JP3000083B2 - Manufacturing method of electronic parts container - Google Patents
Manufacturing method of electronic parts containerInfo
- Publication number
- JP3000083B2 JP3000083B2 JP17769398A JP17769398A JP3000083B2 JP 3000083 B2 JP3000083 B2 JP 3000083B2 JP 17769398 A JP17769398 A JP 17769398A JP 17769398 A JP17769398 A JP 17769398A JP 3000083 B2 JP3000083 B2 JP 3000083B2
- Authority
- JP
- Japan
- Prior art keywords
- metal plate
- plate
- electronic component
- ceramic plate
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- Ceramic Products (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、半導体素子等の電
子部品を搭載し且つこの電子部品を外部と導通可能にし
て密封するための電子部品容器の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component container for mounting an electronic component such as a semiconductor device and for sealing the electronic component so that the electronic component can be electrically connected to the outside.
【０００２】[0002]
【従来の技術】一般に、電子部品容器２０は、図３(Ａ)
に示すように、金属板２２と、その表面に固着した四角
枠形状のセラミック板２４と、その上に固着した金属製
の蓋板２９とから形成される。上記セラミック板２４に
囲まれたキャビティ２１内の金属板２２上には、例えば
半導体素子２８が固着される。この半導体素子２８は、
複数のワイヤＷを介してセラミック板２４の内側段部２
６上に形成された図示しない端子と導通されると共に、
外側段部２７上に形成された端子を介して、外部と導通
可能とされている。2. Description of the Related Art Generally, an electronic component container 20 is shown in FIG.
As shown in FIG. 1, the metal plate 22 is formed by a rectangular frame-shaped ceramic plate 24 fixed to the surface thereof, and a metal lid plate 29 fixed thereon. For example, a semiconductor element 28 is fixed on the metal plate 22 in the cavity 21 surrounded by the ceramic plate 24. This semiconductor element 28
The inner step 2 of the ceramic plate 24 via a plurality of wires W
6 and is electrically connected to a terminal (not shown) formed on
Via terminals formed on the outer step portion 27, conduction with the outside is enabled.
【０００３】尚、上記金属板２２は、半導体素子２８が
発する熱を外部に放熱する作用を有すると共に、電子部
品容器２０を図示しないマザーボード等の装置表面に固
着するのにも活用される。また、蓋板２９は、半導体素
子２８を外気から遮断する。係る電子部品容器２０は、
次のようにして製造される。即ち、図３(Ｂ)に示すよう
に、無酸素銅からなる金属板２２の上表面２２ａに、予
め矩形枠に成形された共晶銀のロウ材２３を介して、上
記セラミック板２４を載置する。次いで、ロウ材２３の
共晶銀が溶融する温度に加熱し、金属板２２とセラミッ
ク板２４をロウ付けする。この場合、ロウ材２３が均一
に流れるようにするため、金属板２２の上表面２２ａと
セラミック板２４の底面は、共に予め平坦面とされてい
る。The metal plate 22 has a function of radiating heat generated by the semiconductor element 28 to the outside, and is also used for fixing the electronic component container 20 to a device surface such as a motherboard (not shown). Further, the cover plate 29 shields the semiconductor element 28 from the outside air. Such an electronic component container 20 includes:
It is manufactured as follows. That is, as shown in FIG. 3B, the ceramic plate 24 is placed on the upper surface 22a of the metal plate 22 made of oxygen-free copper via the eutectic silver brazing material 23 previously formed into a rectangular frame. Place. Next, the metal plate 22 and the ceramic plate 24 are brazed by heating to a temperature at which the eutectic silver of the brazing material 23 melts. In this case, the upper surface 22a of the metal plate 22 and the bottom surface of the ceramic plate 24 are both flat surfaces in advance so that the brazing material 23 flows uniformly.
