KR100821277B1 - Chip ceramic component element and chip ceramic component and Method for the same - Google Patents

Abstract

Insulator ceramic substrates; Internal electrodes formed on at least one of a surface or a rear surface of the insulator ceramic substrate; And a functional ceramic sheet laminated and bonded on the insulator ceramic substrate to cover the internal electrodes, wherein a separation groove for cutting the internal electrodes is formed to penetrate into the ceramic substrate. A chip ceramic component element is disclosed which is partially embedded in the separation groove.

Chip Varistor, Thermistor, Plasticity, Anchoring, Separation Groove, Green Sheet, Electrical Characteristics, Deviation, Internal Electrode, Tip, Deformation

Description

Chip ceramic component element and chip ceramic component and Method for the same

1 is a cross-sectional view showing a schematic structure of a chip ceramic component according to an embodiment of the present invention.

2 is a process chart showing a method of manufacturing a chip ceramic component according to the present invention.

3 is a plan view showing various aspects of the separation groove according to the present invention.

4 is a cross-sectional view illustrating a modification of FIG. 1.

5 is a cross-sectional view showing another modification of FIG. 1.

Figure 6 shows that the separation groove is formed in the longitudinal direction of the internal electrode.

7 is a cross-sectional view showing another embodiment of the present invention.

8 is a cross-sectional view of a chip ceramic component element in accordance with another embodiment of the present invention.

9 is a cross-sectional view of a chip ceramic component element in accordance with another embodiment of the present invention.

The present invention relates to a chip ceramic component element and a method of manufacturing the same.

With the high functionality of electronic devices, the use of functional elements is increasing. These devices provide chip varistors that protect semiconductor devices from electrostatic discharges and prevent malfunctions of final electronic devices, and deliver dangerous values to active devices such as microcomputers as resistance changes by sensing changes in ambient temperature. Chip thermistor

These functional passive devices are manufactured by a lamination method, which is structurally possible by a combination of a ceramic body, an internal electrode, and an external electrode extending the internal electrode, which influence electrical characteristics. In general, in order to realize electrical characteristics, the internal electrodes may be arranged on the same line on the functional ceramic, or may be configured in the form of overlap between the functional ceramics.

In general, the arrangement of the internal electrodes is made through the screen printing method, it can be seen that the internal electrodes thus formed are deformed unlike the first designed form. This is because during the printing of the internal electrodes, the viscosity of the paste changes below the reference viscosity, when the emulsion thickness and tension of the screen is uneven, or when a pattern is formed at the contacts of the metal wires forming the screen, and high lamination. In the case of, the shape of the tip of the electrode is deformed upward due to the accumulated pressure transfer during the repeated printing lamination process. The deformation of the internal electrode affects the electrical characteristics in the final product, and serves as a representative factor causing the characteristic variation.

In addition, when the internal electrode is configured to face the surface of the functional ceramic for low capacitance or other purposes, in the design requiring a minute spacing of less than 60 μm, the bleeding phenomenon among the above-described deformation factors is the most important factor. Therefore, there is a risk of an electric short phenomenon.

     Accordingly, an object of the present invention is a chip ceramic component element that is structurally simple and can minimize the variation of electrical characteristics of the final product without deformation of the designed internal electrode when the internal electrode is to be designed to face the same surface of the functional ceramic. To provide.

Another object of the present invention is to provide a method of manufacturing the above-described chip ceramic component element.

The above and other objects, features and advantages will be clearly understood through the embodiments described below.

The above object is an insulator ceramic substrate; Internal electrodes formed on at least one of a surface or a rear surface of the insulator ceramic substrate; And a functional ceramic sheet laminated and bonded on the insulator ceramic substrate to cover the internal electrodes, wherein a separation groove for cutting the internal electrodes is formed to penetrate into the ceramic substrate. Part is achieved by chip ceramic component elements embedded in the separation grooves.

According to this configuration, the deformation of the front end portion of the opposing internal electrode can be minimized, thereby having an effect of reducing the variation of electrical characteristics, and it is possible to manufacture a precision class product.

