JPH1174065A - Dividable ceramic substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a dividable ceramic substrate on which a crack or a split with a scribed line as the starting point is seldom generated from the edge face even at the time of a heat treatment of the ceramic motherboard. SOLUTION: A first scribed line 2, by which an edge ear part 3 is partitioned, is formed in the width direction of a ceramic motherboard 1, at both ends in a longitudinal direction of the rectangular shape ceramic motherboard 1. A second plural scribed lines 4 are formed along the longitudinal direction of the ceramic motherboard 1, but as the both ends thereof are terminated in the middle of the edge ear parts 3, an unscribed parts 5 are formed on the edge face sides of the edge ear parts 3. As the second scribed lines 4 are not formed on the edge faces of the edge ear parts 3, a crack or a split with the second scribed lines 4 as the starting point is seldom generated from the edge faces at the time of applying a heat treatment. Instead of forming the unscribed parts 5, at least the parts on the edge face sides of the edge ear parts 3 of the second scribed lines 4 can be made relatively shallower, and in this case, dividability of the ceramic parent plate 1 is improved. Moreover, the dividablity of the ceramic parent plate 1 can be improved by making a pitch on the parts of the edge face sides of the edge ear parts 3 of the second scribed lines 4 relatively smaller.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-point ceramic substrate for obtaining a ceramic wiring substrate and the like.

[0002]

2. Description of the Related Art FIG. 9 is a front view showing a conventional ceramic substrate for multi-point production.

FIG. 10 is an enlarged front view of a region A in FIG.

FIG. 11 is an enlarged sectional view of the same.

In the figure, 101 is a ceramic base plate,
102 is the first scribe line, 103 is the end ear, 10
Reference numeral 4 denotes a second scribe line, 105 denotes a side ear, 106 denotes a ceramic substrate, and 107 denotes a crack.

The ceramic base plate 101 has a rectangular shape.

The first scribe lines 102 are formed at both ends in the longitudinal direction of the ceramic base plate 101 by a laser scribe method in the width direction of the ceramic base plate 101, thereby defining end ears 103. .

A plurality of second scribe lines 104 are similarly formed along the longitudinal direction of the ceramic base plate 101 by a laser scribe method, thereby defining a ceramic substrate 106.

First and second scribe lines 102, 1
Reference numeral 04 denotes a point formed by irradiating a laser beam in a point-like manner and forming fine holes to a proper depth on the ceramic base plate 101 at a predetermined pitch along a predetermined dividing line.

In addition, the first and second scribe lines 10
As shown in FIGS. 10 and 11, the portions 2 and 104 have the same pitch and the same depth at both the portion defining the end lug 103 and the portion defining the ceramic substrate 106.

In this manner, the end lug 103 defined on the end of the ceramic base plate 101 and the side lug 105 defined on both sides are divided into the second and second scribe lines 102,
When the ceramic mother plate 101 is folded by hand along 104,
Since the substrate is divided along the first and second scribe lines 102 and 104, a plurality of ceramic substrates 106 can be obtained.

Actually, printed wirings and the like are formed on each ceramic substrate 106 before division, so that each ceramic substrate 106 is individually divided at the final stage.

[0013]

SUMMARY OF THE INVENTION A ceramic base plate 10
When the wiring material is printed on 1 and dried in a drying furnace, and then subjected to a heat treatment such as firing in a firing furnace,
It was found that a crack 107 or a crack starting from the second scribe line 104 from the end face of the ceramic base plate 101 was easily generated.

An object of the present invention is to provide a multi-point ceramic substrate which is unlikely to cause inconveniences such as cracks and cracks starting from a scribe line from the end face even when heat treatment is applied to the ceramic base plate.

[0015]

According to a first aspect of the present invention, there is provided a multi-point ceramic substrate, comprising: a rectangular ceramic base plate; and a width direction defining end ears at both longitudinal ends of the ceramic base plate. A first scribe line that is formed; and a plurality of second scribe lines that are formed along the longitudinal direction of the ceramic base plate and that both ends partially straddle the end lugs. It is characterized by:

In the present invention and each of the following inventions, definitions and technical meanings of terms are as follows unless otherwise specified.

The ceramic base plate is made of a thin plate of ceramics such as alumina, and the size and proportions of the short side and long side can be appropriately set according to the size and the number of ceramic substrates to be obtained. Is free.

The end lugs are cut off at both ends in the longitudinal direction of the ceramic base plate to obtain a ceramic substrate having a predetermined shape and thickness, and when manufacturing a multi-point printed wiring device or the like. It is formed for the purpose of easy handling, such as a support portion for mounting on a manufacturing facility.

