JPH04286190A - Manufacture of ceramic printed wiring board - Google Patents

Abstract

PURPOSE:To prevent the generation of defectives in a polishing process by accurately controlling the quantities of the surfaces polished of upper and lower sections and polishing the surfaces. CONSTITUTION:In an internal-layer conductor forming process, conductors 17a, 17b, 18a, 18b for marks are formed on the same surface as internal layer conductors 13b, 15b nearest to surfaces 10a, 10b so as to cross the external form line 10c of a ceramic printed wiring board body 10. When side faces 10e, 10f along the external line 10c are formed through a cutting process, the cut surfaces of the conductors for the marks are exposed onto the side faces 10e, 10f. In a polishing process, the quantity of polishing is determined while using the conductors 17a, 17b, 18a, 18b for the marks as references, and both surfaces 10a, 10b of the upper and lower sections are polished uniformly.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a ceramic printed wiring board, and more particularly to a method of manufacturing a ceramic printed wiring board that is constructed so that surface polishing after firing can be performed with high precision.

[0002] Ceramic printed wiring boards are generally manufactured by laminating a plurality of green sheets with vias and inner layer conductors formed thereon, firing them, then surface polishing, and forming surface layer conductors on the polished surfaces. be done. During this process, when the laminated wiring board is fired, the surface becomes wavy, and the next surface polishing process is performed to flatten the wavy surface and adjust the wiring board to a predetermined thickness. . In recent years, from the viewpoint of improving the yield of wiring boards, it has been desired to perform this polishing process with high precision and to reduce the occurrence of defective products in this process.

0003

BACKGROUND ART FIG. 8 is a diagram illustrating a conventional method of manufacturing a ceramic printed wiring board.
A cross section of a ceramic printed wiring board main body (hereinafter simply referred to as the wiring board main body) 1 formed by laminating thick films 2 to 5 formed based on 5a and completing firing is shown.

The thick film 2 has a conductor 2b formed on the upper surface of the green sheet 2a, and a via 2c electrically connected to the conductor 2b. The other thick films 3, 4, 5 also have conductors 3b, 4b, 5b and vias 3c, 4c, although the arrangement is different.
5c, and has substantially the same configuration as the thick film 2. Further, in the thick film 5, the conductor 6 is formed not only on the upper surface but also on the lower surface.

By laminating and firing these thick films 2 to 5, each green sheet 2a to 5a is made into a ceramic, and each conductor 2b to 5b and each via 2c to 5c is melted and becomes electrically conductive. The connected wiring board body 1 shown in the same figure
is formed. The green sheets 2a to 5a shrink slightly by being made into ceramic, and the surface 1 of the wiring board body 1
a and 1b are in a wavy state as shown in the figure.

Conductors 2b formed on surfaces 1a and 1b,
6 indicates vias 2c to 5c inside wiring board body 1 and conductor 3b.
This is a continuity testing conductor for connecting a testing device for testing the electrical continuity of ~5b, and becomes unnecessary when the testing is completed. Therefore, after the inspection, the surfaces 1a and 1b of the wiring board body 1 are
In the figure, the surface 1c including the conductors 2b and 6 is indicated by a dotted line,
1d to flatten the wavy surfaces 1a and 1b, and adjust the wiring board body 1 to a predetermined thickness A. Note that the positions of surfaces 1c and 1d are the same as those of conductors 3b and 5b.
It is determined by predetermined dimensions B1 and B2 from the bottom surface of the conductors 3b and 5b shown in the figure so that the conductors 3b and 5b are not exposed.

[0007]

9 is a side view of the wiring board main body 1 shown in FIG. 8. FIG.

As shown in the figure, the side surface 1e of the wiring board body 1 after firing becomes a solid white ceramic surface, and no boundary lines between the film thicknesses 2 to 5 appear. Therefore, the thickness direction (Z1 - Z
2 direction) cannot be determined from the external appearance, and as shown in Figure 8, the positions of
It was not possible to accurately determine the positions of surfaces 1c and 1d defined by . As a result, the above-mentioned surfaces 1a, 1
In the step of polishing b, the upper and lower surfaces 1a and 1b were appropriately polished using only the board thickness dimension A of the completed ceramic printed wiring board wiring board as a target value, resulting in uneven polishing amounts. This causes one surface to become the predetermined surface 1.
Conductor 3b closest to surfaces 1c, 1d beyond c, 1d
, 5b may be excessively polished to the exposed position, resulting in defective products.

The present invention was made in view of the above problems, and provides a ceramic printed wiring board that can reduce the occurrence of defective products due to excessive polishing by accurately controlling the amount of polishing on the upper and lower surfaces. The purpose is to provide a manufacturing method.

0010

[Means for Solving the Problems] In order to achieve the above object, the invention of claim 1 includes an inner layer conductor forming step of forming an inner layer conductor on a green sheet, and a plurality of green sheets on which the inner layer conductor is formed. A lamination step of laminating the green sheet laminate to form a green sheet laminate, a firing step of firing the green sheet laminate to form a ceramic printed wiring board body, and polishing the surface of the ceramic printed wiring board body to reduce the board thickness. A polishing step for adjusting the dimensions to a predetermined size, and on the surface of the ceramic printed wiring board body polished in the polishing step,
A method for manufacturing a ceramic printed wiring board comprising a surface layer conductor forming step of forming a surface layer conductor, wherein the polishing step is formed at a position that will be an end face of the ceramic printed wiring board body in the inner layer conductor forming step. This is a configuration in which polishing is performed using at least one mark conductor as a reference.

[0011] Furthermore, in the invention of claim 2, from the viewpoint of performing surface polishing with higher precision, the conductor for the mark is
The structure is such that the surface layer conductor is formed at the same level as the inner layer conductor closest to the surface layer conductor.

[0012] According to a third aspect of the present invention, the conductors for the marks are formed at positions corresponding to end faces near four corners of the ceramic printed wiring board body.

[0013]

[Operation] The invention of claim 1 is characterized in that, in the inner layer conductor forming step, a mark conductor is formed at a position that will become the end face of the ceramic printed wiring board body, and then a laminating step and a firing step are performed to form the inner layer conductor. The end face of the mark conductor is exposed on the end face of the ceramic printed wiring board body. The position of the conductor for this mark in the board thickness direction is at the same level as the position of the inner layer conductor formed at the same time, so in the polishing process, the position of the conductor for this mark is used as a reference to complete the ceramic printed wiring board. The surface position of the state can be determined. Therefore, the precision of the amount of polishing in the polishing process is improved, thereby preventing the inner layer conductor from being exposed due to excessive polishing.

Further, in claim 2, by forming the mark conductor at the same level as the inner layer conductor closest to the surface layer conductor, the mark conductor exposed on the end surface and
Since the distance to the completed surface of the ceramic printed wiring board is minimized and errors are reduced, it is possible to obtain a more accurate polishing amount.

Furthermore, in claim 3, the amount of polishing can be controlled at the four corner positions of the ceramic printed wiring board body by forming the mark conductors at positions that will be the end faces near the four corners of the ceramic printed wiring board body. can do. Thereby, the entire surface of the ceramic printed wiring board main body can be polished uniformly, and the accuracy of surface polishing can be improved.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a flowchart showing an embodiment of the method for manufacturing a ceramic printed wiring board according to the present invention. Each step will be explained along this flowchart.

First, a green sheet forming step 21 is performed. Here, a slurry made by kneading glass and alumina is continuously formed into a sheet shape, placed on a belt conveyor, and conveyed through a drying oven to form a green sheet. The green sheet formed in this step is in a flexible state.

Next, a via forming step 22 is performed. here,
A hole is punched at a predetermined position in the green sheet formed in the green sheet forming step 21, and the hole is filled with copper paste by vacuum suction. The filled copper paste becomes a solid conductive via through a firing step 26, which will be described later.

Next, an inner layer conductor forming step 23 is performed. Here, a predetermined pattern of inner layer conductors is printed on the surface of the green sheet using copper paste. The printed copper paste becomes a solid inner layer conductor through a firing step 26, similar to the vias described above.

FIG. 2 shows the steps 21, 22, 23 up to this point.
FIG. 2 is a cross-sectional view showing a state in which vias and inner layer conductors are formed on a green sheet. Each green sheet 12a~
15a includes vias 12c to 15c made of copper paste,
Thick films 12 to 15 are formed with inner layer conductors 12b to 15b, respectively.
is configured. These thick films 12 to 15 are laminated in the subsequent lamination step 24 in the positional relationship shown in FIG.

