JP2003309004A - Insulating substrate and manufacturing method of electronic component using the insulating substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a large number of resistors easily from a substrate used in manufacturing resistors such as chip resistors. <P>SOLUTION: Upper and lower edges 3a, 3b wherein a primary dividing groove 201 and a secondary dividing groove 202 are not formed are provided on the periphery of a substrate 100 to be used for holding the substrate 100 in processing such as carrying, printing and baking. Since breake of the substrate 100 can be prevented by holding upper and lower edges 3a, 3b, an area of an edge required for the right and left of the substrate 100 can be reduced and the resistor can be printed in the reduced part. The primary dividing groove 201 is apart from the right and left edges of the substrate 100 by a prescribed distance L1, the primary dividing groove 201 is prevented from reaching the right and left edges of the substrate 100 so that a groove which becomes a breake start point is not present in both right and left end parts of the substrate 100. As a result, the substrate 100 can be made as hard to break as a conventional one in an electrode printing/baking process. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an insulating substrate having a dividing groove used for forming a large number of electronic components such as chip resistors and a method of manufacturing an electronic component using the insulating substrate.

[0002]

2. Description of the Related Art [Chip resistor manufacturing method: FIG. 1] FIG.
Will be explained.

When manufacturing a chip resistor, first, a ceramic powder, a binder resin, a solvent and the like, which are raw materials for an insulating substrate, are mixed to prepare a slurry (S102).

Next, this slurry is formed into a thin plate to form a green sheet and dried (S103), and further, on the front surface and the back surface of this green sheet, a primary dividing groove, which is a groove for primary division, and 2 After forming a secondary dividing groove, which is a groove for the next dividing, by a press or the like (S104), the green sheet is fired to produce a ceramic substrate (S105).

The reason why the primary dividing groove and the secondary dividing groove are formed in the green sheet before firing is that the groove can be easily formed in the green sheet before firing. By using it, a resistive film or the like is printed on the ceramic substrate obtained by firing the green sheet as described later, and when the resistors to be the products are divided from this ceramic substrate, division is easily performed. This is because.

[Ceramic Substrate: FIG. 2] FIG. 2 shows an example of a ceramic substrate 200 manufactured conventionally. The size of the ceramic substrate 200 varies depending on the manufacturing apparatus of the green sheet, the specifications of the chip resistor, etc., but the size when manufacturing a small chip resistor (length × width × thickness). An example is, for example, 60 × 49.
Sizes such as 5 × 0.275 mm and 70 × 60 × 0.275 mm are used.

Such small chip parts, for example, 1
When the ceramic substrate 200 used for the 005 size has a very thin wall thickness of 0.275 mm, it will be damaged during the work until the resistor is completed through each process such as printing process and firing process described later. There is. Therefore, in order to reduce the damage of the ceramic substrate 200 during the work, in order to protect the ceramic substrate 200, the primary dividing groove 201 and the secondary dividing groove are provided around the ceramic substrate 200 of FIG. Edge 20 without groove 202
3a, 203b, 204a, 204b are provided.

These edges 203a, 203b, 204a, 2
04b protects the top, bottom, left, and right ends of the ceramic substrate 200 when the ceramic substrate 200 is conveyed, thereby making it difficult to damage the ceramic substrate and performing a printing process, a firing process, or the like for forming a resistor on the ceramic substrate 200. In, it is also used as a holding portion for holding the ceramic substrate 200. Also, the left and right edges 204a, 204b
Is finally divided and removed using the grooves 207a and 207b.

The ceramic substrate 200 shown in FIG. 2 has a primary dividing groove 201 and a secondary dividing groove 202 in the central portion (portions excluding the edges 203a, 203b, 204a and 204b).
Are formed. The primary dividing groove 201 is composed of a plurality of parallel grooves that connect up to the left and right edges (a pair of four sides facing each other) of the ceramic substrate 200, and will be described later using the plurality of grooves. Ceramic substrate 200-1
Make the next division easier. The secondary dividing grooves 202 are a plurality of parallel grooves that connect up to the upper and lower edges of the ceramic substrate 200 (the remaining one pair of four sides), and are orthogonal to the primary dividing grooves. The plurality of grooves are used to facilitate the later-described secondary division of the ceramic substrate 200 to be described later.

