JP2017152576A - Manufacturing method of chip resistor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of chip resistor capable of dealing with compaction with good production efficiency.SOLUTION: After forming a front electrode 2 and a resistor 3 on the surface, a large-sized board 10 is irradiated with laser light in the primary division direction and secondary division direction, while sticking the back of the large-sized board 10 to a fixed base material 12, thus forming a through slit 13 having a lattice shape in plan view, penetrating the large-sized board 10 and reaching the way of the fixed base material 12. Thereafter, a protective film 4 is formed to cover the resistor 3 while keeping the state of the large-sized board 10, before taking individualized multiple single chips 10A by exfoliating the large-sized board 10 from the fixed base material 12.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a method of manufacturing a chip resistor in which a plurality of sets of electrodes, resistors, and the like are formed on a large substrate, and then the large substrate is divided into a lattice and separated into pieces.

  The chip resistor is a rectangular parallelepiped insulating substrate made of ceramics, a pair of front electrodes disposed opposite to each other on the surface of the insulating substrate with a predetermined interval, and disposed opposite to the back surface of the insulating substrate with a predetermined interval. A pair of back electrodes, an end face electrode that bridges the front electrode and the back electrode, a resistor that bridges the pair of front electrodes, and an insulating protective film that covers the resistor. Yes.

  In general, when manufacturing such a chip resistor, a large number of electrodes, resistors, protective films, and the like are collectively formed on a large substrate, and then the large substrate is extended in a lattice shape. By dividing (breaking) along the dividing groove and the secondary dividing groove, a large number of individual chips are taken. These primary division grooves and secondary division grooves are formed in advance on a large-sized substrate, and as a method for forming them, a mold having a V-shaped cross section is embossed on a large-sized substrate (green sheet) before baking. And a method (laser scribing method) in which a large-sized substrate after firing is irradiated with laser light are known.

  Further, instead of such a break method using the division grooves, as described in Patent Document 1, a large number of electrodes, resistors, and protective films are provided for a large substrate having no division grooves. Etc. are formed in a lump, and then the large substrate is fixed to a support base, and a large substrate is cut into a lattice using a dicing blade, thereby obtaining a large number of individual chips. Dicing methods are also known.

JP 2007-173281 A

  However, in the dividing method in which the dividing groove provided in advance on the large substrate is broken, a bending stress that opens the dividing groove having a V-shaped cross section is applied to the large substrate to cause a break. Ceramics existing between the two are not broken at right angles to the substrate surface, and the part is broken (deformed cracking) in a random oblique direction with respect to the substrate surface, and the external dimensions of the chip resistor vary accordingly. May occur. Such a variation is within a dimensional error range for a chip resistor having a large outer dimension, but cannot be ignored in the case of an ultra-small chip resistor such as 0402 mm size or 0201 mm size.

  On the other hand, in the dividing method by dicing disclosed in Patent Document 1 and the like, a large substrate is cut using a diamond blade or the like that rotates at high speed, so that the shape can be processed with high dimensional accuracy. However, one cutting line is formed by scanning a blade that rotates at high speed from one side of the large substrate to the opposite side, and it is necessary to perform such a cutting process a plurality of times for each of the primary division and the secondary division. Therefore, there is a problem that it takes a lot of tact time to finish all the cutting steps. In addition, the cutting allowance corresponding to the thickness of the blade is cut from the large substrate by dicing, and it is necessary to secure such a cutting allowance on the large substrate in accordance with the number of dicing of the primary division and the secondary division. There is also a problem that production efficiency is very poor.

  The present invention has been made in view of the actual situation of the prior art, and an object of the present invention is to provide a method of manufacturing a chip resistor that has high production efficiency and can cope with downsizing.

  As a first means for achieving the above object, a method for manufacturing a chip resistor according to the present invention is characterized in that the first divided predicted line and the second divided predicted line extending in a lattice shape are formed on the surface of a large-sized substrate. Forming a plurality of pairs of electrodes overlapping the expected division line and forming a plurality of resistors straddling the pair of electrodes; and a back surface of the large substrate on which the electrodes and the resistors are formed A step of attaching to the surface of the large substrate, forming a through-slit reaching the middle of the base by irradiating a laser beam along the first predicted division line and the second predicted division line, A step of forming a protective film made of an insulating resin so as to cover the resistor after the formation of the through slit; and, after the formation of the protective film, the large substrate is peeled off from the base to form a single chip. Characterized in that it comprises a a step of reduction.

