JPH0436120Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a lead holder for an integrated circuit container in which an integrated circuit chip is mounted.

[Prior Art] An integrated circuit container such as a CER-QUAD package includes a rectangular substrate and a plurality of leads extending from a cavity provided in the center of the substrate toward four sides. These leads are bent into a J-shape so as to extend from the top surface to the bottom surface of the board.

[Problems to be solved by the invention] It has been found that the following problems occur when an IC chip is mounted in a conventional integrated circuit container.

(1) Since the leads protrude from the bottom of the board,
When mounting an IC, the heater block does not come into close contact with the entire bottom of the board, and therefore heat conduction from the heater block is poor.

(2) Although multiple leads are arranged at intervals on the substrate, the pitch of the leads may be distorted due to glass melting during sealing. Furthermore, since the leads are protruding from the four sides of the board, it is difficult to automatically feed the container.

(3) It is very difficult to remove the electrode when plating the lead.

[Means for Solving the Problems] In the present invention, a lead holder used when mounting an IC chip in an integrated circuit container that is bent into a J-shape so that multiple leads extend to the bottom of the board. can get. This lead holder is made of a metal plate that has comb-shaped protrusions located between multiple leads and is thicker than the thickness of the leads on the bottom of the board, and is placed against the bottom of the board when an IC chip is mounted. Ru. When this holder is used, the comb-like protrusions of the metal plate are positioned between the leads on the bottom surface of the board, thereby preventing misalignment between the leads during IC chip mounting.

[Example] Next, the present invention will be described in more detail with reference to the drawings showing an example of the present invention.

Referring to FIGS. 1a to 1c, in order to obtain an integrated circuit container according to an embodiment of the present invention, first, alumina-based powder is press-molded to have a cavity 10, and then heated at a temperature of about 1400°C. The powder is fired in the atmosphere to obtain a powder sintered container 11. Five layers of Au paste or Ag-Pd paste 12 are placed in the cavity 10 of this container 11.
Apply ~10μm, dry and bake at 900~1000℃. Thereafter, a low melting point glass powder 13 is printed and applied to the sealed portion by screen printing or the like and pre-sintered. Next, place the IC lead frame 14 on the sealing glass part, and place the lead frame 1 on the container 11 at 400 to 500°C.
Crimp 4.

Referring to FIG. 2, the lead holder is formed by processing a metal plate having a thickness equal to or slightly thicker than the thickness of the leads 14 on the bottom surface of the substrate of the container 11. This lead holder is composed of a backing metal plate 15 that is etched or pressed to have comb-like protrusions 16 having a width and a number of spacings equal to the lead spacing of the lead frame 14. The comb-like projections 1 of this comb-like backing metal plate 15
6 is inserted into the J-shaped bent portion of the lead frame 14 attached to the container 11 to mount an IC chip, etc. (FIG. 1).

Specifically, when mounting an IC chip in an integrated circuit container, with the metal plate 15 attached,
By mounting an IC chip in the cavity part 10 of the integrated circuit container, performing wire bonding, and thereafter sealing the cap and plating the leads,
Implements IC chip implementation. Thereafter, the fabrication of the device is completed by removing the backing metal plate 15 just before testing the electrical characteristics of the device.

[Effects of the present invention] In the integrated circuit container according to the present invention, since the comb-like metal plate is used as a lead holder,
It has the following effects.

(1) Since the comb-shaped protrusions of the lead holder are inserted between the leads on the bottom of the board, the heat conductivity from the heater block is good when the IC chip is mounted.

(2) Even if the glass melts during sealing, the pitch of the leads will not be distorted.

(3) When plating the lead, the electrode can be easily removed.

[Brief explanation of the drawing]

Figures 1 a to c are perspective views of an embodiment of the present invention;
FIG. 2 is a plan view of an example of a lead holder used in an embodiment of the present invention. 10...Cavity, 11...Container, 12...
paste, 13...low melting point glass, 14...lead frame, 15...backing metal plate, 16...comb-like protrusions.

Claims (1)

[Scope of utility model registration request] J so that multiple leads extend to the bottom of the board.
In a holder for holding leads of an integrated circuit container bent into a shape, the metal plate has comb-like protrusions located between the plurality of leads and has a thickness greater than the thickness of the leads on the bottom surface of the substrate. A lead holder for an integrated circuit container, characterized by comprising: