WO2005045856A1

WO2005045856A1 - Electronic component manufacturing method

Info

Publication number: WO2005045856A1
Application number: PCT/JP2004/015708
Authority: WO
Inventors: Ryuusuke Suzuki
Original assignee: Minowa Koa Inc.
Priority date: 2003-11-11
Filing date: 2004-10-22
Publication date: 2005-05-19
Also published as: JPWO2005045856A1

Abstract

A method for manufacturing an electronic component in which circuit elements are fabricated on a ceramic substrate (1). The method is suitable for massproduction of an electronic component with high accuracy even if the electronic component is of a small size. The method comprises eleventh to thirteenth steps executed in this order. In the eleventh step, circuit elements (3) are fabricated on a large ceramic substrate (1) having dividing grooves (4) formed at least in one direction in the surface of the ceramic substrate (1). In the twelfth step, the ceramic substrate (1) is diced in a direction generally perpendicular to the dividing grooves (4) so as to produce rectangular strips (12) where unit electronic component pieces (10) are strung. In the thirteenth step, the substrate (1) is divided into the unit electronic component pieces (10) by imparting stress to the substrate (1) so as to cut the rectangular strips (12) along the dividing grooves (4).

Description

Specification

Manufacturing method of electronic components

Technical field

The present invention relates to a method for manufacturing an electronic component in which a circuit element is formed on a ceramic substrate surface, and particularly to a method for manufacturing an electronic component using conductive balls as electronic component terminals. Background art

[0002] Mass production of electronic components is necessary in order to secure a sufficient supply amount in consideration of supplying the electronic components to mass-produced electronic devices. Therefore, in the case of an electronic component (for example, a chip resistor or the like) in which a circuit element is formed on the surface of a ceramic substrate, the circuit element is usually formed on a large ceramic substrate surface provided with a dividing groove in advance by a thick film technique or a thin film technique. Are formed as many as necessary for a large number of electronic components, and then the ceramic substrate is divided into individual electronic component units along the dividing grooves to realize mass production (for example, Japanese Patent Application Laid-Open No. No. 353012).

[0003] Further, with respect to an electronic component in which a circuit element is formed on the surface of a ceramic substrate and a conductive ball is used as an electronic component terminal, US Pat. No. 6,326,677 and International Publication WO97Z30461 disclose such an electronic component. .

Patent Document 1: JP-A-2002-353012

Patent Document 2: U.S. Patent No. 6,326,677

Patent Document 3: International Publication WO97Z30461

Disclosure of the invention

Problems to be solved by the invention

[0004] As the size of electronic components is reduced with increasing effort, it becomes more difficult to realize the mass production. The reason for this is that the dimensional accuracy of the division is directly reflected on the dimensions of the electronic component, so that a very high division position accuracy is required, which complicates the manufacturing process.

[0005] Further, it is difficult to realize the above-mentioned mass production of an electronic component in which a circuit element is formed on a ceramic substrate surface and a conductive ball is used as an electronic component terminal. The reason is that the manufacturing process involves sticking of the ceramic substrate and the conductive ball. [0006] That is, if the ceramic substrate and the conductive balls are fixed before the dividing step, and if the dividing step is to be performed in that state, the fixing part between the ceramic substrate and the conductive balls during the dividing step. Excessive stress may be concentrated. As a result, the ceramic substrate is separated from the conductive ball, and may not function as an electronic component. Therefore, adoption of these steps is unsuitable for the production of electronic components in which circuit elements are formed on the surface of the ceramic substrate and conductive balls are used as electronic component terminals. There are two main types of strong stress application in current technology. One is to apply a stress to bend the ceramic substrate in the direction to open the dividing groove. The other is to apply stress by vibration generated in the cutting and dividing process by dicing the ceramic substrate.

[0007] A first problem to be solved by the present invention is to provide a method of manufacturing an electronic component in which a circuit element is formed on a ceramic substrate surface, even if the electronic component is small in size, with good dimensional accuracy. It is an object of the present invention to provide a method of manufacturing an electronic component suitable for mass production. A second object of the present invention is to provide a method for manufacturing an electronic component in which a circuit element is formed on a ceramic substrate surface and the conductive ball is used as an electronic component terminal. That is, excessive stress should not be concentrated on the fixing portion between and.

Means for solving the problem

[0008] In order to solve the above first problem, a first method for manufacturing an electronic component in which a circuit element 3 is formed on a surface of a ceramic substrate 1 according to the present invention is a method for manufacturing an electronic component provided on at least one direction on a surface. A circuit element 3 is formed on a surface of a large ceramic substrate 1 having a groove 4 (for example, FIG. 1 (a)) (for example, FIG. 1 (b)). A dicing process is performed on the surface of the substrate 1 in a direction substantially orthogonal to the dividing groove 4 (e.g., FIG. 1 (c)) to form By applying a stress to the substrate 1 so as to open the dividing groove 4, the substrate 1 is divided into unit electronic component pieces 10 (for example, FIG. 1 (d)). The thirteen steps are performed in this order.

[0009] The method of forming the circuit element 3 in the eleventh step is particularly preferably screen printing from the viewpoint of mass productivity. The circuit element 3 includes a resistor element, a capacitor element, an inductor element, a multiple element having one kind of these in a large number of electronic components, and a network element. And composite elements, such as CR components, which are combined in one electronic component by combining two or more of these elements.

