JP3358990B2 - Manufacturing method of chip type resistor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

As shown in FIGS. 1 to 3, the present invention relates to a method of forming a thick resistive film 4 on an upper surface of a chip type insulating substrate 2. As shown in FIG.
Are formed so as to connect between the upper surface electrode films 3 formed on both right and left sides, and on both right and left end surfaces of the insulating substrate 2, side electrodes 5 connected to the upper surface electrode film 3 are formed.
A heat-resistant protective film 6 such as glass is formed on the upper surface of the insulating substrate 2.
Is formed so as to cover the resistance film 3.

[0002]

2. Description of the Related Art Heretofore, for manufacturing a chip type resistor 1, for example, a method described in Japanese Patent Application Laid-Open No. 4-241401 and shown in FIGS. 10 to 13 has been adopted.

[0003] First, as shown in FIG. 10, a ceramic material plate A 'in which a large number of chip-type insulating substrates 2 are connected side by side in a vertical direction and a horizontal direction, and the ceramic material body A' is connected to each other. A groove-shaped vertical streak line B 'and a horizontal streak line C' for breaking for each insulating substrate 1 are manufactured by firing in a state engraved in advance, and on the upper surface of the ceramic material plate A ', as shown in FIG. As shown in the figure, the upper electrode films 3 are formed so as to extend along the vertical lines B 'by screen printing of a material paste and baking after the screen printing, and then the ceramic material plate A' On each of the upper surfaces of the insulating substrates 2 in
As shown in FIG. 12, the resistive film 4 is formed by screen printing of a paste and baking after the screen printing.

After each of the resistance films 4 is trimmed and adjusted so that its resistance value becomes a predetermined value, a protective film 6 is formed on the upper surface of each of the insulating substrates 2 by screen printing. It divided ceramic material plate a 'and, as shown in FIG. 13, by breaking (cracking) along each longitudinal muscle Looking B, rod-shaped ceramic blanks a ₁ a plurality of', each a ₂ '· · · The side electrode film 5 is formed on the longitudinal side surface of each of the rod-shaped ceramic material pieces A ₁ ′, A ₂ ′. Are divided along each of the insulating substrates 2 by breaking along.

[0005]

However, in this conventional manufacturing method, each insulating substrate 2 is broken by breaking the ceramic material A 'along each vertical line B' and each horizontal line B '. Since the ceramic material body A 'can be divided into each insulating substrate 2 at an extremely high speed, there is an advantage that
On the other hand, as described below,. In the case where the ceramic material plate A ′ is broken for each insulating substrate 2 along each of the vertical lines B ′ and the horizontal lines C ′ engraved in advance, the surface of each insulating substrate 2 is shown in FIG. 2 and FIG.
As shown by a two-dot chain line, breakage (breaking) in an inclined manner frequently occurs, so that not only the dimensional accuracy of the width dimension W and the length dimension L in the insulating substrate 2 is significantly reduced, but also in some cases, The width dimension W and the length dimension L deviate from the standard dimensions, resulting in a defective product.

[0006] In addition to this, as described above,
B 'and each insulating substrate 2 along each horizontal line C'.
When you break, you will see the
The surface electrode film 3 and the side electrode film 5 also break at the same time.
Therefore, the upper electrode film 3 and the side electrode film
Since the occurrence of peeling defects frequently occurs in No. 5, the occurrence rate of defective products is high. . The ceramic material A 'is manufactured in a state of a green sheet by engraving each vertical line B' and each horizontal line C 'on the green sheet and firing the green sheet. And the distance between the horizontal lines C ', there is a large variation due to shrinkage during firing of the green sheet.

Therefore, when each of the upper electrode film 3, the resistive film 4, and the protective film 6 is formed on the upper surface of the fired ceramic material plate A 'by screen printing, a screen mask used for each screen printing is used. A large number of screen masks are prepared in which the punched holes are adjusted according to the variation in the spacing between the vertical lines B 'and the variation in the spacing between the horizontal lines C'. Since the screen mask must be properly used in accordance with the above-mentioned variations, not only does the production of the screen mask require a great deal of cost, but also the screen printing requires a great deal of trouble, and the cost increases significantly. I do. There was a problem to say.

It is a technical object of the present invention to provide a manufacturing method which can be manufactured at low cost without causing these problems.