In this case, the bonding may be performed by the part of the functional ceramic sheet penetrating into the insulator ceramic substrate at the interface with the insulator ceramic substrate and firing.

According to this configuration, the functional ceramic sheet and the insulator ceramic substrate are firmly bonded physically and chemically.

The object is an insulator ceramic substrate; Internal electrodes formed on at least one of a surface or a rear surface of the insulator ceramic substrate; And a functional ceramic layer having electrical characteristics applied and baked in the paste state on the insulator ceramic substrate to cover the internal electrodes, wherein a separation groove for cutting the internal electrodes penetrates into the ceramic substrate. Part of the functional ceramic layer is achieved by chip ceramic component elements embedded in the separation grooves.

According to this configuration, the deformation of the front end portion of the opposing internal electrode can be minimized, thereby having an effect of reducing the variation of electrical characteristics, and it is possible to manufacture a precision class product.

Here, an auxiliary electrode connected to the inner electrode may be formed on an inner side wall of the separation groove.

According to this configuration, since the internal electrodes face each other, the opposing area increases significantly compared with the prior art. As a result, the thermistor has the effect of lowering the resistance, and in the case of the capacitor, the capacitance is increased.

In this case, the functional ceramic sheet or the functional ceramic layer may be laminated or formed only in an adjacent portion with respect to the separation groove.

According to such a structure, it has the effect of reducing the cost of an expensive functional ceramic sheet | seat.

Here, the insulator ceramic substrate is a single ceramic substrate formed by dividing a plurality of chip ceramic component elements into scribe lines, the depth of the scribe line is 40% or less of the thickness of the ceramic substrate, and the depth of the separation groove is It may be 1/3 or less of the depth of the scribe line.

According to this configuration, it is possible to prevent the occurrence of a defect in the breaking step of dividing into unit chips.

Here, the width of the separation groove may range from 50㎛ to 200㎛.

According to this configuration, the functional ceramic material can be completely filled in the separation groove.

Here, the thickness of the functional ceramic sheet may be 1.5 to 5 times the depth of the separation groove.

According to this configuration, the functional ceramic sheet can be completely filled into the separation groove by sufficiently transferring the pressure by isothermal isostatic pressure.

Here, a protective layer may be formed on a portion of the inner electrode to cover the separation groove.

According to this configuration, the tip surface of the inner electrode is prevented from being torn off in the process of cutting the contact portion between the heat treated inner electrode and the ceramic substrate during the dicing sawing operation of the inner electrode.

Preferably, the separation groove cuts the internal electrode in one of a width direction and a length direction of the internal electrode.

The above object is to print an internal electrode on the surface of the insulator ceramic substrate; Cutting the internal electrode to form a separation groove penetrating into the insulator ceramic substrate to separate the internal electrode; Stacking and pressing a functional ceramic sheet over the entire surface of the insulator ceramic substrate to compress the functional ceramic sheet to fill the separation grooves; Firing the functional ceramic sheet at a predetermined temperature; And forming an external electrode to be electrically connected to the internal electrode.

Here, the pressing is performed by isothermal isostatic pressure.

The above object is also an insulator ceramic substrate; A first functional ceramic sheet having electrical properties laminated and bonded on the insulator ceramic substrate; Internal electrodes formed on the first functional ceramic sheets; And a second functional ceramic sheet laminated and bonded on the insulator ceramic substrate to cover the internal electrodes, wherein a separation groove for cutting the internal electrodes is formed to penetrate into the ceramic substrate. Part of the functional ceramic sheet is achieved by a chip ceramic component element embedded in the separation groove.

According to this configuration, the first functional ceramic sheet has a strong adhesive force with the ceramic substrate. In addition, the adhesion of the internal electrodes by heat treatment is much better for the first functional ceramic sheet than for the ceramic substrate. In addition, heat treatment may be performed at a temperature of about 50 ° C. lower than that of forming an internal electrode on the ceramic substrate. Moreover, since the second functional ceramic sheet portion and the first functional ceramic sheet portion embedded in the separation groove are made of the same material, they are strongly adhered through secondary firing.