Here, it is needless to say that the circuit element 3 can be formed on any of the divisional groove 4 existing surface and the non-existing surface of the ceramic substrate 1. Further, since it is “the dividing groove 4 provided in at least one direction”, for example, the ceramic substrate 1 in which the dividing groove 4 is provided vertically and horizontally may be used. In this case, the dicing process described later can be performed along the dividing groove 4, and if the vertical and horizontal dimensions of the electronic component are previously defined by the dividing groove 4, the dicing process at the time of die cutting is performed. There is an advantage that positioning can be facilitated.

[0011] The daisin kakae in the twelfth step is, for example, a daisin kakae using a dicing saw having diamond powder adhered to the surface. Commercially available tools and equipment can be used for the powerful die shredder.

Here, the strip 12 is, for example, one in which the individual unit electronic component pieces 10 are partitioned by the dividing grooves 4 and are arranged in a line as shown in FIG. 1 (c).

In the thirteenth division step, for example, a commercially available division apparatus can be used as a means for applying a stress to the substrate 1 so as to open the division groove 4.

The “dividing groove 4 provided on the surface in at least one direction” is formed, for example, when molding the ceramic substrate 1. Also, before forming the circuit element 3, the dividing groove 4 is formed in advance on the ceramic substrate 1 having both surfaces smooth without forming the dividing groove 4 during the molding.

[0015] The above-mentioned "stress application" is realized in a form suitable for mass production by passing the strip 12 between rollers 8 while being placed on a belt 9, as shown in Fig. 2, for example.

At present, there are two types of practical-level technologies for dividing and processing the ceramic substrate 1. One is a dividing process by applying a stress that causes the ceramic substrate 1 to bend in a direction in which the dividing groove 4 is opened. The other is cutting by dicing.

[0017] The former has the advantage that the processing speed is high enough to be suitable for mass production and the processing cost can be kept low, but the divisional dimensional accuracy is usually low. On the other hand, the latter has the advantage of high accuracy of the dimensional dimension, but usually has a low processing speed and high cost.

[0018] According to the first manufacturing method of the present invention, the divisional dimensional accuracy is particularly low and the strip 12 is required to be formed. It is possible to increase the dimensional accuracy in the dividing step. The reason why the dimensional accuracy in the dividing step required for forming the strip 12 is particularly low is that, in the dividing method in which the force is applied so as to open the dividing groove 4, which is conventionally employed, the length of the dividing groove 4 to be subjected to the stress However, since the length of the strip 12 is as long as the length of the strip 12, it is difficult to uniformly apply stress to the entire dividing groove 4. Another reason is that it is difficult to make the depth of the dividing groove 4 uniform over a long distance corresponding to the length of the strip 12.

Here, in the first manufacturing method, the dividing step required for forming the strip 12 is realized by dicing, so that the dividing dimensional accuracy is high. As described above, the die cutting speed is usually slow, so in the 13th step, the splitting process by applying stress that turns the ceramic substrate 1 in the direction to open the splitting groove 4 which is advantageous in terms of processing speed is adopted. are doing. As described above, in the case of the large division process, the division dimensional accuracy is usually low. However, the length of the division groove 4 to be subjected to the stress is as short as the width of the strip 12, and such a division groove 4 is short. Since the depth rarely varies greatly within one dividing groove 4, it is easy to apply a uniform stress to the entire dividing groove 4, so that the dividing dimensional accuracy is maintained at a high level. A great advantage is that the processing speed is high while the processing speed is high.

Therefore, in the first manufacturing method, in a method of manufacturing an electronic component in which a circuit element is formed on a ceramic substrate surface, even if the electronic component is small, it has good dimensional accuracy and is suitable for mass production. A method for manufacturing an electronic component can be provided, which solves the first problem of the present invention.

[0021] Similarly, a method of manufacturing an electronic component of the present invention, which solves the first problem of the present invention, is a method of manufacturing an electronic component in which a circuit element is formed on a ceramic substrate surface. The method includes a first dividing step of forming strips in which small pieces are connected, and a second dividing step of forming the strips into unit electronic component pieces. One of the first dividing step and the second dividing step is performed by dicing and the other is performed. However, the present invention is characterized in that a stress is applied to the substrate so as to open a dividing groove formed beforehand or after the formation of the circuit element on the substrate surface. The present manufacturing method conceptually includes the above-described first manufacturing method and a second manufacturing method described later, and therefore, the following description will be made on the premise thereof.

[0022] In the dicing process in this manufacturing method, as in the first manufacturing method described above, the force of using a blade such as a die sine blade is severely worn. Ceramic substrate 1 is very hard It is a material. However, as a result of employing a dicing process in one of the first and second dividing steps and a dividing method in which stress is applied to the substrate 1 so as to open a dividing groove in the other, abrasion of the blade is reduced by 1Z3. — Can be reduced to about 2Z3. Also, since at least two of the four sides of the outer shape (rectangular or square) of the electronic component will be formed by dicing, split grooves are opened for all four sides that make up the small electronic component. The dimensional accuracy is higher than in the case where a division method for applying stress to the substrate 1 is employed. Thus, as in the first manufacturing method and the second manufacturing method described later, it is possible to provide a method for manufacturing electronic components having good dimensional accuracy and suitable for mass production even if the electronic components are small. Thus, the first problem of the present invention is solved.