[0009]

SUMMARY OF THE INVENTION In order to achieve this technical object, the present invention provides a method of connecting a large number of chip-type insulating substrates in a longitudinal direction and a lateral direction, connecting them integrally, and recognizing positions around them.
An upper electrode film is formed on the upper surface of the ceramic material plate formed by integrally connecting the blank portions with the marks by screen printing of a material paste and firing after this screen printing.
Each of the insulating substrates is formed so as to extend along each vertical boundary line, and each of the margins is
To the part outside the left and right ends of the vertical row on the insulating substrate
The reference mark is placed on the material
Was formed by screen printing of paste, then the location of the insulating substrate on the upper surface of the ceramic material plate, a resistance film, across said upper surface electrode of the resistive film by baking after screen printing and the screen printing material paste The film is formed so as to be electrically connected to the film, and a protective film for each of the resistive films is formed by screen printing. Then, the ceramic material plate is formed by a disk cutter provided on a single rotating shaft. , Based on the position recognition mark
As the vertical boundaries between each insulating substrate
By simultaneously cutting along the plurality of boundaries among all of the boundaries, it is divided into a plurality of rod-shaped ceramic material pieces, and on the longitudinal side surface of each of the rod-shaped ceramic material pieces, After forming the side electrode film so that the side electrode film is electrically connected to the upper electrode film by applying a material paste and baking after the application, each rod-shaped ceramic material piece is connected to one rotating shaft. At each end, use a plurality of disk cutters
Simultaneous cutting along a plurality of boundary lines among the horizontal boundary lines between the respective insulating substrates is performed for all of the boundary lines with reference to the reference mark in the margin portion to be formed. Thereby, each insulating substrate is divided. "It was to be.

[0010]

According to the present invention, according to the present invention, a groove-shaped vertical line and a horizontal line are engraved on a ceramic material plate in advance as in the prior art, and a break is made along each of the vertical line and the horizontal line. Without dividing (split), the portion of each vertical boundary line and each horizontal boundary line between each insulating substrate should be divided into each insulating substrate by cutting with a disk cutter. Therefore, when each of the upper surface electrode film, the resistive film and the protective film is screen-printed using a screen mask, the ceramic material plate, regardless of shrinkage when firing from a green sheet, a plurality of ceramic sheets Since the same screen mask can be used for the material, prepare a large number of screen masks for each screen printing, and The use of different screen masks can be omitted.

Moreover, since the ceramic material plate is divided into individual insulating substrates by cutting with a disk cutter, the side surfaces of the respective insulating substrates do not become inclined unlike the above-mentioned conventional break. Therefore, it is possible to improve the dimensional accuracy of the width dimension and the length dimension of each insulating substrate, and it is possible to reliably reduce the occurrence of defective products whose width dimension and the length dimension deviate from the standard dimensions at the time of division.

Further, according to the present invention, each of cutting the ceramic material plate into a plurality of rod-shaped ceramic material pieces and cutting each of the rod-shaped ceramic material pieces into a plurality of insulating substrates, By using a plurality of disk cutters provided on the rotating shaft, the ceramic
Required to cut the blank material board into many insulating substrates
The cost is reduced.

[0013]

Therefore, according to the present invention, when manufacturing a chip type resistor, a large number of each of a plurality of types of screen masks are prepared by forming an upper electrode film, a resistive film and a protective film. In addition to eliminating the need to use a large number of screen masks, in addition to avoiding the occurrence of defective products, the manufacturing cost can be significantly reduced and the dimensional accuracy of each chip type resistor can be improved. In addition, the above-described effect can be exerted even when manufacturing a small chip type resistor.

[0014]

In addition to the above, according to the present invention, after setting the relative position of the position recognition mark and the reference mark correctly, a plurality of ceramic material plates are set out of each of the vertical boundary lines.
In addition to performing cutting of each bar-shaped ceramic material piece along the boundary line with reference to the position recognition mark provided in the margin, the bar-shaped ceramic material pieces are cut out of the respective boundary lines in the horizontal direction. to cut each insulating substrate along a plurality of boundary lines, by performing a reference mark provided at the same time when forming the upper electrode film on the margin as a reference, cutting and to each bar-shaped ceramic blanks When cutting into insulating substrates, it is possible to minimize the relative displacement of the cutting line relative to each of the vertical and horizontal boundary lines, so that dimensional accuracy can be further improved. In addition, occurrence of defective products due to displacement of the cutting line can be reliably reduced.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS.

