JP2578398Y2 - Substrate for chip-shaped electronic components - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for a chip-shaped electronic component for obtaining an insulating substrate used for a chip resistor, a multiple resistor, a semi-fixed resistor and the like.

[0002]

2. Description of the Related Art Conventionally, chip-shaped electronic components such as chip resistors, multiple resistors, and semi-fixed resistors are generally formed by a single rectangular chip having divided grooves formed vertically and horizontally in order to improve productivity. It has been manufactured using a substrate for electronic components (hereinafter simply referred to as a substrate for electronic components).

More specifically, as shown in FIGS. 5 and 6, an electronic component substrate 51 is made of ceramic or the like, and has divided grooves 11 to 14 formed on one or both main surfaces thereof.

The electronic component substrate 51 has divided grooves 11 to 11.
14, an electronic component region 51a from which one chip-shaped electronic component can be extracted after the dividing process, and the electronic component region 51a.
and a margin area 51b provided around a. The dummy element extracted from the blank area 51b is
The electronic components extracted from the electronic component area 51a are sorted out and discarded.

The blank area 51b is formed on the outermost element area of the plurality of electronic component areas 51a so that a predetermined thick film pattern can be formed stably.
In order to prevent the element area from being damaged or damaged when nipping and handling 1, to ensure stable division processing when thrown into a dividing machine such as a dividing roller, and also to make positioning marks for screen printing, etc. Such as to form
It is provided for various purposes.

For example, a chip resistor, which is one of the chip-shaped electronic components, is formed by using the above-described electronic component substrate 51 and, for example, forming one chip partitioned by the dividing grooves 11 to 14 of the electronic component substrate 51. Various thick films are formed in a region to be a resistor (hereinafter, referred to as an element region 50a) by a thick film technique, and are manufactured through a division process.

First, on the surface of each element region 50a,
An underlayer thick conductor film serving as a terminal electrode facing each other is formed.

Next, a resistor film is formed between a pair of underlying thick conductor films on the surface of each element region 50a.

Next, a primary glass film serving as a protective film is formed on the resistor film.

Next, the resistor film is irradiated with laser light or the like through the primary glass film to remove a part of the resistor film,
Adjust to a predetermined resistance value.

Next, a secondary glass film serving as a protective film is formed so as to cover the primary glass film on the resistor film whose resistance value has been adjusted.

The steps so far are formed on the electronic component substrate 51 described above.

Next, the divided grooves 11 to 14 formed vertically and horizontally are provided.
Among them, the primary division processing is performed on the electronic component substrate 51 in a strip shape along the one-way division grooves 11 and 13 so that the underlying conductor film serving as the terminal electrode is exposed.

Next, an end surface conductive film is formed on the end surface of the strip-shaped electronic component substrate so that the underlying thick film conductive film on the front and back surfaces conducts.

Next, a secondary division process is performed along the division grooves 12 and 14 in the other direction among the division grooves 11 to 14. As a result, a semi-finished product of a chip resistor having a base thick film conductor serving as a terminal electrode, a resistor film, and a protective film formed on a substrate is extracted from the electronic component region 51a.

Finally, a plating process is performed on the surface of the underlying thick conductor film to be a terminal electrode.

A conventional electronic component substrate 51 has an electronic component region 51a, which is an aggregate of element regions 50a that are divided into individual chip resistors, and a dummy discarded around the region 51a. Margin area 51 from which elements are extracted
b, the thickness of the electronic component substrate 51 is substantially the same, and the width of the margin region 51b is set to be the same as the length and width of one element region 50a. Therefore, the shape of the chip resistor extracted from the electronic component area 51a and the shape of the dummy element extracted from the blank area 51b are generally substantially the same.

In the dividing step, a substrate for an electronic component or a substrate for a strip-shaped electronic component is interposed between both rollers by using a dividing machine having a fixing roller having a displaced rotating shaft and a pressing roller. , And the dividing process is performed particularly by the load from the pressing roller.

[0019]

Conventionally, the shape of the chip resistor extracted from each element region 50a of the electronic component region 51a and the shape of the dummy element (discarded) extracted from the margin region are substantially the same. Therefore, it is difficult to select the chip resistor and the dummy element from a state where both elements are mixed.

