JPH09330802A - Resistor and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the substrate of a resistor mountable on a mounting substrate by using either surface side of the substrate by forming a protective layer so that the layer can cover the upper surfaces of at least first upper-surface electrode layers and a resistance layer and a pair of second upper-surface electrode layers in the side section of the upper surface of the protective layer. SOLUTION: A pair of first upper-surface electrode layers 22 are provided in the side section of the upper surface of a substrate 21 to the side edges of the substrate 21 and a resistance layer 23 is provided on the upper surface of the substrate so that part of the layer 23 can be electrically connected to the layers 22 in an overlapping state. Then a protective layer 24 composed of lead borosilicate glass, or epoxy resin, etc., is formed on the layer 23 to the side edges of the substrate 21 so that the layer 24 can cover the upper surfaces of at least the layers 22 and 23. In addition, a pair of second upper- surface electrode layers 25 composed of a mixture of silver and glass or a phenolic type resin, etc., is provided in the side section of the upper surface of the layer 24 to the side edges of the substrate 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resistor and a method for manufacturing the same.

[0002]

2. Description of the Related Art The prior art is disclosed in Japanese Patent Laid-Open No. 4-102302.
Is disclosed in US Pat.

A conventional resistor and a method for manufacturing the same will be described below with reference to the drawings.

FIG. 9 is a sectional view of a conventional resistor. In the figure, reference numeral 1 denotes an insulating substrate. Reference numeral 2 is a first upper surface electrode layer provided on the left and right ends of the upper surface of the insulating substrate 1. Reference numeral 3 denotes a resistance layer provided so as to partially overlap the first upper electrode layer 2. Reference numeral 4 denotes a first protective layer provided so as to cover only the entire resistive layer 3. Reference numeral 5 is a trimming groove provided in the resistance layer 3 and the first protective layer 4 for correcting the resistance value. Reference numeral 6 is a second protective layer provided only on the upper surface of the first protective layer 4. Second reference numeral 7 is provided on the upper surface of the first upper electrode layer 2 so as to extend to the full width of the insulating substrate 1.
Of the upper electrode layer. Reference numeral 8 denotes a side surface electrode layer provided on the side surface of the insulating substrate 1. Reference numerals 9 and 10 denote a nickel plating layer and a solder plating layer provided on the surfaces of the second upper surface electrode layer 7 and the side surface electrode layer 8. At this time, the solder plating layer 10
Is provided lower than the second protective layer 6. That is, in the conventional resistor, the second protective layer 6 is provided highest.

A method of manufacturing the conventional resistor having the above-described structure will be described below with reference to the drawings.

10 and 11 are process diagrams showing a conventional method for manufacturing a resistor. First, as shown in FIG. 10A, the first upper surface electrode layer 2 is formed by coating on both left and right ends of the upper surface of the insulating substrate 1.

Next, as shown in FIG. 10B, a resistance layer 3 is formed by coating on the upper surface of the insulating substrate 1 so as to partially overlap the first upper surface electrode layer 2.

Next, as shown in FIG. 10C, after the first protective layer 4 is formed by coating so as to cover only the entire resistance layer 3, the total resistance value of the resistance layer 3 is a predetermined resistance value. A trimming groove 5 is formed in the resistance layer 3 and the first protective layer 4 by a laser or the like so as to be within the range of values.

Next, as shown in FIG. 11A, the second protective layer 6 is formed by coating only on the upper surface of the first protective layer 4.

Next, as shown in FIG. 11B, a second upper surface electrode layer 7 is formed by coating on the upper surface of the first upper surface electrode layer 2 so as to extend to the full width of the insulating substrate 1.

Next, as shown in FIG. 11 (c), the first upper surface electrode layer 2 and the first and second side surfaces on the left and right ends of the insulating substrate are first and
The side surface electrode layer 8 is formed by coating so as to be electrically connected to the second upper surface electrode layers 2 and 7.