  After forming electrodes and resistors on the surface of the large substrate in this way, with the back surface of the large substrate attached to the base, the surface of the large substrate is irradiated with laser light to reach the middle of the base If a slit is formed, a protective film can be formed in a batch after the through slit is formed, and the protective film can be prevented from being damaged by the heat of the laser beam. After removing the large substrate, a large number of chips can be obtained simply by removing the large substrate from the base. In addition, since the division in the primary division direction and the secondary division direction are both performed by laser scribing, it is possible to perform substrate division of the portion cut by the laser light with high dimensional accuracy and accompanying the division of the portion. Since almost no cutting allowance is generated, a chip resistor with high production efficiency and suitable for downsizing can be provided.

  In addition, as a second means for achieving the above object, the chip resistor manufacturing method according to the present invention is characterized in that the surface of the large substrate on which the first divided predicted line and the second divided predicted line extending in a lattice shape are set. Forming a plurality of pairs of electrodes overlying the first expected division line and forming a plurality of resistors straddling the pair of electrodes; and a back surface of the large substrate on which the electrodes and the resistors are formed A step of affixing to a base, a step of forming a through slit reaching the middle of the base by irradiating the surface of the large substrate with the laser beam along the second expected division line, and after the formation of the through slit Forming a protective film made of an insulating resin so as to cover the electrode and the resistor, and dicing the large substrate along the first expected division line from above the protective film; Forming the dividing groove reaching the middle of the base by dividing the electrode into two, and separating the large substrate on which the through slit and the dividing groove are formed from the base into a plurality of single chips. And singulation.

  In the manufacturing method of the chip resistor by the second means, when cutting the large-sized substrate attached to the base along the dividing lines extending in a lattice shape, dividing in one direction is performed by laser scribing, and in the other direction. Since the division is performed by dicing, the tact time is somewhat longer than the first means described above by the amount of division in one direction by dicing, but it is possible to ensure a smooth cut surface by dicing. It is possible to achieve substantially the same effect as the first means.

  In the above manufacturing method, if the through slit is formed by laser scribing before trimming the resistance value of the resistor, even if the resistance value of the resistor is changed by the heat of the laser when the through slit is formed, Since the trimming adjustment of the resistance value is performed in the subsequent process, there is no problem.

  Further, in the above manufacturing method, when the protective film has the same color as the large-sized substrate, even if the protective film formed after the through slit is formed flows into the through slit, the protective film is exposed on the divided surface of the chip resistor. Since the film is less noticeable, a chip resistor suitable for bulk mounting can be realized.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the chip resistor which can respond to size reduction with good production efficiency can be provided.

It is a top view of the chip resistor concerning the example of a 1st embodiment of the present invention. It is sectional drawing which follows the II-II line of FIG. It is sectional drawing which follows the III-III line of FIG. It is a top view which shows the manufacturing process of this chip resistor. It is sectional drawing which shows the manufacturing process of this chip resistor. It is sectional drawing which shows the manufacturing process of this chip resistor. It is sectional drawing of the chip resistor which concerns on the example of 2nd Embodiment of this invention. It is a top view which shows the manufacturing process of this chip resistor. It is sectional drawing which shows the manufacturing process of this chip resistor. It is sectional drawing which shows the manufacturing process of this chip resistor.

  Embodiments of the invention will be described with reference to the drawings. As shown in FIGS. 1 to 3, the chip resistor according to the first embodiment of the present invention includes a rectangular parallelepiped insulating substrate 1 and a pair of tables provided at both ends in the longitudinal direction on the surface of the insulating substrate 1. An electrode 2, a rectangular resistor 3 provided so as to be connected to these surface electrodes 2, an insulating protective film 4 covering a part of both surface electrodes 2 and the entire surface of the resistor 3, and an insulating substrate 1 A pair of back electrodes 5 provided at both ends in the longitudinal direction on the back surface, a pair of end face electrodes 6 provided at both ends in the longitudinal direction of the insulating substrate 1, and the end face electrodes 6, the front electrode 2 and the back electrode 5 It is mainly composed of a pair of external electrodes 7 deposited on the surface.

  The insulating substrate 1 is an alumina substrate made of ceramics, and this insulating substrate 1 was cut by a laser scribing along a primary division prediction line and a secondary division prediction line extending in the horizontal and vertical directions, and a large number of substrates were taken. Is.