Here, “small” refers to so-called 1005, 0603, or 0402-sized electronic components or components having outer dimensions smaller than those. For example, in the case of a 1005 size electronic component, the width of a strip 12 is about 1. Omm or about 0.5 mm. For example, in the case of an electronic component of 0603 size, the width of the strip 12 is about 0.6 mm or about 0.3 mm. In the case of a 0402 size electronic component, for example, the width of the strip 12 is about 0.4 mm or about 0.2 mm. For these “small” electronic components, it has conventionally been difficult to establish a technique with good dimensional accuracy and suitable for mass production, but the present invention has solved it. Here, the external dimensions of the electronic parts conforming to or conforming to the standard have been described. However, even if the electronic parts have external dimensions outside the standard, those having the strip 12 width of 1.Omm or less have conventionally had good dimensional accuracy. Further, it has been difficult to establish a technique suitable for mass production, and the present invention can solve the problem.

[0024] In order to solve the above first problem, a second method for manufacturing an electronic component in which the circuit element 3 is formed on the surface of the ceramic substrate 1 according to the present invention is a method for manufacturing the electronic component 3 on the surface of a large ceramic substrate 1. A twenty-first step of forming, a twenty-second step of forming a dividing groove 4 for partitioning the unit electronic component piece 10 in at least one direction of the surface, and a strip 12 in which a plurality of the unit electronic component pieces 10 are formed. A dicing process on the surface of the substrate 1 in a direction substantially orthogonal to the dividing groove 4, and the above-described base so as to open the dividing groove 4 of the strip 12. There is a twenty-fourth step of dividing the substrate 1 into unit electronic component pieces 10 by applying stress to the plate 1, and the twenty-first to twenty-fourth steps are performed in this order. [0025] The twenty-first step substantially corresponds to the eleventh step in the first manufacturing method. The twenty-second step corresponds to the twelfth step in the first manufacturing method. The twenty-fourth step corresponds to the thirteenth step in the first manufacturing method. Although the 23rd step was calorie, the vigorous step was substantially included in the 11th step. Therefore, the second manufacturing method solves the first problem of the present invention, while the first manufacturing method solves the first problem. In addition, the second manufacturing method has more advantageous effects than the first manufacturing method described below, and it is considered that the product defect rate can be reduced.Therefore, it is necessary to consider producing a certain amount of non-defective electronic components. In such a case, it is considered that the production rate is increased as a whole due to the effect of reducing the product defect rate, and the mass productivity is further improved.

[0026] The difference between the eleventh step and the twenty-first step is whether or not the dividing groove 4 is formed in advance on the surface of the ceramic substrate 1. In the twenty-first step, the dividing groove 4 is not formed in advance on the surface of the ceramic substrate 1, but the dividing groove 4 is formed in the following twenty-third step. A powerful forming method is based on, for example, Daishindaka Kae. Unlike the cutting and dividing process by dicing the ceramic substrate 1 described above, the digging process does not reach the point where the ceramic substrate 1 is cut, but is a process for forming a slightly shallow dividing groove 4 on the surface of the ceramic substrate 1. is there. Here, in the processing up to cutting the ceramic substrate 1, a blade such as a dicing blade is used, but the blade is severely worn. Ceramic substrate 1 is also a very hard material. However, such abrasion is not so intense when processing is performed to form a slight shallow dividing groove 4 on one surface of the ceramic substrate. Therefore, when mass production of electronic components is considered as in the present invention, it can be said that this is an appropriate method of forming the dividing groove 4. In addition, the above-mentioned problem that the depth of the dividing groove 4 becomes nearly the same can be solved by vigorous dicing. This is because the amount of excavation (including excavation depth) can be easily adjusted with heavy machining.

[0027] In the above-described twenty-third step, a further advantage of forming the dividing groove 4 after the formation of the circuit element 3 is that division into a suitable position is performed irrespective of the position where the circuit element 3 is formed, depending on the formation result. Groove 4 can be formed. If the dividing grooves 4 were formed in the ceramic substrate 1 before the circuit elements 3 were formed, the burden of the circuit element 3 forming process would be extremely large. This is because the formation of the circuit element 3 with the position shifted is not allowed. This is because the smaller the size of electronic components, the higher the accuracy of the circuit element formation position is required. The advantages become more significant as miniaturization progresses.

In the first and second manufacturing methods, a step of fixing the conductive ball 2 to the terminal portion of the circuit element 3 of the unit electronic component piece 10 can be included. That is, the electronic component thus obtained is an electronic component in which the circuit element 3 is formed on the surface of the ceramic substrate 1 and the conductive ball 2 is used as an electronic component terminal.

Here, in order to fix the conductive ball 2 to the terminal portion 7 of the circuit element 3, screen printing or the like of a talium solder is applied to the position where the conductive ball 2 is to be fixed, and then the ball, grid, array ( A BGA) type electronic component ball mounting device or the like can be used. For the “fixation”, fixation using solder, a conductive adhesive, or the like is preferable.

[0030] Among the effects obtained by the first and second manufacturing methods, the advantage that the divisional dimensional accuracy can be increased is obtained because excessive vibration such as large vibrations in the entire ceramic substrate 1 during the division step. This is substantially synonymous with the absence of a stress application shock. The reason is that if an excessive stress is applied to the entire ceramic substrate 1, an impact is applied to the substrate 1 area other than the dividing groove 4 when applying the stress for opening the dividing groove 4. This is because it is considered that there is a possibility that division occurs in areas other than the linear region along the dividing groove 4, and that the divisional dimensional accuracy may decrease. Also, if there is an excessive stress applied to the entire ceramic substrate 1 due to die shrinkage or the like, unintended cutting of the substrate 1 region during division by dicing, This is because it is considered that chips and the like may occur, and the accuracy of the divided dimension may be reduced.