[Resistor: FIG. 3] Next, in FIG. 1, electrodes 220a and 220b (first electrodes) are printed by printing electrodes at predetermined positions on the front surface and the back surface of the ceramic substrate 200 and then firing the electrodes. Are formed (S106), and resistors are printed on the surface of the ceramic substrate 200 at positions where the electrodes are connected to each other and then fired to form the resistance film 230 (S107). Further, after forming the primary protective film of the resistive film 230, trimming for adjusting the resistance value of the resistive film 230 is performed (S108), and the overcoat 250 (secondary protective film) is further provided at the position where the resistive film 230 is covered. Print and form. An example of the resistor formed by the steps of S106 to S108 is shown in FIG. 3, which is a partially enlarged view of FIG.

Next, the edge 204a and the edge 206b are formed in the groove 207a from the ceramic substrate 200 on which the resistor is formed.
It is divided and removed by 207b (S109), and then the ceramic substrate 200 is linearly divided into strips along the primary dividing grooves 201 shown by arrows in FIG. 2 to obtain primary divided products (S11).
0). Next, the side surface electrode 23 is formed on the end surface of the divided primary product.
0a and 230b (second electrode) are formed by roller printing, dipping, sputtering, etc., and fired if necessary (S11
1) After further subjecting the divided end faces to plating treatment (S112), the primary divided product is divided into secondary parts along the secondary dividing grooves 201 (S113), so that the ceramic substrate 200 shown in FIG. A large number of chip resistors 250 shown in FIG. 3 can be taken.

[0012]

DISCLOSURE OF THE INVENTION As described above,
The ceramic substrate 200 forming the resistor has a very thin wall thickness. Therefore, the ceramic substrate 200 is likely to be damaged during various treatments (conveyance, printing of electrodes, resistive film, firing treatment, etc.) for forming resistors on the surface thereof. Therefore, in order to reduce damage to the ceramic substrate 200 in the resistor manufacturing process, edges (203a, 203b, 204a, 204b) are provided around the ceramic substrate 200, and resistors are divided at the edges. By devising that the groove (primary divided groove 201, secondary divided groove 202) that facilitates the above is not formed, damage to the ceramic substrate 200 during the processing step is reduced.

However, the ceramic substrate 20 of FIG.
At 0, it is not possible to form a resistor from the upper, lower, left and right edges.

On the other hand, in the ceramic substrate of FIG. 2 in which the edges of the ceramic substrate are removed and the dividing grooves are formed up to the end of the substrate, the number of ceramic substrates that are damaged when forming the resistor is the same as that of the conventional ceramic substrate with edges. Increased compared to the substrate.
Therefore, the number of resistors finally obtained from the edgeless ceramic substrate is smaller than that of the same-sized edged ceramic substrate shown in FIG.

The present invention has been made as a starting point to solve the above-mentioned problems of the prior art, and an object thereof is a substrate used for manufacturing an electronic component such as a chip resistor. (EN) An insulating substrate capable of easily and electronically manufacturing a large amount of electronic components such as resistors, and a method of manufacturing an electronic component using the insulating substrate.

[0016]

An insulating substrate according to an embodiment of the present invention for achieving the above object has the following constitution. That is, the first for substrate division that is substantially orthogonal to each other
The first groove group and the second groove group, and the first distance, which is the distance between the end of each groove of the first groove group and the end of the substrate, is not in contact with the end. Short enough, and the second
The distance between the end of each groove of the groove group and the end of the substrate.
Characterized by being shorter than the distance.

Here, for example, it is preferable that a first groove group and a second groove group for dividing the substrate having substantially the same pattern are formed on the front surface and the back surface of the substrate, respectively.

