JPH11176603A - Chip resistor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent occurrence of spread in printing a resistor in order to stabilize a resistance value, by forming a recess on a surface of an insulating substrate, forming a resistor in the recess, and bridging a pair of electrodes by the resistor. SOLUTION: Break grooves 1 are press-molded in the shape of a lattice on both top and bottom surface of a substrate essentially formed of alumina rectangular recesses 3 are formed in unit regions 2 partitioned by the break grooves 1, and then the substrate is fired. Subsequently, conductive paste containing silver, palladium and the like is coated opposite to both surfaces of the substrate every unit region 2, the end of top surface is printed to face onto the recesses 3, and top and bottom surface electrodes 4a and 4b are formed by firing the substrate. Resistive paste containing ruthenium oxide is printed in the recesses 3 to bridge the electrodes 4a of the top surface, and resistors 5 are formed by firing the substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip resistor, and more particularly, to a chip resistor capable of stabilizing the volume of a resistor and being formed as thin as possible.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 23, a chip-type resistor X is composed of an insulating substrate 100 formed in a chip shape made of ceramics, and a pair of opposed electrodes 200, 200 formed on the insulating substrate 100. Resistor 300 formed so as to bridge between both electrodes 200, 200, and glass coat covering this
400, each electrode 200, a resistor 300,
Each of the glass coats 400 is formed by printing and baking.

[0003]

However, the insulating substrate 10
Since the resistor 300 and the glass coat 400 are formed on the plane 0, the resistor X is raised and has no flatness, and the thickness of the entire resistor X is increased.

[0004] Further, since the resistor 300 is printed on a flat surface, bleeding 350 tends to occur at the time of printing, and the volume of the resistor 300 is not constant due to the bleeding 350, and the resistance value varies. There was a problem that it became large.

An object of the present invention is to provide a chip type resistor which can solve the above-mentioned problems.

[0006]

Therefore, in order to solve the above-mentioned problems, according to the present invention, there is provided an insulating substrate having a concave portion formed on a surface thereof, a resistor formed in the concave portion, And a pair of electrodes bridging through the body. Therefore, a flat and thin chip resistor can be obtained. In addition, the occurrence of bleeding during printing of the resistor is also prevented, the volume of the resistor becomes constant, and the resistance value is stabilized.

According to the present invention, at least a pair of electrodes, at least a part of which faces the inside of the recess, are formed to face each other, and the inside of the recess is formed so as to bridge the same pair of electrodes. A resistor was formed. Therefore, it is possible to obtain a flat and thin chip-type resistor while maintaining the conventional manufacturing process for electrode printing, resistor printing, and the like. The body volume becomes constant and the resistance value stabilizes.

According to the present invention, a second concave portion for electrode printing is further provided outward from the concave portion. Therefore, the electrodes can be made flatter and thinner by printing in the recesses.

According to the present invention, the surface height of the resistor is substantially the same as the surface electrode. Therefore, the chip surface becomes flatter.

Further, according to the present invention, the resistor is formed substantially flush with the surface of the insulating substrate. Therefore, the thickness of the resistor is eliminated on the insulating substrate, and a flat and thin chip resistor having only the thickness of the insulating substrate and the glass coat can be obtained.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A chip resistor according to the present invention comprises:
It comprises an insulating substrate having a recess formed on the surface, a resistor formed in the recess, and a pair of electrodes bridging through the resistor.

In manufacturing, first, a concave portion is formed on a chip-shaped insulating substrate, and at least a pair of electrodes partially facing the concave portion are formed to face each other, and the same pair of electrodes are bridged. As described above, the resistor can be formed in the recess.

That is, a lattice-shaped break groove is formed in a large-sized insulating substrate, and a recess for printing a resistance paste is formed in each unit area defined by the break groove.

Next, a conductive paste containing silver and palladium is placed in an opposed state in each unit area, and
Printing and firing so that the tip faces the recess,
A part thereof forms a pair of surface electrodes facing the recess.