  The pair of front electrodes 2 and the pair of back electrodes 5 are obtained by screen-printing Ag-based paste and drying and firing. The resistor 3 is obtained by screen-printing resistance paste such as ruthenium oxide and drying and firing. It is. Both ends in the longitudinal direction of the resistor 3 overlap the surface electrode 2 and are not shown, but the resistor 3 is formed with trimming grooves for adjusting the resistance value.

  The protective film 4 has a two-layer structure of an undercoat layer and an overcoat layer, of which the undercoat layer is a screen paste of glass paste dried and fired, and the overcoat layer is a screen print of an epoxy resin paste. And heat-cured.

  The pair of end face electrodes 6 are obtained by applying an Ag paste, drying and firing, and these end face electrodes 6 are formed on the end face of the insulating substrate 1 to electrically connect the front electrode 2 and the back electrode 5.

  The pair of external electrodes 7 has a two-layer structure of a barrier layer and an external connection layer, of which the barrier layer is a Ni plating layer formed by electrolytic plating, and the external connection layer is a Sn plating layer formed by electrolytic plating. .

  Next, a manufacturing method of the chip resistor configured as described above will be described with reference to FIGS. 5 shows a cross-sectional view along the line XX in FIG. 4, and FIG. 6 shows a cross-sectional view along the line YY in FIG.

  First, a large-sized substrate 10 made of ceramic from which a large number of insulating substrates 1 are taken is prepared. Although the large divided substrate 10 is not formed with a primary divided groove or a secondary divided groove, the large divided substrate 10 has a first divided predicted line and a second divided predicted line that extend in the vertical and horizontal directions in the post-process shown in FIG. Each of the squares which are laser-scribed along the two divided prediction lines is a chip formation region for one piece.

  Then, by printing an Ag-based paste on the surface of the large-sized substrate 10 and drying and baking it, a predetermined interval exists on the surface of the large-sized substrate 10 as shown in FIGS. Thus, a plurality of front electrodes 2 are formed. Also, before and after this, an Ag-based paste is printed on the back surface of the large substrate 10 and dried and fired to form a plurality of back electrodes 5 on the back surface of the large substrate 10 with a predetermined interval.

  Next, a resistor paste such as ruthenium oxide is screen-printed on the surface of the large-sized substrate 10 and then dried and fired, so that a pair of front electrodes 2 are formed as shown in FIGS. A plurality of resistor bodies 3 are formed to straddle. In addition, the formation order of the surface electrode 2 and the resistor 3 may be reverse to the above.

  Next, after reducing the damage to the resistor 3 at the time of trimming groove formation, after forming an undercoat layer (not shown) covering the resistor 3 by screen-printing glass paste, drying and firing, A trimming groove is formed in the resistor 3 from above the undercoat layer to adjust the resistance value.

  Next, as shown in FIGS. 4, 5, and 6 (c), an adhesive 11 is applied to the entire back surface of the large substrate 10, and the fixing base 12 is attached to the large substrate 10 through the adhesive 11. Thereafter, the adhesive 11 is thermally cured. The adhesive 11 is preferably one that can be washed with a specific solvent. In the case of this embodiment, a shellac resin that is soluble in an alcohol solvent is used. The fixed base 12 is preferably a hard material such as glass having a thickness of 0.1 mm or more. In the present embodiment, the same ceramic substrate (thickness is 0.3 mm) as the material of the large substrate 10 is used. ing.

  Next, laser light is irradiated from the surface side of the large-sized substrate 10, and this laser light is respectively projected along a primary division prediction line passing through the central portion of the surface electrode 2 and a secondary division prediction line extending across the resistor 3. By scanning, as shown in FIGS. 4, 5, and 6 (d), through-hole slits 13 in a planar view that penetrate the large substrate 10 and reach the middle of the fixed base 12 are formed. Since these through slits 13 are formed by a laser scribing method that cuts with laser light, a large number of through slits are formed in a short time at predetermined positions (primary division prediction lines and secondary division prediction lines) of the large-sized substrate 10. 13 can be formed with high accuracy.

  5 and 6 (d) show the V-shaped through slit 13 having a relatively large inclination angle, the straight through slit 13 having a very small inclination angle is actually formed.