The above object is an insulator ceramic substrate; A first functional ceramic sheet having electrical properties laminated and bonded on the insulator ceramic substrate; Internal electrodes formed on the first functional ceramic sheets; And a second functional ceramic sheet having electrical characteristics laminated and bonded on the insulator ceramic substrate so as to cover the internal electrode, wherein a separation groove for cutting the internal electrode penetrates into the first functional ceramic sheet, Part of the second functional ceramic sheet is achieved by a chip ceramic component element embedded in the separation groove.

According to this structure, since the ceramic substrate with a large mechanical strength is not cut | disconnected, it has the advantage of extending the life of the blade used at the dicing sawing operation.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In the accompanying drawings, dimensions and shapes are shown modified to emphasize the features of the invention.

1 is a cross-sectional view showing a schematic structure of a chip ceramic component according to an embodiment of the present invention.

A functional ceramic sheet having electrical characteristics on the insulator ceramic substrate 100 so that the internal electrodes 110 and 110a are formed on at least one of the front surface or the rear surface of the insulator ceramic substrate 100 and covering the internal electrodes 110 and 110a. 200) are stacked and joined. In addition, the glass protective film 300 is selectively formed to cover the functional ceramic sheet 200, and the ceramic substrate 100, the internal electrodes 110 and 110a, the functional ceramic sheet 200, and the glass protective film 300 are formed. External terminals 500 electrically connected to the internal electrodes 110 and 110a may be formed on opposing side surfaces of the substrate 110, and the plating layer 510 and the plating layer 520 may be formed on the external terminals 500.

According to the present invention, separation grooves 102 for cutting the internal electrodes 110 and 110a in the width direction are formed to penetrate into the ceramic substrate 100, and a part of the functional ceramic sheet 200 is separated grooves 102. Is buried in.

According to such a configuration, the internal electrodes 110 and 110a can be separated by cutting to solve the above-described problems at the internal electrode tip by screen printing. In addition, since a part of the functional ceramic sheet 200 is embedded in the separation groove 102, deformation of the front end portion of the internal electrode may be prevented even by pressing the functional ceramic sheet 200.

In this embodiment, the functional ceramic sheet 200 is used as an example, but the functional ceramic is paste-dispensed onto the ceramic substrate 100 in a state where the internal electrodes 110 and 110a are separated by the separation groove 102. Thus, the separation groove 102 may be filled and baked to form a functional ceramic layer.

Preferably, when the functional ceramic sheet 200 is applied, a part of the functional ceramic sheet 200 is forced to a plurality of cavities (or pores) formed on the surface of the insulator ceramic substrate 100 through an isothermal isostatic process before firing. By being filled with the filling, the functional ceramic sheet 200 and the insulator ceramic substrate 100 may be physically and firmly coupled to each other.

In this case, the insulator ceramic substrate 100 may be alumina or mullite series, it is preferable to apply a product fired at a high temperature of 1100 ℃ or more. This is because when using an insulator ceramic substrate fired at a temperature of less than 1100 ° C., when the functional ceramic sheet 200 is fired at a high temperature of 1100 ° C. or higher, problems such as warpage of the insulator ceramic substrate 100 may occur. .

In addition, the material of the functional ceramic sheet 200 may be appropriately selected and applied to the varistor material, thermistor material, bead material, MLCC material, etc. according to the type of the final product.

4 is a cross-sectional view showing a modification of this embodiment.

According to this modification, auxiliary electrodes 104 and 104a are formed on the inner side walls of the separation grooves 102 and connected to the internal electrodes 110 and 110a, respectively.

According to such a structure, since the internal electrodes 110 and 110a face each other, the opposing area increases significantly. Therefore, the thermistor has the effect of lowering the resistance, and the capacitor has the effect of increasing the capacitance.

5 is a cross-sectional view showing another modification of this embodiment.