The electronic component area 51a and the margin area 51
b, the width of the margin region 50b is narrow enough to correspond to the length or width of one element region 50a, that is, from the end of the electronic component substrate 51 to the electronic component region 51a.
Is short, the division reliability is reduced due to the relationship between the load from the pressure roller and the moment due to the distance during the division processing.

Further, it is possible to improve the division reliability by forming a blank area 51b corresponding to the length or width of two or more elements from the end of the electronic component substrate 51 to the electronic component area 51a. It is conceivable that the electronic component substrate 51
The number of elements that can be extracted from the data is reduced.

The present invention has been made in view of the above problems, and has as its object to provide electronic components such as a chip resistor extracted from an electronic component region and a dummy element extracted from a margin region. A chip-like electronic component substrate that can easily sort out and further improve the reliability of division in each element region at the outermost peripheral portion of the electronic component region and can maximize the number of extracted electronic components. To provide.

[0023]

SUMMARY OF THE INVENTION The present invention is directed to a chip-like electronic component substrate formed by forming an electronic component region for extracting a chip-like electronic component by vertical and horizontal dividing grooves and a margin region around the electronic component region. A chip-shaped electronic component substrate, wherein the thickness of the blank region is smaller than the thickness of the electronic component region.

[0024]

According to the present invention, since the thickness of the blank area is smaller than the thickness of the electronic component area, when the division processing is performed, the thickness of the chip-shaped electronic component extracted from the electronic component area is reduced.
The dummy element extracted from the blank area has a different thickness and a different weight.

By taking advantage of this difference, after the division processing, the mixed chip-shaped electronic components and the dummy element are separated by using, for example, a sieve in which only the dummy element is shaken off, or by a centrifugal separator due to a difference in weight. Can be easily selected mechanically.

Also, in the dividing process, when a load is applied from the pressure roller, the thickness of the margin region is small, so that the division at the dividing groove at the boundary between the electronic component region and the margin region can be easily performed.
This can be performed reliably, and there is no need to increase the margin area as in the related art. Therefore, the number of electronic components that can be extracted from the electronic component substrate can be maximized.

[0027]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a substrate for a chip-shaped electronic component according to the present invention. As an example, a description will be given of an electronic component substrate used for a chip resistor.

FIG. 1 is a plan view of the electronic component substrate of the present invention. FIG. 2A is a sectional view taken along line XX of FIG. 1, and FIG. 2B is a sectional view taken along line YY of FIG.

In FIG. 1 and FIG.
Is made of alumina ceramic or the like, and its front and rear surfaces are formed with vertical and horizontal dividing grooves 11, 12, 13,
14 are formed. The electronic component substrate 1 includes a dividing groove 1
After being divided along 1, 12, 13, and 14, an electronic component region 1a serving as a chip resistor and the electronic component region 1a
Is surrounded by a blank area 1b. In addition, the dividing groove 11,
12 is formed on the front side, and divided grooves 13 and 14
Are formed on the back side so as to face the dividing grooves 11 and 12 on the front side. Also, the dividing grooves 11 and 12 on the surface side
Alternatively, one of the back-side divided grooves 13 and 14 is formed so as to straddle the electronic component region 1a and the margin region 1b.
In the drawing, both main surfaces are formed.

In FIGS. 1 and 2, the dividing grooves 11, 12, 13,
14, the electronic component region 1a is partitioned into, for example, 5 rows and 5 columns, and each partitioned element region 10a is
It becomes one chip resistor. A blank area 1b is provided around the electronic component area 1a in a shape corresponding to one element area. Therefore, when the electronic component substrate 1 is finally divided, 25 chip resistors and 24 dummy elements are extracted.

More specifically, the planar shapes of the electronic component element region 1a and the blank region are the one element region 10a (the planar shape of the chip resistor) and the number of extractions from the electronic component element region 1a (n rows × m columns: n and m are arbitrary numbers).

In the cross-sectional shape of the electronic component substrate 1, the thickness of the electronic component region 1a is, for example, 0.8 mm, and the thickness of the margin region 1b is, for example, 0.6 mm.

The V of the divided grooves 11, 12, 13, 14
The opening width in a letter shape is, for example, 0.2 mm, and the depth is, for example, 0.08 mm.

