JPH11168003A - Chip component and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a chip component wherein local bulges are prevented. SOLUTION: All of a resistive film 2, pull-out electrodes 3, and an outer package 4 are embedded within a recess 1a of a chip 1, and the resistive film 2 is located under the pull-out electrodes 3, and moreover the surface height of the extraction electrodes and the surface height of the outer package 14 match with each other and are flush with the upper surface of the chip 1, so that the outward bulge of one part of the component due to the effects of the thickness of he resistive film 2 and the outer package 4 with not occur.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component such as a chip resistor and a method for manufacturing the chip component.

[0002]

2. Description of the Related Art A typical chip resistor as a chip component is formed on one surface of a chip so as to be connected to a prismatic chip, a resistance film formed at the center of one surface of the chip, and both ends of the resistance film. A pair of extraction electrodes, an exterior formed on one surface of the chip so as to cover all of the resistive film and at least a part of the extraction electrodes, and a pair of external electrodes formed on both ends of the chip so as to be connected to each of the extraction electrodes. It has.

[0003] In general, a chip resistor has a resistive film, which is formed in a predetermined arrangement on one surface of a substrate having a size capable of taking a large number.
After forming the extraction electrode and the exterior in order, the substrate is divided into individual chips such that one resistive film and a pair of extraction electrodes remain on one surface of the chip, and external electrodes are formed on both ends of the divided chip. It is manufactured by.

[0004]

In the conventional chip resistor, a resistive film is formed on one surface of the chip, and an outer package is formed so as to cover the resistive film. Will bulge outward. A chip resistor having such a shape needs to be turned upside down when mounted on a circuit board, and a bulk supply method which has attracted attention in recent years, that is, chip components stored in a bulk form are arranged and supplied. Cannot adapt to the scheme. This defect can also occur in other types of chip components having similar configurations and shapes.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a chip component in which local swelling is prevented and a method for manufacturing the chip component capable of accurately manufacturing the chip component. It is in.

[0006]

In order to achieve the above object, a chip component according to the present invention has the following features.
A chip having a concave portion in the center of one surface, a circuit portion embedded in the concave portion, a pair of extraction electrodes provided on the chip so as to be connected to both ends of the circuit portion, and a circuit portion excluding a connection portion of the extraction electrode An exterior provided on the chip so as to cover the surface of the chip, and a pair of external electrodes provided on the chip so as to be connected to each of the extraction electrodes, the circuit portion is located below the extraction electrode, The feature is that the surface height and the surface height of the exterior are the same. According to this chip component, since the circuit portion is located below the extraction electrode and the surface height of the extraction electrode matches the surface height of the exterior, a part of the component is affected by the thickness of the circuit portion and the exterior. Does not bulge outward.

On the other hand, the method for manufacturing a chip component of the present invention
A step of preparing a substrate having at least one linear concave portion on one surface, a step of embedding circuit portions at intervals in the concave portion of the substrate, and both end portions of each circuit portion. Forming extraction electrodes at intervals on the substrate so that they are connected to the substrate; and covering the substrate so that the exposed portions of each circuit section are covered and its own surface height matches the surface height of the extraction electrodes. Forming, a step of dividing the substrate into individual chips so that a concave portion remains in the center of one surface of the chip, and a step of forming a pair of external electrodes on the chip so as to be connected to each of the extraction electrodes. Is its feature. According to this manufacturing method, the chip component described in claim 1 can be suitably manufactured.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS [First Embodiment] FIGS. 1 to 3 show a first embodiment in which the present invention is applied to a chip resistor. FIG. 1 is a plan view of a chip resistor, and FIG. Y- in FIG.
FIG. 3 is a sectional view taken along line XX of FIG. 1.

Reference numeral 1 in the drawing denotes a prism-shaped chip, which is made of a known insulating material, for example, alumina ceramics. At the center of the upper surface of the chip 1 in the length direction, a concave portion 1a having a substantially U-shaped vertical cross section having a predetermined depth and length is provided. In addition, at each of both ends in the longitudinal direction of the concave portion 1a,
A step 1b having a height dimension of about 1/2 of the depth of the recess is provided.

