JP3065743B2 - Manufacturing method of ceramic insulating substrate for electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a thermal print head or a hybrid integrated circuit, in which a glaze layer or various wiring circuits or a resistor element is formed on the surface by applying and firing a paste. The present invention relates to a method for manufacturing an insulating substrate.

[0002]

2. Description of the Related Art Conventionally, a ceramic insulating substrate used for an electronic component such as a thermal print head or a hybrid integrated circuit is firstly made as shown in FIG.
The ceramic material plate 2 is manufactured by arranging a plurality of the ceramic material plates 2 in a connected state and irradiating the back surface of the ceramic material plate 2 intermittently or continuously with a laser beam. As shown in FIGS. 6 and 7, scribe grooves 3, 4 for breaking each are formed at both ends of each side end face 2 a, 2 of the ceramic material plate 2.
b, 2c, and 2d are engraved so as to reach completely, and then a glaze layer or a paste for various wiring circuits or various elements is applied to the surface of the ceramic material plate 2, and then the paste is heated in a furnace. Then, as shown in FIG. 8, the ceramic material plate 2 is manufactured by breaking each of the insulating substrates 1 along each of the scribe grooves 3 and 4, as shown in FIG.

[0003]

By the way, in this conventional manufacturing method, the groove depth H of each of the scribe grooves 3 and 4 engraved on the back surface of the ceramic material plate 2 is described.
Is at least 2/5 of the thickness of the ceramic material plate 2
When deeply into, the ceramic material plate 2, when the break along the respective scribe groove 3,4, the ceramic material plate 2, at the location of each scribe groove 3,4, both sides of the ceramic material plate 2 Can be broken in a state close to a right angle with respect to the length of the insulating substrate 1, the variation in length L and width W of the insulating substrate 1 can be reduced, and the length L and width W of each insulating substrate 1 can be reduced. Dimensional accuracy can be improved.

However, on the other hand, the scribe grooves 3, 4
When the groove depth H is increased as described above , when the glaze layer or a conductive paste for various wiring circuits is applied and then fired at a high temperature in a furnace, the ceramic material plate 2 expands and contracts due to heat. On the other hand, each of the scribe grooves 3 and 4 has a ceramic material plate 2 at both ends.
Has reached the respective side end surfaces 2a, 2b, 2c, 2d of the ceramic material plate 2, the respective scribes completely reaching the respective side end surfaces 2a, 2b, 2c, 2d of the ceramic material plate 2. Since there is a defect where stress concentration occurs due to the grooves 3 and 4, the ceramic material plate 2 has a problem that cracks or cracks along the scribe grooves 3 and 4 occur frequently.

Therefore, conventionally, each of the scribe grooves 3,
4 is made shallow to less than two-fifths of the thickness of the ceramic material plate 2, but if the groove depth H is made so small, the ceramic material plate 2 will not be fired when the paste is fired. Cracks or cracks along the scribe grooves 3 and 4 can be prevented from being generated at the same time.
Is broken along each of the scribe grooves 3 and 4, the ceramic material plate 2 separates the scribe grooves 3 and 4 from each other.
7 is broken at a position inclined with respect to the front and back surfaces of the ceramic material plate 2 as shown by a one-dot chain line A or a two-dot chain line B in FIG. There is a problem that the variation in the dimension in the length dimension L and the width dimension W increases, and the dimensional accuracy of the length dimension L and the width dimension W in each insulating substrate 1 decreases.

An object of the present invention is to provide a manufacturing method which does not cause such a problem when manufacturing an insulating substrate.

[0007]

In order to achieve this technical object, the present invention provides a method of manufacturing a ceramic material plate in which a plurality of insulating substrates are connected to each other.
A plurality of scribe grooves for breaking the ceramic material plate for each of the insulating substrates are engraved by irradiating a laser beam, and then, a glaze layer or paste for various wiring circuits or various elements is applied to the ceramic material plate. Then, firing, then, in the method of manufacturing an insulating substrate in which the ceramic material plate is broken for each insulating substrate along each scribe groove, the groove depth in each scribe groove , the ceramic material Board thickness
More than two-fifths, and all of these scribe grooves
The two ends of the ceramic material plate are engraved on the portion adjacent to the side end surface of the ceramic material plate without reaching a side end surface of the ceramic material plate, leaving a scribe grooveless portion having a narrow dimension. "It was to be.

[0008]

[Operation] When engraving a plurality of scribe grooves on the surface of a ceramic material plate for breaking the ceramic material plate for each insulating substrate, all of the scribe grooves are placed with both ends of the ceramic material plate facing the ceramic material plate. Without reaching the end face, by engraving the portion adjacent to the side end face of the ceramic material plate, leaving a scribe grooveless portion of a narrow dimension, each side end face of the ceramic material plate, the conventional As described above, since it is possible to avoid a defect in which stress concentration occurs due to the scribe groove over the entire length of each side end face, it is possible to avoid the groove depth of each scribe groove by using a ceramic. Elementary
At each scribe groove, a ceramic plate
Break at a right angle to both sides
5 times the thickness of the ceramic material plate.
Even if it is deeper than two-thirds, cracks or cracks are generated along the scribe grooves in the ceramic material plate upon firing after applying a glaze layer or paste for various wiring circuits or various elements. Can be reliably prevented.