According to this modification, the functional ceramic sheet 200 is not formed on the front surface of the ceramic substrate 100 but is formed only in a portion adjacent to the separation groove 102.

According to this structure, the cost of the expensive functional ceramic sheet 200 is reduced.

Hereinafter, a method of manufacturing a chip ceramic component having the above configuration will be described with reference to the process diagram of FIG. 2.

First, as illustrated in FIG. 2A, an insulator ceramic substrate 100 fired at 1100 ° C. or more is prepared. In this example, only a part of the ceramic substrate 100 is shown for convenience of description, but in the actual manufacturing process, a plurality of chip ceramic parts are manufactured at once by being divided by a scribe line 101 on one ceramic wafer.

As described above, an alumina or mullite material may be used as the insulator ceramic substrate 100. In this embodiment, an alumina substrate having a purity of 96% or more having a thickness variation of 250 μm ± 5 μm was used.

As shown in FIG. 2A, the internal electrode 110 is printed on the insulator ceramic substrate 100.

The internal electrode 110 may be formed by applying a paste containing any one of noble metals such as Ag-Pd, Pd, or Pt by a printing method in a predetermined pattern, followed by hot air drying.

The thickness of the internal electrode 110 may be preferably 1 to 10 μm. When formed smaller than 1㎛ by the screen printing method, it may include a large number of pores on the surface of the electrode resulting in the distribution of electrical properties, if it exceeds 10㎛ it must be repeated several times to implement the screen printing method In this process, the electrode thickness may become uneven.

Subsequently, the internal electrodes are heat treated for 1 to 3 hours in the range of 900 to 1250 ° C. The temperature range is determined according to the type of the selected internal electrode metal, the mechanical bonding strength between the internal electrode and the alumina substrate, and the bonding property with the functional ceramic. In this embodiment, the temperature range is 1200 ° C, using Pd as the internal electrode. Heat treatment was performed under the conditions of 3 hours.

The reason for the heat treatment is to prevent electrode damage in subsequent steps. Specifically, when the heat treatment is not performed, since the printed and dried internal electrodes are attached to the ceramic substrate only by the binder included in the paste, the cooling water used in the electrode separation process by the dicing saw to be performed later. As a result, the adhesive force of the binder is lowered, which finally leads to damage of the electrode.

Subsequently, as shown in FIG. 2B, the separation groove 102 for cutting the internal electrode 110 in the width direction penetrates into the insulator ceramic substrate 100.

Preferably, the depth of the separation groove 102 may be formed up to 1/3 of the depth of the scribe line 101, and when the separation groove 102 is formed to a depth greater than that, it is divided into unit chips to be described later. Defects can occur in the braking process. Here, the scribe line 101 may be processed up to 40% of the total thickness of the ceramic substrate 100.

In addition, the width of the separation groove 102 is particularly related to the electrical properties, and may be preferably 50 to 200 μm for full filling of the functional ceramic sheet 200 or the functional ceramic material. However, even if it is smaller than 50㎛ can meet the conditions by changing the manufacturing conditions, if it exceeds 200㎛ has a disadvantage in that the process width is added because the set width must be processed through repeated cutting operation.

In addition, the shape of the separation groove 102 does not matter in any case. 3 is a plan view showing the shape of various separation grooves 102. 3a can be easily formed using a dicing saw applied with a diamond cutting blade, and a curved shape or a long elliptical shape as shown in FIGS. 3b to 3d can be formed by laser or plasma etching. Can be implemented. In particular, in the case of using a laser such as a Nd YAG laser or a CO 2 laser, various beam intensities and spot sizes vary, so that various non-linear separation grooves having a width of several nm to 150 μm can be formed. Can form a separation groove having a fine width of several nm to several μm.

In addition, as illustrated in FIG. 6, the separation groove 102 ′ may be formed in the same length direction as the internal electrode 110. In this case, since the length adjustment of the opposing internal electrodes 110 is easier than the separation grooves 102 in the width direction, the electrical characteristics may be variously changed. In addition, in order to form an insulator protective film during the subsequent process, the step of removing the ceramic with a laser or the like is easier than the case of forming the separation groove 102 in the width direction.

