CN112935570A - Method for manufacturing alloy resistor based on laser - Google Patents
Method for manufacturing alloy resistor based on laser Download PDFInfo
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- CN112935570A CN112935570A CN202110301786.0A CN202110301786A CN112935570A CN 112935570 A CN112935570 A CN 112935570A CN 202110301786 A CN202110301786 A CN 202110301786A CN 112935570 A CN112935570 A CN 112935570A
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- laser
- alloy
- resistor
- alloy plate
- alloy resistor
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/123—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in an atmosphere of particular gases
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a method for manufacturing an alloy resistor based on laser, which comprises the following steps: selecting an alloy plate with the thickness corresponding to the resistance value of the manufactured resistor, cutting the alloy plate into a set size, and placing the cut alloy plate in a laser device; arranging an alloy resistor array pattern distributed on the alloy plate according to the size of the alloy plate; the laser device carries out laser engraving on the alloy plate in a laser mode according to the obtained alloy resistor array pattern; and welding metal foils at positions corresponding to the alloy resistor electrodes by adopting a welding process, and cutting the resistors on the metal plates into particles. The invention adopts the three-dimensional resistor precise line with the hollow structure manufactured by laser, can ensure that the manufactured alloy resistor has smaller size, and adopts simpler, more environment-friendly and quicker process.
Description
Technical Field
The invention belongs to the field of electronic component manufacturing, and particularly relates to a method for manufacturing an alloy resistor based on laser.
Background
At present, the development of an alloy resistor usually needs to adjust the thickness of an alloy sheet to improve power under the condition of meeting the small size, but the existing yellow light manufacturing process has the disadvantages of high pollution and environmental friendliness, and has high requirements on product quality and assembly process, so that the overall production cost is high. The other environment-friendly alloy resistor forming process is the problem that the alloy edge crater is easily caused by the adoption of a stamping die cutting process along with the increase of the metal thickness, or the cut edge is turned over and the like, and is limited by the fact that the size of an alloy resistor cannot be miniaturized according to the parameters of a die, and the existing stamping process can only manufacture products with models of 1206 and 2512 above the model of 0805, and cannot break through to manufacture products with smaller sizes. Therefore, it is urgently needed to develop a new method for manufacturing high-precision miniature alloy resistor by using new process.
Disclosure of Invention
Aiming at the condition that the small-size resistor cannot be manufactured simultaneously considering the requirements of resistor size miniaturization and environmental protection in the prior art, the invention provides a novel process for manufacturing the small-size resistor, and an alloy resistor is manufactured by adopting laser.
The technical purpose is achieved, the technical effect is achieved, and the invention is realized through the following technical scheme:
a method for manufacturing an alloy resistor based on laser is characterized by comprising the following steps: selecting an alloy plate with the thickness corresponding to the resistance value of the manufactured resistor, cutting the alloy plate into a set size, and placing the cut alloy plate in a laser device; arranging an alloy resistor array pattern distributed on the alloy plate according to the size of the alloy plate; the laser device carries out laser engraving on the alloy plate in a laser mode according to the obtained alloy resistor array pattern; and welding metal foils at positions corresponding to the alloy resistor electrodes by adopting a welding process, and cutting the resistors on the metal plates into particles.
Preferably, the alloy resistor array pattern comprises alloy resistor line areas and non-alloy resistor line areas which are distributed in an array mode, and the laser device is used for laser engraving the non-alloy resistor line areas.
Preferably, the non-alloy resistor line area comprises a first laser engraving area located in the outer area of the alloy resistor profile and a second laser engraving area located inside the alloy resistor profile, and the line width of the second laser engraving area is smaller than 50 um.
Preferably, the number of times that the laser device scans the non-alloy resistor circuit area is the ratio of the thickness of the alloy plate to the thickness of the alloy plate etched by the laser at a single time, and the number of times that the laser device scans the alloy plate is controlled within 20 times.
Preferably, the laser engraving process parameters of the laser device include:
the power of the laser is 60-1500W, the frequency of the laser is 1 KHZ-50 MHZ, the pulse is 100-500 ps, and the spot diameter of the laser is 1-5 mm.
Preferably, the scanning speed of the laser is 50-150 mm/min.
Preferably, the laser includes, but is not limited to, ultraviolet laser, green laser, infrared laser emitted by a solid laser, and ultraviolet laser, green laser, infrared laser emitted by a fiber laser.
Preferably, a square infrared laser square wave is used.
Preferably, a three-dimensional galvanometer is arranged in the laser device and used for adjusting the laser depth of the laser beam scanned in the plane direction.