Reference numeral 2 denotes a resistance film having a rectangular planar shape, which is made of a known resistance material, for example, ruthenium oxide. The resistance film 2 is embedded in the recess 1 a of the chip 1. The width dimension of the resistive film 2 is smaller than the width dimension of the chip 1 (recess 1a), the thickness dimension corresponds to the dimension from the bottom surface of the recess 1a to the upper surface of the step 1b, and the length dimension is the height of the step of the recess 1a. It corresponds to the distance between the parts 1b.

Reference numeral 3 denotes a pair of extraction electrodes having a rectangular planar shape, which is made of a known electrode material, for example, silver. Each extraction electrode 3
Are embedded at both ends in the longitudinal direction (upper portions of the step portion 1b) in the concave portion 1a of the chip 1 so that one end in the length direction overlaps and connects to both ends of the resistive film 2. The width dimension of each extraction electrode 3 matches the width dimension of the resistive film 2, the thickness dimension corresponds to the dimension from the upper surface of the step 1b to the opening edge of the recess 1a, and the length dimension is the upper surface of the step 1b. Slightly larger than the length dimension.

Reference numeral 4 denotes an exterior having a substantially rectangular planar shape, which is made of a known exterior material, for example, quartz glass. This exterior 4
The concave portion 1 of the chip 1 covers the entire surface of the resistive film 2 except for the connection portion of the extraction electrode 3 and the inner end surface of each extraction electrode 3.
It is buried in a. The width of the package 4 matches the width of the chip 1, the thickness above the resistive film 2 matches that of the extraction electrode 3, and the length dimension of the extraction electrode 3
In the intervening portion, the distance matches the distance between the extraction electrodes 3, and in other portions, the length matches the length of the concave portion 1a.

That is, the resistance film 2, the extraction electrode 3 and the exterior 4 are all buried in the recess 1 a of the chip 1.
The sum of the thickness of the resistive film 2 and the thickness of the outer case 4 above the resistive film 2 matches the depth of the recess 1a. Also,
Since the thickness dimension of the extraction electrode 3 and the thickness dimension of the outer package 4 on the upper side of the resistance film 2 match, the surface height of the extraction electrode 3 and the surface height of the exterior 4 match each other and are flush with the upper surface of the chip 1. In state.

Reference numeral 5 denotes a pair of external electrodes, which are well-known electrode materials;
For example, it is made of silver. Each external electrode 5 is provided at both ends of the chip 1 so as to cover the entire surface of the extraction electrode 3 and both ends of the surface of the exterior 4 and is connected to the extraction electrode 3.

Here, a manufacturing procedure of the chip resistor shown in FIGS. 1 to 3 will be described with reference to FIGS. still,
In the illustrated example, the manufacturing method is described using a six-piece board, but in actuality, a board having a size capable of taking a larger number of components than this is used.

First, as shown in FIG. 4, a substrate having, for example, an alumina substrate CS having parallel linear recesses LG at predetermined intervals on one surface is prepared. This substrate CS is formed by using a ceramic slurry containing alumina powder as a material and using a method such as a doctor blade to form a green sheet having a predetermined thickness, and from this, a unit-shaped green sheet (unfired ceramic substrate) is die-cut. And the like, a step of forming a linear concave portion LG in the green sheet by a method such as embossing, and a step of firing the green sheet at a predetermined temperature.

Next, as shown in FIG. 5, a resist paste containing a ruthenium oxide powder is formed in each concave portion LG of the substrate CS in a predetermined shape and thickness using a method such as screen printing or the like. Is applied at regular intervals along the line and is baked at a predetermined temperature to form a resistive film RF.

Next, as shown in FIG. 6, an electrode paste containing silver powder is formed on both sides of each resistive film RF in each concave portion LG of the substrate CS by using a method such as screen printing or the like. The lead electrode EC is formed with a thickness and applied at regular intervals along the concave portion LG and baked at a predetermined temperature.

Next, as shown in FIG. 7, an exterior paste mainly composed of quartz glass is applied to each recess LG of the substrate CS in a predetermined shape and thickness by using a method such as screen printing. At a predetermined temperature to form an exterior AF.

Next, as shown in FIG. 8, using a cutting tool such as a diamond blade, the substrate CS is cut along the lines shown by broken lines in the figure, and divided into individual chips CC.

