formed. Manufactured as a form. FIG.
In (b), C indicates a firing furnace.

[0003] Primary break groove 10 and secondary break groove 2
When the secondary break groove 20 is formed so as to be shallower than the primary break groove 10, the primary break groove 10 is often configured to be more easily divided.

In the following, as an example, the manufacturing process of the chip type resistor will be briefly described. The upper electrode 11 is printed and dried over the primary break groove 10 of the fired ceramic substrate B, and the same is applied to the back surface. The lower electrode (not shown) is also printed and dried at the position.

Next, the resistor 12 and the first protective glass layer 13 of the resistor 12 are printed, dried, and sintered between the upper electrodes 11, and trimming 14 for adjusting the resistance value is performed. After printing, drying and sintering, the substrate is divided along the primary break groove 10 to obtain a bar-shaped substrate B ′.

As shown in FIG. 4E, the dividing portion of the dividing device 70 for the ceramic substrate B is constituted by a large-diameter roller 50 and a small-diameter roller 60, and is provided between the large-diameter roller 50 and the small-diameter roller 60. The ceramic substrate B is inserted and divided by utilizing the difference in curvature between the rollers 50 and 60.

After the division into the bar-shaped substrate B ', the upper electrode 11
A side electrode connecting the electrode and the lower electrode is applied and dried, and divided along the secondary break groove 20 to form a single chip resistor.

In the division of the secondary break groove 20, similarly to the division of the primary break groove 10, the division is performed by a division device 70 having a division portion composed of a large-diameter roller 50 and a small-diameter roller 60.

[0009]

However, as the size of electronic components has been reduced, the thickness of the ceramic substrate has been reduced, and the depth of the primary break groove and the secondary break groove have been made different from each other to form a ceramic green sheet. It became difficult to engrave.

Therefore, when the difference between the depths of the primary break groove and the secondary break groove is small or almost equal, when the ceramic substrate B is divided into the bar-shaped substrates B 'as shown in FIG. In addition to the division along the primary break groove 10, the division also occurs along the secondary break groove 20.

Since the application of the side electrodes performed after the division into the bar-shaped substrates is performed in accordance with the dimensions of the complete bar-shaped substrate, all the bar-shaped substrates that have been broken along the secondary break grooves have been shortened. It was treated as a defective product, causing a great decrease in yield.

Further, ceramic green sheets include:
Since the primary and secondary break grooves are engraved on only one side, the ceramic substrate tends to warp due to the difference in shrinkage between the front and back surfaces of the ceramic green sheet during firing. There is also a problem that the yield of the substrate is reduced.

[0013]

According to the first aspect of the present invention, a primary break groove is formed on one side of a ceramic green sheet, and the primary break groove is orthogonal to the primary break groove on the opposite side. A ceramic substrate characterized in that secondary break grooves are cut in the direction and fired.

According to a second aspect of the present invention, there is provided a ceramic substrate characterized in that a primary break groove is formed in the ceramic green sheet and a positioning through-hole is formed at the same time. It is.

Further, according to the present invention, there is provided a dividing method in which the ceramic substrate is sandwiched between a small-diameter roller and a large-diameter roller to divide the primary break groove and the secondary break groove. The ceramic substrate is characterized in that, in the step of dividing the break groove, the surface on which the primary break groove is arranged is divided, and in the step of dividing the secondary break groove, the surface where the secondary break groove is arranged is divided while contacting the large diameter roller. Is not provided.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION The ceramic substrate of the present invention has a primary break groove formed on one side of a ceramic green sheet, and a secondary break groove formed in a direction orthogonal to the primary break groove on the opposite side, and is fired. It is a ceramic substrate obtained by:

The primary break groove and the secondary break groove are formed by pressing a ceramic green sheet with a mold provided with a ridge blade adapted to the shape of the primary break groove or the secondary break groove. .

In particular, when forming a primary break groove,
A punching pin for piercing the positioning through-hole is provided in the mold in which the ridge blade is arranged according to the shape of the primary break groove, and the primary break groove and the positioning through-hole are simultaneously formed. Form.

Therefore, it is possible to reduce the number of processing steps of the ceramic green sheet and to improve the production efficiency, and to form the secondary break grooves without using the positioning through holes without shifting from the primary break grooves. can do.

When the ceramic substrate having the break grooves formed on both surfaces is divided along the break grooves, each roller is held between a small-diameter roller and a large-diameter roller in the same manner as in the conventional dividing method. Is divided using the difference in the curvatures of.