Such an electronic component substrate 1 can be easily formed by press molding in an unfired state of alumina ceramic, and is formed by firing.

Next, examples of electronic components to which the above-described electronic component substrate 1 can be applied include a substrate of a multiple resistor, a substrate of a semi-fixed resistor, and a substrate of a thick-film coil component.
The operation of the electronic component substrate 1 will be described below with reference to an example in which the substrate is used as a substrate of a chip resistor. FIG. 3 is a cross-sectional view of the electronic component substrate 1 before the division processing.

As disclosed in the prior art, the chip resistor is formed by performing the thick film technique a plurality of times on each element region 10a of the electronic component substrate 1, performing a dividing process, and further performing a plating process or the like. It is formed. Note that each manufacturing process is performed collectively for the plurality of element regions 10a.

First, the underlying thick conductor films 21a and 21b serving as terminal electrodes are provided on the surface side of the opposite side of each element region 10a.
To form Next, the underlying thick conductor films 22a and 22b serving as terminal electrodes are formed on the back side of the opposite side of each element region 10a.
To form The underlying thick conductor films 21a, 21b, 22
For a and 22b, an Ag-based (Ag, Ag / pd, etc.) conductor paste is formed into a coating film by screen printing, dried, and baked. In addition, the baking process is performed on both underlying thick conductor films 2.
1a, 21b, 22a, and 22b can be performed simultaneously.

Next, the underlying thick conductor films 21a, 21a,
1b, the resistor film 3
To form The resistor film 3 is formed by printing a resistive paste such as ruthenium oxide, drying and baking.

Next, a primary glass film 4 serving as an insulating protective film is formed so as to cover the resistor film 3. The primary glass film 4 is formed by printing a glass paste containing borosilicate glass or the like as a main component, drying the glass paste, and baking the glass paste.

Next, the resistance film 3 coated with the primary glass film 4 is partially cut by irradiating a laser beam to adjust the resistance value. The primary glass film 4
Means that the laser beam is directly applied to the resistor film 4
The resistor film 4 is formed so as not to be damaged.
Is removed, and the primary glass film 4 is also removed. The primary glass film 4 may be omitted depending on the laser light irradiation conditions.

Next, further, so as to cover the resistor film 3,
A secondary glass film 5 serving as an insulating protective film is formed. The secondary glass film 4 is formed by printing a glass paste mainly containing borosilicate glass or the like, drying the glass paste, and then baking the glass paste.

By the above steps, as shown in FIG. 3, in the element region 10a of the electronic component substrate 1, the base conductor films 21a, 21b, 22a, 22b serving as terminal electrodes, the resistor film 3, and the primary film are formed. The glass film 4 and the secondary glass film 5 are formed.

Next, the electronic component substrate 1 is subjected to primary division processing. Specifically, the base conductor films 21a, 2
1b, 22a, dividing groove 1 in the direction in which the ends of 22b are exposed
For example, the substrates 1 and 13 are put into a dividing machine having at least a pressing roller and a pressing sphere so as to be divided into a strip-shaped electronic component substrate 1. At this time, a margin area 1 is provided at both ends.
b is attached.

Next, the strip-shaped electronic component substrate 1 is aligned, and an end surface conductive film is applied between the underlying conductive films 21a and 22a and between the underlying conductive films 21b and 22b by applying the above-described Ag-based conductive paste. , Dried and fired.

Thereafter, the strip-shaped electronic component substrate is subjected to a secondary division process. More specifically, the remaining divided grooves 12 and 14 are put into, for example, a dividing machine having at least a pressing roller and a pressing sphere so as to be divided, and divided into each element region 10a. At this time, dummy elements extracted from the blank area 1b are also mixed.

Here, each element extracted from the electronic component area 1a and the dummy element extracted from the blank area 1b are at least different in thickness.

Using this thickness, for example, by using a shaker in which a thin dummy element is shaken off,
Each element extracted from the electronic component area 1a and the dummy element extracted from the margin area 1b can be easily and reliably selected. In addition to this shaking, sorting can be performed by a sorting machine using a centrifugal separator utilizing a difference in weight.