Then, a resistive paste containing ruthenium oxide is printed in the concave portion so as to bridge the pair of surface electrodes, and is fired to form a resistor.

At this time, since the resistive paste is printed in the concave portions, there is no possibility that the electrodes are securely bridged to cause a conduction failure and the edges are formed without bleeding. The volume of the resistor is also constant.

Next, a glass paste is printed and fired on the resistor to coat it with a glass, and then trimmed appropriately to adjust the resistance value to obtain a finished product.

As described above, in the chip type resistor according to the present invention, since the resistor is formed in the concave portion, there is no swelling, a flat finish even when coated with glass, and a thin type resistor. it can.

In this case, the resistor is formed halfway to the entire depth of the recess, or at least shallower than the surface of the surface electrode, and the inside of the recess is filled with a glass coat to match the height of the surface electrode. As described later, the surface height of the resistor can be adjusted to the surface electrode, and a glass coat can be formed thereon.

As described above, when the glass coat is flat, a clear mark can be formed on the glass coat, and since the thickness is reduced, the transfer efficiency in the case of stacking and transferring is improved.

In order to prevent the surface electrode from projecting from the insulating substrate, a second concave portion for electrode printing is provided in advance from the concave portion to the outside, and the surface electrode is provided in the second concave portion. Can be printed so that the electrode surface height is substantially the same as that of the insulating substrate. Therefore, a flatter and thinner chip-type resistor can be obtained.

Further, the surface height of the resistor can be substantially the same as the surface electrode. In this case, if all of the resistance paste is contained in the concave portion, the glass coat formed in the subsequent process can be surely formed into a thin and flat shape.
Further, the resistance paste may be printed so as to slightly protrude from the concave portion, and in any case, the chip surface can be made flatter.

Further, the resistor may be formed by printing and baking a resistor paste in a state substantially flush with the surface of the insulating substrate.

In this case, the surface electrode is connected to the second electrode as described above.
If it is formed in the recess, the surface electrode and the resistor are almost the same as the surface height of the insulating substrate. If the glass coat is formed thin, a very thin chip resistor can be manufactured.

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be specifically described below with reference to the drawings.

FIG. 1 shows a large-sized insulating substrate B for dividing and forming a chip type resistor A according to the present invention, and FIG.
FIG. 2 is a sectional view taken along line II of FIG.

The insulating substrate B shown in FIG. 1 shows a state in which a resistor 5 is formed in a concave portion 3 formed for each unit area 2, and the following steps are performed until this state.

That is, first, a break groove 1 is press-formed in a grid pattern on the front and back surfaces of a substrate mainly composed of alumina, and a unit region 2 defined by each break groove 1 is formed.
A rectangular recess 3 is formed in the inside, and this is fired.

Thereafter, a conductive paste containing silver or palladium is opposed to each other in each unit region 2 on both surfaces of the substrate in each unit region 2.
It is printed so as to face inside, and is baked to form the front and back electrodes 4a and 4b (see FIG. 4).

Next, a resistor paste containing ruthenium oxide is printed in the recess 3 so as to bridge between the electrodes 4a on the substrate surface, and baked to form a resistor 5 as shown in FIG. An insulated substrate B is obtained. At this time, since the tips of the pair of electrodes 4 are formed in the recess 3, respectively,
Is reliably bridged between the electrodes 4 and 4, and the edge is reliably formed by the concave portion 3 without bleeding, so that the volume is also constant.

Thereafter, a chip type resistor A is obtained by the following steps.

That is, a glass paste is printed on the resistor 5 and baked to form a glass coat 6 (see FIG. 3), and then the resistor 5 is trimmed by a trimming device (not shown) to adjust the resistance value. I do.

Then, this is also divided by a breaker (not shown) along the break groove 1 in the direction of the line II in FIG. 1 to form a strip-shaped insulating substrate to form the side electrode 4c. Chips are formed along the respective break grooves 1 by a device to obtain chip resistors A.