Finally, nickel plating is applied to the surfaces of the second upper electrode layer 7 and the side electrode layer 8 and then solder plating is performed to form a nickel plating layer 9 and a solder plating layer 10. Was manufacturing resistors.

[0013]

However, in the above-described conventional configuration and manufacturing method, since the second protective layer 6 is provided higher than the solder plating layer 10, only the lower surface of the insulating substrate 1 of the resistor is used. However, there is a problem that it cannot be mounted on a mounting board by a batch mounting machine in bulk mounting or the like, which mounts the resistor regardless of the upper and lower surfaces of the resistor, only on a mounting board (not shown).

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a resistor which can be mounted on a mounting board on both upper and lower surfaces of the resistor substrate and a method of manufacturing the resistor. .

[0015]

To achieve the above object, the present invention provides a protective layer provided so as to cover at least the upper surfaces of the first upper surface electrode layer and the resistance layer, and the upper surface of the protective layer. And a pair of second upper surface electrode layers provided on the side portions of.

In order to achieve the above object, the present invention provides a protective layer forming step of providing a protective layer so as to cover at least the upper surfaces of the first upper surface electrode layer and the resistance layer, and the upper surface of the protective layer. And a second upper surface electrode layer forming step of providing a second upper surface electrode layer on a side portion.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION The invention according to claim 1 of the present invention comprises: a substrate; a pair of first upper surface electrode layers provided on a side portion of an upper surface of the substrate; A resistance layer provided so as to be electrically connected to the upper surface electrode layer of 1;
A protective layer provided so as to cover at least the upper surfaces of the first upper surface electrode layer and the resistance layer, a pair of second upper surface electrode layers provided on a side portion of the upper surface of the protective layer, and at least the substrate. And a side surface electrode layer provided so as to electrically connect the first and second upper surface electrode layers to the side surface.

[0018] Further, the invention according to claim 2 includes a substrate,
A pair of first upper electrode layers and a lower electrode layer provided on the upper and lower sides of the substrate, and a pair of first upper electrode layers and a lower electrode layer provided on the upper surface of the substrate so as to be electrically connected to the first upper electrode layer; A resistive layer, a protective layer provided so as to cover at least the upper surfaces of the first upper electrode layer and the resistive layer,
A pair of second upper electrode layers provided on the side of the upper surface of the protective layer, and the first and second electrode layers on at least side surfaces of the substrate;
And a side surface electrode layer provided so as to electrically connect the upper surface electrode layer and the back surface electrode layer.

The invention described in claim 3 is the same as that of claim 1.
Alternatively, at least one of the first and second upper surface electrode layers described in 2 is provided up to the side edge of the substrate.

The invention described in claim 4 is the same as the claim 2.
The back electrode layer described is provided up to the side edge of the substrate.

The invention described in claim 5 is the first invention.
Or the second upper electrode layer described in 2 is 5 μm thicker than the protective layer.
It is more expensive.

The invention according to claim 6 is the first invention.
Alternatively, the side surface electrode layer described in 2 is covered with the solder layer and is higher than the protective layer by 10 μm or more.

In the invention according to claim 7, the ridge lines of the side surface electrode layer or the solder layer according to claim 1, 2 or 6 are rounded.

The invention described in claim 8 is the first invention.
Alternatively, the first upper surface electrode layer described in 2 is made of a silver-based material.

The invention described in claim 9 is the same as claim 1.
Or the protective layer described in 2 is made of glass or a resin material.

According to a tenth aspect of the present invention, the second upper electrode layer according to the first or second aspect is made of a conductive material containing at least glass or resin.

In the eleventh aspect, the side electrode layer according to the first or second aspect is made of a conductive material containing at least glass or resin.

According to a twelfth aspect of the present invention, the second upper surface electrode layer and the second lower electrode layer according to the first or second aspect are characterized in that:
They have the same shape.

According to a thirteenth aspect of the present invention, the side surface electrode layer facing the side surface of the substrate according to the first or second aspect comprises:
It has a notch.