The first and second scribe lines are generally formed by a laser scribe method, but the present invention is not limited to this. In short, it means that fine scratches are continuously formed in advance along a predetermined dividing line so that the ceramic mother plate can be easily divided into a predetermined shape when a bending force is applied. Here, the term “continuous” means that it looks macroscopically continuous, and when viewed microscopically, it includes, for example, a state in which perforations by a laser beam are formed with some gap.

When the first and second scribe lines are formed by the laser scribe method, the depth of the perforations is suitably about 30 to 50% of the thickness of the ceramic base plate.

Further, that the second scribe line is formed so as to partially extend over the end ear portion means that the second scribe line is not formed over the entire end ear portion, but is formed over the end ear portion. Means that the remaining portion constitutes a non-scribed portion. It goes without saying that the second scribe line is formed over the entire middle portion along the longitudinal direction of the ceramic base plate except for the end ears at both ends.

Thus, in the present invention, the second scribe line is formed over a part of the end lug, and the scribe non-formation part exists on the end face side. Even if heat treatment is performed in a furnace or the like, cracks and cracks starting from the second scribe line from the end face as in the related art are significantly reduced.

On the other hand, there is no problem in dividing the individual ceramic substrates from the ceramic mother plate.

A ceramic substrate for multi-point picking according to a second aspect of the present invention is a rectangular ceramic substrate and a first scribe formed in a width direction defining end ears at both longitudinal ends of the ceramic base plate. And a line formed along the longitudinal direction of the ceramic base plate, both ends of which extend over substantially the entirety of the end ears, and at least the end face side portions of the end ears are formed relatively shallow. And a plurality of second scribe lines.

In the present invention, the second scribe line is formed over the whole of the end lug as in the prior art, but at least a portion of the end lug on the end face side is relatively shallow.

The depth of the shallow scribe line on the end face side of the end lug can be about 25 to 40% of the thickness of the ceramic base plate, but is 5% of the depth of the relatively deep part.
It is effective to make it shallower by more than%.

When a scribe line is formed by the laser scribe method, a relatively shallow scribe line can be formed by reducing the energy of the laser beam, shortening the irradiation time, or using both. .

Here, at least the portion on the end face side means a portion in contact with the end face of the ceramic base plate.

Therefore, if the scribe line at the end face side is formed relatively shallow, it may be formed over the entire end lug, or may be formed at the center of the ceramic base plate at the end lug. The closer part may be formed relatively deep similarly to the second scribe line in the part adjacent to the ceramic substrate, and only a part of the end face side may be formed shallow.

Thus, in the present invention, since the second scribe line is formed over the entire edge of the end portion of the ceramic base plate, the ceramic base plate can be easily divided along the longitudinal direction, and the end portion of the ceramic base plate can be easily divided. Since the scribe line is shallow at least at the end face side of the ear portion, cracks and cracks starting from the second scribe line from the end face of the ceramic base plate are less likely to occur when heat treatment is performed.

A ceramic substrate for multi-point picking according to a third aspect of the present invention is a first ceramic substrate having a rectangular shape, and a first shape formed at both ends in a longitudinal direction of the ceramic base plate in a width direction defining end ears. A scribe line; formed along the longitudinal direction of the ceramic base plate, with both ends reaching the end face, and at the end ears, at least the end face side is relatively shallow and formed at a relatively small pitch And a plurality of second scribe lines.

According to the present invention, the pitch of at least the end face of the end lug of the second scribe line is reduced.
Despite being shallow, it is easier to split.

At least the portion on the end face side has the same meaning as in claim 3.

According to a fourth aspect of the present invention, there is provided the ceramic substrate for multi-point production according to any one of the first to third aspects, wherein the second scribing line is used to form side ears on both side surfaces of the ceramic base plate. It is characterized in that a part is formed.

In the present invention, the side lugs are formed on both sides along the longitudinal direction of the ceramic base plate, so that the thickness of each ceramic substrate in the longitudinal direction can be easily made constant, and the ceramic base plate can be made uniform. Is easier to handle.

[0036]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a front view showing a first embodiment of a ceramic substrate for multi-point production according to the present invention.

FIG. 2 is an enlarged front view of the area B in FIG.

In the figure, 1 is a ceramic base plate, 2 is a first scribe line, 3 is an end ear, 4 is a second scribe line, 5 is a non-scribed portion, 6 is a side ear, 7 Is a ceramic substrate.

The thickness of the ceramic base plate 1 is 0.635 m.
m of alumina ceramic thin plate.

The first scribe line 2 is formed by a laser scribe method in parallel with both end faces of the ceramic base plate 1 and has a depth of 250 μm and a pitch of 160 μm.