Subsequently, as illustrated in FIG. 2C, the functional ceramic sheet 200 is stacked on the entire surface of the ceramic substrate 100 on which the separation grooves 102 are formed.

The thickness of the functional ceramic sheet 200 to be stacked may vary depending on the depth of the separation groove 102, preferably 1.5 to 5 times the depth of the separation groove 102. If less than 1.5 times, cracks may occur between the separated electrodes, and if more than 5 times, there is insufficient pressure transfer even in an isothermal isostatic environment to fill the functional ceramic sheet 200 into the separation groove 102. Becomes difficult.

The functional ceramic sheet 200 is a binder solution 20 to 40 using, for example, a 100% weight ratio of a compound composed of zinc oxide as a main material and procedium oxide, cobalt oxide, and neodium oxide, which exhibit varistor properties. 30% to 50% by weight of the solvent (weight ratio of 10 to 20%), toluene and ethanol in a ratio of 8: 2, respectively, in a ratio of 30 to 50% by a hot air casting process maintained at 120 to 130 ° C. The thickness of the ceramic sheet 200 may be formed to be in the range of 10㎛ ~ 60㎛ ± 0.5㎛.

Subsequently, the functional ceramic sheet 200 is press-bonded with a uniaxial pressurized flat press at a temperature of 40 to 70 ° C. and a pressure of 200 psi or more, and a scribed insulated ceramic substrate 100 is mounted on an aluminum plate or auxiliary material, and vacuum After sealing in a plastic bag, isostatic pressing is carried out under a water temperature of 80 ° C. and 2200 psi (3 minutes) to 6000 psi (15 minutes).

Due to such isothermal isostatic pressing, a part of the functional ceramic sheet 200 is forcibly pushed and filled into the separation groove 102 formed by intruding into the insulator ceramic substrate 100.

In this case, the use of the aluminum plate or the auxiliary material in the crimping process is to prevent breakage of the scribed insulator ceramic substrate that may occur during isostatic pressing.

Subsequently, by firing the functional ceramic sheet 200 through the firing process, the portion of the functional ceramic sheet 200 forcibly filled with the separating grooves 102 is fired and physically coupled to the insulator ceramic substrate 100. At the same time, the tip ends of the internal electrodes 110 and 110a are pressed by the filling from the upper surface and the side surface and securely fixed, thereby preventing the tip portion from being deformed.

Thereafter, as shown in FIG. 2D, a predetermined portion is selectively trimmed from both ends of the width direction of the functional ceramic sheet 200 by a laser or the like.

Subsequently, as shown in FIG. 2E, the glass protective film 300 is selectively applied to the entire surface of the functional ceramic sheet 200. In this case, the protective film 300 may be extended to the portion cut by the laser trimming, that is, the side surface of the functional ceramic sheet 200 in FIG. 2D, thereby fulfilling a protective role. Application of the protective film 300, for example, by forming a paste consisting of a glass composition usable in the range of 700 ~ 800 ℃ by screen printing method and heat treatment.

Thereafter, as shown in FIG. 2F, each chip ceramic component is divided based on the scribe line 101 through a braking process, and the internal electrodes 110 exposed at both ends of the chip ceramic component cut as illustrated in FIG. 2G. The external terminal 500 is formed by dipping the external electrode paste such as silver or silver-epoxy. In addition, if necessary, through the plating process, nickel and tin are sequentially plated on the external terminal 500 to sequentially plate the nickel plating layer 510 and the tin plating layer 520, thereby enabling surface mounting.

The chip ceramic component manufactured by the above method has various characteristics.

First, the deformation of the front end portion of the opposing internal electrode can be minimized, thereby reducing the variation in electrical characteristics.

In addition, the application range can be expanded by completely filling functional ceramics of each kind between opposing internal electrodes.