Therefore, the circuit element 3 is formed on the surface of the ceramic substrate 1 by the first and second manufacturing methods, and the electronic component having the conductive ball 2 as an electronic component terminal is not suitable for the entire ceramic substrate 1 due to excessive vibration and the like. Stress application 'Can be manufactured without impact. Therefore, even if there is a step of attaching the conductive balls 2 to the circuit element 3 terminals of the unit electronic component small pieces 10 before the dividing step, excessive stress is applied to the portion where the ceramic substrate 1 and the conductive balls 2 are attached. And the second problem of the present invention can be solved.

[0032] Here, before the thirteenth step or the twenty-fourth step, a step of fixing the conductive ball 2 to the terminal of the circuit element 3 of the unit electronic component piece 10 is provided. When the stress is applied so as to open the dividing groove 4, the fixed conductive ball 2 becomes the point of emphasis. When the dividing step (13th step and 24th step) is applied by applying the lever to the substrate 1 so that the dividing groove 4 is opened, the dividing groove 4 becomes the point of action. There can be. Even in this case, excessive stress is not usually concentrated on the portion where the ceramic substrate 1 and the conductive ball 2 are fixed. The reason is that the dividing groove 4 whose distance is equivalent to the width of the strip 12 is very short, and the stress required for the division is usually small enough. It is because it does not reach. Further, the concentration of the stress can be further avoided by using a buffer member 5 for protecting the conductive ball 2 from sticking, which will be described later.

[0033] The cushioning member 5 also has, for example, styrofoam, sponge, cloth, rubber, resin, foam resin, and the like. For example, as shown in FIG. 3, the buffer member 5 is placed on the conductive ball 2 and stress is applied to a large number of the conductive balls 2 via the buffer member 5 as shown in FIG. Due to the presence of the buffer member 5, part or all of the applied stress is dispersed to a large number of conductive balls 2 without concentrating on one or a small number of conductive balls 2, and as a result, the ceramic substrate There is a first effect of not causing separation between 1 and the specific conductive ball 2. Or a part or all of the stress is applied to the substrates 1 and Z or the circuit element 3, so that no stress is applied to the conductive balls 2 and the ceramic substrate 1 and the specific conductive balls 2 There is a second effect that does not cause peeling off. For example, the position where the conductive ball 2 is present as shown in FIG. 4 becomes the concave portion 6, and the buffer member 5 and the conductive ball 2 do not directly come into contact with each other. These first and second effects may be performed together when one of them is performed alone.

[0034] In the case of obtaining the second effect, the flexibility of the buffer member 5 is lower than the rigidity of the ceramic substrate 1 and can follow the radius up to the division of the substrate 1, In addition, the cushioning member 5 should have a certain degree of flexibility without breaking. Therefore, there is a case where even a material that is recognized as a “rigid body” by social wisdom can be a “buffer member”.

The buffer member 5 for obtaining the second effect has a portion that comes into contact with the end face of the substrate 1 or the strip 12, for example, as shown in the cross-sectional view of FIG. Further, the conductive ball 2 is located in the concave portion 6, and there is no direct contact between the buffer member 5 and the conductive ball 2. Since the cushioning member 5 has a portion that comes into contact with the end face, the role of preventing the displacement between the conductive ball 2 and the recess 6 in the work of fitting the substrate 1 or the strip 12 and the cushioning member 5. To This is advantageous in that the second effect is more easily obtained. Further, the presence of the contact portion between the end face and the buffer member 5 absorbs the stress applied to the conductive ball 2 in the lateral direction (the direction parallel to the surface of the substrate 1), and further increases the stress of the buffer member ₅ . It is also advantageous in that the effect of dispersion can be exhibited. The strong advantageous effect can be obtained even when the cushioning member 5 having no recess 6 as shown in FIG. 3 and having a portion in contact with the end surface of the substrate 1 or the strip 12 is used. it can. Also, in order to obtain the same effect as the force effect, the substrate 1 or the strip 12 has a portion that extends in a direction substantially perpendicular to the substrate end surface force substrate 1 surface like a container, and the buffer member 5 is attached to the portion. It can be mounted on one surface of the board while fitting so that it contacts. That is, the fitting side of the fitting between the base plate 1 or the strip 12 and the cushioning member 5 and the fitting side can be reversed.

In addition, as shown in FIG. 4, the cushioning member 5 has a larger contact area with the surface of the ceramic substrate 1 in a portion that is relatively convex due to the presence of the concave portion 6 as compared with the concave portion 6. preferable. This is because it is considered that the second effect in which the convex portion substantially contributes to the stress dispersion is easily obtained.

The cushioning member 5 can be made of, for example, a rosin-based material such as flats filled between the conductive balls 2 on the surface of the substrate 1. The rosin-based material may exist beyond the top of the conductive ball 2 or may exist without exceeding the top. Since the rosin-based material has both an adhesive effect and a buffering effect, it reinforces the adhesion between the conductive ball 2 and the substrate 1 and propagates the stress directly applied to the specific conductive ball 2 to the surroundings. And apply stress substantially evenly to the large number of conductive balls 2. Therefore, the rosin-based material has the same function as the buffer member 5. The buffer effect is remarkable when the rosin-based material exists beyond the top of the conductive ball 2. The reason is that it is difficult to directly apply stress to the specific conductive ball 2. Further, it is needless to say that the material is not limited to the rosin-based material but can be used as the buffer member 5 as well as the rosin-based material as long as the material has both an adhesive effect and a buffering effect.