The end lugs 3 are defined at both longitudinal ends of the ceramic base plate 1 by the first scribe lines 2.

The plurality of second scribe lines 4 are formed in parallel with the longitudinal direction of the ceramic base plate 1 by the laser scribe method at the same depth and pitch as the first scribe lines 2.

Further, since the second scribe line 2 is formed only up to about half the length of the end lug 3 in the longitudinal direction of the ceramic base plate 1, a scribe non-formation portion is formed on the end face side. 5 are formed.

The side ears 6 are defined on both sides of the ceramic base plate 1 by the outermost second scribe lines 4.

The ceramic substrate 7 is defined by first and second scribe lines 2 and 4. Therefore, the ceramic base plate 1 is divided along the first and second scribe lines 2 and 4 to remove the end lugs 3 and the side lugs 6 and to separate the ceramic substrates 7 from each other. Is divided into eight pieces in FIG.
The ceramic substrate 7 is used for forming a fixing heating element in a thick film.

Since the second scribe line 4 is formed only to the middle of the end lug 3 and the scribe non-formation portion 5 is formed on the end face side of the ceramic base plate 1, Even if heat treatment is applied to the ceramic base plate 1 in a drying furnace or a baking furnace, the second scribe line 4
Cracks and cracks originating from the starting point hardly occur.

FIG. 3 is a front view showing a second embodiment of the ceramic substrate for multi-point production according to the present invention.

FIG. 4 is an enlarged sectional view of a region C in FIG.

In the figure, the same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof will be omitted.

The present embodiment is different from the first embodiment in that the end face side portion 4a of the end portion of the second scribe line 4 is formed relatively shallow as shown in FIG.

That is, while the depth of the second scribe line 4 is 250 μm, the end face side portion 4a is
It is set to 0 μm.

However, the pitch between the end face side portion 4a of the second scribe line 4 and the other portions is the same of 160 μm. In FIG. 4, the drawing is exaggerated for easy understanding.

Since the end face side portion 4a of the second scribe line 4 in the end ears 3 of the ceramic base plate 1 is formed relatively shallow, the end face of the ceramic base plate 1 can be heated even if heat treatment is applied. Therefore, cracks and cracks starting from the second scribe line are less likely to occur.

Further, since the second scribe line 4 is formed up to the end face of the end lug 3, the division of the ceramic base plate 1 is easier than in FIG.

FIG. 5 is an enlarged front view of a portion similar to the region C in FIG. 3 showing the third embodiment of the ceramic substrate for multi-point picking of the present invention.

FIG. 6 is an enlarged sectional view of the same.

In the figure, the same parts as those in FIGS. 3 and 4 are described with the same reference numerals.

This embodiment is different in that the end face side portion 4a 'of the second scribe line 4 is made relatively shallow and the pitch is made relatively small.

That is, the pitch of the second scribe line 4 is 160 μm, while the pitch of the end face side portion 4a ′ is 140 μm. Note that the second scribe line 4
The scribe depth of the end face side portion 4a 'is the same as that of the second embodiment shown in FIGS.

Thus, in this embodiment, the end face side portion 4a 'of the second scribe line 4 is relatively shallow,
In addition, since the pitch is relatively small, division of the end face side portion is further facilitated, but cracks and cracks starting from the second scribe line 4 from the end face hardly occur when heat treatment is performed.

FIG. 7 is a front view showing a fixing heating element manufactured using the ceramic substrate obtained by the present invention.

FIG. 8 is a rear view of the same.

In the figure, 7 is a ceramic substrate, 8 is a resistance heating element, 9a and 9b are first terminal patterns, 10 is a first conductor pattern, 11 and 11 are first conductive through holes, and 12 is a heat sensor. , 13, 13 are a pair of second conductor patterns, 14, 14 are second terminal patterns, 15, 1
Reference numeral 5 denotes a pair of second conductive through holes, and reference numerals 16 and 16 denote through holes.

The resistance heating element 8 is composed of 55% by weight of palladium.
The resistance heating element is formed by screen-printing a conductive material containing a silver-palladium-based alloy as a main component on the surface of the ceramic substrate 7, drying in a drying furnace, and firing in a firing furnace.

The first terminal patterns 9a and 9b are formed separately on the front and back of the ceramic substrate 7 by printing, drying and baking. On the other hand, the first terminal pattern 9a is provided on the rear surface of the ceramic substrate 7 and has a first conductive through-hole. It is connected to one end of the resistance heating element 8 via the holes 11, 11 and the first conductive pattern 10. The other first terminal pattern 9 b is provided on the surface of the ceramic substrate 7 and is directly connected to the other end of the resistance heating element 8.

