JPH0737708A - Manufacture of chip component - Google Patents

Abstract

PURPOSE:To provide a method of manufacturing chip components with an excellent dimensional accuracy and high yield. CONSTITUTION:A first process to form a ceramic substrate 1, a second process to bake the predetermined electrode 2 at the surface, a fifth process to form a resistor 3, a sixth process to form a splitted substrate 9 including slits for splitting, a seventh process to divide both end faces in the side of electrode 2, an eighth process to form an end face electrode to both end faces in the side of electrode 2 and a ninth process to form chip components by dividing the splitted substrate 9 are composed. Therefore, a rotary machining blade harder than the ceramic substrate 1 having the splitting slit and sharp angle is pressed in the vertical direction to the ceramic substrate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a small and thin chip part for high density mounting on various consumer electronic devices.

[0002]

2. Description of the Related Art Conventionally, with the development of various consumer electronic devices,
A demand has arisen for a small and thin chip component that is mounted in high density on these devices and that has a high dimensional accuracy and can be mass-produced.

A conventional method of manufacturing a chip component will be described below with reference to the drawings. FIG. 2 is a process diagram showing a conventional method of manufacturing a chip component. As shown in FIG.
The method of manufacturing a chip component is as follows: a first step in which a dividing slit, which is a break groove, is placed in the ceramic substrate 11 and fired; and electrodes 12 on both ends of a divided substrate 14 divided by the dividing slit on the fired ceramic substrate 11. And a third step of forming the resistor 13 by printing and firing so as to overlap the end portion of the electrode 12, and the end faces of the divided substrate 14 on the electrode 12 side along the dividing slit. A fourth step of dividing, a fifth step of forming the end face electrodes 15 on both end surfaces of the divided substrate 14 on the electrode 12 side, and a sixth step of dividing the divided substrate 14 along the dividing slits to form a chip component 16.
And a process.

However, in the above method, since the ceramic substrate 11 having the slits for division is fired in the first step, the volumetric shrinkage of the ceramic substrate 11 during firing of the ceramic causes a small error in the outer dimensions of the divided substrate 14. It is necessary to adjust the dimensions of the electrode 12 and the resistor 13 in the second step and the third step to form the substrate, and the size of the substrate is classified according to lots, and a large number of electrodes and There was a problem that a resistance printing mask had to be used. Also,
When the electrode and the resistance printing mask overlap with the dividing slit, the paste flows into the dividing slit, which causes a problem of printing bleeding during printing.

In order to solve these problems, a manufacturing method using a laser scribing method as disclosed in JP-A-4-24140 has been proposed in recent years. In this manufacturing method, the step of forming the dividing slit which is the break groove in the above manufacturing method is performed after forming the electrodes and the resistors, and further, the dividing slit is formed using a laser beam. At this time, the ceramic substrate on which the electrodes and the resistors are formed is irradiated with a laser beam, the ceramic substrate is thermally melted by thermal energy, and the melt is scattered by the assist gas to form the slit for division.

As a result, since the dividing slit is formed by using the fired ceramic substrate without firing the ceramic substrate having the dividing slit formed therein, dimensional error of the dividing slit due to firing of the ceramic substrate does not occur. It is possible to obtain a chip component with high dimensional accuracy.

[0007]

However, in the above-mentioned conventional method of manufacturing a chip component, since the slit for division is formed in the ceramic substrate by using the laser beam, the thermal energy of the laser beam causes the ceramic substrate to be melted by heat. When the melted material is scattered by the assist gas, the ceramic material of the scattered ceramic substrate adheres to the electrodes formed on the ceramic substrate or the resistor surface,
There is a problem that the shape of the break cut surface cut along the dividing slit may not be smooth.

In order to solve the above problems, the present invention cuts a ceramic substrate by using a rotary working blade having a sharp angle shape having a hardness higher than that of the ceramic substrate as a means for forming a slit for division. The formed electrodes and resistor surfaces do not adhere to cutting chips, and the processed shape of the cut surface does not become uneven, and the dimensional accuracy of the dividing slit does not occur, so dimensional accuracy is good,
It is an object of the present invention to provide a method for manufacturing a chip component having a high yield.