According to a fourteenth aspect of the present invention, the step of providing the first upper surface electrode layer so as to extend over the upper surface of the division groove of the substrate on the sheet having the division groove; A step of providing a resistive layer so as to be electrically connected, a step of providing a protective layer so as to cover at least the upper surfaces of the first upper surface electrode layer and the resistive layer, and a second step on a side portion of the upper surface of the protective layer. The step of providing the upper surface electrode layer, the step of dividing the sheet having the dividing groove formed by forming the second upper surface electrode layer into strips, and the first and second strips on at least the side surface of the strip substrate. It comprises a step of providing a side surface electrode layer so as to be electrically connected to the top surface electrode layer, and a step of dividing the strip-shaped substrate on which the side surface electrode layer is formed into individual pieces.

According to a fifteenth aspect of the present invention, there is provided a step of forming a first upper surface electrode layer and a back surface electrode layer so as to extend over the upper surface and the lower surface of the dividing groove of the substrate having the dividing groove, and A step of providing a resistance layer so as to electrically connect the first upper surface electrode layers, a step of providing a protective layer so as to cover at least the upper surfaces of the first upper surface electrode layer and the resistance layer, and When the step of providing the second upper surface electrode layer on the side surface of the upper surface and the sheet having the dividing groove formed by forming the second upper surface electrode layer are divided into strips, at least the side surface of the strip-shaped substrate is covered with the first substrate. 1, a step of providing a side surface electrode layer so as to electrically connect the second top surface electrode layer and the back surface electrode layer, and a step of dividing the strip-shaped substrate on which the side surface electrode layer is formed into individual pieces. It is a thing.

According to a sixteenth aspect of the present invention, in the step of forming the first and second upper surface electrode layers according to the fourteenth and fifteenth aspects, the first and second upper surface electrode layers are formed on the side edges of the substrate. It is a process that is provided up to.

In the seventeenth aspect of the present invention, the step of forming the back electrode layer according to the fourteenth or fifteenth aspect is a step of forming the back electrode layer up to the side end portion of the substrate.

Further, in the invention described in claim 18, the step of forming the second upper surface electrode layer according to claim 14 or 15 is a step of forming the second upper surface electrode layer 10 μm or more higher than the protective layer. There is something.

According to a nineteenth aspect of the present invention, the step of forming the side electrode layer according to the fourteenth or fifteenth step includes a step of covering the side electrode layer with a solder layer, and the solder layer is a protective layer. It includes a step higher by 20 μm or more.

According to a twentieth aspect of the present invention, the step of forming the side electrode layer or the solder layer according to the fourteenth, fifteenth or nineteenth aspect includes a step of rounding the ridge of the side electrode layer or the solder layer. It is contained.

In a twenty-first aspect of the invention, the step of forming the first upper surface electrode layer according to the fourteenth or fifteenth aspect is a step of printing and firing a silver-based material. .

Further, in the invention described in claim 22, the step of forming the protective layer according to claim 14 or 15 is a step of printing, firing or curing a glass or resin material.

Further, in the invention described in Item 23, in the step of forming the second upper surface electrode layer according to Item 14 or 15, printing or firing of a conductive material containing at least glass or resin is carried out. It is a process of curing.

Further, in the invention described in claim 24, in the step of forming the side electrode layer according to claim 14 or 15, a conductive material containing at least glass or resin is formed by printing or sputtering. It is a process that becomes.

With this structure and manufacturing method, the resistor can be mounted on the mounting substrate on either the upper or lower surface of the substrate.