[0038] After the division step, the rosin-based material can be washed and removed using an alcohol, a ketone such as acetone, or ethyl acetate or the like, that is, an organic solvent. If the material can be removed after the dividing step as described above, the conductive boss on the substrate 1 surface may be used instead of the rosin-based material. By filling the space between the rosin-based materials, the same function as that of the rosin-based material can be performed.

When the rosin-based material or the like is used as the cushioning member 5, the material is filled between the conductive balls 2 on the surface of the substrate 1, solidified, and then cut along the dividing grooves 4 by a dicing method or the like. Alternatively, in the second manufacturing method of the present invention, it is preferable to form the dividing grooves 4 by dicing or the like after the filling and solidification. When forming the strong dividing groove 4, the buffer member 5 is cut along the dividing groove 4 at the same time. As described above, cutting the cushioning member 5 made of a rosin-based material or the like along the dividing groove 4 has an advantage that the applied stress at the time of division can be reduced. The reason is that the presence of the rosin-based material or the like can also be a factor inhibiting division, and the factor can be removed by the cutting. Further, since the present invention is premised on going through a dicing step, there is an advantage that even if the number of the cutting steps is increased, a large process load is not required.

When the dividing groove 4 and the conductive ball 2 are not formed and arranged on the same surface of the ceramic substrate 1, when the stress is applied so as to open the dividing groove 4 of the strip 12, It is needless to say that excessive stress is not applied to the portion where the ceramic substrate 1 and the conductive ball 2 are fixed, because the surface of the substrate 1 is different from the surface of the fixed conductive ball 2.

As described above, the advantage of performing the step of fixing the conductive ball 2 to the circuit element 3 terminal portion of the unit electronic component piece 10 before the dividing step is that the state of the large ceramic substrate 1 or the strip 12 is as follows. Since the plurality of unit electronic component pieces 10 are integrated, for example, in series, the fixing step can be performed in a state in which the handling is better than when the individual unit electronic component pieces 10 are handled. Specifically, for example, when a commercially available ball mounting device is used, the conductive balls 2 are fixed to the circuit element 3 terminals 7 without stopping the operation of the ball mounting device for all the unit electronic component pieces 10. Can be.

In the first and second manufacturing methods, the step of fixing the conductive ball 2 to the terminal of the circuit element 3 of the unit electronic component piece 10 is performed after the thirteenth step or the twenty-fourth step. You can also. That is, the step of fixing the conductive balls 2 to the terminal portions 7 of the circuit element 3 can be performed after the division step. In this case, it is clear that the vibration caused by the dividing process has no effect on the fixed portion between the ceramic substrate 1 and the conductive ball 2. Excessive stress on the fixed part Needless to say, it is possible to solve the second problem of the present invention, in which no problem is caused.

When the step of fixing the conductive balls 2 to the terminal portions 7 of the circuit element 3 is performed after the dividing step, the conductive balls 2 are connected to the terminal elements 7 of the circuit element 3 without stopping the operation of the ball mounting device. In order to obtain the advantage of fixing the conductive ball 2, for example, in the first manufacturing method, the step of arranging the plurality of unit electronic component pieces 10 is performed after the thirteenth step, or the second manufacturing method In the method, the step of arranging the plurality of unit electronic component pieces 10 is performed after the completion of the 24th step.

Here, as a result of the “arrangement”, the positional relationship between the unit electronic component pieces 10 is fixed as shown in FIG. For this purpose, for example, a bottomed container 11 having a plurality of recesses 17 into which unit electronic component pieces 10 can be inserted is used. Here, it is preferable that all of the arranged surfaces of the circuit elements 3 and the terminal portions 7 are on the upper side. This is because the gravitational force of the conductive ball 2 is easily fixed to a position where the conductive ball 2 should be fixed. In order to fix the conductive ball 2 to the circuit element 3 terminal portion 7 by the above-mentioned ball mounting device, it is particularly preferable to align the front and back of the arranged unit electronic component pieces 10 and make the unit electronic component pieces 10 at equal intervals. . This is because the operation of the ball mounting device can be made smooth and a program for setting the operation can be simplified.

Here, the means for aligning the front and back of the unit electronic component piece 10 is, for example, to make the light reflectivity of one surface and the other surface of the unit electronic component piece 10 different in advance, and to irradiate light and detect the reflected light. With such a simple method, one side faces upwards, and only the unit electronic component pieces 10 are sorted and collected, and then the one side faces upwards, and the state is maintained. It is a means to arrange while doing.

Here, it is preferable that the packing step can be performed as it is in a state where the unit electronic component small pieces 10 are inserted into the container 11 in that the packaging process of the electronic components can be simplified. In this case, the container 11 plays a role as a part of an electronic component packaging material such as a taping material.

[0047] Instead of the container 11 in which the unit electronic component pieces 10 are individually inserted into the recesses 17 as shown in Fig. 5 (a), a plurality of unit electronic component pieces 10 as shown in Fig. 5 (b) are used. It goes without saying that a container 11 having a recess 17 that can be accommodated can be used.