The thick film 15 has vias 15c and inner layer conductors 15.
In addition to b, a continuity testing conductor 16 to which a continuity testing device is connected in a continuity testing step 27 to be described later is formed on its lower surface. In addition, since the inner layer conductor 12b is located at the outermost surface in the stacked state, the continuity test conductor 16
The conductor 12b for continuity testing functions in the same manner as described above.

Furthermore, the upper surfaces 13d, 15 of the thick films 13, 15
In addition to the inner layer conductors 13b and 15b, mark conductors 17a, 17b, 18a, and 18b are formed in d, respectively.

FIG. 3 is a plan view showing the printed pattern of the thick film 13. The thick film 13 shown in FIG. 2(B) is II-I in FIG.
A cross section along line I is shown.

In FIG. 3, the thick film 13 has an outline line 13.
Four wiring boards 13-1 to 13-4 having the same configuration and surrounded by -1a to 13-4a are formed at once. Outline lines 13-1a to 13-4a are lines to be processed in a second cutting process 28, which will be described later.

Here, the mark conductor 17 shown in the figure
Pay attention to a and 17b. As shown in the figure, the mark conductors 17a and 17b are oriented perpendicularly across the corner of the wiring board 13-1, and are aligned with the outline 13 of the wiring board 13-1.
-1a. Wiring board 13-1
Similarly, at the other three corners of the mark conductor 17
a are formed such that they are perpendicular to each other with the corner of the outline 13-1a in between.

Similarly, mark conductors are formed at each of the four corners of the other wiring boards 13-2 to 13-4. Further, the upper surface 15d of the film thickness 15 has the same configuration as the upper surface 13d of the film thickness 13 except for the arrangement of the inner layer conductor 15b, and the mark conductors 18a and 18b are formed at the same position as in the figure. These mark conductors 17a, 17b, 18a, 1
8b is printed with copper paste at the same time as the inner layer conductors 13b and 15b. Note that these mark conductors 17a, 17b, 1
The functions of 8a and 18b will be explained in detail later.

Next, a lamination step 24 is performed. Here, Figure 2
The thick films 12 to 15 shown in the figure are aligned with high precision and laminated. Since the green sheets 12a to 15a have flexibility as described above, the inner layer conductors 13b to 15b and the mark conductors 17a, 17b, 18a, and 18b are sandwiched between the upper and lower green sheets 12a to 15a. The surfaces of the opposing green sheets 12a to 15a are in close contact with each other without forming any gaps. In this way, thick film 1
2 to 15 are laminated to form a green sheet laminate.

Next, a first cutting step 25 is performed. Figure 3 to 4
As shown, three wiring boards 13-1 to 13-4 are shown.
Four wiring boards are formed at the same position for the other thick films 12, 14, and 15, respectively. Therefore, here, by dividing the green sheet laminate into four parts by a straight line passing between each of the wiring boards 13-2 to 13-4 of the green sheet 13 shown in FIG. 4a
Form the wiring board larger than the actual size.

Therefore, in the following explanation, the divided 1
This is performed for one wiring board 13-1.

[0030] Next, a firing step 26 is performed. Here, the green sheet laminate divided into four parts in step 25 is fired in a firing apparatus. This firing process 26 is divided into a first firing and a second firing for its purpose. The first firing is performed under wet nitrogen (Wet N2) to remove unnecessary materials such as binder added during green sheet forming. Further, in the second firing, firing is performed under dry nitrogen (DryN2) at a higher temperature than in the first firing, and the green sheet from which unnecessary materials have been removed is turned into a ceramic. Therefore, through this firing step 26, the green sheet laminate becomes a ceramic printed wiring board main body, which is the base of the ceramic printed wiring board. Vias 12c to 15c, inner layer conductors 13b, 14b,
15b, the continuity test conductors 12b and 16, and the mark conductors 17a, 17b, 18a, and 18b become conductors made of solid copper through this process.

FIG. 4 is a cross-sectional view of the ceramic printed wiring board body formed in the firing process 26, and the thick films 12 to 15 shown in FIG.
The state after the firing step 26 is shown.