(First Embodiment) A resistor and a method of manufacturing the resistor according to the first embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view of a resistor according to the first embodiment of the present invention. In the figure, 21 is a substrate made of alumina or the like. Reference numeral 22 denotes a pair of first upper electrode layers made of a mixed material of silver and glass or the like provided on the side of the upper surface of the substrate 21, and is preferably provided up to the side end of the substrate 21. Reference numeral 23 denotes the first upper surface electrode layer 2 on the upper surface of the substrate 21.
2 is a resistance layer made of a mixed material of ruthenium oxide and glass, which is provided so as to partially overlap with 2 and to be electrically connected. Reference numeral 24 is a protective layer made of lead borosilicate glass or the like or epoxy resin or the like provided so as to cover at least the upper surfaces of the first upper surface electrode layer 22 and the resistance layer 23.
Preferably, it is provided up to the side edge of the substrate 21. Two
Reference numeral 5 denotes a pair of second upper surface electrode layers formed on a side surface of the upper surface of the protective layer 24 and made of a mixed material of silver and glass or a phenol resin, and preferably provided up to the side edge of the substrate 21. Is. Reference numeral 26 denotes a side surface electrode layer made of a mixed material of silver and glass, etc., which is provided on the side surface of the substrate 21 so as to be electrically connected to at least the first and second upper surface electrode layers 22 and 25. The ridgeline of 26 has a roundness. Reference numeral 27 denotes a first solder layer made of nickel plating or the like provided so as to cover the side electrode layer 26 as necessary. Reference numeral 28 denotes a second solder layer provided so as to cover the first solder layer 27 if necessary, and preferably the ridge line of the second solder layer 28 has a roundness.

With respect to the resistor configured as described above,
Hereinafter, the manufacturing method will be described with reference to the drawings.

2 and 3 are process diagrams showing a method of manufacturing a resistor according to the first embodiment of the present invention.

First, as shown in FIG. 2A, a mixed paste material of silver and glass is screen-printed and dried so as to straddle the dividing grooves 31 of a sheet 32 made of alumina or the like having vertical and horizontal dividing grooves 31. Then, the first upper surface electrode layer 33 is formed by firing in a belt type continuous firing furnace at a temperature of about 850 ° C. with a profile of about 45 minutes.

Next, as shown in FIG. 2B, a mixed paste material of ruthenium oxide and glass is applied to the first upper surface electrode layer 33 so as to electrically connect the first upper surface electrode layers 33. Screen-printed and dried on the upper surface of the sheet 32 so that it overlaps with a part of
Baking is performed at a temperature of 0 ° C. with a profile of about 45 minutes to form the resistance layer 34.

Next, as shown in FIG. 2C, the resistance layer 3
In order to correct the resistance value of No. 4, the trimming groove 35 is formed by trimming with a laser or the like. At this time, before the trimming, at least a precoat (not shown) with glass or the like may be performed, and then the precoat and the resistive layer 34 may be trimmed from the upper surface of the precoat with a laser or the like to form a trimming groove 35.

Next, as shown in FIG. 2D, a lead borosilicate glass paste is screen-printed and dried so as to cover the upper surfaces of the first electrode layer 33 and the resistance layer 34, and a belt-type continuous firing furnace is used. And is baked at a temperature of about 600 ° C. according to a profile of about 45 minutes to form the protective layer. At this time, the protective layer 36 is at least the first upper surface electrode layer 3
3 and the upper surface of the resistance layer 34 may be covered.

Next, as shown in FIG. 3A, a mixed paste material of silver and glass is screen-printed and dried on the upper surface of the protective layer 36 having the first upper surface electrode layer 33 on the lower surface, and the belt is then dried. Type continuous firing furnace at a temperature of about 600 ℃,
The second upper surface electrode layer 37 is formed by baking according to a profile of about 45 minutes.

Next, as shown in FIG. 3B, the strip-shaped substrate 38 is divided along the dividing groove 31 of the sheet 32 so that the first and second upper surface electrode layers are exposed from the side surfaces. To form.

Next, as shown in FIG. 3C, a mixed paste material of silver and glass is roller-transfer printed so as to electrically connect the first and second upper surface electrode layers 33 and 37. -Drying and baking in a belt type continuous baking furnace at a temperature of about 600 ° C. with a profile of about 45 minutes to form the side electrode layer 39.

Next, as shown in FIG. 3D, the strip-shaped substrate 38 is divided into individual pieces to form individual substrate 40.