Here, by performing the step of fixing the conductive ball 2 to the terminal portion of the circuit element 3 after the division step, there is an advantage that it is easy to apply soldering to the terminal portion. Conventional or This is because they can be used for barrel plating, which is the method of soldering to the electronic component terminals. Due to the presence of such soldering, there is an IJ point at which the solder wettability of the terminal portion is improved, and the bonding strength is increased when the bonding of the conductive ball 2 to the terminal portion is realized by soldering.

[0049] In the first and second manufacturing methods, it is preferable that the surface on which the circuit element 3 is formed on the ceramic substrate 1 and the surface on which the dividing groove 4 is present are the same surface. The first manufacturing method has an advantage that, in the circuit element 3 forming step (eleventh step), the positional relationship with the dividing groove 4 can be confirmed visually or the like, and the positional accuracy can be improved. That's why. In the second manufacturing method, in the dividing groove 4 forming step (the 23rd step), the positional relationship with the circuit element 3 can be confirmed visually or the like, and there is an advantage that the positional accuracy can be increased. It is. The invention's effect

According to the present invention, in a method for manufacturing an electronic component in which the circuit element 3 is formed on the surface of the ceramic substrate 1, even if the electronic component is small, it has good dimensional accuracy and is suitable for mass production. A method for manufacturing parts can be provided. Circuit elements 3 are formed on the surface of the ceramic substrate 1, and excessive stress is concentrated on the part where the ceramic substrate 1 and the conductive balls 2 are fixed in the electronic component manufacturing method using the conductive balls 2 as electronic component terminals. I couldn't let it. Brief Description of Drawings

FIG. 1 is a diagram sequentially showing states of an electronic component at the end of each step, regarding an outline of a method for manufacturing an electronic component of the present invention.

FIG. 2 is a view showing a state in which a large substrate is placed on a belt and passed between rollers to apply stress so as to bend the large substrate.

FIG. 3 is a perspective view showing an example of an outline of a state in which a buffer member is placed on a large-sized ceramic substrate surface on which circuit elements and conductive balls are formed and arranged according to the present invention.

FIG. 4 is a partially omitted cross-sectional view showing an example of an outline of a state in which a large-sized substrate on which circuit elements and conductive balls are formed and arranged according to the present invention and a buffer member are fitted.

FIGS. 5 (a) and 5 (b) are perspective views each showing an example of an outline of a state in which unit electronic component pieces according to the present invention are housed and arranged in a container.

[FIG. 6] A circuit configuration of a unit electronic component is formed as an example of an embodiment of the present invention. It is a figure which shows a situation sequentially.

[7] FIG. 7 is a view sequentially showing a state in which a conductive ball is fixed on a land of a substrate, as an example of an embodiment of the present invention.

Explanation of symbols

[0052] 1. substrate, 2. conductive ball, 3. circuit element, 4. dividing groove, 5. cushioning member, 6. recess, 7. land, electrode, terminal, 8. roller, 9. belt, 10.Unit electronic parts small piece, 11.container, 12.strip, 13.resistor, 14.glass film, 16.overcoat, 1 7.recess, 19.flux, 20.common electrode

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

(Embodiment of the first manufacturing method)

The best mode for carrying out the present invention based on the first manufacturing method will be described below.As shown in FIG. 1, a large number of dividing grooves 4 are formed in one direction in advance on one surface. A large-sized alumina ceramic substrate 1 having a thickness of 0.5 mm, which has been molded and subjected to the sintering process, is prepared. The divided substrate 1 along the strong dividing groove 4 becomes one side of a single electronic component. The process of forming the circuit elements 3 and the like on the surface of the large substrate 1 having the groove will be described below with reference to the drawings. Here, FIG. 6 shows the substrate 1 (unit electronic component small piece 10) of the minimum unit.

First, an Ag—Pd-based conductive paste containing a glass frit is screen-printed on the surface of the ceramic substrate 1 on which the dividing grooves 4 are formed, and then baked to form an electrode / land for an element. 7 and the common electrode 20 and land 7 are obtained (FIG. 6 (a)). Next, a metal glaze-based resistor paste mainly composed of ruthenium oxide and glass frit is screen-printed so as to be in contact with both the common electrode 20 and the electrode 7, and then fired to obtain the resistor 13 (FIG. 6 (b )). Next, a glass paste is screen-printed so as to cover the resistor 13 and then fired to obtain a glass film 14 (FIG. 6 (c)). Next, a step of forming a trimming groove in the resistor 13 by irradiating a laser to adjust the resistance in order to set a resistance value of the resistor composed of the electrode 7, the common electrode 20 and the resistor 13 to a desired value is performed. (Fig. 6 (d)). At this time, the glass film 14 damages the entire resistor 13. Acts as much as possible. Next, in order to protect the entire resistive element with an epoxy resin-based paste, an overcoat 16 as a protective film is screen-printed, and then the epoxy resin paste is cured by heating (FIG. 6 (e)). When disposing the overcoat 16, the necessary lands 7 of the electrode 7 and the common electrode 20 are exposed (FIG. 6 (e)). Thus, the first step is completed. Note that the configuration of the circuit element 3 (unit electronic component piece 10) of a single electronic component shown in FIG. 6 is different from the configuration of the circuit element 3 shown in FIGS. Come to configure so-called network resistance! Thus, the eleventh step is completed.