【０００４】[0004]
【発明が解決すべき課題】しかしながら、係るロウ付け
後にロウ材２３の共晶銀が凝固して収縮する際、図３
(Ｃ)に示すように、金属板２２がその下表面２２ｂ側に
反ることがある。この反りは、セラミック板２４がロウ
付けされていない金属板２２の図示で左右の自由端２２
ｃに顕著に表れる。係る反りは、金属板２２とセラミッ
ク板２４との熱膨張係数が相違することに起因して生じ
る。即ち、上記ロウ材２３がロウ付け後に収縮する際、
セラミック板２４とロウ付けされた金属板２２の上表面
２２ａは、左右の自由端２２ｃのみが収縮するのに対
し、下表面２２ｂは全面に渉り収縮する。このため、図
示のようにこの下表面２２ｂの左右の自由端２２ｃが僅
かに下向きに偏移する反りを誘起させる。However, when the eutectic silver of the brazing material 23 solidifies and shrinks after such brazing, FIG.
As shown in (C), the metal plate 22 may warp to the lower surface 22b side. This warpage is caused by the left and right free ends 22 of the metal plate 22 to which the ceramic plate 24 is not brazed.
c appears remarkably. Such warpage occurs due to the difference in the coefficient of thermal expansion between the metal plate 22 and the ceramic plate 24. That is, when the brazing material 23 contracts after brazing,
On the upper surface 22a of the metal plate 22 brazed to the ceramic plate 24, only the left and right free ends 22c contract, whereas the lower surface 22b contracts over the entire surface. For this reason, as shown in the figure, the left and right free ends 22c of the lower surface 22b induce a warp slightly displaced downward.
【０００５】金属板２２に係る反りが生じると、その上
表面２２ａに追って半導体素子２８を搭載する際にその
密着が不十分になり易く、且つ蓋板２９をセラミック板
２４の上端面２５にロウ付けする際に、両者間に隙間を
形成して密封が不十分になることもある。更に、得られ
た電子部品容器２０を図示しないマザーボード等の表面
上に固着する際にも、金属板２２の下表面２２ｂとの間
に隙間が形成されるため、半導体素子２８の放熱が不十
分になり易い。この隙間を生じないように強制的に固着
すると、セラミック板２４に割れが生じ得るという問題
点もあった。本発明は、以上に述べた従来の技術におけ
る問題点を解決し、追って搭載される半導体素子等の電
子部品を十分な密着性をもって固着でき、蓋板による密
封も確実になされ、且つマザーボード等の装置の表面上
に確実に固着し得る電子部品容器の製造方法を提供する
ことを課題とする。[0005] When the metal plate 22 is warped, the adhesion is likely to be insufficient when the semiconductor element 28 is mounted following the upper surface 22 a, and the cover plate 29 is soldered to the upper end surface 25 of the ceramic plate 24. At the time of attachment, a gap may be formed between the two and sealing may be insufficient. Further, even when the obtained electronic component container 20 is fixed on a surface of a motherboard or the like (not shown), a gap is formed between the electronic component container 20 and the lower surface 22b of the metal plate 22, so that the semiconductor element 28 has insufficient heat radiation. Easy to be. There is also a problem that the ceramic plate 24 may be cracked if it is forcibly fixed so as not to form the gap. The present invention solves the above-mentioned problems in the conventional technology, can fix electronic components such as semiconductor elements to be mounted later with sufficient adhesiveness, ensures sealing with a cover plate, and enables a motherboard or the like to be securely mounted. An object of the present invention is to provide a method of manufacturing an electronic component container that can be securely fixed on a surface of an apparatus.
【０００６】[0006]
【課題を解決するための手段】本発明は、上記課題を解
決するため、ベースとなる金属板とセラミック板とをロ
ウ付けにて固着するに際し、予め上記金属板をセラミッ
ク板がロウ付けされる表面側に反らせるおくことに着想
してなされたものである。即ち、本発明の電子部品容器
の製造方法は、セラミックス板と金属板をロウ付けして
形成する電子部品容器の製造方法であって、上記金属板
をセラミックス板がロウ付けされる表面側に予め反らせ
る工程と、該反った金属板にロウ材を介して上記セラミ
ックス板をロウ付けする工程とを含むと共に、上記反り
形成工程と同時に、上記反りを形成した金属板の表裏面
の少なくとも何れかに反りの存在を示すマークを設け
る、ことを特徴とする。According to the present invention, in order to solve the above-mentioned problems, when a metal plate serving as a base and a ceramic plate are fixed by brazing, the metal plate is previously brazed to the ceramic plate. The idea was to make it warp to the front side. That is, the method for manufacturing an electronic component container according to the present invention is a method for manufacturing an electronic component container formed by brazing a ceramic plate and a metal plate, wherein the metal plate is previously formed on the surface side on which the ceramic plate is brazed. a step of deflecting, with a step of brazing the ceramic plate via a brazing material to a metal plate was Tsu the reflected, the warp
At the same time as the forming process, the front and back surfaces of the metal plate on which the warpage was formed
A mark indicating the presence of warpage is provided on at least one of
That, characterized in that.