  Next, an epoxy resin paste is screen printed from above the undercoat layer and cured by heating, thereby extending in the horizontal direction (XX direction) as shown in FIGS. A plurality of protective films 4 are formed to cover the resistors 3 arranged in the longitudinal direction (YY direction) across the through slit 13 in a strip shape. Since the formation of the protective film 4 is performed on the large-sized substrate 10 attached to the fixed base 12, it is possible to suppress the warping of the large-sized substrate 10 due to thermal contraction when the resin paste is heat-cured. it can. In particular, if the thickness of the thinnest part (the part extending from the tip of the through slit 13 to the lower surface of the fixed base 12) after the through slit 13 is formed is 0.08 mm or more, the large substrate 10 Warpage can be reliably prevented, which is preferable. Further, since the formation of the protective film 4 is performed on the large-sized substrate 10 in a state of being attached to the fixed base material 12, even if the large-sized substrate 10 is divided for each chip formation region by the laser scribing method, The protective film 4 can be formed collectively.

  After forming the lattice-like through slits 13 on the large substrate 10 by laser scribing in this way, the adhesive (shellac resin) 11 is washed with an alcohol solvent and the fixing base 12 is peeled off from the large substrate 10. As shown in FIGS. 4, 5, 6 (f), a large number of single chips 10 </ b> A having the same size as the chip resistors are obtained from the large-sized substrate 10.

  Although not shown in the drawing, after that, an end surface electrode that conducts the front electrode 2 and the back electrode 5 on both end surfaces of the chip unit 10A is obtained by applying an Ag paste to the end surface of each chip unit 10A, drying and firing. Form. Finally, by applying electrolytic plating of Ni, Sn, etc. to each chip single body 10A, external electrodes that cover the end face electrode and the front electrode 2 and the back electrode 5 are formed, as shown in FIGS. Complete chip resistor.

  As described above, in the chip resistor manufacturing method according to this embodiment, after the surface electrode 2 and the resistor 3 are formed on the surface of the large substrate 10, the back surface of the large substrate 10 is fixed to the fixed base (base material). In a state of being attached to the base 12, the laser beam is irradiated along the primary division direction and the secondary division direction to form a through slit 13 that penetrates the large substrate 10 and reaches the middle of the fixed base 12. As a result, the protective film 4 can be formed in a lump in the state of the large substrate 10 after the through slit 13 is formed, and the resin that is the material of the protective film 4 is damaged by the heat of the laser light. It is possible to prevent this, and it is possible to obtain a large number of chip single-pieces 10 </ b> A that are separated by simply peeling the large substrate 10 from the fixed base 12 after the protective film 4 is formed. In addition, since the division in the primary division direction and the secondary division direction are both performed by laser scribing, it is possible to perform substrate division of the portion cut by the laser light with high dimensional accuracy and accompanying the division of the portion. A cutting resistor is hardly generated, and a chip resistor with high production efficiency and suitable for downsizing can be provided.

  FIG. 7 is a cross-sectional view of a chip resistor according to a second embodiment of the present invention. The chip resistor is provided at a rectangular parallelepiped insulating substrate 1 and both longitudinal ends of the surface of the insulating substrate 1. A pair of front electrodes 2, a rectangular resistor 3 provided so as to be connected to the front electrodes 2, an insulating protective film 4 that covers the entire surfaces of the front electrodes 2 and the resistor 3, and an insulating substrate A pair of back electrodes 5 provided at both ends in the longitudinal direction on the back surface of the substrate 1, a pair of end surface electrodes 6 provided so as to go from the end surface of the insulating substrate 1 to the upper surface of the protective film 4, and the end surface electrodes 6 and the back It is mainly composed of a pair of external electrodes 7 attached to the surface of the electrode 5.

  The second embodiment shown in FIG. 7 differs from the first embodiment described above in that the protective film 4 covers the entire surface of the surface electrode 2 and the resistor 3 and the upper surface of the protective film 4. The end face electrode is formed in an L-shaped cross section so as to wrap around, and the other configuration is basically the same, so that the same reference numerals are given to the portions corresponding to FIGS. The description to be omitted will be omitted.

  Next, a manufacturing method of the chip resistor according to the second embodiment will be described with reference to FIGS. 9 shows a cross-sectional view along the line XX in FIG. 8, and FIG. 10 shows a cross-sectional view along the line YY in FIG.

  First, a large-sized substrate 10 made of ceramic from which a large number of insulating substrates 1 are taken is prepared. Although the large divided substrate 10 is not formed with a primary divided groove or a secondary divided groove, the large divided substrate 10 has a first divided expected line and a first divided line extending in the vertical and horizontal directions in the subsequent processes shown in FIGS. Each of the squares divided by the two-divided prediction lines and divided by the two-divided prediction lines is a chip formation region.