Each green sheet 12a of the ceramic printed wiring board body (hereinafter simply referred to as the wiring board body) 10
15a is made into a ceramic by the firing step 26 as described above, so that the boundaries between the thick films 12 to 15 do not appear visually (in the figure, the boundaries between the thick films 12 to 15 do not appear). lines are shown as dotted lines). In addition, each of the green sheets 12a to 15a shrinks slightly by being made into a ceramic, so that the surfaces 10a and 10b of the wiring board body 10 become wavy as shown in the figure. In addition, 1 in the same figure
The dotted line indicated by 0c corresponds to the outline 13-1a shown in FIGS. 2 and 3.
This is the outline of the final shape of the ceramic printed wiring board.

Next, a continuity test step 27 is performed. here,
As described above, the continuity testing device is connected to the continuity testing conductors 12b and 16.
vias 12c to 15c and inner layer conductor 13b
, 14b, 15b for disconnection or short circuit. The wiring board main body 10 in which a disconnection or short circuit has been detected is rejected from the production process as a defective product at this stage.

The wiring board main body 10 for which no defects were detected in the continuity testing step 27 proceeds to the next second cutting step 28 . Here, the wiring board main body 10 is shaped along an outline 10c shown in FIG. 4 (corresponding to the outline 13-1a shown in FIGS. 2 and 3).

FIG. 5 shows the wiring board main body 10A whose outer shape has been processed. By the second cutting step 28, two orthogonal side surfaces 10e are formed sandwiching the corner 10d of the wiring board main body 10A.
, 10f are ceramicized as described above and have solid white surfaces, and the boundaries between the thick films 12 to 15 cannot be seen from the outside. However, since the mark conductors 17a and 17b explained with reference to FIGS. 2 and 3 were formed so as to straddle the outline line 13-1a, in this step 28, the cut surfaces of the mark conductors 17a and 17b were As shown, it is exposed on the side surfaces 10e and 10f. Similarly, the mark conductors 18a and 18b formed on the thick film 15 also have side surfaces 10e and 18b.
Expose above 10f.

Mark conductors 17a, 17b, 18a, 1
The dimensions of the exposed cross-sectional portion of 8b are approximately 100 μm in width and 50 μm in height, and their presence on the white side surfaces 10e and 10f can be visually confirmed.

Next, a surface polishing step 29 is performed. here,
Surface 10a of wiring board main body 10A whose external shape has been processed as shown in FIG.
, 10b, and the surface 1 is wavy as shown above.
0a and 10b, and form surfaces 10g and 10h that will become the completed state of the ceramic printed wiring board,
The wiring board main body 10A has a predetermined thickness A in the completed state. The continuity testing conductors 12b and 16 are not needed after the continuity testing process 27 is completed, so they are scraped off in this process 29.

As described above, these surfaces 10g and 10h have a predetermined dimension B from the bottom surface of the inner layer conductors 13b and 15b so that the inner layer conductors 13b and 15b are not exposed from the surface.
1, B2.

In this embodiment, as described above, mark conductors 17a, 17b, 18a, 18b are formed at the same height as the bottom surfaces of inner layer conductors 13b, 15b, and these mark conductors 17a, 17b, 18a , 18b are exposed on the side surfaces 10e and 10f and can be visually confirmed. Therefore, the positions of the inner layer conductors 13b and 15b in the plate thickness direction (Z1-Z2 direction) are the same as those of the mark conductors 17a, 17b, 18a, 18 even after firing.
It can be estimated more easily than b, and furthermore, the inner layer conductor 13
The positions of surfaces 10g and 10h that are distanced by dimensions B1 and B2 from the positions of the bottom surfaces of surfaces b and 15b can also be easily obtained. That is, the mark conductors 17a, 17b, 18a,
The positions of surfaces 10g and 10h are distanced from the bottom surface of 18b by dimensions B1 and B2 toward surfaces 10a and 10b.

Therefore, in the surface polishing step 29, by polishing the mark conductors 17a, 17b, 18a, and 18b to the surfaces 10g and 10h, not only the plate thickness dimension A as in the conventional method but also the dimensions B1, B2 can also be polished with high precision control, and as a result,
It is possible to avoid the situation in which the inner layer conductor is exposed due to an imbalance in the amount of polishing that occurs in the prior art.