In other words, when varistor ceramic is applied, the distribution of varistor voltage or capacitance, which is an electrical characteristic, can be minimized, and product specifications can be diversified by changing the width of the separation groove, It can discharge to ground through varistor. In addition, in the case of applying the dielectric ceramic, it is possible to implement a low-capacity capacitor of a precision class with little dispersion as described above.

Furthermore, when PTC or NTC thermistor ceramics are applied, dispersion of resistance values can be minimized, and various specifications can be realized by changing the width of the separation groove as described above.

7 is a cross-sectional view showing another embodiment of the present invention.

Referring to FIG. 7, a protective layer 400 may be formed in a portion where the separation groove 102 is to be formed.

Specifically, the protective layer 400 is formed by a printing method at a position where a dicing saw operation is to be performed to form the separation groove 102 on the internal electrode 110. For example, the black epoxy which added the organic pigment to the PVB system which volatilizes and extinguishes on hot air drying conditions of 310 degreeC 1 hour can be used.

According to this configuration, in the process of cutting the contact between the internal electrode 110 and the ceramic substrate 100 heat-treated blade surface is rotated at a high speed in the dicing saw operation of the internal electrode 110 to be carried out later. To prevent the tip of the cable from being torn off.

In this embodiment, the electrode was previously heat-treated, and then a protective layer was formed of epoxy. However, the glaze (overglaze) usable at a high temperature may be printed and dried on the internal electrode, and then heat-treated at the same time. have. In this case, however, the high-temperature glaze must be selectively used in consideration of the heat shrinkage rate, reactivity, temperature range of use and the like with the functional ceramic.

It is also possible to use glass instead of epoxy.

8 is a cross-sectional view of a chip ceramic component element in accordance with another embodiment of the present invention.

According to this embodiment, the functional ceramic sheet 210 is bonded onto the ceramic substrate 100, the internal electrode 110 is printed on the substrate, dried, and first baked. Thereafter, the same steps as described above are repeated to fabricate the chip ceramic component element.

According to this embodiment, the functional ceramic sheet 210 has a strong adhesive force with the ceramic substrate 100. In addition, the adhesion of the internal electrode 110 by the heat treatment is superior to the functional ceramic sheet 210 than to the ceramic substrate 100. In addition, heat treatment may be performed at a temperature of about 50 ° C. lower than that of forming the internal electrode 110 on the ceramic substrate 100. Furthermore, since the portion of the functional ceramic sheet 200 and the portion of the functional ceramic sheet 210 embedded in the separation groove 102 are made of the same material, they are strongly bonded through the secondary firing.

9 is a cross-sectional view of a chip ceramic component element in accordance with another embodiment of the present invention.

This embodiment differs from the embodiment of FIG. 8 in that the separation groove 102a extends only inside the functional ceramic sheet 210.

According to this embodiment, since the ceramic substrate 100 having a high mechanical strength is not cut in addition to the above-described advantages, the life of the blade used in the dicing sawing operation can be extended.

Although the above has been described with reference to the preferred embodiment, various modifications are possible at the level of those skilled in the art. The following is a description of these modifications.

(1) The above embodiment can be applied to chip ceramic components such as varistors, thermistors, beads, or capacitors.

(2) The internal electrodes can be appropriately arranged according to the type of chip ceramic component to be formed, that is, varistors, beads, thermistors, capacitors, and the like.

(3) In addition, since the varistor must absorb static electricity and quickly discharge to the ground, the separation groove should be composed of only one, but two or more thermistors and capacitors should be formed according to the design variable of the resistance value or the capacitance value. can do.

(4) In the above embodiment, a single layer of functional ceramic sheet is laminated on the insulator ceramic substrate, but the present invention is not limited thereto.

Multiple functional ceramic sheets may be stacked on the insulator ceramic substrate, and internal electrodes may be formed for each stacked functional ceramic sheet.

Therefore, the present invention should not be limited to the above embodiments but should be construed in accordance with the claims set forth below.

As described above, the present invention has various advantages.

First of all, the deformation of the front end portion of the opposing internal electrode can be minimized, thereby reducing the variation of the electrical characteristics and manufacturing a precision class product.