Each element extracted from the electronic component region 1a selected in this manner is applied to the underlying conductor films 21a, 21a.
A plating layer such as a Ni plating layer or a solder plating layer is formed on the surfaces of the conductor films b, 22a, 22b and the end surfaces.

After the formation of the plating layer, each element extracted from the electronic component area 1a and a dummy element extracted from the blank area 1b may be selected.

Further, since the blank area 1b is thin, the division in the blank area 1b becomes very easy, and the dividing property is improved. In particular, the boundary between the electronic component region 1a and the margin region 1b also becomes thin, and the surface and / or
Alternatively, since the dividing grooves 11, 12, 13, and 14 are formed from the back side, the dividing property at this portion is improved, and the dividing groove is located on the outer periphery of the electronic component region 1a where cracks, cracks, and the like are easily generated. In the region 10a to be divided, the division property is improved.

Furthermore, unlike the prior art, it is not necessary to increase the width of the margin region 1b in order to improve the load force from the split roller and the moment due to the width (distance) of the margin region 1b. Can be maximized.

In the above-described embodiment, the electronic component substrate 1 of the chip resistor is the electronic component substrate 1 having the area 10a of 5 rows × 5 columns. However, as shown in FIG.
In the rows, the side on which the terminal electrode is formed may be the electronic component substrate 1 that is exposed from the beginning. This can be used particularly as a substrate for a semi-fixed resistor having a complicated structure at the edge of the substrate. In this case, a dividing machine having a pressurized spherical roller is used as a dividing machine to divide the dividing grooves 11, 12, 1 and 1.
The electronic components 3 and 14 can be divided by one division process. After selecting an element to be a substrate of the semi-fixed resistor by the dividing process, a slider or the like is wound.

It is to be noted that the thinning of the blank area 1b as in the present invention requires the thickness of the blank area 1b to be smaller than that of the electronic component area 1a in the prior art in view of the shape of the dummy element extracted from the blank area 1b. When the width is the same as the thickness and the width of the margin region 1b is narrowed, it seems to be the same by measuring the selectivity. However, conversely, the thickness in the margin region 1b is large, and the width of the margin region 1b is narrow. As a result, the reliability of the division is reduced.

In the above-described embodiment, an electronic component substrate used for a chip resistor or a semi-fixed resistor is exemplified.
Using a ceramic substrate for large electronic components, a predetermined processing operation is performed on the substrate, and chip-type electronic components to be divided are widely applied to various chip-type electronic components such as multiple resistors and thick-film coil components. Applicable.

[0055]

As described above, in the present invention, since the thickness of the blank area of the electronic component substrate is smaller than the thickness of the electronic component area from which the electronic component is extracted, the dummy extracted from the blank area is provided. Since the shape of the element is different from the shape of the electronic component, the selection can be easily performed mechanically.

At the same time, since the margin area is thin, the dividing property is improved. Therefore, the width of the blank area 1b can be minimized, and conversely, the area occupied by the electronic component area on the electronic component substrate can be increased, and the number of extracted electronic components can be maximized.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component substrate according to the present invention.

2A is a sectional view taken along line XX of FIG. 1, and FIG.
FIG. 2 is a sectional view taken along line YY of FIG. 1.

FIG. 3 is a cross-sectional view during a manufacturing process of a chip resistor which is a chip-shaped electronic component using the electronic component substrate of the present invention.

FIG. 4 is a plan view of another electronic component substrate according to the present invention.

FIG. 5 is a plan view of a conventional electronic component substrate.

FIG. 6 is a cross-sectional view of a conventional electronic component substrate.

[Explanation of symbols]

 1 ··· Electronic component substrate 11, 12, 13, 14 ··· Dividing groove 1a · Electronic component area 1b · Margin area 10a · Element area 21a, 21b, 22a, 22b ··· ..Base conductor film 3 Resistor film 4 Primary glass film 5 Secondary glass film

Claims (1)

(57) [Scope of request for utility model registration] 1. A chip-like electronic component substrate in which an electronic component region for extracting a chip-like electronic component and a margin region around the electronic component region are formed by vertical and horizontal division grooves, wherein the thickness of the margin region is A chip-shaped electronic component substrate, which is thinner than a thickness of the electronic component region.