JP2002343615A - Method for manufacturing thick-film chip resistor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a thick-film chip resistor by which problems, such as a damaged insulation substrate or a damaged protective glass will not occur. SOLUTION: This method is used to manufacture the number of resistors 4 at the same time by printing and baking, as a component element for a resistor, a conductive paste, a resistance paste, and an insulation paste on an insulation board 3, such as alumina or the like that is provided with a plurality of unit areas 2, having the same area and shape partitioned by a separation groove 1. The method includes a step for pattern division for forming a dividing part 5 along the separation groove 1, while series printed pastes over the unit areas 2 which are in temporarily dried state.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a plurality of thick film type chip resistors with a high yield.

[0002]

2. Description of the Related Art Conventionally, a thick-film type chip resistor has an alumina having a plurality of unit regions having a constant area defined by a V-groove (a U-shaped or V-shaped cross-section) or the like and having the same shape. A large number of resistors are collectively formed by printing and baking an insulating paste such as a conductive paste, a resistive paste, or glass on the constituent elements of the resistor body on an insulating substrate such as an external substrate. It is generally manufactured by plating.

[0003]

However, when the various pastes are printed and fired, the various pastes flow into the V-grooves formed in the insulating substrate in advance, and the pastes are fired. The function of the V-groove for forming a fragile portion is violated, and division becomes difficult. Particularly, in the case of a glass paste, since the properties after firing are extremely hard, the cut surface becomes sharp, and chipping is caused by external force, which impairs reliability. In order to overcome such a situation, it is conceivable to remove the solidified paste that has flowed into the V-groove before splitting by laser. However, cutting of the baked silver electrode or the like requires a large amount of power. Can be considered as damage to the insulating substrate. In addition, even when the fired protective glass is removed by a laser, it is undeniable that problems such as scattering of the glass and generation of microcracks around the cut portion remain.

The present invention has been made in view of the above circumstances, and has as its object to provide a method of manufacturing a thick film type chip resistor which does not cause a problem of damage to an insulating substrate and a protective glass.

[0005]

According to the present invention, there is provided a method of manufacturing a thick-film type chip resistor which has a plurality of unit regions each having an equal area and a same shape and divided by dividing grooves. In a method of manufacturing a thick film type chip resistor in which a plurality of resistors are collectively formed through a process of printing and baking a conductive paste, a resistor base and an insulating paste on components of a resistor main body on an insulating substrate such as A series of pastes printed over the partitioned area are subjected to a pattern dividing step of forming a divided portion along the division groove in a temporarily dried state. The pattern dividing step includes removing a paste by irradiating a laser beam.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for manufacturing a thick film type chip resistor according to the present invention will be described below with reference to the drawings. In this example, a V-shaped dividing groove 1 is previously cut in a grid pattern on an insulating substrate made of alumina (hereinafter, referred to as an alumina substrate 3) so as to be divided into unit areas having an equal area and a same shape. 2 are formed, and one resistor main body 6 is formed in each unit area 2 by printing and baking an insulating paste such as a conductive paste, a resistive paste, or a glass. This is a method for batch-manufacturing a large number of thick-film chip resistors 4 by performing plating for forming and finishing.

First, as shown in FIG. 1A or FIG. 4A, a conductive paste 8 serving as an internal electrode 7 of a resistor main body 6 is printed on an alumina substrate 3 and, after preliminary drying, is printed. A portion of the conductive paste 8 extending over the portion 2 over the dividing groove 1 is removed by irradiating a laser beam to perform a dividing step of cutting a print pattern, thereby forming a dividing portion 5 in which the dividing groove 1 is exposed as shown in FIG. . The internal electrode 7 is formed by subjecting the conductive paste on which the divided portions 5 are formed to a baking treatment.

Next, as shown in FIG. 4 (b), a resistive paste 10 serving as a resistor 9 straddling a pair of internal electrodes 7 formed in the unit region 2 is individually printed, temporarily dried, and fired.

Further, a glass paste 12 serving as a protective film 11 covering the entire surface of the exposed portion of the resistor 9 with the resistor 9 at the center is applied to a series of strips as shown in FIG. 2 (a) or FIG. 4 (c). 2 and a preliminary drying step, a portion of the glass paste 12 extending over the adjacent unit region 2 over the dividing groove 1 is removed by laser beam irradiation to perform a cutting step of cutting the print pattern. As described above, the dividing portion 5 where the dividing groove 1 is exposed is formed.

A primary dividing step of baking the glass paste 12 thus divided for each unit region 2 and dividing the glass paste 12 along the dividing groove 1 along the dividing portion 5 of the internal electrode (conductive paste 8); An external electrode forming step for covering the end face, a secondary dividing step for dividing the protective film (glass paste 12) 11 along the dividing groove 1 along the dividing portion 5, and a plating step for the surface of the external electrode 13 are shown. The individual thick film type chip resistors 4 as shown in FIG. 5 are completed.

[0011]

As described above, according to the method of manufacturing a thick film type chip resistor according to the present invention, the paste which has penetrated into the dividing groove is removed in advance, thereby forming a fragile portion on the insulating substrate. The problem that the original function is not violated and the division of the substrate becomes difficult is solved.

In addition, even in the case of the thick film type chip resistor itself manufactured by the manufacturing method through the laser cutting process, the end of the pattern facing the cut portion of the divided portion of the fired portion of the glass paste. In addition, the reliability of the protective film covering the resistor can be improved without forming a sharp cut surface, which is a cause of the formation of a smooth melted portion caused by heat during firing and causing chipping easily by external force. Become. Moreover, as in the conventional method of removing the solidified paste that has flowed into the dividing grooves by using a laser, damage to the insulating substrate due to the irradiation of high-power laser, and scattering of glass when the burned protective glass is removed with the laser And the problem of generation of microcracks can be surely solved.

[Brief description of the drawings]

FIGS. 1A and 1B are cross-sectional views taken along the line AA of FIG. 4A showing states before and after a dividing step in a method of manufacturing a thick film type chip resistor according to the present invention.

FIGS. 2A and 2B are cross-sectional views taken along the line BB of FIG. 4C showing states before and after a dividing step in the method of manufacturing a thick-film chip resistor according to the present invention.

FIG. 3 is a sectional view taken along the line CC of FIG. 4C showing a state after a dividing step in the method of manufacturing a thick-film chip resistor according to the present invention.

FIGS. 4A, 4B, and 4C are plan views showing main parts of a method of manufacturing a thick-film chip resistor according to the present invention.

5A and 5B are a plan view and a cross-sectional view illustrating an example of a thick-film chip resistor completed by the method of manufacturing a thick-film chip resistor according to the present invention.

[Explanation of symbols]

 1 division groove, 2 unit area, 3 insulating substrate, 4 resistor, 5 dividing part, 6 resistor body, 7 internal electrode, 8 conductive paste, 9 resistor, 10 resistor paste, 11 protective film, 12 glass paste, 13 External electrode,

Claims (2)

[Claims] 1. A component of a resistor body (6) is formed on an insulating substrate (3) such as alumina having a plurality of unit areas (2) having the same area and the same shape divided by a dividing groove (1). In a method of manufacturing a thick film type chip resistor in which a large number of resistors (4) are collectively formed through a process of printing and baking a resistor paste and an insulating paste, a series of prints over a plurality of unit regions (2) are provided. A method of producing a thick-film chip component, which comprises subjecting the paste to a pattern dividing step of forming a dividing portion (5) along the dividing groove (1) in a temporarily dried state. 2. The method according to claim 1, wherein the pattern dividing step is a step of removing a paste by irradiating a laser beam.