[0009]

In order to achieve the above object, in the method for manufacturing a chip component of the present invention, a first step of forming a functional material on one surface of a substrate after firing and a functional material are formed. A second step of forming a dividing slit on the substrate,
A third step of dividing the substrate on which the functional material is formed along the dividing slits, and as a means for forming the dividing slits in the second step, rotation with a sharp angular shape having higher hardness than the substrate A processing blade is used, and the rotary processing blade is pressure-cut in a direction perpendicular to the substrate.

[0010]

According to the above method, the functional material is formed on the substrate after firing to form the slits for division, so that it is possible to deal with the dimensional error of the slits for division which occurs when the substrate having the slits for division is fired. Since it is not necessary to form a functional material by using it, the reliability and simplification of the chip component can be improved during the manufacturing process. Further, when the slit for division is formed, the rotary working blade presses the substrate in a direction perpendicular to the cutting, so that a cutting groove of several μm is formed on the substrate, and a micro crack machine is formed from the tip of the cutting groove. When the substrate is divided along the cutting grooves that will be the slits for division, the linear microcracks from the tip of the cutting grooves cause
The shape of the divided surface of the substrate can be made linear so that the divided surface of the substrate can be made smooth, and the yield reduction can be prevented without adhering cutting chips of the substrate to the surface of the substrate.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a process drawing showing a method for manufacturing a chip component of the present invention.

As shown in FIG. 1, a substrate having a composition of 55% glass and 45% alumina has a dimension of 6 cm in length and 5 c in width.
m, the thickness of 0.5 mm is low-temperature sintered to form the ceramic substrate 1; and a chip size of 2.0 × 1. The second step of printing and forming a predetermined electrode pattern for the chip resistance of 25 mm, and the printed and dried ceramic substrate 1 at the firing temperature of 850 ° C.
And a fourth step of printing and forming a resistance pattern designed corresponding to the above electrode pattern on the fired ceramic substrate 1 by using a resistance paste containing ruthenium oxide as a main component, and print drying. A fifth step of firing the formed ceramic substrate 1 at a firing temperature of 850 ° C. to form the resistor 3, and a division substrate 9 in which a slit for division is formed on the ceramic substrate 1 on which the electrode 2 and the resistor 3 are formed. And a seventh step of dividing both end surfaces of the divided substrate 9 on the electrode 2 side, and a sixth step of forming end surface electrodes 5 on both end surfaces of the divided substrate 9 on the electrode 2 side by using an end surface electrode paste. It has eight steps and a ninth step of dividing the divided substrate 9 on which the end face electrodes 5 are formed to form a chip component. As means for forming the dividing slit in the sixth step, the divided substrate 9 having a hardness higher than that of the ceramic substrate 1 is used. high Using a rotary machining blade having a Convenient angular shape, and is intended to press the cutting in a vertical direction the rotary machining blade relative to the ceramic substrate 1.

The method of manufacturing the above chip component will be described in more detail below. The method for forming the dividing slits on the ceramic substrate will be described in detail. A diamond blade is processed into the shape of the rotary processing blade 6 having the shape of an abacus ball. At this time, the tip angle a of the rotary processing blade 6 is 1
It is processed to 30 degrees. A through hole for penetrating the support rod is formed in the center of rotation of the diamond blade (rotation processing blade 6). The guide pin is passed through the through hole of the diamond blade and supported (it becomes the guide portion 7).

At this time, the size of the through-hole and the guide pin in the slit alignment affects the size of the slit for division, so that it is preferable to increase the assembling accuracy within an allowable range. The diamond blade (rotation processing blade 6) having such a structure applies a pressure of 0.5 to 1.0 kg / cm ² to the surface of the ceramic substrate 1 via the guide pins of the guide portion 7 while applying a pressure of 0.5 to 1.0 kg / cm ² . Process while rotating the surface. At this time, a cutting groove with a diamond blade (rotating blade 6) can be formed on the surface of the ceramic substrate 1 to a depth of several μm. Then, when the ceramic substrate 1 is turned upside down, it is made parallel to the dividing slit on an elastic rubber plate or the like, and even if mechanical stress is applied evenly from above the cutting groove, it is pressed along the dividing slit. , Break into the rod-shaped ceramic substrate 1. The surface of the break surface 4 thus formed is smooth and has high dimensional accuracy.