Next, as shown in FIG. 9, an electrode paste containing silver powder is applied to both ends of each chip CC in a predetermined shape and thickness by using a technique such as dipping, and is applied to a predetermined temperature. To form external electrodes EE.

The chip resistor according to the present embodiment has a resistance film 2
The extraction electrode 3 and the exterior 4 are all buried in the recess 1 a of the chip 1, the resistive film 2 is located below the extraction electrode 3, and the surface height of the extraction electrode 3 and the surface of the exterior 4 are different. Since they match each other and are flush with the upper surface of the chip 1, a part of the component does not bulge outward due to the influence of the thickness of the resistive film 2 and the outer package 4. In other words, since the shape of the component itself is substantially symmetrical in the longitudinal direction, the width direction, and the thickness direction, and has no direction limitation such as front and back, it is troublesome to align the front and back when mounting on a circuit board as in the related art. Is eliminated, and adaptation to a bulk supply method that has been attracting attention in recent years becomes possible.

Further, according to the manufacturing method of the present embodiment, the substrate CS having the linear concave portions LG is formed in a unit-shaped green sheet (unfired ceramics substrate) by embossing or the like to form the linear concave portions LG. After that, since the unfired ceramics substrate is formed by firing, the inner surface of the recess LG is more smoothly finished and the recess L is compared with a case where similar recesses are formed by grinding in the fired substrate.
The dimensional variation of G can be suppressed, whereby the dimensional accuracy of the resistive film RF embedded in the concave portion LG can be increased.

After the extraction electrode EC is formed in the component manufacturing process, trimming for adjusting the resistance value of the resistance film 2 may be appropriately performed. Specifically, in a state where the detection terminal is brought into contact with the extraction electrode EC on both sides of the resistive film, the surface of the resistive film RF is irradiated with a laser beam in the infrared region to irradiate the resistive film R.
A method of forming a slit in F can be adopted as a resistance value adjusting method.

Second Embodiment FIGS. 10 to 12 show a second embodiment in which the present invention is applied to a chip resistor. FIG. 10 is a plan view of the chip resistor, and FIG. FIG. 12 is a sectional view taken along line XX of FIG. 10.

In the drawing, reference numeral 11 denotes a prism-shaped chip, which is made of a known insulating material, for example, alumina ceramics. At the center in the longitudinal direction of the upper surface of the chip 11, a concave section 11a having a U-shaped vertical section having a predetermined depth and length is provided.

Reference numeral 12 denotes a resistance film having a rectangular planar shape, which is made of a known resistance material, for example, ruthenium oxide. The resistance film 12 is embedded in the recess 11 a of the chip 11. The width dimension of the resistive film 12 is smaller than the width dimension of the chip 11 (the concave section 11a), the thickness dimension corresponds to the depth dimension of the concave section 11a, and the length dimension coincides with the length dimension of the concave section 11a. .

Reference numeral 13 denotes a pair of extraction electrodes having a rectangular planar shape, which is made of a known electrode material, for example, silver. Each of the extraction electrodes 13 is provided at both ends of the upper surface of the chip 11 such that one end in the longitudinal direction thereof coincides with the end of the chip, and the other end in the longitudinal direction overlaps and connects to both ends of the resistive film 12. Is provided. The width of each extraction electrode 13 matches the width of the resistance film 12.

14 is an exterior having a substantially rectangular planar shape.
It is made of a known exterior material, for example, quartz glass. The exterior 14 is provided from the inside of the concave portion 11 a of the chip 11 to the upper surface so as to cover the entire surface of the resistive film 12 except for the connection portion of the extraction electrode 13 and the inner end surface of each extraction electrode 13.
The width of the outer case 14 matches the width of the chip 11, the thickness above the resistive film 12 matches that of the extraction electrode 13, and the length between the extraction electrodes 13 at the portion between the extraction electrodes 13. The distance coincides with the length of the chip 11 at other portions.

That is, the resistance film 12 is embedded in the recess 11a of the chip 11, and the thickness of the resistance film 12 matches the depth of the recess 11a. Further, since the thickness dimension of the extraction electrode 13 and the thickness dimension of the exterior 14 above the resistance film 12 match, the surface height of the extraction electrode 13 and the surface height of the exterior 14 match each other.