【０００７】これによれば、金属板に予めロウ付けによ
り生じる反りと相当量の反りを逆向きに形成してあるた
め、セラミック板をロウ付けしても上記反りがロウ付け
により反りを吸収・相殺することにより、平坦な金属板
を有する電子部品容器を確実に得ることができ、蓋板に
よる密封も確実に行うことができる。しかも、工程数を
増やしたり、マーク形成時に表裏面を判別することなく
して、金属板における反りを与えた表面が確実に識別で
きるため、極めて僅かの曲げによる反りであっても、係
る反りを有する表面をロウ付け工程で正確に認識でき
る。従って、製造時に金属板の表裏面を誤ってロウ付け
することを確実に予防できる。尚、上記反りを得るに
は、所定形状に成形された金属板を上下一対の凹・凸型
からなるプレスで曲げ加工しても良いし、或いは、金属
板の素材をプレスで打ち抜き加工する際、これと同時に
又は引き続いて曲げを与えて反りを付与することによっ
ても可能である。According to this, since a warp caused by brazing and a considerable amount of warp are previously formed on the metal plate in the opposite direction, even if the ceramic plate is brazed, the warp absorbs the warp by brazing. By canceling out, it is possible to reliably obtain an electronic component container having a flat metal plate,
According sealing also Ru can be reliably performed. Moreover, the number of processes
Without increasing or distinguishing the front and back sides when forming marks.
The warped surface of the metal plate
Even if warpage is caused by extremely slight bending,
Surface with warpage can be accurately recognized in the brazing process
You. Therefore, the front and back surfaces of the metal plate are incorrectly brazed during manufacturing.
Can be reliably prevented. In order to obtain the above-mentioned warpage, a metal plate formed into a predetermined shape may be bent by a press having a pair of upper and lower concave and convex shapes, or when a metal plate material is punched by a press. It is also possible by simultaneously or subsequently applying a bend to impart a warp.
【０００８】尚、上記マークには、小さな凹み又は突
起、或いは凸型内に併設した微少な突起による刻印等が
含まれる。また、従来の反りは金属板におけるロウ付け
されたセラミック板に隣接する部分以外の自由端に生じ
易いので、係る自由端にのみ予め逆向きの反りを付与し
ても、平坦な金属板を有する電子部品容器を製造するこ
とが可能である。[0008] Incidentally, the above mark, small dents or protrusions, or include time indicia and the like due to minute projections features in convex. Also, since the conventional warpage is likely to occur at the free end of the metal plate other than the portion adjacent to the brazed ceramic plate, even if the reverse warp is applied only to the free end in advance, the metal plate has a flat metal plate. It is possible to manufacture electronic component containers.
【０００９】[0009]
【発明の実施の形態】以下において本発明の実施に好適
な形態を図面と共に説明する。図１は電子部品容器１の
製造方法に関し、図１(Ａ)はそのベースとなる金属板２
の断面を示す。この金属板２は、平面視が長方形で厚さ
１.５ｍｍの無酸素銅からなり、その上表面２ｂが追っ
てセラミック板６がロウ付けされる表面である。この金
属板２を図示しない緩やかに湾曲して凹んだ下型上に載
置して拘束し、この金属板２に対し下端面が上記同様に
湾曲して突出する上型を押し当てるプレス曲げ加工を行
う。金属板２の上・下表面２ｂ，２ｃには予め潤滑油が
塗布されている。その結果、図１(Ｂ)に示すように、左
右の端部２ａが図示で上向きに反り上るように、全体に
上表面２ｂ側に数１０μｍ程度の反りが形成された金属
板２′となる。尚、図１(Ｂ)で金属板２′の反りを便宜
上誇張して示す(以下同様)。上表面２ｂの適所には、上
記プレスと同時に微少な凹み３が付与され、この上表面
２ｂ側に金属板２が反っていることを表示する。Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 relates to a method of manufacturing an electronic component container 1, and FIG.