However, since the ceramic substrate is bent so as to bend toward the small-diameter roller, the surface on which the primary break groove is provided is divided in the step of dividing the primary break groove, and the surface of the secondary break groove is divided in the step of dividing the secondary break groove. The arrangement surface is divided into contact with the large-diameter roller so that a division failure is less likely to occur, and the division is performed reliably.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described in detail with reference to the drawings.
FIG. 1 shows a ceramic substrate A of the present invention, in which a primary break groove 1 is formed on the front surface and a secondary break groove 2 is formed on the back surface.

The cutting of the primary break groove 1 and the secondary break groove 2 is performed at the stage of the ceramic green sheet a before firing, and as shown in FIG. 2, the ceramic green sheet has a substantially rectangular sheet shape. a is engraved by pressing with a mold (not shown) having a ridged blade arranged in accordance with the shape of the primary break groove 1 or the secondary break groove 2.

In FIG. 2, the primary break grooves 1 indicated by broken lines, which are orthogonal to the secondary break grooves 2, indicate that they are arranged on the back surface of the ceramic green sheet a.

Further, when the primary break groove 1 is carved, not only the ridge blade but also a plurality of through pins (not shown) for forming the positioning through holes 4 at required positions in the mold. The positioning through-holes 4 can be simultaneously formed in the ceramic green sheet a.

When manufacturing an electronic component such as a multiple electronic component or a chip capacitor in which a through-hole is previously provided in the ceramic substrate A, the through-hole is formed by the primary break groove 1 and the You may comprise so that it may arrange | position simultaneously with the through-hole 4 for positioning.

In this embodiment, since the primary break groove 1 is formed first, the primary break groove 1 and the positioning through hole 4 are arranged at the same time. In the case of engraving 2 first, the secondary break groove 2 and the positioning through hole 4 may be arranged at the same time.

By forming the primary break grooves 1 and forming the positioning through holes 4 in the ceramic green sheet a, the number of processing steps for the ceramic green sheet a can be reduced, and the ceramic green sheet a When the secondary break grooves 2 are formed on the back surface, the primary break grooves 1 and the secondary break grooves 2 can be formed with a high yield without causing a shift with respect to the primary break grooves 1. .

The primary break groove 1 and the secondary break groove 2 engraved on the ceramic green sheet a may have the same depth as each other, or may have a secondary break groove as in the prior art. The groove 2 may be formed shallower than the primary break groove 1 so as to further reduce the possibility that the primary break groove 1 is divided along the secondary break groove 2 by mistake.

The ceramic green sheet a in which the primary break grooves 1 and the secondary break grooves 2 are engraved is cut into a required size and fired to form a ceramic substrate A.

In this embodiment, an example is shown in which a ceramic green sheet a serving as one ceramic substrate A is taken out from one ceramic green sheet a, but a plurality of ceramic substrates A can be taken. Good.

The ceramic green sheet a has cuts formed by the primary break 1 groove and the secondary break groove 2 on both surfaces, so that the difference in shrinkage between the front surface and the back surface generated during firing is reduced. The size of the substrate can be reduced, and the occurrence of defects due to the warpage of the ceramic substrate A can be reduced.

After that, as described in the prior art, an electrode portion, a resistor, or a dielectric glass in the case of a chip type capacitor is provided on the ceramic substrate A, and divided along the primary break groove 1. Bar-shaped substrate A '
And

The division in the primary break groove 1 is shown in FIG.
As shown in (a), the separation is performed by a dividing device 7 using a large-diameter roller 5 and a small-diameter roller 6 as in the prior art. Here, the ceramic substrate A is fed so that the surface of the ceramic substrate A where the primary break grooves 1 are provided contacts the large-diameter roller 5. In FIG. 3A, reference numeral 8 denotes a feeding belt conveyor for feeding the ceramic substrate A.

When the ceramic substrate A is sandwiched between the large-diameter roller 5 and the small-diameter roller 6 in the dividing device 7, the ceramic substrate A is bent toward the small-diameter roller 6 due to the difference in curvature between the rollers 5 and 6. Attempting force acts.

The stress generated by the bending force acts on the primary break groove 1 so as to expand the primary break groove 1, thereby acting intensively on the primary break groove 1, and therefore, the cracks along the primary break groove 1. , And can be divided into bar-shaped substrates A ′.

Conversely, when the ceramic substrate A is fed to the dividing device 7 such that the surface on which the primary break groove 1 of the ceramic substrate A is disposed and the small-diameter roller 6 contact each other, the large-diameter roller 5 The stress generated due to the difference in curvature between the roller and the small-diameter roller 6 is apt to act in a dispersed manner, so that a crack along the primary break groove 1 is unlikely to occur, and defective division is likely to occur.