First, as shown in FIG. 4, a plurality of chip-type insulating substrates 2 are connected in a row in the vertical and horizontal directions, and a ceramic material plate A having a margin connected to the periphery thereof is attached to a green sheet. Produced by firing
A pair of through-holes a 'for position recognition are drilled in pairs at each of the left and right sides of the substantially central portion of the ceramic material body A, and a notch for recognition of the front and back of the ceramic material plate A is formed at one corner. a ″ is provided.

On the upper surface of the ceramic material plate A, an upper electrode film 3 is formed by screen printing an appropriate material paste using a screen mask as shown in FIG. 5 and baking after the screen printing. The upper electrode film 3 is formed so as to extend along each vertical boundary line B between the insulating substrates 1.

At the time of screen printing of the upper electrode film 3, the screen mask used for the screen printing is recognized with respect to the ceramic material plate A while the through holes a 'in the ceramic material plate A are recognized by a camera or the like. At the same time, the reference marks D are formed in the margins in the horizontal rows of each insulating substrate 2. In addition,
The reference mark D may be formed by screen printing different from screen printing of the upper electrode film 3.

Next, as shown in FIG. 6, a resistive film 4 is screen-printed with an appropriate material paste on a surface of each of the insulating substrates 2 on the upper surface of the ceramic material plate A using a screen mask. By firing after screen printing , both ends of the resistive film 4 are connected to the upper electrode.
It is formed so as to overlap with the film 3 so as to be electrically conductive .

Further, after each of the resistance films 4 is trimmed and adjusted so that the resistance value becomes a predetermined resistance value, the resistance films 4 are placed on the respective insulating substrates 2 on the upper surface of the ceramic material plate A. The covering protective film 6 is formed by screen printing using a screen mask.

On the other hand, as shown in FIG. 7, a rotary table 11 is provided on the upper surface of an XY table 10 which reciprocates in two directions, an X direction and a Y direction. Are arranged so as to reciprocate in the horizontal direction along the upper surface of the rotary table 11.
Second, a plurality of (three) disk cutters 13 are connected to a plurality of, for example, one by skipping one of the boundary lines B in the vertical direction.
It is provided at the interval between the boundary lines B.

As shown in FIGS. 5 and 6,
After the ceramic material plate A on which the upper electrode film 3, the resistance film 4, and the protective film 6 have been formed is placed on the upper surface of the turntable 11, each through-hole a 'in the ceramic material plate A is connected with a camera or the like. Rotating table 1 while recognizing
1 or by moving the XY table 10, each vertical boundary line B between the insulating substrates 2 becomes perpendicular to the axis of the rotary shaft 12, and Each disk cutter 1 on shaft 12
3 is aligned with each of the vertical boundary lines B.

After the positioning, the rotary shaft 12 is moved in the horizontal direction while rotating, so that the vertical boundary lines B of the ceramic material plate A are aligned along the boundary lines B. in each disc cutter 13 Te, the upper
The cutting along with the surface electrode film 3 is repeatedly performed for each boundary line B in the ceramic material plate A, so that the ceramic material plate A is divided into a plurality of rod-shaped ceramic material pieces A as shown in FIG. _It is divided into ₁ , A ₂ , A ₃ ...

Next, on the longitudinal side surfaces of the rod-shaped ceramic material pieces A ₁ , A ₂ , A _3.
The side electrode film 5 is brought into contact with the upper electrode film 3 by appropriately applying a material hast and baking thereafter.
To be electrically conductive .

On the other hand, as shown in FIG. 9, a rotary table 15 is provided on the upper surface of an XY table 14 which reciprocates in two directions, an X direction and a Y direction. Are arranged so as to reciprocate in the horizontal direction along the upper surface of the rotary table 15.
6, a plurality of (two) disk cutters 17 are connected to the respective boundary lines C between the insulating substrates 1 in the horizontal direction.
For example, at least a plurality of boundary lines C, such as skipping at least one, are provided.