  Then, an Ag-based paste is printed on the surface of the large-sized substrate 10 so as to overlap with the first expected division line, and is then dried and fired. As shown in FIGS. A plurality of pairs of front electrodes 2 extending in a band shape are formed on the surface of 10 at a predetermined interval. Also, before and after this, a plurality of pairs of back electrodes extending in a strip shape on the back surface of the large-sized substrate 10 by printing an Ag-based paste on the back surface of the large-sized substrate 10 so as to overlap the first expected division line, and drying and firing. 5 are formed at predetermined intervals.

  Next, a resistor paste such as ruthenium oxide is screen-printed on the surface of the large-sized substrate 10 and then dried and fired, so that a pair of front electrodes 2 are formed as shown in FIGS. A plurality of resistor bodies 3 are formed to straddle.

  Next, a glass paste is screen-printed, dried and fired to form an undercoat layer (not shown) that covers the resistor 3. However, at this time, only the undercoat layer is formed, and trimming adjustment of the resistor 3 is not performed.

  Next, as shown in FIGS. 8, 9, and 10 (c), the adhesive 11 is applied to the entire back surface of the large-sized substrate 10, and the fixing base material 12 is attached to the large-sized substrate 10 through the adhesive 11. Thereafter, the adhesive 11 is thermally cured. The adhesive 11 and the fixing base 12 are the same as those used in the first embodiment.

  Next, a laser beam is irradiated from the surface side of the large-sized substrate 10, and this laser beam is scanned along a secondary division prediction line extending in a direction orthogonal to the primary division prediction line with the resistor 3 interposed therebetween. As shown in 8, 9, 10 (d), a through slit 14 that penetrates the large substrate 10 and reaches the middle of the fixed base 12 is formed.

  Thereafter, a trimming groove is formed in the resistor 3 from above the undercoat layer described above to adjust the resistance value. If the resistance value is adjusted after forming the through slit 14 passing through the vicinity of the resistor 3 in this way, even if the resistance value of the resistor 3 is changed by the heat of the laser when the through slit 14 is formed, Since the trimming adjustment of the resistance value is performed in this step, there is no problem.

  Next, as shown in FIGS. 8, 9, and 10 (e), an epoxy resin paste is screen-printed on the chip-forming region of the large-sized substrate 10 and cured by heating, whereby FIGS. As shown in FIG. 2, a protective film 4 covering all the surface electrodes 2 and the resistors 3 is formed. As in the first embodiment, the formation of the protective film 4 is performed on the large-sized substrate 10 that is attached to the fixed base 12, and therefore the heat when the resin paste of the protective film 4 is heat-cured. The warping of the large substrate 10 due to the shrinkage can be suppressed, and the protective film 4 can be formed in a lump even if the large substrate 10 is divided into individual chip formation regions by the laser scribing method.

  Next, as shown in FIGS. 8, 9, and 10 (f), a mask material is printed or sputtered from above the protective film 4 so as to overlap with the first expected division line, whereby an internal resistance is formed on the protective film 4. A strip-shaped masking material 15 having the same width as that of the body 3 is formed.

  Next, by cutting with a dicing blade along the primary division predicted line from the surface side of the large substrate 10, the strip-shaped surface electrode 2 is moved along the longitudinal direction as shown in FIGS. The dividing groove 16 reaching the fixed base 12 is formed by cutting into two.

  Next, by sputtering nickel chrome (Ni / Cr) from the front surface side of the large substrate 10, the front electrode 2 and the back electrode exposed in the dividing groove 16 as shown in FIGS. 5, end face sputtering 17 is formed which bridges the end faces 5 and wraps around the protective film 4 and the masking material 15.

  Thereafter, the adhesive 11 is washed with an alcohol solvent, the fixing base 12 is peeled off from the large substrate 10, and at the same time, the masking material 15 is removed, so that a large number of single chips having the same size as the chip resistors are removed. Get. As a result, an end face electrode 6 having an L-shaped cross section that extends from both end faces to the upper surface of the protective film 4 is formed on these chips alone. Finally, electrolytic plating of Ni, Sn, etc. is performed on each chip to form the external electrode 7 that covers the end face electrode 6 and the back electrode 5, thereby completing the chip resistor as shown in FIG. .