Here, for example, the first distance is 0.2
It is preferably formed to have a range of 0.8 mm.

Here, for example, it is preferable that the first groove group is formed of a plurality of divided grooves having a substantially equal distance between grooves.

Here, for example, a piece group divided into approximately the same width by the second groove group and a first piece group formed on both sides of the piece group and wider than a unit of the piece group. It is preferable that one edge portion and a second edge portion that is formed outside the first edge portion and is wider than the first edge portion are formed.

An electronic component manufacturing method according to an embodiment of the present invention for achieving the above object has the following configuration. That is, a functional film that contributes to the characteristics of an electronic component and a first electrode connected to the functional film are provided on an insulating substrate in which a first groove group and a second groove group for dividing a substrate that are substantially orthogonal to each other are formed. In the method of manufacturing the formed electronic component, the functional film and the first film are formed on the insulating substrate separated from each other so that an end of the insulating substrate and an end of each groove of the first groove group are not in contact with each other. Forming an electrode, dividing the insulating substrate along the first groove group, and connecting the first electrode to the insulating substrate divided along the first groove group. And a step of further dividing the insulating substrate divided along the first groove group along the second groove group.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION With reference to the drawings, an insulating substrate 100 according to a preferred embodiment of the present invention, that is, a chip-type electronic component such as a chip resistor, particularly 160
Insulating substrate 100 used for easily manufacturing a large number of electronic components when manufacturing a small chip component having a size of 8,1005,0603 or smaller, and a method of manufacturing the insulating substrate 100. The details will be described.

The shapes of the substrate 100 and the grooves and resistors formed on the substrate 100 described in the present embodiment are merely examples, and unless otherwise specified, the scope of the present invention is not limited thereto. It is not intended to be limited only to this, and is determined according to the characteristics and specifications of the resistor formed on the substrate.

Further, in the following description of the substrate 100 and the manufacturing method thereof, there is a part common to the conventional substrate 200 described with reference to FIGS. 1 to 3, but in the following description, the description of the common part will be omitted. Since they are duplicated, their explanations are omitted and only different points will be explained.

[Structure of Substrate, Structure of Resistor: FIG. 4, FIG. 5 and FIG. 3] Insulating material used to easily and in large quantity produce resistors of the present embodiment. An example of the substrate 100 is shown in FIG.

At the center of the substrate 100, as in the conventional substrate, the primary division is made up of a plurality of parallel grooves (horizontal grooves) for primary division of the substrate 100 as shown in FIG. A groove 1 and a secondary divided groove 2 composed of a plurality of parallel grooves (vertical grooves) are formed in a direction orthogonal to the primary divided groove 1.

Although FIG. 4 shows the front surface of the substrate 100, the rear surface of the substrate 100 is also provided with primary dividing grooves and secondary dividing grooves having the same pattern as that of FIG. 4 although not shown. There is.

Edges 3a and 3b are formed on the outer portion in the vertical direction of the central portion of the substrate 100 where the primary dividing groove 1 and the secondary dividing groove 2 are formed. This edge 3a, 3
Since the primary dividing groove 1 and the secondary dividing groove 2 are not formed in b, it is less likely to be damaged than the left and right edges where the primary dividing groove 1 and the secondary dividing groove 2 are formed. So, this edge 3
The symbols a and 3b are used to hold the substrate 100 when the substrate 100 is transported or various treatments are performed.

Further, from the end of the primary dividing groove 1 to the substrate 100
The distance to the left end 6a or the right end 6b is L1. Note that FIG. 5 shows a partially enlarged view of the primary-divided substrate when the substrate 100 is divided into strips using the primary dividing grooves 1. As shown in FIG. 5, the primary-divided substrate has a first pattern (product: piece group), a second pattern (dummy pattern: first edge portion), and a third pattern (for holding portion). : Second edge portion).