Finally, if necessary, a first plating layer (not shown) made of nickel plating or the like is formed so as to cover the side surface electrode layer 39, and tin and lead are provided so as to cover the first plating layer. A resistor is manufactured by forming a second plating layer (not shown) made of an alloy plating with the above.

The characteristics of the resistor constructed and manufactured as described above will be described below. (Experimental method) After mounting in a bulk cassette with an automatic mounting machine (Matsushita Electric Industrial Co., Ltd .: Panasato Mv2) and automatically mounting the resistors on the land pattern of the mounting board by the bulk cassette of the automatic mounting machine, at 200 to 250 ° C 10-30
Solder shall be provided on the side surface of the resistor by reflow soldering for 2 seconds. At this time, a silk printing pattern is provided between the land patterns.

(Pass / Fail Judgment) FIG.
As shown in (a), when the resistor 44 has the solder 42 only on one side of the soldering land pattern 41 of the mounting substrate, it is determined as no. Regarding the θ deviation, as shown in FIG. 4B, when the resistor 44 is θ on the soldering land pattern 43.
= No when rotating by 0.2 degrees or more.

(Judgment Result 1) Below, (Table 1) shows the judgment results of the height of the second upper surface electrode layer from the protective layer and the number of mounting defects.

[0058]

[Table 1]

As is clear from (Table 1), the second upper electrode layer of the resistor according to the present embodiment has a protective layer 5
If the height is more than μm, the number of mounting defects is extremely small. Therefore, it is preferable that the second upper electrode layer is higher than the protective layer by more than 5 μm.

(Judgment result 2) Similarly, (Table 2) shows the judgment results of the height of the side surface electrode layer from the protective layer and the number of mounting defects.

[0061]

[Table 2]

As is clear from (Table 2), in the present embodiment, when the height of the side surface electrode layer is 10 μm or more from the protective layer, the number of mounting defects is extremely small, so that the side surface electrode layer is 10 μm thicker than the protective layer. It should be higher than this.

(Second Embodiment) A resistor and a method of manufacturing the same according to a second embodiment of the present invention will be described below with reference to the drawings.

FIG. 5 is a sectional view of a resistor according to the second embodiment of the present invention. In the figure, 51 is a substrate made of alumina or the like. Reference numeral 52 denotes a pair of first upper surface electrode layers made of a mixed material of silver and glass or the like, which is provided on the side surface of the upper surface of the substrate 51, and is preferably provided up to the side edge of the substrate 51. Reference numeral 53 denotes a pair of back surface electrode layers made of a mixed material of silver and glass and provided on the side surface of the lower surface of the substrate 51.
Preferably, it is provided up to the side edge of the substrate 51. 5
Reference numeral 4 is a resistance film made of a mixed material of ruthenium oxide and glass, which is provided on the upper surface of the substrate 51 so as to partially overlap the first upper surface electrode layer 52 and be electrically connected. 55
Is a protective layer made of lead borosilicate glass or the like provided so as to cover at least the upper surfaces of the first upper surface electrode layer 52 and the resistance layer 54, and is preferably provided up to the side edge of the substrate 51. Reference numeral 56 denotes a pair of second upper surface electrode layers formed of a mixed material of silver and glass or the like, which is provided on the side surface of the upper surface of the protective layer 55. It has the same shape. Reference numeral 57 denotes a side surface electrode layer made of a mixed material of silver and glass or the like, which is provided on the side surface of the substrate 51 so as to be electrically connected to at least the first and second upper surface electrode layers 52 and 56. The ridgeline of 57 has a roundness. Reference numeral 58 is a first solder layer made of nickel plating or the like provided so as to cover the side surface electrode layer 57 as necessary. 59 is the first solder layer 5 if necessary
The second solder layer provided so as to cover 8 and preferably the ridge line of the second solder layer 59 has a roundness.

Regarding the resistor configured as described above,
Hereinafter, the manufacturing method will be described with reference to the drawings.