As for specific dimensions, each thick film 12 to 15
Since the board thickness after the firing step 26 is approximately 0.4 mm, the board thickness dimension C of the wiring board main body 10A before the surface polishing step 29 is approximately 1.6 mm. And dimensions B1, B
2 is considered to be at least about 0.1 mm for insulation purposes, so
The plate thickness dimension A in the polished state is approximately 1.0 mm. That is, surface polishing is performed by about 0.3 mm on each of the upper and lower surfaces. Since the height of the waves on the surfaces 10a and 10b shown in FIG. 5 is about 0.1 mm, the wavy portions of the polished surfaces 10g and 10h are completely removed and the surfaces are flattened.

FIG. 6 is a side view of the wiring board main body 10B polished in the surface polishing step 29.

As shown in the figure, the wiring board main body 10B is formed so that the board thickness dimension A and the dimensions B1 and B2 from the bottom surface to the surfaces 10g and 10h of the inner layer conductors 13b and 15B are formed according to predetermined dimensions. Finally, the wiring board body 10 in this state
In step B, a surface layer forming step 30 is performed. Here, the surface 10g
, 10h, a surface layer conductor (not shown) is formed by a conventional photolithography technique. Some of the surface layer conductors are vias 12c and 15c exposed on the surfaces 10g and 10h.
Electrical continuity is achieved by contacting the end face of the In this way, the surface layer conductor is formed and the ceramic printed wiring board is completed.

As described above, according to the manufacturing method of this embodiment, the side surfaces 10e, 1
Mark conductors 17a, 17b, 18 exposed above 0f
Based on a and 18b, the completed surface 10g and 10
You can know the position of h. Therefore, in the surface polishing step 29, by polishing the surfaces 10g and 10h, the accuracy of the amount of polishing on both sides of the wiring board body is improved, and the outermost inner layer conductors 13b and 15b are polished. It is possible to leave a sufficient thickness of glass-ceramic in place. Therefore, the situation where the inner layer conductor is exposed due to the imbalance of polishing amount as in the conventional case is prevented, and the surface polishing step 2
The occurrence of defective products in step 9 can be prevented.

Note that the mark conductor is not limited to the upper surfaces 13d and 15d of the thick films 13 and 15 as in the above embodiment, but even if it is formed on the upper surface of the thick film 14 between them, the dimensions B1 and B2
By increasing the value of by the thickness of the thick films 13 and 14, the positions of the surfaces 10g and 10h can be similarly obtained. However, in this case, B1 and B2 are the thick films 13 and 14
The resulting surface 10
The positional accuracy of g and 10h is lower than that of the above embodiment. As in this embodiment, by forming the mark conductor at the same level as the inner layer conductor closest to the surface layer conductor, the dimensions B1 and B2 are minimized and errors are reduced.
The positions of surfaces 10g and 10h can be obtained with the highest accuracy.

As shown in FIG. 3, the four wiring boards 13-1 to 13-4 formed on the thick film 13 are provided with mark conductors 17a at the four corners so as to sandwich the respective corners. , 17b
is formed. Therefore, the wiring boards 13-1 to 13-4 whose external shapes have been processed in the second cutting step 28 have mark conductors at positions sandwiching the four corners, that is, at both ends of the four side surfaces. It becomes exposed. By forming the mark conductors in the vicinity of the four corners in this way, the surfaces 10g and 10h estimated from the mark conductors,
The parallelism with the surface on which the inner layer conductors 13b and 15b are formed can be improved. That is, the inclination of the polished surface is prevented,
Surface polishing can be performed with higher precision.

Furthermore, as shown in FIG. 3, four wiring boards 1
3-1 to 13-4 have two wires, one at each corner, at different positions.
A set of mark conductors 17b is formed (a single mark conductor is indicated by reference numeral 17a). Also, as shown in Figure 7,
The green sheet laminate 19 is cut out and fired,
Furthermore, the four wiring board main bodies 10A-1 to 10A-4 whose external shapes have been processed in the second cutting step 28 have continuity testing conductors 12b of the same pattern formed on their respective upper surfaces.

Generally, individual wiring board bodies 10A-1 to 10
At first glance, A-4 cannot be distinguished from other wiring board bodies formed simultaneously from one green sheet laminate 19. However, according to this embodiment, due to the positional relationship between the mark conductor 17b and the continuity test conductor 12b, the history of the wiring board main body 10A, that is, the wiring board The extraction addresses E to H can be easily known. Thereby, when a defect is discovered in the continuity testing step 27, addresses E to H on the green sheet laminate 19 of the wiring board body having the defect can be easily known.