Preferably, during laser engraving, inert gas flows through the alloy plate in a cavity of the laser device at a flow speed of 0.01-0.05L/s.
The invention has the beneficial effects that:
1. the invention adopts the three-dimensional resistor precise line with the hollow structure manufactured by laser, can ensure that the manufactured alloy resistor has smaller size such as 0402 and 0201 products, has high precision and stable resistance distribution, and breaks through the difficulty in manufacturing the resistor with the size below 0805 by the conventional punch forming process.
2. The alloy prepared by the method for designing the three-dimensional galvanometer to control the depth of the laser deep processing scene has high resistance precision, and simultaneously effectively solves the problem that the existing punch forming process is difficult to manufacture and has low yield because the thickness of metal is increased.
3. The process is a physical processing mode, requires few raw materials, is simple and easy to operate for resistor forming, is energy-saving and environment-friendly, has high production speed and efficiency and low cost, and can replace the traditional high-pollution lithography etching forming process; meanwhile, the requirement on the punching template during punching and cutting of the single-grain resistor is also reduced.
4. The process can be used for manufacturing high-thickness alloy plates larger than 100 mu m and obtaining precise circuits which can be miniaturized to be 30-50 mu m wide by laser, so that alloy resistor products with different specifications can be obtained, and meanwhile, the excellent electrical performance can meet the diversified application requirements of client application ends on high-precision miniature resistors.
Drawings
FIG. 1 is a schematic structural diagram of the embodiment of the present invention after step D is completed;
FIG. 2 corresponds to the enlarged illustration at FIG. 1A;
FIG. 3 is a schematic structural diagram after step E is completed in the embodiment of the present invention;
FIG. 4 is a schematic structural diagram after step F is completed according to the embodiment of the present invention;
FIG. 5 is a schematic structural diagram after step G is completed in the embodiment of the present invention;
FIG. 6 is a schematic structural diagram (single-particle alloy resistor) after step H in the embodiment of the present invention;
FIG. 7 is a schematic structural diagram (single-particle alloy resistor) after step I is completed in the embodiment of the present invention;
FIG. 8 is a schematic structural diagram after step K is completed according to the embodiment of the present invention;
wherein: 01-alloy plate, 02-alloy resistor, 03-upper right electrode, 04-upper left electrode, 05-radium tangent line, 06-protective layer, 07-character code mark, 08-copper layer, 09-nickel layer, 10-tin layer, 11-non-alloy resistor circuit, 1101-first laser engraving area and 1102-second laser engraving area.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following detailed description of the principles of the invention is provided in connection with the accompanying drawings.
A. Setting the size of the alloy plate 01, and setting an alloy resistor array pattern distributed on the alloy plate according to the set size of the alloy plate 01, wherein the designed pattern is guided into the control of a laser device.
The designed pattern comprises alloy resistor line areas and non-alloy resistor line 11 areas which are distributed in an array mode, wherein the non-alloy resistor line 11 areas correspond to areas which are etched by laser engraving through a laser device, and therefore the alloy resistor line areas which are matched with the alloy resistor 02 in shape and are arranged in an array mode are reserved.
B. The sealed working chamber of the laser device is filled with inert gas such as argon, nitrogen or other gases.
C. The alloy material belt is punched into an alloy plate 01 with a set size through a machine, and the alloy plate is positioned on a workbench of the sealed working cavity through a driving machine gripper.
D. Laser engraving alloy resistor array
The equipment device comprises:
in the embodiment of the invention, the fiber laser adopts infrared laser for emission, the infrared laser is coupled into the double-clad fiber in a certain mode, the thin fiber conduit is directly used as a resonant cavity for amplification, and a focused beam can be directly used to obtain a light source with required power. The laser scans and cuts the alloy plate surface along two directions of an X, Y axis, and the depth of field of a light source is adjusted by the added three-dimensional galvanometer in the device, so that the laser cutting depth of single scanning in the Z axis direction is controlled.
Picosecond-level ultrashort pulses are selected, the quantity is large, the energy is small, the lens cannot be damaged, the forming precision is high, the waveform is square vertical cutting, the front surface and the back surface of the alloy plate are of vertically consistent patterns after alloy plate excess materials are cut, the cutting edge is smooth and flat, and a high-thickness alloy plate larger than 100 microns is laser-obtained to be a precise line which can be miniaturized to be 30-50 microns wide.
Specifically, the movement path of the laser beam is controlled through a graphic line of the target precise alloy resistor 02 stored in a computer, so that the laser beam selectively scans the area of the line of the non-alloy resistor, the surface temperature of the alloy material irradiated by the laser reaches 3000 ℃, the metal is instantly gasified, and the gasified metal particles are instantly taken away by the inert gas.