(First Embodiment) FIG. 3 is a perspective view of a chip-type resistor (hereinafter referred to as a resistor) A according to a first embodiment, FIG. 4 is a sectional view of the resistor A, and FIG. FIG. 2 is an explanatory diagram showing components of A in an exploded manner in a layer direction.

As shown in FIGS. 3 to 5, the resistor A according to the present embodiment has front and rear electrodes 4a, 4b and 4 on the short side of a rectangular unit region 2 divided from an insulating substrate B. Side electrode 4c
And a pair of electrodes 4 composed of
Are formed on the bottom 41 of the concave portion 3 formed in the same rectangular shape as the unit region 2, the rising portion 42 rising along the peripheral wall of the concave portion 3, and the flat portion 2 a of the unit region 2. Surface
43 and from one.

A resistor 5 bridging the pair of electrodes 4, 4
Are the front end 41 of the surface electrode 4a and the rising
Printed and baked in a superposed state with the surface area 43 and in a state substantially flush with the surface portion 43. As shown in FIGS. 3 and 4, a flat resistance including the surface electrode 4a is provided on the unit region 2. A surface will be formed. Therefore, the glass coat 6 for protecting the resistor 5 can also be printed and fired flat.

As described above, the resistor A according to the present embodiment is
Since the flatness is excellent and the thickness can be reduced, the mark can be clearly printed on the glass coat 6, and the number of laminations can be increased at the time of transportation in the lamination state. Can be improved.

In addition, when printing the resistive paste,
Thereby, since the outline is clear without blurring the edge, the volume after firing becomes constant, and the resistance value can be easily managed.

FIG. 6 shows another embodiment of the present embodiment. This is because the electrode 4 is a surface electrode of the resistor A shown in the first embodiment.
The difference is that the shape is the same as 4a except for the tip 41, and the volume of the resistor 5 is correspondingly large.

(Second Embodiment) FIG. 7 is a perspective view of a chip-type resistor (hereinafter referred to as a resistor) A according to a second embodiment, FIG. 8 is a sectional view of the resistor A, and FIG. FIG. 2 is an explanatory diagram showing components of A in an exploded manner in a layer direction.

This embodiment differs from the first embodiment in that a second recess 20 for electrode printing is provided outward from the recess 3.

That is, from the short side of the concave portion 3 to the short side of the unit region 2, the surface electrode 4 a is the unit region 2 which is an insulating substrate.
A second concave portion 20 for electrode printing is provided so as not to protrude from the surface of the surface electrode 4a.
Is printed so that the electrode surface height is substantially the same as that of the insulating substrate.

Therefore, in this embodiment, FIGS.
As shown in (2), since the surface height of the resistor 5 is the same as that of the surface electrode 4 and is flush with the plane portion 2a of the unit region 2, the entire surface of the unit region 2 is the surface electrode. 4a, the resistor and the resistor 5 are flat, and the glass coat 6 can be reliably printed and fired in a flat state.

Further, as compared with the first embodiment, since the surface electrode 4a is in the buried state, it can be formed thinner and the product can be reduced in size.

(Third Embodiment) FIG. 10 shows a resistor A according to a third embodiment. This is similar to the second embodiment in that the surface height of the resistor 5 is substantially flush with the plane portion 2a of the unit region 2, but the electrode 4 is similar to the other embodiments of the first embodiment. In addition, the surface portion 43 is formed on the plane portion 2a of the unit region 2, and the front end portion 41 of the surface electrode 4a is removed.

In FIG. 10, the glass coat 6 has a thickness sufficient to cover the surface electrode 4a. However, a thin coating may be used as long as the resistor 5 can be protected.

(Fourth Embodiment) FIG. 11 shows a resistor A according to a fourth embodiment. This is different from the previous embodiment in that the glass coat 6 covers only the surface of the resistor 5.

That is, the surface electrode 4a is exposed and the glass coat 6 is printed and fired so as to be flush with the height of the surface electrode 4a. In this embodiment, even the thickness of the glass coat 6 is absorbed. Therefore, it is possible to manufacture the resistor A which is the thinnest and has excellent flatness.