  As described above, in the chip resistor manufacturing method according to the second embodiment, after the surface electrode 2 and the resistor 3 are formed on the surface of the large substrate 10, the back surface of the large substrate 10 is fixed to the fixed base material 12. Since the penetration slit 14 that penetrates the large substrate 10 and reaches the middle of the fixed base material 12 is formed by irradiating the laser beam along the predicted secondary division line while being attached to The protective film 4 can be formed in the state of the large substrate 10 after the formation of the slits 14, and the single chip 10 </ b> A separated into pieces by simply peeling the large substrate 10 from the fixed base 12 after the formation of the protective film 4 is obtained. A large number can be taken.

  In the second embodiment, a through slit 14 is formed in the large substrate 10 by laser scribing to cut in the secondary division direction, and a division groove 16 is formed in the large substrate 10 with a dicing blade in the primary division direction. Therefore, compared with the first embodiment in which both the primary division direction and the secondary division direction are performed by laser scribing, the tact time is somewhat longer by the amount that the primary division direction is performed by dicing. However, it is possible to provide a chip resistor with good production efficiency and suitable for downsizing. In addition, since the surface electrode 2 before being cut by dicing can be formed in a strip shape, even when the electrode pattern is printed with the miniaturization of the chip resistor, the linearity between the electrodes is increased and the resistance value is increased. Can be stabilized, and a smooth cut surface is ensured by dicing, so that the end face electrode 6 can be formed by sputtering from the upper surface.

  In the second embodiment, since the through slit 14 is formed by laser scribing before trimming adjustment of the resistor 3, the resistance value of the resistor 3 is generated by the heat of the laser when the through slit 14 is formed. Even if has changed, there is no problem because the resistance value of the resistor 3 is adjusted to the target value in the subsequent trimming process.

  In the first and second embodiments, since the protective film 4 is formed after the through slits 13 and 14 are formed, the resin paste that is the material of the protective film 4 is formed inside the through slits 13 and 14. When the large-sized substrate 10 is removed from the fixed base material 12 and separated into single chips 10A, a part of the protective film 4 is exposed on the divided surfaces along the through slits 13 and 14. . In that case, if a white resin similar to the material (ceramics) of the large substrate 10 is used as the protective film 4, the protective film 4 exposed on the dividing surface of the insulating substrate 1 becomes less conspicuous, which is suitable for bulk mounting. A chip resistor can be realized.

DESCRIPTION OF SYMBOLS 1 Insulating substrate 2 Front electrode 3 Resistor 4 Protective film 5 Back electrode 6 End surface electrode 7 External electrode 10 Large format board 10A Chip unit 11 Adhesive 12 Fixed base material (base)
15 Masking material 13, 14 Through slit 16 Dividing groove 17 End face sputtering

Claims (4)

A plurality of pairs of electrodes overlapping the first divided predicted line are formed on the surface of the large substrate on which the first divided predicted line and the second divided predicted line extending in a lattice shape are set, and straddling between the paired electrodes. Forming a plurality of resistors;
Attaching the back surface of the large substrate on which the electrode and the resistor are formed to a base;
Forming a through slit reaching the middle of the base by irradiating a laser beam along the first expected division line and the second expected division line on the surface of the large substrate;
Forming a protective film made of an insulating resin so as to cover the resistor after the formation of the through slit;
Separating the large substrate from the base after the formation of the protective film and dividing it into a large number of single chips;
A method for manufacturing a chip resistor, comprising: A plurality of pairs of electrodes overlapping the first divided predicted line are formed on the surface of the large substrate on which the first divided predicted line and the second divided predicted line extending in a lattice shape are set, and straddling between the paired electrodes. Forming a plurality of resistors;
Attaching the back surface of the large substrate on which the electrode and the resistor are formed to a base;
Forming a through slit reaching the middle of the base by irradiating the surface of the large substrate with laser light along the second division prediction line;
Forming a protective film made of an insulating resin so as to cover the electrode and the resistor after the formation of the through slit;
Dicing the large substrate from above the protective film along the first expected division line to form a dividing groove reaching the middle of the base by dividing the electrode into two parts;
Separating the large substrate having the through slits and the dividing grooves from the base and separating them into a large number of single chips;
A method for manufacturing a chip resistor, comprising:   3. The method of manufacturing a chip resistor according to claim 1, wherein the through slit is formed before trimming a resistance value of the resistor.   3. The method of manufacturing a chip resistor according to claim 1, wherein the protective film has a color similar to that of the large substrate.