One or more of the rod-shaped ceramic material pieces A ₁ , A ₂ , A ₃ ... Are placed on the upper surface of the rotary table 15, and then each of the rod-shaped ceramic material pieces A Rotating the rotary table 15 or moving the XY table 14 while recognizing each reference mark D of the first bar-shaped ceramic material piece A ₁ among A ₁ , A ₂ , A _3. By doing so, each horizontal boundary line C between the insulating substrates 2 in the first rod-shaped ceramic material piece A ₁ is perpendicular to the axis of the rotating shaft 16, and each disk in the rotating shaft 16. The cutter 17 is positioned so as to coincide with each of the horizontal boundary lines C.

After the positioning, the rotating shaft 16 is moved in the horizontal direction while rotating, so that each horizontal boundary line C ₁ of the first rod-shaped ceramic material piece A ₁ is moved.
Of each disk cutter 1 along the boundary line C.
In 3 , the first rod-shaped ceramic material piece A ₁ is cut into plural pieces by repeatedly cutting the upper electrode film 3 across each boundary line C of the first rod-shaped ceramic material piece A ₁ . The substrate is divided into individual insulating substrates 2.

This division is made by dividing the rod-shaped ceramic material pieces A ₂ , A _3, ... Other than the first rod-shaped ceramic material piece A _1.
Similarly, the chip resistor 1 as shown in FIGS. 1 to 3 can be manufactured.

[Brief description of the drawings]

FIG. 1 is a partially cutaway perspective view of a chip-type resistor.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a sectional view taken along line III-III of FIG.

FIG. 4 is a perspective view of a ceramic material plate used in the method of the present invention.

FIG. 5 is a perspective view when an upper electrode film is formed on the upper surface of the ceramic material plate in FIG. 4;

6 is a perspective view when a resistive film is formed on the upper surface of the ceramic material plate in FIG.

FIG. 7 is a perspective view showing a state where the ceramic material plate is cut into a plurality of rod-shaped ceramic material pieces.

FIG. 8 is a perspective view showing the rod-shaped ceramic material piece.

FIG. 9 is a perspective view showing a state where the rod-shaped ceramic material piece is cut into a plurality of insulating substrates.

FIG. 10 is a perspective view of a ceramic material plate used in a conventional method.

11 is a perspective view when an upper electrode film is formed on the upper surface of the ceramic material plate in FIG.

FIG. 12 is a perspective view when a resistive film is formed on the upper surface of the ceramic material plate in FIG.

FIG. 13 is a perspective view when the ceramic material plate is broken into a plurality of rod-shaped ceramic material pieces.

[Explanation of symbols]

1 chip resistor second insulating substrate 3 upper electrode film 4 resistor film 5 side electrode film 6 protective film A ceramic material plate B longitudinal direction of the border line A ₁ of the boundary line C laterally, A _2, A ₃ rod-shaped ceramic blanks 10,14 XY table 11,15 Rotary table 12,16 Rotary axis 13,17 Dicing cutter

Claims (1)

(57) [Claims] 1. A plurality of chip-type insulating substrates are arranged in a longitudinal direction and a lateral direction, are connected integrally, and have position recognition marks around them.
The upper surface electrode film is formed on the upper surface of the ceramic material plate formed by integrally connecting the blank portions provided with the above, by the screen printing of the material paste and the firing after the screen printing, the vertical direction between the respective insulating substrates. The insulating base is formed so as to extend along the boundary line, and
The reference marks should be placed on the part of the board
Material paste based on the position recognition mark.
Then, a resistive film is formed at each insulating substrate on the upper surface of the ceramic material plate by screen printing of a material paste and baking after the screen printing so that both ends of the resistive film are formed on the upper surface electrode film. Along with being formed so as to be electrically conductive to, a protective film for each of the resistive films is formed by screen printing, and then, the ceramic material plate, a disk cutter provided on a plurality of rotating shafts, On the basis of the position recognition mark,
Of the vertical boundaries between each insulating substrate,
Simultaneous cutting along several boundary lines is performed for all of the boundary lines, thereby dividing into a plurality of rod-shaped ceramic material pieces. After the film is formed so that the side electrode film is electrically connected to the upper electrode film by applying a material paste and baking after the application, a plurality of rod-shaped ceramic material pieces are provided on one rotating shaft. With each disk cutter provided, the margin at both ends
With reference to the reference mark of the section, by simultaneously cutting along all of the plurality of boundary lines among the plurality of boundary lines in the horizontal direction between the respective insulating substrates, A method for manufacturing a chip-type resistor, wherein the chip-type resistor is divided every time.