On the other hand, the scribe-groove-free portion adjacent to each side end surface of the ceramic material plate has a small size, so that when the ceramic material plate is broken for each insulating substrate along each scribe groove, At the same time, it can be easily broken.

[0010]

Thus, according to the present invention, it is possible to reliably prevent cracks or cracks from being generated along the scribe grooves in the ceramic material plate when firing the glaze layer or the paste for various wiring circuits or various elements. Under the condition that the scribe grooves can be formed, the groove depth of each of the scribe grooves can be increased, so that the dimensional variation in the length dimension and width dimension of each insulating substrate can be reduced, and the length in each insulating substrate can be reduced. This has the effect that the dimensional accuracy of the dimensions and width dimensions can be significantly improved as compared with the case of the conventional manufacturing method.

[0011]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing an embodiment of the present invention;
Will be described.

In this figure, reference numeral 2 denotes a ceramic material plate manufactured by connecting a plurality of insulating substrates 1 to each other, and a laser beam is applied to the back surface of the ceramic material plate 2 intermittently or continuously. Accordingly, when the scribe grooves 3 and 4 for breaking the ceramic material substrate 2 for each insulating substrate 1 are cut, the groove depth H in each of the scribe grooves 3 and 4 is set to
In addition to making the thickness of the material plate 2 two-fifths or more,
As shown in FIGS. 1 and 2, all of the scribe grooves 3, 4 do not reach both end surfaces 2 a, 2 b, 2 c, 2 d of the ceramic material plate 2. Side end surfaces 2a, 2b, 2
In the portion adjacent to c and 2d, the scribe groove-less portions 5 and 6 having a small size S are formed and engraved.

Next, a glaze layer or a paste for various wiring circuits or various elements is applied to the surface of the ceramic material plate 2 and then fired at a high temperature in a furnace.
Next, as shown in FIG. 4, the ceramic material plate 2 is broken for each of the insulating substrates 1 along the scribe grooves 3 and 4.

When firing the glaze layer or the paste for various wiring circuits or various elements, each side end face 2a, 2b, 2c, 2 of the ceramic material plate 2 is fired.
d, there is no defective portion where stress concentration occurs due to the scribe grooves over the entire length of each of the side end faces 2a, 2b, 2c and 2d. Even if the groove depth H of the ceramic material plate 2 is increased, it is possible to reliably prevent the ceramic material plate 2 from being cracked or cracked along the scribe grooves 3 and 4. End faces 2a, 2b, 2
The scribe-groove-free portions 5 and 6 adjacent to c and 2d have a small dimension S, so that when the ceramic material plate 2 is broken for each of the insulating substrates 1 along the scribe grooves 3 and 4 at the same time. You can break.

According to an experiment conducted by the present inventor, it is preferable that the dimension S of each of the scribe grooveless portions 5 and 6 be within 2 mm.
By setting the groove depth H at 4 to 2/5 or more of the thickness of the ceramic material plate 2, the accuracy of the length dimension L and the width dimension W of the insulating substrate 1 can be greatly improved. Was.

[Brief description of the drawings]

FIG. 1 is a perspective view of a ceramic material plate according to an embodiment of the present invention.

FIG. 2 is an enlarged perspective view of a main part in FIG.

FIG. 3 is an enlarged sectional view taken along line III-III of FIG. 2;

FIG. 4 is a perspective view showing a state in which the ceramic material plate of FIG. 1 is broken for each insulating substrate.

FIG. 5 is a perspective view of a ceramic material plate according to a conventional example.

FIG. 6 is an enlarged perspective view of a main part in FIG.

7 is an enlarged sectional view taken along line VII-VII of FIG. 6;

8 is a perspective view showing a state in which the ceramic material plate of FIG. 5 is broken for each insulating substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Insulating board 2 Ceramic material plate 3, 4 Scribe groove 5, 6 No scribe groove

Claims (1)

(57) [Claims] 1. A ceramic material plate in which a plurality of insulating substrates are connected to each other, and a plurality of scribe grooves for breaking the ceramic material plate for each of the insulating substrates are irradiated on the ceramic material plate with a laser beam. The ceramic material plate is then coated with a glaze layer or a paste for various wiring circuits or various elements, and then fired. Then, the ceramic material plate is insulated along each of the scribe grooves. In the method for manufacturing an insulating substrate, wherein each substrate is broken, the groove depth of each of the scribe grooves is determined by using the ceramic
Make each scribe groove at least 2/5 of the thickness of the material plate.
All, and characterized in that the engraving leaving without the scribe ungrooved portion of the narrow dimension portion adjacent to the side end surface of the ceramic material plate to reach the both ends to the side end face of the ceramic raw material plate Of manufacturing a ceramic insulating substrate for electronic components.