2 shows a cross section of FIG. The metal plate 2 is made of oxygen-free copper having a rectangular shape in plan view and a thickness of 1.5 mm, and the upper surface 2b is a surface to which the ceramic plate 6 is brazed. A press bending process in which the metal plate 2 is placed and restrained on a lower mold which is not shown and is slightly curved and concave, and an upper mold whose lower end face is curved and protrudes in the same manner as described above. I do. Lubricating oil is applied to the upper and lower surfaces 2b and 2c of the metal plate 2 in advance. As a result, as shown in FIG. 1 (B), a metal plate 2 'having a warpage of about several tens [mu] m is formed on the upper surface 2b side so that the left and right ends 2a warp upward in the drawing. . In FIG. 1B, the warpage of the metal plate 2 'is exaggerated for convenience (the same applies hereinafter). The position of the upper surface 2b, the pressing at the same time as the fine small dents 3 is given to indicate that the metal plate 2 is warped to the upper surface 2b side.
【００１０】次に、上記反りを有する金属板２′に対
し、セラミック板６をロウ付けする。このセラミック板
６は主にアルミナからなり、図１(Ｃ)に示すように、断
面が略凸字形状で且つ平面視で四角枠形状を呈する。セ
ラミック板６は、内側段部７と外側段部８及びこれらの
間から上方に突出する上端面９を有する。該セラミック
板６は、アルミナを主成分とする複数のグリーンシート
を所定の枠形状に成形し、これらのグリーンシートの表
面にタングステン等の高融点金属を含む導体ペースト層
をスクリーン印刷により形成した後、各シートを積層・
圧着して焼成することによって製造される。従って、内
側段部７と外側段部８の表面には電子部品やリードフレ
ーム等と導通するための図示しない端子が複数形成され
ている。Next, a ceramic plate 6 is brazed to the warped metal plate 2 '. The ceramic plate 6 is mainly made of alumina, and has a substantially convex cross section and a rectangular frame shape in plan view as shown in FIG. 1 (C). The ceramic plate 6 has an inner step 7 and an outer step 8, and an upper end surface 9 protruding upward from between them. The ceramic plate 6 is formed by forming a plurality of green sheets containing alumina as a main component into a predetermined frame shape, and forming a conductive paste layer containing a high melting point metal such as tungsten on the surface of these green sheets by screen printing. , Stack each sheet
It is manufactured by pressing and firing. Accordingly, on the surfaces of the inner step 7 and the outer step 8, a plurality of terminals (not shown) for conducting with electronic components, lead frames, and the like are formed.
【００１１】先ず、上記セラミック板６を金属板２′の
上表面２ｂに対し、共晶銀のロウ材４を介して載置し、
適宜固定する。このロウ材４は予めセラミック板６の底
面と同じ形状に成形されている。次いで、該ロウ材４が
溶融する約８００℃に加熱し保持する。そして、このロ
ウ付け後にロウ材４は冷却しつつ収縮する。この際、金
属板２′には前記反りがセラミック板６がロウ付けされ
る上表面２ｂ側に付与されているので、セラミック板６
と金属板２′の熱膨張係数の差によって、下表面２ｃ側
に本来形成されるべき反りを吸収・相殺する。このよう
にロウ付けされた金属板２の表面等に図示しないＮｉメ
ッキ、及びＡｕメッキ等を施すと、図１(Ｄ)に示すよう
に、極めて平坦度の高い金属板２とこれに固着されたセ
ラミック板６とを有する電子部品容器１を得ることがで
きる。First, the ceramic plate 6 is placed on the upper surface 2b of the metal plate 2 'via the brazing material 4 of eutectic silver.