6 and 7 are process diagrams showing a method of manufacturing a resistor according to the second embodiment of the present invention.

First, as shown in FIG. 6A, a sheet 6 made of alumina or the like having vertical and horizontal dividing grooves 61 on its upper and lower surfaces.
The mixed paste material of silver and glass is screen-printed and dried so as to straddle the two dividing grooves 61, and this sheet 62 is turned upside down so as to straddle the dividing grooves (not shown) of the sheet 62. The mixed paste material is screen-printed, dried, and fired in a belt-type continuous firing furnace at a temperature of about 850 ° C. with a profile of about 45 minutes,
The upper surface electrode layer 63 and the back surface electrode layer 64 are formed.

Next, as shown in FIG. 6B, a mixed paste material of ruthenium oxide and glass is applied to the first upper surface electrode layer 63 so as to electrically connect the first upper surface electrode layers 63. Screen-printed and dried on the upper surface of the sheet 62 so as to overlap with a part of the
The resistance layer 65 is formed by firing at a temperature of 0 ° C. with a profile of about 45 minutes.

Next, as shown in FIG. 6C, the resistance layer 6
In order to correct the resistance value of No. 5, the trimming groove 66 is formed by trimming with a laser or the like. At this time, before trimming, at least after precoating (not shown) with glass or the like, the trimming groove 66 may be formed by trimming the precoat and the resistance layer 65 from the upper surface of the precoat with laser or the like.

Next, as shown in FIG. 6D, a lead borosilicate glass paste is screen-printed and dried so as to cover the upper surfaces of the first upper surface electrode layer 63 and the resistance layer 65, and belt-type continuous firing is performed. The protective layer 67 is formed by firing in a furnace at a temperature of about 600 ° C. for a profile of about 45 minutes. At this time, the protective layer 67 may cover at least the upper surfaces of the first upper surface electrode layer 63 and the resistance layer 65.

Next, as shown in FIG. 7A, a mixed paste material of silver and glass is screen-printed and dried on the upper surface of the protective layer 67 having the first upper surface electrode layer 63 on the lower surface, and the belt is Type continuous firing furnace at a temperature of about 600 ℃,
The second upper surface electrode layer 68 is formed by firing according to a profile of about 45 minutes.

Next, as shown in FIG. 7B, the strip-shaped substrate 69 is divided along the dividing groove 61 of the sheet 62 so that the first and second upper surface electrode layers are exposed from the side surfaces. To form.

Next, as shown in FIG. 7C, a mixed paste material of silver and glass is roller-transfer printed so as to electrically connect the first and second upper surface electrode layers 63 and 68. -Drying and baking in a belt type continuous baking furnace at a temperature of about 600 ° C. with a profile of about 45 minutes to form the side electrode layer 70.

Next, as shown in FIG. 7D, the strip-shaped substrate 69 is divided into individual pieces to form individual piece-shaped substrates 71.

Finally, if necessary, a first plating layer (not shown) made of nickel plating or the like is formed so as to cover the side surface electrode layer 70, and tin and lead are provided so as to cover the first plating layer. A resistor is manufactured by forming a second plating layer (not shown) made of an alloy plating with the above.

The characteristics of the resistor constructed and manufactured as described above will be described below. Where the experimental method,
The pass / fail judgment is the same as that described in the first embodiment, and thus the description thereof is omitted.

(Judgment Result 3) Below, (Table 3) shows the judgment results of the height of the second upper surface electrode layer from the protective layer and the number of mounting defects.

[0078]

[Table 3]

As is clear from (Table 3), the second upper electrode layer of the resistor according to the present embodiment is formed from the protective layer to the second upper electrode layer.
If the height is more than μm, the number of mounting defects is extremely small. Therefore, it is preferable that the second upper electrode layer is higher than the protective layer by more than 5 μm.

(Judgment result 4) Similarly, (Table 4) shows the judgment results of the height of the side surface electrode layer from the protective layer and the number of mounting defects.