As shown in fig. 1, the non-alloy resistor circuit area includes a first laser engraving area 1101 located in an area outside the profile of a single alloy resistor 02 and a second laser engraving area 1102 located inside the profile of the alloy resistor 02, and a line width of the second laser engraving area 1102 is smaller than 50 um.
In order to effectively gather laser energy on the surface of an alloy plate, instantly gasify metal and ensure the line width precision of the manufactured metal plate, the process parameters adopted by the invention during laser engraving are as follows:
(a) the power of the fiber laser is 60-1500W, and the alloy resistor circuit is manufactured by selecting corresponding power according to the size and thickness of the product.
(b) The short pulse of the laser is 100-500 ps, and corresponding pulse parameters are selected according to the precision and specification of the product.
(c) The frequency of the laser is 1 KHZ-50 MHZ, and the workpiece with high thickness can be processed due to low laser reflectivity.
(d) The scanning speed of the laser is 50-150 mm/min, and the scanning speed is adjusted according to the precision requirement and the production yield, so that the precise alloy resistor with high yield is obtained.
(e) The laser spot diameter is 30-250 um, and a high-precision micro alloy resistor circuit can be prepared by selecting the corresponding spot size according to the 02 size, precision and graphic complexity of the alloy resistor.
In addition, in order to effectively take away gasified metal in time, inert gas is introduced into the device at the flow rate of 0.01-0.05L/s, gasified metal particles can be conveniently recovered through a metal particle recovery device arranged at a gas outlet of the device, the pollution to the environment is reduced, and meanwhile, the recovered metal can be used as the cost for enterprise recovery.
As shown in fig. 1 and 2, taking production of 0201 type 200 milliohm alloy resistor 02 products as an example, an alloy plate with the thickness of 100um and the size of 300 x 250mm is subjected to laser scanning for vaporizing 0.5um on the surface of the alloy plate once, the laser only needs to repeat a movement path for 20 times, and metal in a non-alloy resistor circuit area is completely vaporized to form a precise three-dimensional alloy resistor 02 graphic circuit, namely more than 20 ten thousand alloy resistors with high precision and stable resistance distribution are distributed on the alloy plate in an array manner, so that the production process is simple, efficient and environment-friendly.
The thickness of the alloy plate gasified once by laser scanning can be adjusted by different product specifications.
E. As shown in fig. 3, the laser-formed alloy plate is placed in a positioning area under a metal diffusion welding machine by a machine gripper, a copper foil is sucked by the machine gripper and placed in a welding area on the upper right side of a single alloy resistor 02 in the alloy plate, micro-arcs are generated by pressurization and electrification, and the welding surfaces of the two are fused and welded into a whole to manufacture an upper right electrode 03, namely the welding electrode is a physical welding electrode to replace the traditional high-pollution electroplating process.
F. As shown in fig. 4, the robotic gripper places the single alloy resistor 02 of the upper right welding electrode in the positioning area under the metal diffusion welding machine and places the copper foil in the to-be-welded positioning area on the upper left side of the welding electrode through the robotic gripper, and micro-arcs are generated after pressurization and electrification so that the two contact surfaces are fused and jointed, namely, the upper left electrode 04 is prepared.
G. As shown in fig. 5, the resistance of the alloy resistor 02 after the electrodes are fabricated on the alloy plate is preliminarily measured, and then the resistance and the precision are finely adjusted to a set value by using the laser beam 05, so that the yield of the product is effectively improved.
H. As shown in fig. 6, an insulating protective layer 06 is coated on the middle outer surface of the alloy resistor.
I. As shown in fig. 7, a character code 07 is formed on the middle of the upper outer surface of the middle insulating protective layer by pad printing.
J. The alloy resistor 02 distributed on the alloy plate with the manufactured character codes is divided into separate particles at the connection part in a mechanical stamping mode.
K. As shown in fig. 8, a layer of metal copper 08, metal nickel 09 and metal tin 10 is uniformly coated on the outer surface of each of the two ends of the alloy resistor in sequence by electroplating.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. A method for manufacturing an alloy resistor based on laser is characterized by comprising the following steps:
selecting an alloy plate with the thickness corresponding to the resistance value of the manufactured resistor, cutting the alloy plate into a set size, and placing the cut alloy plate in a laser device;
arranging an alloy resistor array pattern distributed on the alloy plate according to the size of the alloy plate;
the laser device carries out laser engraving on the alloy plate in a laser mode according to the obtained alloy resistor array pattern;
and welding metal foils at positions corresponding to the alloy resistor electrodes by adopting a welding process, and cutting the resistors on the metal plates into particles.