Fix as appropriate. This brazing material 4 is formed in advance in the same shape as the bottom surface of the ceramic plate 6. Next, it is heated and maintained at about 800 ° C. where the brazing material 4 melts. After this brazing, the brazing material 4 contracts while cooling. At this time, since the warpage is given to the metal plate 2 'on the upper surface 2b side on which the ceramic plate 6 is brazed, the ceramic plate 6'
The difference in thermal expansion coefficient between the metal plate 2 'and the metal plate 2' absorbs and cancels the warpage that should be originally formed on the lower surface 2c side. When Ni plating and Au plating (not shown) are applied to the surface and the like of the metal plate 2 thus brazed, as shown in FIG. 1D, the metal plate 2 having extremely high flatness is fixed to the metal plate 2. The electronic component container 1 having the ceramic plate 6 thus obtained can be obtained.
【００１２】この電子部品容器１は、平坦な金属板２を
有するので、追ってそのキャビティ５内に装入される電
子部品を上表面２ｂに密着して固定でき、セラミック板
６の上端面９も平坦になるため、この上端面９にロウ付
けされる金属製の蓋板も確実に密着し、上記電子部品を
確実に密封することが可能となる。また、電子部品から
の放熱も確実になり、且つ金属板２の下表面２ｃも平坦
なため、電子部品容器１自体をマザーボード等の装置の
表面上に密着させることもできる。尚、金属板２に予め
付与する反りは、その材質、形状、及び寸法に応じて事
前に最適値を把握しておくことが望ましい。また、セラ
ミック板６の上端面９上には、予め前記焼成時に蓋板用
の例えばコバール(Fe−29％Ni−17％Co)からなる枠形状
のロウ材を載置し固着させておくこともできる。Since the electronic component container 1 has the flat metal plate 2, the electronic component to be charged into the cavity 5 can be fixed in close contact with the upper surface 2b, and the upper end surface 9 of the ceramic plate 6 can also be fixed. Since it is flat, the metal cover plate brazed to the upper end surface 9 is also in close contact with the electronic component, and the electronic component can be securely sealed. In addition, since the heat radiation from the electronic component is ensured and the lower surface 2c of the metal plate 2 is flat, the electronic component container 1 itself can be brought into close contact with the surface of a device such as a motherboard. Note that it is desirable that the optimum value of the warpage to be applied to the metal plate 2 in advance is determined in advance according to the material, shape, and size of the metal plate 2. Further, a frame-shaped brazing material made of, for example, Kovar (Fe-29% Ni-17% Co) for the cover plate is placed and fixed on the upper end surface 9 of the ceramic plate 6 in advance during the firing. Can also.
【００１３】図２は異なる形態の電子部品容器の製造方
法に関する。尚、以下においては、前記形態と同じ要素
や部分には、同じ符号を共通して用いるものとする。図
２(Ａ)は平面視が長方形の金属板１２′の断面を示す。
この金属板１２′も無酸素銅からなり、その上表面１２
ｂが追って前記セラミック板６がロウ付けされる表面で
ある。そして、上表面１２ｂの左右の端部１２ａのみを
プレス曲げで上向きに反らせ、中央部は平坦面に形成し
ている。尚、上表面１２ｂの適所に反りの存在と方向を
示す凹み３を形成する。そして、図２(Ｂ)に示すよう
に、金属板１２′の中央部の平坦な上表面１２ｂにこれ
と略同じ外枠寸法のセラミック板６をロウ材４を介して
前記同様に固着する。すると、ロウ材４の加熱後におけ
る収縮は、セラミック板６がロウ付けされない金属板１
２′の左右の自由端１２ａに表れようとするが、予め逆
向きに上記反りを付与してあるため、図示のように平坦
な金属板１２とこれに固着されたセラミック板６とを有
する電子部品容器１０を得ることができる。FIG. 2 relates to a method for manufacturing an electronic component container of a different form. In the following, the same reference numerals are used in common for the same elements and portions as in the above-described embodiment. FIG. 2A shows a cross section of a metal plate 12 'having a rectangular shape in plan view.