[0049] This effect is caused, for example, when a defect occurs in the wiring board body 10A-2 at address F of the green sheet laminate 19, and also when all the wiring board bodies produced earlier at the same address have defects. If it turns out that
By investigating the positional relationship between the mark conductor 17b and continuity test conductor 12b of the set, it is possible to easily find defective products from all previously completed ceramic printed wiring boards.

In the above embodiment, the wiring board main body was formed by laminating four thick films, but the present invention is not limited to this, and the wiring board body may be formed from two or more thick films. It is effective if it is a wiring board body.

[0051]

Effects of the Invention As described above, according to the invention of claim 1, by polishing the surface of the ceramic printed wiring board body using the mark conductor as a reference, the accuracy of the polishing amount is improved, which is different from the conventional method. This prevents the inner layer conductor from being exposed due to imbalance in the amount of polishing. Therefore, it is possible to prevent the occurrence of defective products in the polishing process, which greatly contributes to improving the yield of ceramic printed wiring boards.

Further, according to the invention of claim 2, the distance between the mark conductor and the completed surface of the ceramic printed wiring board is minimized, and errors are reduced, so that the accuracy of the amount of polishing is further improved. be able to.

Further, according to the third aspect of the present invention, the amount of polishing can be controlled at the four corner positions of the ceramic printed wiring board body, so that the entire surface can be polished evenly, and the surface polishing process can be performed with higher precision. Can be done.

[Brief explanation of the drawing]

FIG. 1 is a flowchart showing one embodiment of a method for manufacturing a ceramic printed wiring board according to the present invention.

FIG. 2 is a cross-sectional view showing a state in which vias and inner layer conductors are formed on a green sheet.

FIG. 3 is a plan view showing a thick film printing pattern.

FIG. 4 is a cross-sectional view of a ceramic printed wiring board body formed by a firing process.

FIG. 5 is a cross-sectional view of the ceramic printed wiring board main body in a state where the outer shape has been processed in a second cutting step.

FIG. 6 is a side view of the ceramic printed wiring board main body polished by a surface polishing process.

FIG. 7 is a diagram illustrating the identification effect of the ceramic printed wiring board body by the mark conductor.

FIG. 8 is a diagram illustrating a conventional ceramic printed wiring board manufacturing method, and shows a cross section of a conventional ceramic printed wiring board main body.

9 is a side view of the ceramic printed wiring board body shown in FIG. 8. FIG.

[Explanation of symbols]

10 Ceramic printed wiring board 10A Ceramic printed wiring board (outline processed) 1
0B Ceramic printed wiring board (surface polished) 10
a, 10b, 10g, 10h Surface 10c Outline 10d Corner 10e, 10f Side 12, 13, 14, 15 Thick film 12a, 13a, 14a, 15a Green sheet 1
3b, 14b, 15b Inner layer conductor 12c, 13c, 14c, 15c Via 17a, 17
b, 18a, 18b Mark conductor 19 Green sheet laminate 21 to 30 Process

Claims (3)

[Claims] 1. An inner layer conductor forming step (23) of forming inner layer conductors (13b to 15b) on green sheets (12a to 15a), and green sheets (12a to 15b) on which the inner layer conductors (13b to 15b) are formed. 15a) to form a green sheet laminate (19); and a firing step to sinter the green sheet laminate (19) to form a ceramic printed wiring board body (10). (26) and the ceramic printed wiring board body (
A polishing step (29) of polishing the surfaces (10a, 10b) of 10) and adjusting the plate thickness to a predetermined dimension;
) The ceramic printed wiring board body (1
A method for manufacturing a ceramic printed wiring board comprising a surface layer conductor forming step (30) of forming a surface layer conductor on the surface (10g, 10h) of the polishing step (0B).
29) is an end surface (10) of the ceramic printed wiring board body (10A) in the inner layer conductor forming step (23).
at least one mark conductor (17a, 17b, 18a, 18b) formed at the position of (e, 10f)
A method for manufacturing a ceramic printed wiring board, characterized by performing polishing based on. 2. Conductors for the marks (17a, 17b
, 18a, 18b) are formed at the same level as the inner layer conductor (13b, 15b) closest to the surface layer conductor. 3. Conductors for the marks (17a, 17b
, 18a, 18b) are formed at positions near four corners of the ceramic printed wiring board main body (10A), respectively, to form end faces of the ceramic printed wiring board body (10A).