Reference numeral 15 denotes a pair of external electrodes, which are made of a known electrode material, for example, silver. Each external electrode 15 is an extraction electrode 1
3 are formed on both ends of the chip 11 so as to cover the entire surface of the chip 3 and both ends of the surface of the exterior 14, and are connected to the extraction electrodes 13.

Here, a manufacturing procedure of the chip resistor shown in FIGS. 10 to 12 will be described with reference to FIGS. In the illustrated example, the manufacturing method is described using a six-piece board. However, in the actual example, a board having a size capable of taking a larger number of components is used.

First, as shown in FIG. 13, a substrate, for example, an alumina substrate CS having parallel linear concave portions LG on one surface at predetermined intervals is prepared. This substrate CS is formed by using a ceramic slurry containing alumina powder as a material and using a method such as a doctor blade to form a green sheet having a predetermined thickness, and from this, a unit-shaped green sheet (unfired ceramic substrate) is die-cut. And the like, a step of forming a linear concave portion LG in the green sheet by a method such as embossing, and a step of firing the green sheet at a predetermined temperature.

Next, as shown in FIG. 14, a resist paste containing a ruthenium oxide powder is formed in each concave portion LG of the substrate CS in a predetermined shape and thickness by using a method such as screen printing. Is applied at regular intervals along the line and is baked at a predetermined temperature to form a resistive film RF.

Next, as shown in FIG. 15, an electrode paste containing silver powder is formed on both sides of each resistive film RF on the entire surface of the substrate in a predetermined shape and thickness using a technique such as screen printing or the like. It is applied at equal intervals along the LG, and is baked at a predetermined temperature to form the extraction electrode EC.

Next, as shown in FIG. 16, an exterior paste mainly composed of quartz glass is applied to the inside of each recess LG of the substrate CS in a predetermined shape and thickness using a method such as screen printing. Then, this is baked at a predetermined temperature to form the exterior AF.

Next, as shown in FIG. 17, using a cutting tool such as a diamond blade, the substrate CS is cut along the lines shown by broken lines in the figure, and divided into individual chips CC.

Next, as shown in FIG.
An electrode paste containing silver powder is applied in a predetermined shape and thickness by using a technique such as dipping on both ends of the electrode paste, and is baked at a predetermined temperature to form an external electrode EE.

The chip resistor of the present embodiment has a resistance film 12
Is embedded in the recess 11a of the chip 11, the resistance film 12 is located below the extraction electrode 13, and the surface height of the extraction electrode 13 and the surface height of the exterior 14 match each other. A part of the component does not bulge outward due to the influence of the thickness of the resistive film 12 and the exterior 14. In other words, since the shape of the component itself is substantially symmetrical in the longitudinal direction, the width direction, and the thickness direction, and has no direction limitation such as front and back, it is troublesome to align the front and back when mounting on a circuit board as in the related art. Is eliminated, and adaptation to a bulk supply method that has been attracting attention in recent years becomes possible.

According to the manufacturing method of this embodiment, as in the first embodiment, the substrate CS having the linear concave portions LG is formed.
Is formed by forming a linear concave portion LG in a unit-shaped green sheet (unfired ceramics substrate) by a method such as embossing and then firing the unfired ceramics substrate. As compared with the case where the same recess is formed by grinding, the inner surface of the recess LG can be finished more smoothly and the dimensional variation of the recess LG can be suppressed, whereby the resistance film RF embedded in the recess LG can be formed. The dimensional accuracy can be improved.

Although the electrode EC and the exterior AF are cut together with the substrate CS in the component manufacturing process, a chip resistor having no cut surface on the exterior can be obtained by forming the exterior AF individually in units of resistive films. If two extraction electrodes EC are formed for each resistive film, a chip resistor having no cut surface in the extraction electrode can be obtained.

In the part manufacturing process, the extraction electrode EC is used.
After the formation, the trimming for adjusting the resistance value of the resistance film 2 may be appropriately performed. Specifically, a method of forming a slit in the resistive film RF by irradiating the surface of the resistive film RF with a laser beam in the infrared region while the detection terminal is in contact with the extraction electrode EC on both sides of the resistive film is known. It can be adopted as a value adjustment method.