(Fifth Embodiment) FIGS. 12 and 13 show a resistor A according to a fifth embodiment. This is because, as described in the second embodiment, from the short side of the concave portion 3 to the short side of the unit region 2, the electrode printing is performed so that the surface electrode 4a does not protrude from the surface of the unit region 2 which is an insulating substrate. Second recess 20 for
And the surface electrode 4a is printed in the second recess 20 so that the electrode surface height is substantially the same as that of the insulating substrate, and as described in the fourth embodiment, the glass coat 6 is formed. Indicates that only the surface of the resistor 5 is covered. Here, as shown in FIG. 14, the inner wall portion 20a of the second concave portion 20 is formed to be recessed more deeply than the inner wall portion 3b of the concave portion 3.

The surface electrode 4a of the electrode 4 is formed integrally and continuously from a tip portion 41 provided on the bottom surface of the concave portion 3, a rising portion 42, and a surface portion 43. The recess 20 is formed along the inner wall portion 20a. Even with such a configuration, the entire surface of the unit region 2 can be made flat and thin.

FIGS. 15 and 16 show another embodiment of the present embodiment. This is because the inner wall 3b of the recess 3 and the second
As shown in FIG. 17, the inner wall portion 20a of the concave portion 20 is formed in an inclined shape. Therefore, the rising part 42 of the electrode 4 is also inclined.

With such a configuration, the concave portion 3 or the second concave portion
The inner edge of 20 becomes almost flat, and the printing of the resistor 5 and the electrode 4 becomes easy.

(Sixth Embodiment) FIG. 18 shows a resistor A according to a sixth embodiment. This is because, in the first to fifth embodiments, the resistor 5 is formed first, and the electrode 5 is formed on the resistor 5 after the electrode 4 is formed in the recess 3 first. 4 are formed in an opposed state and are bridged to each other via a resistor 5.

Since the surface electrode 4a of the electrode 4 in the present embodiment only needs to be the surface portion 43, printing is easy.

(Seventh Embodiment) FIGS. 19 and 20 show a resistor A according to a seventh embodiment. This is the same as the resistor A according to the sixth embodiment, in which the resistor 5 is first formed in the recess 3, but the short side of the recess 3 as described in the second embodiment. A second concave portion 20 for electrode printing is provided so that the surface electrode 4a does not protrude from the surface of the unit region 2 which is an insulating substrate from the surface of the unit region 2 to the short side of the unit region 2. The electrode 4a is printed.

(Eighth Embodiment) FIGS. 21 and 22 show an eighth embodiment.
1 shows a resistor A according to an embodiment. This is different from the seventh embodiment in that the glass coat 6 covers only the surface of the resistor 5.

That is, as described in the fourth and fifth embodiments, the surface electrode 4a is exposed and the glass coat 6 is printed and fired so as to be flush with the height of the surface electrode 4a. It is.

Although the present invention has been described with reference to each embodiment, the present invention is not limited to the above-described embodiment, and a pair of electrodes at least partially facing the recess 3 formed on the unit region 2. 4 includes all the elements in which the resistor 5 is formed in the concave portion 3 so as to bridge between them. With this configuration, a flat and thin chip-type resistor A can be obtained. 5, the occurrence of bleeding during printing is also prevented,
The volume of the resistor 5 becomes constant, and the resistance value becomes stable. Moreover, since at least a part of the electrode 4 faces the recess 3, it is possible to reliably bridge with the resistor 5.
There is no risk of causing poor conductivity.

[0059]

The present invention is embodied in the above embodiment and has the following effects.

According to the first aspect of the present invention, an insulating substrate having a concave portion formed on the surface thereof, a resistor formed in the concave portion,
By providing a pair of electrodes bridging through the resistor, a flat and thin chip resistor can be obtained. In addition, the occurrence of bleeding during printing of the resistor is also prevented, the volume of the resistor becomes constant, and the resistance value is stabilized.