The conductive through-hole means a small through-hole formed in the ceramic substrate 7 including the first and second conductive through-holes 11, 11 and 15, 15.
A conductor pattern is formed on the inner surface of the through hole, and is used to electrically connect both surfaces of the ceramic substrate 7.

The first conductor pattern 10 is formed on the surface of the ceramic substrate 7 by printing, drying and baking, and one end thereof is connected to the other end of the resistance heating element 8.

The thermal sensor 12 is composed of a thermistor, and is disposed on the back surface of the ceramic substrate 7 at a position facing the resistance heating element 8 by thick film printing or by conductive bonding of a chip-shaped thermistor.

The second conductor patterns 13 and 13 are similarly formed by printing, drying and baking, one end of which is connected to the thermal sensor 12 and the other end of which is the second conductive through hole 15.
15 are connected to the second terminal patterns 14, 14.

The through holes 16 and 16 are formed in the resistance heating element 8.
This is a safety protection means that, when a thermal runaway occurs, the ceramic substrate 7 is damaged by thermal strain to cut off the current.

Although not shown, the resistance heating element 8 and the surrounding ceramic substrate 7 are protected by coating a vitreous protective film thereon, so that the voltage resistance and the friction resistance are improved.

[0073]

According to the first aspect of the present invention, the second scribe line formed along the longitudinal direction of the ceramic base plate is not formed at least on the end face side of the end lug.
It is possible to provide a multi-point ceramic substrate in which cracks and cracks starting from the second scribe line from the end face when heat treatment is applied to the ceramic base plate are less likely to occur.

According to the second and third aspects of the present invention, the second
Since the end face side of the end portion of the scribe line is relatively shallow, cracks and cracks starting from the second scribe line from the end face are less likely to occur from the end face when heat treatment is applied to the ceramic base plate. In addition, it is possible to provide a multi-point ceramic substrate having relatively good division performance.

According to the third aspect of the present invention, in addition to the above, the pitch of the second scribe lines at the end ears is further reduced relatively, thereby providing a ceramic substrate for multi-point picking with even better division. be able to.

According to the fourth aspect of the present invention, the side edge portions are defined by the second scribe lines on both sides along the longitudinal direction of the ceramic base plate, so that the size of the ceramic substrate can be set to a predetermined value. It is possible to provide a multi-point ceramic substrate in which a ceramic base plate can be easily handled.

[Brief description of the drawings]

FIG. 1 is a front view showing a first embodiment of a ceramic substrate for multi-point production according to the present invention.

FIG. 2 is an enlarged front view of an area B in FIG. 1;

FIG. 3 is a front view showing a second embodiment of the ceramic substrate for multi-point production according to the present invention;

FIG. 4 is an enlarged cross-sectional view of a region C in FIG. 3;

FIG. 5 is an enlarged front view of a portion similar to the region C in FIG. 3 showing a third embodiment of the ceramic substrate for multi-point production according to the present invention;

FIG. 6 is an enlarged sectional view of the same.

FIG. 7 is a front view showing a heating element for fixing manufactured using the ceramic substrate obtained by the present invention.

FIG. 8 is also a rear view.

FIG. 9 is a front view showing a conventional ceramic substrate for multi-point production.

FIG. 10 is an enlarged front view of a region A in FIG. 9;

FIG. 11 is an enlarged sectional view of the same.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Ceramic base plate 2 ... 1st scribe line 3 ... End ear part 4 ... 2nd scribe line 5 ... Non-scribe part 6 ... Side ear part 7 ... Ceramic substrate

Claims (4)

[Claims] 1. A rectangular ceramic base plate; first scribe lines formed in a width direction defining end ears at both ends in a longitudinal direction of the ceramic base plate; And a plurality of second scribe lines, both ends of which extend partially over the end lugs. 2. A rectangular ceramic substrate; first scribe lines formed in a width direction defining end ears at both ends in a longitudinal direction of the ceramic base plate; and along a longitudinal direction of the ceramic base plate. A plurality of second scribe lines, both ends of which extend over substantially the entirety of the end ears, and at least a part of the end ears on the end face side is formed relatively shallow. A ceramic substrate for multi-point production, comprising: 3. A rectangular ceramic base plate; a first scribe line formed in a width direction defining end ears at both ends in a longitudinal direction of the ceramic base plate; and a longitudinal scribe line in a longitudinal direction of the ceramic base plate. A plurality of second scribe lines formed along the ridge line, both ends of which extend to the end face, and at least the end face side portion at the end face is relatively shallow and formed at a relatively small pitch. And a ceramic substrate for multi-point production. 4. The ceramic substrate according to claim 1, wherein side lugs are formed on both side surfaces of the ceramic base plate by the second scribe lines.