2. The method for manufacturing the alloy resistor based on the laser according to claim 1, wherein the method comprises the following steps: the alloy resistor array graph comprises alloy resistor line areas and non-alloy resistor line areas which are distributed in an array mode, and the laser device is used for laser engraving the non-alloy resistor line areas.
3. The method for manufacturing the alloy resistor based on the laser according to claim 2, wherein the method comprises the following steps: the non-alloy resistor line area comprises a first laser engraving area and a second laser engraving area, wherein the first laser engraving area is located in the outer area of the alloy resistor outline, the second laser engraving area is located inside the alloy resistor outline, and the line width of the second laser engraving area is smaller than 50 um.
4. The method for manufacturing the alloy resistor based on the laser according to the claim 2 or 3, wherein the method comprises the following steps: and the scanning times of the laser device to the non-alloy resistor circuit area is the ratio of the thickness of the alloy plate to the thickness of the alloy plate etched by the laser at a single time, and the scanning times of the laser device to the alloy plate is controlled within 20 times.
5. The method of claim 4, wherein the method comprises the steps of: the technological parameters of the laser engraving device during laser engraving comprise:
the power of the laser is 60-1500W, the frequency of the laser is 1 KHZ-50 MHZ, the pulse is 100-500 ps, and the spot diameter of the laser is 1-5 mm.
6. The method of claim 5, wherein the method comprises the steps of: the scanning speed of the laser is 50-150 mm/min.
7. The method for manufacturing the alloy resistor based on the laser according to any one of claims 1 to 3, wherein the method comprises the following steps: the laser includes, but is not limited to, ultraviolet laser, green laser and infrared laser emitted by a solid laser, and ultraviolet laser, green laser and infrared laser emitted by a fiber laser.
8. The method of claim 7, wherein the method comprises the steps of: a square infrared laser square wave is used.
9. The method for manufacturing the alloy resistor based on the laser according to claim 1, wherein the method comprises the following steps: the laser device is provided with a three-dimensional galvanometer for adjusting the laser depth of the laser beam scanned in the plane direction.
10. The method for manufacturing the alloy resistor based on the laser according to claim 1, wherein the method comprises the following steps: and during laser engraving, inert gas flows through the alloy plate in the cavity of the laser device at the flow rate of 0.01-0.05L/s.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110301786.0A CN112935570A (en) | 2021-03-22 | 2021-03-22 | Method for manufacturing alloy resistor based on laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110301786.0A CN112935570A (en) | 2021-03-22 | 2021-03-22 | Method for manufacturing alloy resistor based on laser |
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| CN112935570A true CN112935570A (en) | 2021-06-11 |
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| CN202110301786.0A Pending CN112935570A (en) | 2021-03-22 | 2021-03-22 | Method for manufacturing alloy resistor based on laser |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1542872A (en) * | 2003-04-28 | 2004-11-03 | 罗姆股份有限公司 | Chip resistor and method of manufacturing the same |
| US20060216955A1 (en) * | 2003-11-04 | 2006-09-28 | Swenson Edward J | Laser-based termination of miniature passive electronic components |
| CN103137280A (en) * | 2011-11-24 | 2013-06-05 | 乾坤科技股份有限公司 | Method of manufacturing resistor |
| TW201508780A (en) * | 2013-08-26 | 2015-03-01 | Hung-Ju Cheng | Method for manufacturing alloy chip resistor |
| JP2017152576A (en) * | 2016-02-25 | 2017-08-31 | Koa株式会社 | Manufacturing method of chip resistor |
| US20190198204A1 (en) * | 2017-12-26 | 2019-06-27 | Ralec Electronic Corporation | Method for making resistors |
-
2021
- 2021-03-22 CN CN202110301786.0A patent/CN112935570A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1542872A (en) * | 2003-04-28 | 2004-11-03 | 罗姆股份有限公司 | Chip resistor and method of manufacturing the same |
| US20060216955A1 (en) * | 2003-11-04 | 2006-09-28 | Swenson Edward J | Laser-based termination of miniature passive electronic components |
| CN103137280A (en) * | 2011-11-24 | 2013-06-05 | 乾坤科技股份有限公司 | Method of manufacturing resistor |
| TW201508780A (en) * | 2013-08-26 | 2015-03-01 | Hung-Ju Cheng | Method for manufacturing alloy chip resistor |
| JP2017152576A (en) * | 2016-02-25 | 2017-08-31 | Koa株式会社 | Manufacturing method of chip resistor |
| US20190198204A1 (en) * | 2017-12-26 | 2019-06-27 | Ralec Electronic Corporation | Method for making resistors |
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