This metal plate 12 'is also made of oxygen-free copper, and its upper surface 12
b is a surface to which the ceramic plate 6 is brazed. Then, only the left and right end portions 12a of the upper surface 12b are bent upward by press bending, and the central portion is formed as a flat surface. In addition, a depression 3 indicating the presence and direction of the warp is formed at an appropriate position on the upper surface 12b. Then, as shown in FIG. 2B, a ceramic plate 6 having substantially the same outer frame dimensions as the above is fixed to the flat upper surface 12b at the center of the metal plate 12 'via the brazing material 4 in the same manner as described above. Then, the shrinkage of the brazing material 4 after heating is caused by the metal plate 1 to which the ceramic plate 6 is not brazed.
Although it is supposed to appear on the left and right free ends 12a of the 2 ', since the above-mentioned warpage is given in the opposite direction in advance, an electron having a flat metal plate 12 and a ceramic plate 6 fixed thereto as shown in the figure. The parts container 10 can be obtained.
【００１４】即ち、金属板１２においてセラミック板６
がロウ付けされる中央部は、上下表面１２ｂ，１２ｃ共
にロウ材４が収縮しようとしてもセラミック板６に固着
されているので、上記収縮による反りが顕在化しにく
い。これに対し、金属板１２左右の自由端１２ａは収縮
による反りが表れ易い。これを効果的に防ぐため、上記
のような金属板１２′を用いた。従って、係る金属板１
２を有する電子部品容器１０によれば、そのキャビティ
５内に追って装入される電子部品を上表面１２ｂに一層
確実に密着させることが可能となり、且つセラミック板
６の上端面９も平坦になるため蓋板を一層確実にロウ付
けして密着することができる。That is, in the metal plate 12, the ceramic plate 6
Since the brazing material 4 is fixed to the ceramic plate 6 at both the upper and lower surfaces 12b and 12c of the central portion where the brazing material is shrunk, the warpage due to the shrinkage is less likely to become apparent. On the other hand, the left and right free ends 12a of the metal plate 12 tend to be warped due to shrinkage. To effectively prevent this, the metal plate 12 'as described above was used. Therefore, such a metal plate 1
According to the electronic component container 10 having the electronic component 2, the electronic component to be charged into the cavity 5 can be more securely adhered to the upper surface 12b, and the upper end surface 9 of the ceramic plate 6 becomes flat. Therefore, the lid plate can be more securely brazed and adhered.
【００１５】[0015]
【実施例】ここで本発明方法の具体的な実施例を比較例
と共に説明する。無酸素銅からなり幅２５ｍｍ、奥行き
１５ｍｍ、厚さ１．５ｍｍの金属板と、アルミナを９２
wt％含み、幅１５ｍｍ、奥行き１５ｍｍ、厚さ１．５ｍ
ｍのセラミック板とをそれぞれ１０枚用意した。金属板
のうちの５枚に対し、追ってセラミック板がロウ付けさ
れる表面側に予めプレス曲げにより、前記金属板２′と
同様で且つ５０μｍの反りを与えて実施例とした。残り
５枚の平坦な金属板はそのまま比較例とした。Now, specific examples of the method of the present invention will be described together with comparative examples. A metal plate made of oxygen-free copper and having a width of 25 mm, a depth of 15 mm, and a thickness of 1.5 mm, and alumina of 92 mm
Including wt%, width 15mm, depth 15mm, thickness 1.5m
and m ceramic plates were prepared. An example was given in which five of the metal plates were warped 50 μm in the same manner as the metal plate 2 ′ by press bending in advance on the surface side on which the ceramic plate was brazed. The remaining five flat metal plates were used as comparative examples as they were.
【００１６】因みに、上記金属板の熱膨張係数は、２２.
４×１０-6／℃(７００℃)であり、セラミック板の熱膨
張係数は、７.５×１０-6／℃(７００℃)である。そし
て、共晶銀(Ａｇ−Ｃｕ系合金)からなり、幅１５ｍｍ、
奥行き１５ｍｍ、厚さ０.０５ｍｍのロウ材を、上記各金
属板とセラミック板との間にそれぞれ挟持し、８００℃
で約１時間加熱した。得られた１０個の電子部品容器に
おける各例の金属板の反り量をレーザ反り測定器で測定
し、且つ実施例１〜５及び比較例１〜５の平均値を算出
した。それらの結果を表１に示す。Incidentally, the coefficient of thermal expansion of the metal plate is 22.