Although the slit for division is several μm, the reason why it is possible to make a break with high dimensional accuracy to the back side is that the size to be cut is several microns, but since it is cut while applying pressure, its sharp rotation. This is because mechanical stress is applied to the ceramic substrate 1 from the processing blade 6, and the microcrack 8 can be scribed up to the back side of the ceramic substrate 1 in an encapsulated state. By applying a pressure, it has a function of containing invisible microcracks 8 therein.

Since each process such as electrode printing firing and resistance printing firing is performed before forming the slits for division, there are no manufacturing troubles such as cracks and cracks in the ceramic substrate. Further, since the dividing slit is formed after firing, the dimensional accuracy becomes very high.

As described above, according to the present embodiment, the electrode formed on the substrate by cutting using the rotary processing blade having a sharp angle shape with higher hardness than the substrate as a means for forming the dividing slit. , The size of the slit for dividing is not formed because cutting chips are not attached to the surface of the functional material such as the resistor and the processed shape of the cut surface is not smoothed, and the slit for dividing is formed after baking the substrate. No error will occur.

Although the above-mentioned embodiment is applied to the manufacture of a chip type resistor, the present invention is a method for manufacturing a chip capacitor in which a thick film capacitor is formed on a ceramic substrate and then a slit for division is formed, It goes without saying that it is also the most suitable method as a method for manufacturing a coil, various sensors in which circuit elements are formed on a ceramic substrate, or a method for manufacturing electronic components such as chip modules in which semiconductor components are mounted.

As the substrate, any material can be applied, such as a low temperature sintered substrate, an alumina substrate, or a glass substrate, as long as it can be formed into a slit for division by a rotary processing blade.

[0020]

As described above, according to the present invention, since the functional material is formed on the substrate after baking to form the slits for division, such a problem occurs when the substrate having the slits for division is fired. It is not necessary to form the functional material according to the dimensional error of the dividing slit, and the reliability and the simplification of the chip component during the manufacturing process can be improved. Further, when the slit for division is formed, the rotary working blade presses the substrate in a direction perpendicular to the cutting, so that a cutting groove of several μm is formed on the substrate, and a micro crack machine is formed from the tip of the cutting groove. When the substrate is divided along the cutting groove that serves as the dividing slit by linearly embedding a mechanical break, the shape of the dividing surface of the substrate is linear due to the linear microcracks from the tip of the cutting groove. It is possible to make all the divided surfaces of the substrate uniform and to prevent the cutting waste of the substrate from adhering to the surface of the substrate and prevent the yield from decreasing.

[Brief description of drawings]

FIG. 1 is a process explanatory view showing a method for manufacturing a chip part of the present invention.

FIG. 2 is a process explanatory view showing a conventional method for manufacturing a chip resistor.

[Explanation of symbols]

 1 Ceramic Substrate 2 Electrode 3 Resistance 4 Break Surface 5 End Surface Electrode 6 Rotating Machining Blade (Scribe Blade) 7 Guide Section 8 Micro Crack 9 Divided Substrate

Claims (2)

[Claims] 1. A first method for forming a functional material on one surface of a substrate.
A step of forming a dividing slit on the substrate on which the functional material is formed, and a third step of dividing the substrate on which the functional material is formed along the dividing slit, and the division in the second step A method of manufacturing a chip component, wherein a rotary machining blade having a sharp angle shape having a hardness higher than that of a substrate is used as a means for forming a slit for use, and the rotary machining blade is pressure-cut in a direction perpendicular to the substrate. 2. The chip component according to claim 1, wherein the substrate on which the dividing slit is formed is divided by providing a processed surface on a flat surface and applying a mechanical stress from the processed back surface along the dividing slit. Manufacturing method.