After division into the bar-shaped substrate A ', the bar-shaped substrate A' is subjected to side electrode processing.
Are divided along the line to obtain a single electronic component A ″.

When dividing along the secondary break groove 2, the dividing device 7 using the large-diameter roller 5 and the small-diameter roller 6 is used. It is necessary to contact the large diameter roller 5.

In this embodiment, the bar-shaped substrate A ', which has been fed to a coating device (not shown) for applying the side-surface electrodes, is processed in the feeding state when the side-surface electrodes of the bar-shaped substrate A' are processed. The coating device is configured to carry out the product in a state in which it is turned over.

Specifically, in the coating apparatus, the bar-shaped substrate A 'is once clamped by a coating jig (not shown).
The bar-shaped substrate A 'on which the side electrodes are applied is turned upside down and released.

In another embodiment, the bar-shaped substrate A ′ is formed after the side electrode is baked and before the secondary break groove 2 is divided.
The bar-shaped substrate A ′ may be turned upside down and fed to the splitting device 7 by adding an upside down process.

Further, as another embodiment, the side electrode processing step is the same as the conventional one, and as shown in FIG. 3B, the large-diameter roller of the dividing device 7 'used for dividing the secondary break groove 2 is used. It may be configured to perform the division by reversing the arrangement position of the roller 5 and the small-diameter roller 6. In FIG. 3B, reference numeral 8 'denotes a feeding belt conveyor for feeding the bar-shaped substrate A', and 9 denotes a feeding auxiliary roller.

In this embodiment, the ceramic substrate A used for manufacturing the chip-type electronic component has been described. However, the present invention can also be used for manufacturing a semiconductor package using ceramics. And the present invention can be applied to all products manufactured in a multi-cavity form.

[0045]

According to the present invention, a primary break groove is formed on one surface of a ceramic green sheet, and a secondary break groove is formed on the opposite surface in a direction perpendicular to the primary break groove, and then fired. Thus, the primary break groove is not divided along the secondary break groove when the primary break groove is divided, and the primary break groove can be surely divided into the bar-shaped substrates, so that the production yield can be improved.

Further, since the cuts formed by the primary break grooves or the secondary break grooves are formed on both sides of the ceramic green sheet, the front and back surfaces of the ceramic green sheet during firing are reduced.
The difference in shrinkage due to firing can be reduced, and warpage of the ceramic substrate can be prevented.

According to the second aspect of the present invention, since the primary break grooves are formed in the ceramic green sheet and the positioning through holes are simultaneously formed, the number of processing steps for the ceramic green sheet can be reduced. , Workability can be improved.

Further, by positioning the secondary break grooves using the positioning through holes, the secondary break grooves do not shift with respect to the primary break grooves, so that a ceramic substrate can be manufactured with high yield. it can.

According to the third aspect of the present invention, in the step of dividing the primary break groove, the surface of the primary break groove is arranged, and in the step of dividing the secondary break groove, the surface of the secondary break groove is arranged.
By dividing while contacting the large-diameter roller, the ceramic substrate can be surely divided without causing division failure.

[Brief description of the drawings]

FIG. 1 is a perspective view of a ceramic substrate according to the present invention.

FIG. 2 is a plan view showing a state of a ceramic green sheet.

FIG. 3 is a schematic view of an apparatus for dividing a ceramic substrate.

FIG. 4 is an explanatory view of a manufacturing process of a conventional chip resistor.

FIG. 5 is a perspective view of a conventional ceramic substrate.

[Explanation of symbols]

 A Ceramic substrate A 'Bar-shaped substrate A "Single electronic component a Ceramic green sheet 1 Primary break groove 2 Secondary break groove

Claims (3)

[Claims] 1. A ceramic substrate characterized in that a primary break groove is engraved on one surface of a ceramic green sheet, and a secondary break groove is engraved on the opposite surface in a direction orthogonal to the primary break groove, and is fired. 2. The ceramic substrate according to claim 1, wherein a primary break groove is formed in the ceramic green sheet, and a positioning through hole is formed at the same time. 3. A dividing method for dividing a ceramic substrate into a primary break groove and a secondary break groove by sandwiching the ceramic substrate between a small-diameter roller and a large-diameter roller,
In the step of dividing the primary break groove, the surface of the primary break groove is divided while the surface of the secondary break groove is divided in the step of dividing the secondary break groove while contacting the large-diameter roller. 3. The method for dividing a ceramic substrate according to claim 1 or 2.