It is 4 × 10 −6 / ° C. (700 ° C.), and the coefficient of thermal expansion of the ceramic plate is 7.5 × 10 −6 / ° C. (700 ° C.). And it consists of eutectic silver (Ag-Cu alloy), 15 mm in width,
A brazing material having a depth of 15 mm and a thickness of 0.05 mm was sandwiched between each of the above-mentioned metal plates and the ceramic plate at 800 ° C.
For about 1 hour. The warpage of the metal plate of each example in the obtained 10 electronic component containers was measured by a laser warpage measuring device, and the average values of Examples 1 to 5 and Comparative Examples 1 to 5 were calculated. Table 1 shows the results.
【００１７】[0017]
【表１】 [Table 1]
【００１８】表１の結果、実施例１〜５の反り量の平均
値は約２３μｍで、比較例１〜５の平均値の約３分の１
であり、実施例の各金属板の反りは小さかった。これに
よって、実施例の金属板が極めて平坦で、且つこれにロ
ウ付けされたセラミック板も平坦性を保った電子部品容
器が得られる本発明方法の効果が裏付けられた。しか
も、追って搭載する電子部品やセラミック板上に載せる
蓋板を容易に密着できると共に、平坦な金属板により各
種の装置上に確実に密着させることもできる。As shown in Table 1, the average value of the warpage of Examples 1 to 5 was about 23 μm, and about one third of the average value of Comparative Examples 1 to 5.
The warpage of each metal plate of the example was small. As a result, the effect of the method of the present invention, in which an electronic component container in which the metal plate of the example was extremely flat and the ceramic plate brazed to the metal plate was also kept flat, was confirmed. In addition, the electronic components to be mounted later and the cover plate to be mounted on the ceramic plate can be easily adhered, and the flat metal plate can be securely adhered to various devices.
【００１９】本発明は、以上に説明した各形態や実施例
に限定されるものではない。例えば、金属板には前記無
酸素銅の他に、コバール(Fe−29wt％Ni−17wt％Co)、Ｃ
ｕ−Ｗ合金、又はその他の銅基合金等を適用することも
できる。また、セラミック板には、アルミナを主成分と
するものを示したが、これに限定されず、例えば窒化ア
ルミニウム(ＡｌＮ)やガラスセラミック、ムライト等、
からなるものも含まれる。更に、その形状も平面視で四
角枠に限らず、日の字形や田の字形として、内部に複数
のキャビティを形成することも可能である。尚、本発明
における電子部品には、１つの半導体素子の他、複数個
の半導体素子を固着して用いるマルチチップモジュー
ル、トランジスタ、ＦＥＴ等の半導体素子やコンデン
サ、抵抗、インダクタ、ＳＡＷフィルタ等も含まれる。The present invention is not limited to the embodiments and examples described above. For example, in addition to the oxygen-free copper, Kovar (Fe-29wt% Ni-17wt% Co), C
A u-W alloy, another copper-based alloy, or the like can be used. Further, the ceramic plate is mainly composed of alumina, but is not limited thereto. For example, aluminum nitride (AlN), glass ceramic, mullite, etc.
Includes those consisting of Further, the shape is not limited to a square frame in plan view, and a plurality of cavities can be formed inside as a sun shape or a cross shape. The electronic component according to the present invention includes, in addition to one semiconductor element, a multi-chip module in which a plurality of semiconductor elements are fixed and used, semiconductor elements such as transistors and FETs, capacitors, resistors, inductors, SAW filters, and the like. It is.