By forming the overcoat 16 (black) on one surface of the insulating substrate 1 (white), the light reflectance of one surface of the unit electronic component piece 10 and that of the other surface are made different. be able to.

Next, a high-viscosity flux 19 is arranged on the land 7 obtained by forming the overcoat 16 (FIG. 7 (a)). The flux 19 used was Senju Metal Industry Co., Ltd. (trade name: Deltalux 529D-1). The arrangement method was a pin transfer method. At the time of this arrangement, care was taken to make flux 19 exist in the land 7 area and narrower area.

[0057] Instead of the pin transfer method, a screen printing method, a ball transfer method using conductive balls 2 instead of the pins, a dispenser method, or the like can be adopted. Needless to say, the flux 19 (trade name: Deltalux 529D-1) can be replaced with a flux having the same viscosity and viscosity as the flux 19.

Next, the conductive balls 2 are mounted by a commercially available ball mounting device (FIG. 7 (b)), and the lands 7 and the conductive balls 2 are fixed (FIG. 7 (c)). The strong conductive ball 2 has a surface layer of tin (so-called lead-free solder) and a core of copper ball. The strong fixing process is based on the known reflow process.

Next, by dicing, a plurality of strips ₁₂ are obtained by cutting the substrate 1 in a direction orthogonal to the dividing grooves 4 so that the processed substrate 1 becomes one side of a single electronic component (for example, FIG. c)

) oDarking is performed by dicing using a dicing saw with diamond powder attached to the surface. Commercially available tools and equipment required for kago dicing Using. This is the end of the twelfth step.

In the next step, the strip 12 is divided along the dividing groove 4 to be subjected to a dividing step of obtaining a unit electronic component piece 10. Therefore, stress was applied in the direction in which the dividing groove 4 was opened. As shown in FIG. 2, the application of the stress is realized by passing the large-sized substrate 1 between the rollers 8 in a state of being placed on a belt 9. At this time, the stress was applied while the strip 12 was wrapped with the cushioning member 5 made of cloth. As a result, a unit electronic component piece 10 was obtained. Thus, the above thirteenth step is completed.

(Embodiment of Second Manufacturing Method)

The best mode for carrying out the present invention based on the above-mentioned second manufacturing method is described below. The embodiment of the above-mentioned first manufacturing method is performed except that a substrate 1 on which a dividing groove is not formed in advance is used. Through the process under the same conditions as the first process. Thus, the twenty-first step in the second manufacturing method is completed.

Next, a step of mounting the conductive balls 2 on the lands 7 of the unit electronic component pieces 10 is performed as in the embodiment of the first manufacturing method.

After that, the dividing groove 4 is formed on the surface of the substrate 1 on which the circuit element 3 is formed. This formation is performed by the same method as in the twelfth step of the first manufacturing method. The dividing grooves 4 are formed by dicing so that a large number of dividing grooves 4 are formed in one direction on the surface of the substrate 1 and the dividing grooves 4 are one side of one electronic component. The positional relationship between groove 4 and circuit element 3 was adjusted. Thus, the twenty-second step in the second manufacturing method is completed.

Then, a strip 12 is obtained by performing a dividing step by dicing calorie in the same manner as the twelfth step in the embodiment of the first manufacturing method. Thus, the twenty-third step of the second manufacturing method is completed.

Next, similarly to the thirteenth step in the embodiment of the first manufacturing method, a dividing step using the buffer member 5 is performed. Thus, the twenty-fourth step in the second manufacturing method is completed.

(Other Embodiments)

In the first and second embodiments, the conductive balls 2 are fixed to the lands 7 on the circuit element 3 forming surface of the large-sized substrate 1. However, the surface opposite to the surface on which the circuit elements 3 are formed on the large substrate 1 Alternatively, the conductive ball 2 may be fixed thereto. In this case, first, it is necessary to provide a via hole or the like for the substrate 1 to conduct electricity from the front to the back.

In the first and second embodiments, the dividing groove 4 exists on the surface of the large substrate 1 on which the circuit element 3 is formed. However, the dividing groove 4 may be present on the surface of the large substrate 1 opposite to the surface on which the circuit elements 3 are formed. However, considering that the division is usually performed in the direction in which the dividing groove 4 is opened, when a part of the circuit element 3 is formed over the adjacent unit electronic component, the part of the circuit element 3 is separated from the substrate 1. There is a concern that the risk may occur in the 13th step or the 24th step. Therefore, a mode in which the dividing grooves 4 are present on the surface of the large substrate 1 on which the circuit elements 3 are formed is more preferable and is considered to be a mode.

In the first and second embodiments, when the land 7 and the conductive ball 2 are fixed, only the high-viscosity flux 19 is interposed between the land 7 and the conductive ball 2. However, for example, in the case where the conductive ball 2 has a copper force in which no solder is present on the surface thereof, a cream solder may be interposed instead of or together with the high-viscosity flux 19 and subjected to a reflow process. Is preferred. Considering the material of the surface of the conductive ball 2 and the material of the land 7, conditions suitable for fixing can be selected. If necessary, the surface of the land 7 can be soldered to improve the solder wettability on the surface of the land 7. Also, a conductive adhesive can be used as a fixing member between the land 7 and the conductive ball 2 without using solder.