The first pattern formed in the central portion of the substrate 100 is a pattern of individual substrates of resistors as products, and has the same shape as the resistors shown in FIG. The second pattern is formed on both outer sides of the first pattern, and when the primary divided product shown in FIG. 5 is secondarily divided to complete the resistor, the shape of this portion is bad. This is because, in many cases, the product cannot be used, so that the actual product and the dummy product can be easily separated by using a dummy product having a size and shape different from that of the actual product. The third pattern is formed on both sides of the outer side of the second pattern, and is prepared as a side electrode or a portion to be held when plating is performed on the end surface of the primary divided product. The resistance film and the like are not printed.

[Characteristics of Substrate] The first characteristic of the substrate 100 is that the substrate is not easily damaged when a resistor is formed on the substrate, like the conventional substrate. That is, the resistor can be formed.

That is, by leaving the upper and lower edges of the substrate 100, it is possible to reduce the damage of the substrate due to the transportation of the substrate, the printing process on the substrate, the baking process, etc., as in the conventional substrate. In the conventional board, the area of the left and right edge parts required to reduce the damage of the board is reduced as much as possible,
By forming a resistor on the edge, it is possible to manufacture a larger amount of resistors than before.

In the substrate 100, the upper and lower edges 3a and 3b are
The substrate 10 is used during the transportation, printing process, baking process, and the like.
Used to hold 0. Therefore, it is possible to prevent the substrate 100 from being damaged from the edge portion to be held even if various kinds of processing similar to the conventional processing are performed. Therefore, the left and right edges of the substrate 100 can be reduced.

However, in the substrate 100, the two edge portions on the left and right sides are completely removed, and the primary dividing groove 201 is removed.
If the left end 6a and the right end 6b are formed, it is impossible to make a substrate which is not easily damaged like the conventional substrate. Therefore, the primary dividing groove 201 is formed by separating it from the left and right edges of the substrate 100 by a predetermined distance L1 (for example, L1 = 0.2 to 0.8 mm).
Do not reach the left and right edges of 00. In this way, by adopting a structure in which the groove which becomes the starting point of the destruction does not exist at the left and right ends of the substrate 100, even if stress is applied to the left and right ends of the substrate 100 during various processes, the starting point of the destruction becomes Groove does not exist at the left and right ends of the substrate 100,
The substrate 100 can be a substrate that is not easily damaged during the electrode printing / firing process as in the conventional case.

The second characteristic of the substrate 100 is that it is possible to reduce the dividing step (S109 in FIG. 1) conventionally required when forming a strip-shaped divided substrate by primary division from the substrate. It is a point. That is, conventionally, when the resistor is formed from the substrate 200, the groove A of S109 is previously formed.
The edge portion is divided with and then the primary dividing groove 1 is added in S110.
Although the substrate 200 is divided by using, in the case of the substrate 100, the step of dividing the edge portion by the groove A in S109 of FIG. 1 can be omitted. In the past, the process of dividing the insulating substrate was at least three steps, but if the present invention is used, two steps will be sufficient.

This is because the substrate 1 is formed from both ends of the primary dividing groove 1.
Since the distance L1 (distance where no groove is formed) to the left end 6a or the right end 6b of 00 is as small as 1 mm or less, the step of dividing the substrate 100 into strips using the primary dividing groove 1 shown in FIG. In (S110 of FIG. 1), when a stress equal to or larger than a predetermined value is applied to the substrate 100, the substrate 100 can be accurately divided along the direction of the primary dividing groove, and a burr that cannot be used as a resistor is formed. This is because it is possible to prevent inaccurate division that occurs. Therefore, even if S109 of FIG. 1 is eliminated, the occurrence of defective products can be reduced.

[Manufacturable Quantity of Resistor] The first characteristic of the substrate 100 of the present embodiment described above will be described in detail below.

First, the number of resistors that can be manufactured when a small chip resistor is manufactured using the substrate 100 shown in FIG. 4 will be described in comparison with the conventional substrate 200.

In FIG. 4, the size of the substrate 100 (vertical x
Width × thickness) is 60 × 49.5 × 0.275 mm,
The upper and lower edges are 2.14 mm, and the left and right edges are L1 (L
1 = 0.2 to 0.8 mm). Also the substrate 10
The first pattern portion of 0 described above has an edge of 0.98
A resistor of × 0.49 mm shall be formed.