[0081]

[Table 4]

As is clear from (Table 4), in the resistor according to the present embodiment, when the side electrode layer has a height of 10 μm or more from the protective layer, the number of mounting defects is extremely small, so the side electrode layer is protected. It is preferable that the height is 10 μm or more from the layer.

(Third Embodiment) A resistor according to a third embodiment of the present invention will be described below with reference to the drawings.

FIG. 8 is a perspective view of a resistor according to the third embodiment of the present invention. Here, the difference from the first and second embodiments is that the second upper surface electrode layer 82 facing the side surface of the substrate 81 has a cutout portion 83. This notch 8
3 has a resistor mounted substrate (not shown)
Since the second upper surface electrode layer 82 does not have a corner portion when mounted on, the second upper surface electrode layer 82 is difficult to peel off.

The notch 8 is formed in the above-mentioned second upper surface electrode layer 82.
Since the third embodiment is the same as the first and second embodiments except that it is provided, the description thereof will be omitted.

[0086]

As described above, according to the present invention, since the second upper surface electrode layer is provided higher than the protective layer, the resistor which can be mounted on the mounting substrate on either the upper surface or the lower surface of the resistor and the manufacturing method thereof are provided. Can be provided.

[Brief description of drawings]

FIG. 1 is a sectional view of a resistor according to a first embodiment of the present invention.

FIG. 2 is a process chart showing the manufacturing method.

FIG. 3 is a process chart showing the manufacturing method.

FIG. 4 is a diagram showing the determination method.

FIG. 5 is a sectional view of a resistor according to a second embodiment of the present invention.

FIG. 6 is a process chart showing the manufacturing method.

FIG. 7 is a process drawing showing the same manufacturing method.

FIG. 8 is a perspective view of a resistor according to a third embodiment of the present invention.

FIG. 9 is a sectional view of a conventional resistor.

FIG. 10 is a process chart showing the same manufacturing method.

FIG. 11 is a process chart showing the manufacturing method.

[Explanation of symbols]

 21 substrate 22 first upper surface electrode layer 23 resistance layer 24 protective layer 25 second upper surface electrode layer 26 side surface electrode layer

Front page continuation (72) Inventor Takumi Shirai 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (24)