In addition, filling the functional ceramics by the type between the opposing internal electrodes has the effect of expanding the application range.

Additionally, rigid bonding can be achieved by forming the anchoring structure at the interface with the insulator ceramic substrate through pressing and plastic fixing the functional ceramic sheet.

Claims (14)

Insulator ceramic substrates; Internal electrodes formed on at least one of a surface or a rear surface of the insulator ceramic substrate; And A functional ceramic sheet having electrical characteristics laminated and bonded on the insulator ceramic substrate so as to cover the internal electrode, And a separation groove for electrically separating the internal electrode into the ceramic substrate, and a portion of the functional ceramic sheet is embedded in the separation groove. The method according to claim 1, And wherein the bonding is achieved by intruding and firing the functional ceramic sheet portion into the insulator ceramic substrate at an interface with the insulator ceramic substrate. Insulator ceramic substrates; Internal electrodes formed on at least one of a surface or a rear surface of the insulator ceramic substrate; And A functional ceramic layer having an electrical property that is applied and baked in a paste state on the insulator ceramic substrate so as to cover the internal electrode, A chip ceramic component element, wherein a separation groove for electrically separating the internal electrode is formed to penetrate into the ceramic substrate, and a portion of the functional ceramic layer is embedded in the separation groove. The method according to claim 1 or 3, And an auxiliary electrode connected to the inner electrode on an inner side wall of the separation groove, respectively. The method according to claim 1 or 3, And wherein said functional ceramic sheet or said functional ceramic layer is laminated or formed only in adjacent portions with respect to said separation groove. The method according to claim 1 or 3, The insulator ceramic substrate is a single ceramic substrate formed by dividing a plurality of chip ceramic component elements into scribe lines, And the depth of the scribe line is 40% or less of the thickness of the ceramic substrate, and the depth of the separation groove is 1/3 or less of the depth of the scribe line. Claim 7 was abandoned upon payment of a set-up fee. The method according to claim 1 or 3, And the width of the separation groove is in the range of 50 μm to 200 μm. Claim 8 was abandoned when the registration fee was paid. The method according to claim 1, And the thickness of the functional ceramic sheet is 1.5 to 5 times the depth of the separation groove. The method according to claim 1 or 3, A chip ceramic component element, wherein a protective layer is formed on a portion of the inner electrode to cover the separation groove. The method according to claim 1 or 3, And the separation groove cuts the internal electrode in one of a width direction and a length direction of the internal electrode. Printing internal electrodes on an insulator ceramic substrate surface; Cutting the inner electrode to form a separation groove penetrating into the insulator ceramic substrate so that the inner electrode is electrically separated; Stacking and pressing a functional ceramic sheet over the entire surface of the insulator ceramic substrate to compress the functional ceramic sheet to fill the separation grooves; And Firing the functional ceramic sheet at a predetermined temperature; And And forming an external electrode to be electrically connected to the internal electrode. The method according to claim 11, The pressing is a method for manufacturing a chip ceramic component, characterized in that carried out by isothermal isostatic pressure. Insulator ceramic substrates; A first functional ceramic sheet having electrical properties laminated and bonded on the insulator ceramic substrate; Internal electrodes formed on the first functional ceramic sheets; And A second functional ceramic sheet having electrical characteristics laminated and bonded on the insulator ceramic substrate so as to cover the internal electrode, And a separation groove for electrically separating the internal electrode penetrates into the ceramic substrate, and a portion of the second functional ceramic sheet is embedded in the separation groove. Insulator ceramic substrates; A first functional ceramic sheet having electrical properties laminated and bonded on the insulator ceramic substrate; Internal electrodes formed on the first functional ceramic sheets; And A second functional ceramic sheet having electrical characteristics laminated and bonded on the insulator ceramic substrate so as to cover the internal electrode, And a separation groove for electrically separating the internal electrode into the first functional ceramic sheet, and a portion of the second functional ceramic sheet is embedded in the separation groove.

Images