【００２０】[0020]
【発明の効果】以上において説明した本発明の製造方法
によれば、金属板に予めロウ付けにより生じる反りと相
当量の反りを逆向きに形成しているので、セラミック板
をロウ付けしても上記反りがロウ付けによる反りを吸収
することにより、平坦な金属板を有し、蓋板による密封
も確実に行える電子部品容器を確実に提供することがで
きる。しかも、工程数を増やしたり、マーク形成時に表
裏面を判別するすことなく、金属板における反りを与え
た表面が確実に識別できるため、ロウ付け時に金属板の
表裏面を誤ってロウ付けすることを確実に予防すること
もできる。According to the manufacturing method of the present invention described above, since a warp caused by brazing and a considerable amount of warpage are previously formed on a metal plate in a reverse direction, even if a ceramic plate is brazed. The above-mentioned warp absorbs the warp due to brazing, so that it has a flat metal plate and is sealed with a lid plate
It can also provide an electronic component container that reliably performed reliably. In addition, the number of processes can be increased,
Without to determine the back surface, since the surface gave warpage of the metal plate can be reliably identified, reliably preventing to that accidentally the front and back surfaces of the brazing at the metal plate brazing
You can also .
【図１】(Ａ)乃至(Ｄ)は本発明の製造方法における各工
程の概略を示す断面図。FIGS. 1A to 1D are cross-sectional views schematically showing each step in a manufacturing method of the present invention.
【図２】(Ａ)及び(Ｂ)は異なる製造方法における各工程
の概略を示す断面図。FIGS. 2A and 2B are cross-sectional views schematically showing respective steps in different manufacturing methods.
【図３】(Ａ)は一般的な電子部品容器を示す断面図、
(Ｂ)及び(Ｃ)は従来の製造方法における各工程の概略を
示す断面図。FIG. 3A is a sectional view showing a general electronic component container,
(B) and (C) are sectional views showing the outline of each step in a conventional manufacturing method.
１，１０…………………電子部品容器 ２，２′,１２,１２′…金属板 ２ｂ，１２ｂ……………上表面(表面) ３…………………………凹み(マーク) ４…………………………ロウ材 ６…………………………セラミック板 1, 10 ... electronic component container 2, 2 ', 12, 12' ... metal plate 2b, 12b ... upper surface (surface) 3 ... ... ... recess (Mark) 4 Brazing material 6 Ceramic plate
Claims (1)
成する電子部品容器の製造方法であって、 上記金属板をセラミックス板がロウ付けされる表面側に
予め反らせる工程と、 該反った金属板にロウ材を介して上記セラミックス板を
ロウ付けする工程とを含むと共に、 上記反り形成工程と同時に、上記反りを形成した金属板
の表裏面の少なくとも何れかに反りの存在を示すマーク
を設ける 、ことを特徴とする電子部品容器の製造方法。1. A method of manufacturing an electronic component container formed by brazing a ceramic plate and a metal plate, comprising: a step of previously bending the metal plate to a surface side on which the ceramic plate is brazed; via the brazing material in a plate with a step of brazing the ceramic plate, at the same time as the warp forming step, the metal plate forming the warp
Mark indicating the presence of warpage on at least one of the front and back
A method for manufacturing an electronic component container, comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17769398A JP3000083B2 (en) | 1998-06-24 | 1998-06-24 | Manufacturing method of electronic parts container |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17769398A JP3000083B2 (en) | 1998-06-24 | 1998-06-24 | Manufacturing method of electronic parts container |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000012718A JP2000012718A (en) | 2000-01-14 |
| JP3000083B2 true JP3000083B2 (en) | 2000-01-17 |
Family
ID=16035464
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17769398A Expired - Fee Related JP3000083B2 (en) | 1998-06-24 | 1998-06-24 | Manufacturing method of electronic parts container |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3000083B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4584757B2 (en) * | 2005-04-07 | 2010-11-24 | 株式会社日立国際電気 | PA module heat sink |
| EP2301760B1 (en) | 2009-09-28 | 2013-08-14 | Fujifilm Corporation | Method of producing aluminum substrate for planographic printing plate and method of recycling planographic printing plate |
| JP6296687B2 (en) * | 2012-04-27 | 2018-03-20 | キヤノン株式会社 | Electronic components, electronic modules, and methods for manufacturing them. |
| JP6192312B2 (en) * | 2013-02-28 | 2017-09-06 | キヤノン株式会社 | A mounting member manufacturing method and an electronic component manufacturing method. |
-
1998
- 1998-06-24 JP JP17769398A patent/JP3000083B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000012718A (en) | 2000-01-14 |
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