[Claims] 1. A substrate, a pair of first upper surface electrode layers provided on a side portion of an upper surface of the substrate, and an upper surface of the substrate provided so as to be electrically connected to the first upper surface electrode layer. Resistive layer, a protective layer provided so as to cover at least the upper surfaces of the first upper surface electrode layer and the resistive layer, and a pair of second upper surface electrodes provided on side portions of the upper surface of the protective layer. A resistor comprising a layer and a side surface electrode layer provided at least on a side surface of the substrate so as to electrically connect the first and second upper surface electrode layers. 2. A substrate, a pair of first upper surface electrode layer and a back surface electrode layer respectively provided on side portions of an upper surface and a lower surface of the substrate, and an electrical connection to the first upper surface electrode layer on the upper surface of the substrate. Provided so as to be electrically connected, a protective layer provided so as to cover at least the upper surfaces of the first upper surface electrode layer and the resistive layer, and a side surface of the upper surface of the protective layer. A resistor including a pair of second upper surface electrode layers and a side surface electrode layer provided on at least a side surface of the substrate so as to electrically connect the first and second upper surface electrode layers and the back surface electrode layer. . 3. The resistor according to claim 1, wherein at least one of the first and second upper surface electrode layers is provided up to a side edge of the substrate. 4. The resistor according to claim 2, wherein the back electrode layer is provided up to the side edge of the substrate. 5. The second upper electrode layer is 5 μm thicker than the protective layer.
3. The resistor according to claim 1, wherein said resistor is higher. 6. The resistor according to claim 1, wherein the side electrode layer is covered with a solder layer and is higher than the protective layer by 10 μm or more. 7. The resistor according to claim 1, wherein a ridge line of the side electrode layer or the solder layer has a rounded shape. 8. The resistor according to claim 1, wherein the first upper electrode layer is made of a silver-based material. 9. The resistor according to claim 1, wherein the protective layer is made of glass or a resin material. 10. The resistor according to claim 1, wherein the second upper surface electrode layer is made of a conductive material containing at least glass or resin. 11. The resistor according to claim 1, wherein the side electrode layer is made of a conductive material containing at least glass or resin. 12. The second upper electrode layer and the lower electrode layer,
3. The resistor according to claim 1, which has the same shape. 13. The side surface electrode layer facing the side surface of the substrate,
3. The resistor according to claim 1, which has a cutout portion. 14. A step of providing a first upper surface electrode layer so as to extend over an upper surface of a division groove of a substrate having a division groove, and a resistance layer so as to electrically connect the first upper surface electrode layers. A step of providing a protective layer so as to cover at least the upper surfaces of the first upper surface electrode layer and the resistance layer, and a second step on the upper surface of the protective layer having the first upper surface electrode layer on the lower surface. A step of providing an upper surface electrode layer, a step of dividing a sheet having a dividing groove formed by forming the second upper surface electrode layer into strips, and at least the side surfaces of the strip-shaped substrate having the first and second upper surfaces. A method for manufacturing a resistor, comprising: a step of providing a side surface electrode layer so as to be electrically connected to an electrode layer; and a step of dividing the strip-shaped substrate on which the side surface electrode layer is formed into individual pieces. 15. A step of providing a first upper surface electrode layer and a back surface electrode layer so as to straddle the upper surface and the lower surface of the dividing groove of the substrate on the sheet having the dividing groove, and electrically connecting the first upper surface electrode layer. A step of providing a resistance layer so as to connect, a step of providing a protective layer so as to cover at least the upper surfaces of the first upper surface electrode layer and the resistive layer, and the protective layer having the first upper surface electrode layer on the lower surface. A second upper surface electrode layer on the upper surface of the substrate, a sheet having a dividing groove formed by forming the second upper surface electrode layer is divided into strips, and at least a side surface of the strip-shaped substrate is provided with the first substrate. 1, a step of providing a side surface electrode layer so as to electrically connect the second top surface electrode layer and the back surface electrode layer, and a step of dividing the strip-shaped substrate on which the side surface electrode layer is formed into individual pieces. Method of manufacturing resistor. 16. The resistor according to claim 14, wherein the step of forming the first and second upper surface electrode layers is a step of providing the first and second upper surface electrode layers up to a side edge of the substrate. Manufacturing method. 17. The step of forming the back electrode layer is a step of providing the back electrode layer up to the side edge of the substrate.
Alternatively, the method for manufacturing the resistor according to Item 15. 18. The step of forming a second upper surface electrode layer comprises:
16. The method of manufacturing a resistor according to claim 14, which is a step of forming the second upper electrode layer to be higher than the protective layer by 10 μm or more. 19. The step of forming a side surface electrode layer includes a step of covering the side surface electrode layer with a solder layer, and the step of forming the side surface electrode layer is higher than the protective layer by 20 μm or more.
4. The method for manufacturing the resistor according to 4 or 15. 20. The method of manufacturing a resistor according to claim 14, wherein the step of forming the side surface electrode layer or the solder layer includes a step of rounding a ridgeline of the side surface electrode layer or the solder layer. . 21. The step of forming the first upper surface electrode layer comprises:
15. A process comprising printing and baking a silver-based material.
Alternatively, the method for manufacturing the resistor according to Item 15. 22. The method of manufacturing a resistor according to claim 14, wherein the step of forming the protective layer is a step of printing, firing or curing a material containing glass or a resin. 23. The step of forming the second upper surface electrode layer comprises:
15. A step of printing, firing or curing a conductive material containing at least glass or resin.
Alternatively, the method for manufacturing the resistor according to Item 15. 24. The method of manufacturing a resistor according to claim 14, wherein the step of forming the side surface electrode layer is a step of forming a conductive material containing at least glass or resin by printing or sputtering. .