JPS6395651A - Manufacture of ceramic ic package substrate - Google Patents

Abstract

PURPOSE:To facilitate the alignment of printing, and to divide the title substrate precisely while improving the reliability of sealing by using laser beams machining as a groove forming means and baking a glass for sealing to a groove forming side surface. CONSTITUTION:Since grooves 8 formed through laser beams machining consist of the aggregate of a large number of holes intermittently arranged at every regular interval and the grooves 8 have rough inner wall surfaces, the grooves 8 are not completely filled when glass 4 for sealing is baked onto the grooves, and space 9 is left on the bottoms of the grooves. Laser beams machining generates microcracks (not shown) among each hole in the grooves 8. The presence of these space 9 and microcracks permit the title substrate to be divided with excellent dimensional accuracy. Since glass 4 for sealing is baked on the groove 8 forming surface side, the position of printing can easily be determined, using the grooves 8 as references.

Description

DETAILED DESCRIPTION OF THE INVENTION "Field of Industrial Application" The present invention can be suitably used in a method of manufacturing a ceramic substrate housing an integrated circuit device (hereinafter abbreviated as "ICJ").

"Prior Art" In general, a ceramic IC package has a ceramic base substrate 2 on which an IC chip 1 is mounted, as shown in FIG.
, an external lead 8 which is joined to the end surface of the base substrate 2 by brazing or the like, and a ceramic cap substrate 5 which is sealed to the main surface of the frame portion 2a of the base substrate 2 with a glass 4 having a low melting point.
It is mainly composed of. Therefore, in the manufacturing stage, it is not necessary to mold and bake the base substrate 2 and the cap substrate 5 one by one from the beginning, and the efficiency is also low. After molding and firing a large substrate 6 having a size approximately equivalent to the total of the desired number of cap substrates 5, 5, . As shown in Φ), it is customary to print a thick film of low melting point glass 4 for sealing, bake it, and divide it into individual substrates of a predetermined size along the lines 7 to simultaneously manufacture a plurality of individual substrates. Here, the reason why the sealing glass 4 is baked on the back side of the #$7 forming surface of the Daisei substrate 6 is that the conventional groove T forming means is a groove cutting process using a carbide tool or the like. Therefore, since the groove 7 is connected at the same depth from one end 7a to the other end 7b, and the inner wall surface of #47 is smooth, if the sealing glass 4 is baked on the side where the groove 7 is formed. , the groove 7 is filled with the low melting point glass 4 and the breakability is poor when dividing into individual i-plates, resulting in poor dimensional accuracy. 151+! This is because a problem arises in which the deviation is more than II.

"Problems to be Solved by the Invention" However, if it is printed on the back side of the surface where the grooves 7 are formed as described above, the accuracy of the divided dimensions will not deteriorate.

However, there is a problem in that it is difficult to align the printing position of the sealing glass 4 to a predetermined position, and it takes a long time to set up printing on the sealing glass 4.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method that solves the above-mentioned problems and allows easy alignment of printing on glass and division with high accuracy.

``Means for Solving the Problems'' The means is to use laser processing for the groove forming means and to bake the sealing glass onto the groove forming surface.

"Operation" As shown in Figure 1, the groove 8 formed by laser processing consists of a collection of many holes arranged intermittently at regular intervals, and the inner wall surface of the groove 8 is rough. , when the sealing glass 4 is baked on it, the first
As shown in ) of the figure, the groove 8 is not completely filled, leaving a space 9 at the bottom. Further, the laser processing generates microcracks (not shown) between the grooves 8. The presence of these spaces 9 and microcracks makes it possible to divide with high dimensional accuracy. In addition, since the sealing glass 4 is baked on the side where the grooves 8 are formed, the printing position can be easily determined with the grooves 8 as a reference.

"Example" A large sintered substrate 6 with an alumina content of 91wt1% and a thickness of 0.60m was heated at a frequency of 800Hz and 7200 Hz per piece using a CL-411 type laser cutter manufactured by NEC ■.
μsec Maximum 0.18■φ under N power 5OW condition
, grooves 8 with a depth of 0.11 were formed in series at intervals of σ, 19. LS made by Nippon Electric Glass Co., Ltd. to cover this groove 8.
-0120 paste containing glass as main component of 0803
It was printed to a thickness of (2), baked at a temperature of 400°C, and then divided along grooves 8, and the dimensional error was less than 0.05 degrees. The divided individual substrates are used as a cap substrate 5, and the sealing glass 4 baked on the cap substrate 5 is brought into contact with the main surface of the frame portion 2a of the base substrate 2 of the same quality as the cap substrate 5, and heated to separate the cap substrate 5 and the base substrate 2. When these were bonded together, the end surface 4a of the sealing glass 4 formed a large meniscus. The reason why such a large meniscus is formed is that since a space 9 is left in the ridge 8, the slope inside the groove 8 is exposed after division, and the sealing/wearing glass 4 also gets wet in this part.

"Effects of the Invention" The printing position of the sealing glass can be easily aligned and divided with high accuracy. Furthermore, since the meniscus of the sealing glass is large, the reliability of sealing is improved.

[Brief explanation of the drawing]

FIG. 1(G) is a perspective view showing grooves formed in a large ceramic substrate according to an embodiment of the manufacturing method of the present invention;
) is a sectional view taken along the line B-B' of Figure 1, which shows the sealing glass baked onto the large ceramic substrate, and FIG. 1 (0 shows the large ceramic substrate divided into individual substrates). Cross-sectional view, Figure 2 is a general ceramic I
A cross-sectional view of the C package, Figure 8 is a perspective view showing grooves formed on the large ceramic substrate according to the conventional method, and Figure 3 (J3) shows the sealing glass baked onto the large ceramic substrate. B-B in Figure 8 (4)
' Line cross-sectional view', Figure 3 (O is a cross-sectional view showing the above-mentioned large ceramic substrate divided into individual substrates. 4...Glass for sealing, 5...Individual substrate (cap substrate), 6 ...Large substrate, 7...Groove Patent applicant: NGK Spark Plug Co., Ltd., Representative: Suzukitei-Pa, "() 3rd (A) 1'>IQ-4(C)

Claims (1)

[Claims] In the method of forming a groove in a large ceramic substrate to divide the large substrate into individual substrates and baking a sealing glass on the boundary line of each individual substrate, the groove forming means is laser processing, and the groove is formed in the sealing glass. A method for manufacturing a ceramic IC package substrate characterized by baking on the surface side.