According to the second aspect of the present invention, a concave portion is formed on a chip-shaped insulating substrate, and at least a pair of electrodes partially facing the concave portion are formed to face each other. By forming a resistor in the concave portion so as to bridge, a flat and thin chip resistor can be obtained as described above, and occurrence of bleeding during printing of the resistor is prevented, The volume is constant and the resistance value is stable,
In addition, the transfer efficiency is improved when the transfer is performed in a stacked state.
In addition, since at least a part of the electrode faces the recess, it is possible to reliably bridge the resistor,
There is no risk of causing poor conductivity.

According to the third aspect of the present invention, in addition to the above effect, the electrodes are also printed in the concave portions by providing the second concave portions for electrode printing outward from the concave portions. Thus, it can be made flatter and thinner.

According to the present invention, the surface height of the resistor is made substantially the same as that of the surface electrode, so that the chip surface can be made flatter in addition to the above-mentioned effects.

According to the fifth aspect of the present invention, the resistor is formed substantially flush with the surface of the insulating substrate. In addition to the above effects, the thickness of the resistor on the insulating substrate is reduced. A flat and thin chip resistor having only the thickness of the insulating substrate and the glass coat can be obtained, and if the electrode is formed in the second recess as described above,
The thinnest chip-type resistor can be manufactured, and the transport efficiency is improved when transported in a stacked state.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a large-sized insulating substrate for forming a chip-type resistor according to the present invention in a divided manner.

FIG. 2 is a cross-sectional view taken along line II of FIG.

FIG. 3 is a perspective view of the chip resistor according to the first embodiment.

FIG. 4 is a sectional view of the resistor.

FIG. 5 is an explanatory diagram showing components of the resistor disassembled in a layer direction.

FIG. 6 is a cross-sectional view of a chip resistor according to another embodiment of the first embodiment.

FIG. 7 is a perspective view of a chip resistor according to a second embodiment.

FIG. 8 is a sectional view of the resistor.

FIG. 9 is an explanatory diagram showing components of the resistor disassembled in a layer direction.

FIG. 10 is a sectional view of a chip resistor according to a third embodiment.

FIG. 11 is a sectional view of a chip resistor according to a fourth embodiment.

FIG. 12 is a perspective view of a chip resistor according to a fifth embodiment.

FIG. 13 is a sectional view of the resistor.

FIG. 14 is an explanatory diagram of a second concave portion of the resistor.

FIG. 15 is a perspective view showing another form of the resistor according to the fifth embodiment.

FIG. 16 is a sectional view of the resistor.

FIG. 17 is an explanatory diagram of a second concave portion of the resistor.

FIG. 18 is a sectional view of a chip-type resistor according to a sixth embodiment.

FIG. 19 is a perspective view of a chip resistor according to a seventh embodiment.

FIG. 20 is a sectional view of the resistor.

FIG. 21 is a perspective view of a chip-type resistor according to an eighth embodiment.

FIG. 22 is a sectional view of the resistor.

FIG. 23 is a sectional view of a conventional chip-type resistor.

[Explanation of symbols]

 Reference Signs List A chip type resistor B insulating substrate 2 unit area 3 recess 4 electrode 4a surface electrode 4b back electrode 4c side electrode 5 resistor 6 glass coat 20 second recess

Claims (5)

[Claims] 1. A chip-type resistor comprising: an insulating substrate having a concave portion formed on a surface thereof; a resistor formed in the concave portion; and a pair of electrodes bridging through the resistor. . 2. A method according to claim 1, wherein a pair of electrodes, at least a part of which faces the inside of the recess, are formed facing each other, and a resistor is formed in the recess so as to bridge the same pair of electrodes. The chip type resistor according to claim 1. 3. The chip type resistor according to claim 1, wherein a second concave portion for electrode printing is provided outward from the concave portion. 4. The chip-type resistor according to claim 1, wherein a surface height of said resistor is substantially the same as a surface electrode. 5. The chip-type resistor according to claim 1, wherein said resistor is formed substantially flush with a surface of an insulating substrate.