The size of the conventional substrate 200 (length × width × thickness) is the same as the size of the substrate 100, 60 × 49.5.
X0.275 mm, the upper and lower edges of the substrate 200 are 2.14 mm, and the left and right edges are 3.74 mm.

Under the above conditions, the results of comparing the number of resistors that can be manufactured from one substrate between the substrate 100 of this embodiment and the conventional substrate 200 are shown.

In the substrate 100 of this embodiment, the number of chip resistors that can be manufactured is 55 rows in the vertical direction and 93 rows in the horizontal direction, for a total of 5115 pieces. On the other hand, the conventional substrate 200
Then, the number of chip resistors that can be manufactured is 4,300 because the four edges are owned in the vertical and horizontal directions. Therefore, the number of chip resistors that can be manufactured on the substrate 100 of this embodiment is about 1.2 times that of the conventional substrate 200 (5115/429).
0≈1.2), and by using the substrate 100 of this embodiment, the number of chip resistors manufactured is about 2 as compared with the conventional one.
It can be seen that the amount can be increased by 0%.

[Breaking of the Substrate and Burrs Occurring at Ends at Primary Division: FIGS. 6 and 7] Next, when the chip resistor is manufactured using the substrate 100 of the present embodiment, the chip resistor The result of the investigation as to whether or not it is possible to increase the manufacturing number by 20% in the actual manufacturing process will be described in detail with reference to FIGS. 6 and 7.

FIG. 6 illustrates substrates (Examples 1 to 3 and Comparative Example) having different distances L1 from the primary dividing groove 1 to the edge of the substrate, which are manufactured to measure the substrate crack in each process. FIG. 7 is a diagram illustrating the number of substrates damaged in each process and a burr (L2) generated at the end of the substrate during the primary division when forming a resistor using each substrate of FIG. It is the figure which showed the result of having compared the magnitude | size of).

That is, as shown in FIG. 6, the distance L1 from both ends of the primary dividing groove 1 to the left end 6a or the right end 6b of the substrate 100 is changed to 0.2, 0.5 and 0.8 mm. Each of Example 1 to Example 3 of the substrate 100 of the embodiment is 2
00 pieces were produced. In addition, as a comparative example of the substrate 100 of the present embodiment, L1 = 0, that is, 200 substrates formed so that the primary dividing grooves reach both ends of the substrate were manufactured as Comparative Example 1.

Next, the back electrode printing step (S106) → the front electrode printing step (S) corresponding to S106 to S108 in FIG.
106) → resistive printing step (S107) → first protective film forming step (S108) → second protective film forming step (S108) in which the number of substrate cracks and burrs L2 (μm) generated at the end portion during the primary division are eliminated. The measurement result is shown in FIG.

As is apparent from FIG. 7, in the case of the comparative example in which the groove reaches the end of the substrate, the back electrode printing step (the number of damaged substrates: 29) → the front electrode printing step (the number of damaged substrates: 13)
44 sheets out of 200, that is, 22% of all the boards in the process from the resistance printing process (the number of damaged substrates: 2)
The substrate (44/200) corresponding to is damaged.

On the other hand, Example 1 which is the substrate of the present embodiment
3 (distance L1 of the portion where the groove is not formed is 0.2 to 0.
In the case of 8 mm), the substrate was not damaged at all in the steps from the back electrode printing step → the front electrode printing step → the resistance printing step. Further, the burr L2 (μm) shown in FIG. 6 generated at the end portion in the primary division is 6 μm at maximum in the case of the first embodiment,
In the case of Example 2, the maximum was 22 μm, and in the case of Example 3, the maximum was 50 μm. Further, it was found that if the burr L2 (μm) shown in Examples 1 to 3 is in the range of 6 to 50 μm, the finally formed resistor is not damaged.