As described above, in each of the above embodiments, the present invention is applied to a chip resistor. However, the present invention is applied to other types of chip parts having a circuit portion other than a resistive film and an exterior covering the circuit portion. Can be widely applied, and the same effect can be obtained.

[0044]

As described above in detail, according to the chip component of the present invention, a part of the component does not bulge outward due to the influence of the thickness of the circuit portion and the outer package, and the shape of the component itself can be changed from front to back. It can be made into a shape without any direction restrictions, so that it does not have to be face-to-face as in the past when mounting on a circuit board, and it is possible to adapt to the bulk supply method that has been attracting attention recently. Can be greatly improved. Further, according to the method of manufacturing a chip component of the present invention, the above-mentioned chip component can be suitably and stably manufactured.

[Brief description of the drawings]

FIG. 1 is a plan view of a chip resistor according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line YY of FIG.

FIG. 3 is a sectional view taken along line XX of FIG. 1;

FIG. 4 is a diagram showing a manufacturing procedure of the chip resistor according to the first embodiment;

FIG. 5 is a diagram showing a manufacturing procedure of the chip resistor according to the first embodiment;

FIG. 6 is a diagram showing a manufacturing procedure of the chip resistor according to the first embodiment;

FIG. 7 is a view showing a manufacturing procedure of the chip resistor according to the first embodiment;

FIG. 8 is a diagram showing a manufacturing procedure of the chip resistor according to the first embodiment;

FIG. 9 is a diagram showing a manufacturing procedure of the chip resistor according to the first embodiment;

FIG. 10 is a plan view of a chip resistor according to a second embodiment of the present invention.

11 is a sectional view taken along line YY of FIG.

FIG. 12 is a sectional view taken along line XX of FIG. 10;

FIG. 13 is a diagram showing a manufacturing procedure of the chip resistor of the second embodiment.

FIG. 14 is a view showing a manufacturing procedure of the chip resistor according to the second embodiment;

FIG. 15 is a view showing a manufacturing procedure of the chip resistor according to the second embodiment;

FIG. 16 is a diagram showing a manufacturing procedure of the chip resistor according to the second embodiment;

FIG. 17 is a diagram showing a manufacturing procedure of the chip resistor according to the second embodiment;

FIG. 18 is a view showing a manufacturing procedure of the chip resistor according to the second embodiment;

[Explanation of symbols]

1, 11: chip, 1a, 11a: concave portion, 1b: step portion,
2,12: Resistive film, 3,13: Lead electrode, 4,14: Exterior, 5,15: External electrode, CS: Substrate, LG: Concave, R
F: resistive film, EC: extraction electrode, AF: exterior, CC: chip, EE: external electrode.

Claims (4)

[Claims] 1. A chip having a recess in the center of one surface, a circuit portion embedded in the recess, a pair of extraction electrodes provided on the chip so as to connect to both ends of the circuit portion, and connection of the extraction electrodes. It has an exterior provided on the chip so as to cover the surface of the circuit part excluding the part, and a pair of external electrodes provided on the chip so as to be connected to each of the extraction electrodes, and the circuit part is below the extraction electrode A chip component, wherein the surface height of the extraction electrode is equal to the surface height of the exterior. 2. The chip component according to claim 1, wherein the extraction electrode and the exterior are buried in the recess. 3. A step of preparing a substrate having at least one linear concave portion on one surface, a step of burying a circuit portion at intervals in the concave portion of the substrate, and connecting to both ends of each circuit portion. Forming extraction electrodes at intervals on the substrate, and forming an exterior on the substrate so as to cover the exposed portions of the respective circuit portions and to adjust the surface height of the extraction electrodes to the surface height of the extraction electrodes. And a step of dividing the substrate into individual chips so that a concave portion remains in the center of one surface of the chip, and a step of forming a pair of external electrodes on the chip so as to be connected to the respective extraction electrodes. Manufacturing method of chip parts. 4. The substrate preparing step includes: forming a linear concave portion in the unfired ceramic substrate by stamping.
Baking the unfired ceramics substrate after forming the recesses.