In the first and second embodiments, the force using a so-called lead-free member in which the surface layer of the conductive ball 2 is tin and the inside is copper, for example, lead: tin = 95: 5 weight By using a lead-containing solder having a specific ratio, the viscosity of lead can be utilized to improve the heat cycle characteristics. When using lead-free solder in consideration of environmental harmony, in addition to Sn alone, Sn-Bi alloy, Sn-In-Ag alloy, Sn-Bi-Zn Alloy, Sn-Zn alloy, Sn-Ag-Bi alloy, Sn-Bi-Ag-Cu alloy, Sn-Ag-Cu alloy, Sn-Ag-In alloy, Sn-Ag-Cu-Sb alloy Alloy, Sn-Ag based alloy, Sn-Cu based alloy, Sn-Sb based alloy can be used.

In the first and second embodiments, as shown in FIG. 1, the distance between the outermost end dividing groove 4 on the surface of the large ceramic substrate 1 and one end of the substrate 1 is A large-sized ceramic substrate 1 having a separation groove 4 on one surface and a distance of 4 or more was used. The outermost surface of one large ceramic substrate It goes without saying that a large-sized ceramic substrate 1 in which the distance between the dividing groove 4 at the end and the end of the substrate 1 is smaller than the distance between the dividing grooves 4 on the surface of the substrate 1 can be used.

However, by using the former substrate 1 (FIG. 1), the dividing groove 4 located at the outermost end of the particularly large substrate 1 is divided by applying stress (the thirteenth process and the twenty-fourth process). In this case, a better division size system can be obtained. The reason is that the fulcrum in the leverage principle (the substrate 1 area corresponding to the dividing groove 4 on the back side of the substrate 1 where the dividing groove 4 exists) and the force point (the division on the substrate 1 surface where the dividing groove 4 exists) (A part other than the area where the groove 4 is located) can be maintained at a certain distance or more, and it is difficult for chips or the like to be generated due to excessive stress (compared to other force points) to the force point. It is.

In the first and second embodiments, in the dividing step of dividing the strip 12 along the dividing groove 4 to obtain the unit electronic component piece 10, the strip is divided into pieces before and after the division using an adhesive tape. It is preferable to fix the substrate 1 over it. This is because individual unit electronic component pieces 10 are prevented from falling apart after division, and the handling of the unit electronic component pieces 10 is improved. Industrial applicability

The present invention can be used in an electronic component in which a circuit element is formed on a ceramic substrate surface, particularly in an electronic component-related industry in which a circuit element is formed on a ceramic substrate surface and a conductive ball is used as an electronic component terminal. .

Claims

The scope of the claims

[1] In a method of manufacturing an electronic component in which a circuit element is formed on a ceramic substrate surface,

A first dividing step of forming a strip in which a plurality of unit electronic component pieces are connected,

A second dividing step of forming the strip into unit electronic component pieces;

One of the first dividing step and the second dividing step is performed by dicing, and the other is performed by applying stress to the substrate so as to open a dividing groove formed beforehand or after forming circuit elements on the substrate surface. Manufacturing method of electronic parts.

[2] In a method of manufacturing an electronic component in which a circuit element is formed on a ceramic substrate surface,

An eleventh step of forming a circuit element on the surface of a large ceramic substrate having a dividing groove provided in at least one direction on the surface,

A twelfth step of dicing the substrate surface in a direction substantially orthogonal to the dividing groove so as to form a strip in which the plurality of unit electronic component pieces are continuous;

A thirteenth step of dividing the substrate into unit electronic component pieces by applying stress to the substrate so as to open the dividing groove of the strip,

A method for manufacturing an electronic component, comprising performing the eleventh to thirteenth steps in this order.

[3] In a method of manufacturing an electronic component in which a circuit element is formed on a ceramic substrate surface,

A twenty-first step of forming circuit elements on a large ceramic substrate surface,

A twenty-second step of forming a dividing groove for dividing the unit electronic component small piece in at least one direction of the surface;

A twenty-third process of dicing the substrate surface in a direction substantially orthogonal to the dividing grooves so as to form strips in which the plurality of unit electronic component pieces are continuous;

A twenty-fourth step of dividing the substrate into unit electronic component pieces by applying stress to the substrate so as to open the dividing groove of the strip,

A method for manufacturing an electronic component, comprising performing the twenty-first to twenty-fourth steps in this order.

4. The method for manufacturing an electronic component according to claim 1, further comprising a step of fixing a conductive ball to a circuit element terminal portion of the unit electronic component piece.

[5] The method according to any one of claims 2 to 4, wherein the step of fixing the conductive ball to the circuit element terminal portion of the unit electronic component piece is performed after the completion of the thirteenth step or the twenty-fourth step. Manufacturing method of electronic components.

[6] The method for manufacturing an electronic component according to any one of claims 1 to 5, wherein the dividing groove is present on the circuit element forming surface of the substrate.

[7] The method for producing an electronic component according to any one of claims 1 to 6, wherein the width of the strip is 1.Omm or less.

[8] A buffer member for protecting a conductive ball from sticking when a strip is divided, including a step of sticking a conductive ball to a circuit element terminal portion before the thirteenth step or the twenty-fourth step. 8. The method for producing an electronic component according to claim 2, wherein:

9. The method for manufacturing an electronic component according to claim 8, wherein the buffer member is a material having both an adhesive effect and a buffer effect filled between the conductive balls.

[10] The material according to claim 9, wherein the material having both the adhesive effect and the buffer effect is a rosin-based material, and is cut along the dividing groove in the thirteenth step or the twenty-fourth step. Manufacturing method of electronic components.