From this, the substrate 10 having the structure shown in FIG.
It can be seen that if the chip resistor is manufactured by using 0, the number of manufactured resistors can be increased by 20% as compared with the related art. Further, in the manufacturing process of the substrate 100, compared with the manufacturing process of the conventional chip resistor, the dividing process for dividing the left and right edges, which is conventionally required, is unnecessary, and the manufacturing process can be simplified.

The example of manufacturing the chip resistor by forming the resistance film on the insulating substrate has been described above. However, if the type of the functional film that contributes to the characteristics of the electronic component other than the resistor is changed, the capacitor, the thermistor, It can be applied to other electronic components such as fuses.

[0051]

As described above, according to the present invention,
For example, to provide an insulative substrate capable of easily and electronically producing a large amount of electronic components such as resistors from a substrate used for producing electronic components such as chip resistors, and a method for producing electronic components using the substrate. You can

[Brief description of drawings]

FIG. 1 is a diagram illustrating a method of manufacturing a substrate and a resistor using the substrate.

FIG. 2 is a diagram illustrating primary and secondary division grooves and edges formed on a conventional substrate.

FIG. 3 is a diagram illustrating a chip resistor formed on a substrate.

FIG. 4 is a diagram illustrating primary and secondary division grooves and edges formed on the substrate of the present embodiment.

FIG. 5 is a diagram for explaining first to third patterns formed on the primary-divided substrate of the present embodiment.

FIG. 6 is a schematic view of a 1 manufactured to measure a substrate crack at each step.
It is a figure explaining the shape of the board | substrate from which the distance from the next division | segmentation groove | channel 1 to a board | substrate edge part differs.

FIG. 7 is a diagram comparing the number of substrates that are damaged in each process and the size of burrs that occur at the edge of the substrate during primary division.

[Explanation of symbols]

L1 From the end of the primary dividing groove to the end of the substrate 1 Primary dividing groove 2 Secondary split groove 3a edge 3b edge 5a upper end 5b bottom 6a Left edge 6b right edge 10 First pattern (product) 11a Second pattern (dummy pattern) 11b Second pattern (dummy pattern) 12a Third pattern (holding part) 12b Third pattern (holding part) 10 First pattern (product) 100 substrates

Claims (6)

[Claims] 1. A first groove group and a second groove group for dividing a substrate, which are substantially orthogonal to each other, and is a distance between an end of each groove of the first groove group and an end of the substrate. The first distance is so short that the end and the end do not come into contact with each other, and is shorter than a second distance which is a distance between the end of each groove of the second groove group and the end of the substrate. An insulating substrate characterized by. 2. A first groove group and a second groove for dividing the substrate, which have substantially the same pattern on the front surface and the back surface of the substrate.
2. The insulating substrate according to claim 1, wherein the groove group is formed. 3. The insulating substrate according to claim 1, wherein the first distance is formed in a range of 0.2 to 0.8 mm. 4. The insulating substrate according to claim 1, wherein the first groove group is formed of a plurality of divided grooves having a substantially equal distance between grooves. 5. A piece group divided into substantially equal widths by the second groove group, and a first edge formed on both sides of the piece group and wider than one unit of the piece group. And a second portion formed outside the first edge portion and wider than the first edge portion.
The insulating substrate according to claim 1, wherein an edge portion of the insulating substrate is formed. 6. A functional film that contributes to the characteristics of an electronic component and a first film connected to the functional film on an insulating substrate having a first groove group and a second groove group for dividing the substrate which are substantially orthogonal to each other. A method of manufacturing an electronic component in which the electrode is formed, in which the functional film and the functional film are formed on the insulating substrate separated from each other so that an end of the insulating substrate and an end of each groove of the first groove group do not contact each other. The step of forming the first electrode, the step of dividing the insulating substrate along the first groove group, the step of dividing the insulating substrate along the first groove group with the first A step of forming a second electrode connected to the electrode, and a step of further dividing the insulating substrate divided along the first groove group along the second groove group. Electronic component manufacturing method.